US20030024687A1 - Radiation fin set for heat sink - Google Patents

Radiation fin set for heat sink Download PDF

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Publication number
US20030024687A1
US20030024687A1 US09/917,658 US91765801A US2003024687A1 US 20030024687 A1 US20030024687 A1 US 20030024687A1 US 91765801 A US91765801 A US 91765801A US 2003024687 A1 US2003024687 A1 US 2003024687A1
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US
United States
Prior art keywords
heat dissipation
fin set
radiation fin
radiation fins
radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US09/917,658
Inventor
Chung Cheng
Jimmy Wu
Eric Chung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ACETHERM TECHNOLOLGIES Co Ltd
Original Assignee
ACETHERM TECHNOLOLGIES Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ACETHERM TECHNOLOLGIES Co Ltd filed Critical ACETHERM TECHNOLOLGIES Co Ltd
Priority to US09/917,658 priority Critical patent/US20030024687A1/en
Assigned to ACETHERM TECHNOLOLGIES CO., LTD. reassignment ACETHERM TECHNOLOLGIES CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHENG, CHUNG-PIN, CHUNG, ERIC, WU, JIMMY
Publication of US20030024687A1 publication Critical patent/US20030024687A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to heat sinks and, more specifically, to a radiation fin set for heat sink, which causes the flow of air of high momentum to mix with the flow of air of low momentum, so as to repress the formation of boundary layer and to improve heat dissipation efficiency of the radiation fins.
  • FIG. 1 is an exploded view of a heat sink according to the prior art.
  • This structure of heat sink comprises a heat dissipation base panel 3 a for fastening to an electronic element that produces heat during its operation, a heat dissipation tube 2 a fixedly fastened to the heat dissipation base panel 3 a , and a metallic radiation fin set la fastened to the heat dissipation tube 2 a and arranged in parallel.
  • the radiation fin set 1 a is comprised of a plurality of radiation fins 10 a , each having a through hole 11 a for the passing of the heat dissipation tube 2 a . This design of radiation fin set la is still not satisfactory in function. As shown in FIG.
  • the quantity of motion of the flow of air 12 a is gradually reduced near the downstream of the radiation fins 10 a , forming a boundary layer 13 a in between each two adjacent radiation fins 10 a .
  • the boundary layer 13 a becomes thick, it blocks the heat dissipation passage between each two adjacent radiation fins 10 a , resulting in low heat dissipation efficiency.
  • the present invention has been accomplished to provide a radiation fin set for heat sink, which eliminates the aforesaid problem. It is the main object of the present invention to provide a radiation fin set for heat sink, which causes the flow of air of high momentum to mix with the flow of air of low momentum, so as to repress the formation of boundary layer and to improve heat dissipation efficiency of the radiation fins. It is another object of the present invention of the present invention to provide a radiation fin set for heat sink, which prevents the formation of wind resistance and improves the efficiency of the dissipation of heat. According to one aspect of the present invention, the radiation fin set is comprised of a plurality of metallic radiation fins.
  • the radiation fins each have a plurality of elongated slots, and a plurality of flanges respectively extended along one side of each of the elongated slots and sloping in one direction for guiding the flow of air of high momentum into mixing with the flow of air of low momentum to repress the formation of boundary layer between each two adjacent radiation fins.
