TW201813489A - Heat sink especially for reducing heat resistance for high frequency and high speed electronic components - Google Patents

Abstract

The present invention is a heat sink for heat dissipation of electronic components, which comprises a bottom plate, a heat dissipation fin disposed on the bottom plate, and a heat pipe connecting the bottom plate and the fin. The heat pipe includes an evaporation section coupled to the bottom plate, a heat dissipation section combined with the fin and a connection section connecting the evaporation section and the corresponding heat dissipation section. The heat dissipation section is parallel to the heat absorption section and extends in opposite directions. The heat dissipation module uses only a single heat pipe and two sets of heat dissipation fins, the two sets of heat dissipation fins use the same set of heat dissipation fins module, and the second set of heat dissipation fins is the horizontal translation, flip or horizontal rotation of the first set of heat dissipation fins. In addition, the placement of the heat dissipation module after the juxtaposition is to use a dislocation method to reduce the heat resistance.

Description

Heat sink

The invention relates to a heat dissipation device, in particular to a heat dissipation device used for electronic components.

With the continuous development of the dot electronic information industry, the operating frequency and speed of electronic component processors are constantly increasing. However, the high frequency and high speed increase the heat generated by the electronic components, which causes the temperature to rise continuously, which seriously affects the performance of the electronic electronic components during operation. In order to ensure the normal operation of the electronic components, the heat generated by the electronic components must be discharged in a timely manner.

In the past, in the design of heat dissipation modules, when high heat dissipation modules were encountered, the solution was to use a large number of heat pipes combined with heat dissipation fins to form a heat dissipation module. Therefore, the manufacturing cost