  • the sloping flanges of the radiation fins each have at least one air vent for the passing of air to prevent formation of wind resistance.
  • FIG. 1 is an exploded view of a heat sink constructed according to the prior art.
  • FIG. 2 is a schematic drawing illustrating the formation of boundary layer between each two adjacent radiation fins according to the prior art.
  • FIG. 3 is an exploded view of a heat sink constructed according to the present invention.
  • FIG. 3A is an enlarged view of part A of FIG. 3.
  • FIG. 4 is an assembly view of FIG. 3.
  • FIG. 5 is a schematic drawing illustrating the formation of boundary layer between each two adjacent radiation fins according to the present invention.
  • FIG. 6 is a perspective view of an alternate form of the heat sink constructed according to the present invention.
  • FIG. 7 is an elevational view of an alternate form of the radiation fin according to the present invention.
  • a radiation fin set 1 is fastened to the front end 20 of a heat dissipation tube 2 .
  • the radiation fin set 1 is comprised of a number of metallic radiation fins 10 arranged in parallel.
  • the radiation fins 10 each have a through hole 11 through which the front end 20 of the heat dissipation tube 2 is inserted to secure the radiation fins 10 in parallel, keeping the radiation fins 10 spaced from one another at an equal space.
  • the heat dissipation tube 2 has a rear end 21 fixedly fastened to a positioning groove 30 on the top sidewall of a heat dissipation base panel 3 .
  • the heat dissipation base panel 3 is fastened to the top sidewall of an electronic device, for example, a CPU 4 .
  • an electronic device for example, a CPU 4 .
  • heat is quickly transmitted from the CPU 4 through the heat dissipation base panel 3 and the heat dissipation tube 20 to the radiation fin set 1 , and then dissipated into the air from the radiation fin set 1 .
  • the radiation fins 10 each have a plurality of elongated slots 12 and a plurality of flanges 13 respectively extended along one side of each of the elongated slots 12 and sloping in one direction at an angle 14 .
  • the flanges 13 are formed of a part of the respective radiation fin 10 upon formation of the respective elongated slots 12 by stamping.
  • the angle of slope 14 of the flanges 13 is within 20-45°, or preferably 30°.
  • FIG. 6 shows an alternate form of the radiation fin set 1 on the heat dissipation base panel 3 according to the present invention.
  • the radiation fins 10 are directly welded (or bonded) to the top sidewall of the heat dissipation base panel 3 without the use of the aforesaid heat dissipation tube 2 .
  • air vents 19 are formed through the flanges 13 of the radiation fin 10 for the passing of currents of air.
  • the number of the air vents 19 on each flange 13 is determined subject to the size of the flanges 13 .
  • a prototype of radiation fin set has been constructed with the features of the annexed drawings of FIGS. 3 ⁇ 7 .
  • the radiation fin set functions smoothly to provide all of the features discussed earlier.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A radiation fin set comprising a plurality of metallic radiation fins arranged in parallel for direct welding/bonding to a beat dissipation base panel or mounting on a heat dissipation tube at the heat dissipation base panel, the radiation fins each having a plurality of elongated slots and a plurality of flanges respectively extended along one side of each of the elongated slots and sloping in one direction at an angle of slope for guiding the flow of air of high momentum into mixing with the flow of air of low momentum to repress the formation of boundary layer and to improve heat dissipation efficiency of the radiation fins.

Description

    BACKGROUND OF THE INVENTION
  • The present invention relates to heat sinks and, more specifically, to a radiation fin set for heat sink, which causes the flow of air of high momentum to mix with the flow of air of low momentum, so as to repress the formation of boundary layer and to improve heat dissipation efficiency of the radiation fins. [0001]
  • Following fast development of computer industry, a variety of high-precision electronic elements have been developed. High-precision electronic elements achieve high operation speed, however they simultaneously produce much heat. Because electronic elements must be operated within a designed working temperature range, heat must be quickly dissipated during their operation. Various heat sinks and radiation fin designs have been disclosed for this purpose. FIG. 1 is an exploded view of a heat sink according to the prior art. This structure of heat sink comprises a heat [0002] dissipation base panel 3 a for fastening to an electronic element that produces heat during its operation, a heat dissipation tube 2 a fixedly fastened to the heat dissipation base panel 3 a, and a metallic radiation fin set la fastened to the heat dissipation tube 2 a and arranged in parallel. The radiation fin set 1 a is comprised of a plurality of radiation fins 10 a, each having a through hole 11 a for the passing of the heat dissipation tube 2 a. This design of radiation fin set la is still not satisfactory in function. As shown in FIG. 2, the quantity of motion of the flow of air 12 a is gradually reduced near the downstream of the radiation fins 10 a, forming a boundary layer 13 a in between each two adjacent radiation fins 10 a. When the boundary layer 13 a becomes thick, it blocks the heat dissipation passage between each two adjacent radiation fins 10 a, resulting in low heat dissipation efficiency.
    • SUMMARY OF THE INVENTION
  • The present invention has been accomplished to provide a radiation fin set for heat sink, which eliminates the aforesaid problem. It is the main object of the present invention to provide a radiation fin set for heat sink, which causes the flow of air of high momentum to mix with the flow of air of low momentum, so as to repress the formation of boundary layer and to improve heat dissipation efficiency of the radiation fins. It is another object of the present invention of the present invention to provide a radiation fin set for heat sink, which prevents the formation of wind resistance and improves the efficiency of the dissipation of heat. According to one aspect of the present invention, the radiation fin set is comprised of a plurality of metallic radiation fins. The radiation fins each have a plurality of elongated slots, and a plurality of flanges respectively extended along one side of each of the elongated slots and sloping in one direction for guiding the flow of air of high momentum into mixing with the flow of air of low momentum to repress the formation of boundary layer between each two adjacent radiation fins. According to another aspect of the present invention, the sloping flanges of the radiation fins each have at least one air vent for the passing of air to prevent formation of wind resistance.[0003]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded view of a heat sink constructed according to the prior art. [0004]
  • FIG. 2 is a schematic drawing illustrating the formation of boundary layer between each two adjacent radiation fins according to the prior art. [0005]
  • FIG. 3 is an exploded view of a heat sink constructed according to the present invention. [0006]
  • FIG. 3A is an enlarged view of part A of FIG. 3. [0007]
  • FIG. 4 is an assembly view of FIG. 3. [0008]
  • FIG. 5 is a schematic drawing illustrating the formation of boundary layer between each two adjacent radiation fins according to the present invention. [0009]
  • FIG. 6 is a perspective view of an alternate form of the heat sink constructed according to the present invention. [0010]
  • FIG. 7 is an elevational view of an alternate form of the radiation fin according to the present invention.[0011]
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
  • Referring to FIGS. 3, 3A, and [0012] 4, a radiation fin set 1 is fastened to the front end 20 of a heat dissipation tube 2. The radiation fin set 1 is comprised of a number of metallic radiation fins 10 arranged in parallel. The radiation fins 10 each have a through hole 11 through which the front end 20 of the heat dissipation tube 2 is inserted to secure the radiation fins 10 in parallel, keeping the radiation fins 10 spaced from one another at an equal space. The heat dissipation tube 2 has a rear end 21 fixedly fastened to a positioning groove 30 on the top sidewall of a heat dissipation base panel 3. The heat dissipation base panel 3 is fastened to the top sidewall of an electronic device, for example, a CPU 4. During operation of the CPU 4, heat is quickly transmitted from the CPU 4 through the heat dissipation base panel 3 and the heat dissipation tube 20 to the radiation fin set 1, and then dissipated into the air from the radiation fin set 1.
  • The [0013] radiation fins 10 each have a plurality of elongated slots 12 and a plurality of flanges 13 respectively extended along one side of each of the elongated slots 12 and sloping in one direction at an angle 14. The flanges 13 are formed of a part of the respective radiation fin 10 upon formation of the respective elongated slots 12 by stamping. The angle of slope 14 of the flanges 13 is within 20-45°, or preferably 30°.
  • Referring to FIG. 5, when the quantity of motion of the [0014] flow 15 is reducing, the thickness of the boundary layer 16 is relatively increased, and the flow of air of high momentum 17 is guided through the elongated slots 12 of the radiation fins 10 to mix with the flow of air low momentum 18 to repress and destroy the boundary layer 16 between each two radiation fins 10, preventing blockage of heat dissipation passage. Thus heat can be quickly dissipated from the CPU.
  • FIG. 6 shows an alternate form of the radiation fin set [0015] 1 on the heat dissipation base panel 3 according to the present invention. According to this arrangement, the radiation fins 10 are directly welded (or bonded) to the top sidewall of the heat dissipation base panel 3 without the use of the aforesaid heat dissipation tube 2.
  • Referring to FIG. 7, [0016] air vents 19 are formed through the flanges 13 of the radiation fin 10 for the passing of currents of air. The number of the air vents 19 on each flange 13 is determined subject to the size of the flanges 13.
  • A prototype of radiation fin set has been constructed with the features of the annexed drawings of FIGS. [0017] 3˜7. The radiation fin set functions smoothly to provide all of the features discussed earlier.
  • Although particular embodiments of the invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention. Accordingly, the invention is not to be limited except as by the appended claims. [0018]

Claims (4)

What the invention claimed is:
1. A radiation fin set comprising a plurality of metallic radiation fins arranged in parallel, said radiation fins each having a plurality of elongated slots and a plurality of flanges respectively extended along one side of each of said elongated slots and sloping in one direction at an angle of slope.
2. The radiation fin set of claim 1 wherein said radiation fins each have a through hole respectively aligned for mounting.
3. The radiation fin set of claim 1 wherein the angle of slope of said flanges is 30°.
4. The radiation fin set of claim 1 wherein said flanges each have at least one air vent for the passing of air.
US09/917,658 2001-07-31 2001-07-31 Radiation fin set for heat sink Abandoned US20030024687A1 (en)

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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050167087A1 (en) * 2004-02-04 2005-08-04 Hon Hai Precision Industry Co., Ltd. Heat dissipating device with heat pipe
DE102004004440A1 (en) * 2004-01-28 2005-08-18 Kermi Gmbh Cooling device for electronic component e.g. microprocessor, allows coolant to flow through channel in heat sink
US20050224214A1 (en) * 2004-03-31 2005-10-13 Zeighami Roy M System and method for cooling electronic assemblies
US20050247434A1 (en) * 2004-04-23 2005-11-10 Foxconn Technology Co., Ltd Heat dissipating device
US7011147B1 (en) * 2004-11-17 2006-03-14 Chung-Tsai Hung Heat pipe type circular radiator with sector cooling fins
US20070091568A1 (en) * 2005-10-24 2007-04-26 Chun-Chi Chen Heat sink
US20070095508A1 (en) * 2005-11-02 2007-05-03 Foxconn Technology Co., Ltd. Heat dissipation device having louvered heat-dissipating fins
US20080017349A1 (en) * 2006-07-21 2008-01-24 Foxconn Technology Co., Ltd. Heat sink
US20080115915A1 (en) * 2006-11-16 2008-05-22 Ryan Chen Heat sink
US20080121372A1 (en) * 2006-11-24 2008-05-29 Foxconn Technology Co., Ltd. Heat dissipation device
US20080135215A1 (en) * 2006-12-06 2008-06-12 Foxconn Technology Co., Ltd. Heat dissipation device
US20090260779A1 (en) * 2008-04-21 2009-10-22 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having an improved fin structure
US20100212868A1 (en) * 2008-02-15 2010-08-26 Yang Chien-Lung Assembled configuration of cooling fins and heat pipes
US20100259899A1 (en) * 2009-06-22 2010-10-14 Mario Facusse Passive cooling system and method for electronics devices
US20100319883A1 (en) * 2009-06-22 2010-12-23 Mario Facusse Passive cooling enclosure system and method for electronics devices
US20120103572A1 (en) * 2010-11-03 2012-05-03 Enermax Technology Corporation Heat dissipating apparatus with vortex generator
US20120103573A1 (en) * 2010-11-03 2012-05-03 Enermax Technology Corpof Heat dissipating apparatus with vortex generator
US20150013955A1 (en) * 2013-07-10 2015-01-15 Hon Hai Precision Industry Co., Ltd. Heat sink

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004004440A1 (en) * 2004-01-28 2005-08-18 Kermi Gmbh Cooling device for electronic component e.g. microprocessor, allows coolant to flow through channel in heat sink
DE102004004440B4 (en) * 2004-01-28 2006-06-29 Kermi Gmbh Cooling device for an electronic component, in particular for a microprocessor
US20050167087A1 (en) * 2004-02-04 2005-08-04 Hon Hai Precision Industry Co., Ltd. Heat dissipating device with heat pipe
US20050224214A1 (en) * 2004-03-31 2005-10-13 Zeighami Roy M System and method for cooling electronic assemblies
US7011144B2 (en) * 2004-03-31 2006-03-14 Hewlett-Packard Development Company, L.P. System and method for cooling electronic assemblies
US7025125B2 (en) * 2004-04-02 2006-04-11 Hon Hai Precision Industry Co., Ltd. Heat dissipating device with heat pipe
US20050247434A1 (en) * 2004-04-23 2005-11-10 Foxconn Technology Co., Ltd Heat dissipating device
US7575045B2 (en) * 2004-04-23 2009-08-18 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating device
US7011147B1 (en) * 2004-11-17 2006-03-14 Chung-Tsai Hung Heat pipe type circular radiator with sector cooling fins
US20070091568A1 (en) * 2005-10-24 2007-04-26 Chun-Chi Chen Heat sink
US7289322B2 (en) 2005-10-24 2007-10-30 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink
US20070095508A1 (en) * 2005-11-02 2007-05-03 Foxconn Technology Co., Ltd. Heat dissipation device having louvered heat-dissipating fins
US20080017349A1 (en) * 2006-07-21 2008-01-24 Foxconn Technology Co., Ltd. Heat sink
US7568518B2 (en) * 2006-07-21 2009-08-04 Furui Precise Component (Kunshan) Co., Ltd. Heat sink
US20080115915A1 (en) * 2006-11-16 2008-05-22 Ryan Chen Heat sink
US20080121372A1 (en) * 2006-11-24 2008-05-29 Foxconn Technology Co., Ltd. Heat dissipation device
US20080135215A1 (en) * 2006-12-06 2008-06-12 Foxconn Technology Co., Ltd. Heat dissipation device
US20100212868A1 (en) * 2008-02-15 2010-08-26 Yang Chien-Lung Assembled configuration of cooling fins and heat pipes
US20090260779A1 (en) * 2008-04-21 2009-10-22 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having an improved fin structure
US20100259899A1 (en) * 2009-06-22 2010-10-14 Mario Facusse Passive cooling system and method for electronics devices
US20100319883A1 (en) * 2009-06-22 2010-12-23 Mario Facusse Passive cooling enclosure system and method for electronics devices
US8582298B2 (en) 2009-06-22 2013-11-12 Xyber Technologies Passive cooling enclosure system and method for electronics devices
US9036351B2 (en) * 2009-06-22 2015-05-19 Xyber Technologies, Llc Passive cooling system and method for electronics devices
US9351424B2 (en) 2009-06-22 2016-05-24 Xyber Technologies Passive cooling enclosure system and method for electronics devices
US20120103572A1 (en) * 2010-11-03 2012-05-03 Enermax Technology Corporation Heat dissipating apparatus with vortex generator
US20120103573A1 (en) * 2010-11-03 2012-05-03 Enermax Technology Corpof Heat dissipating apparatus with vortex generator
US9163884B2 (en) * 2010-11-03 2015-10-20 Enermax Technology Corporation Heat dissipating apparatus with vortex generator
US20150013955A1 (en) * 2013-07-10 2015-01-15 Hon Hai Precision Industry Co., Ltd. Heat sink

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Owner name: ACETHERM TECHNOLOLGIES CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHENG, CHUNG-PIN;WU, JIMMY;CHUNG, ERIC;REEL/FRAME:012034/0008

Effective date: 20010727

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION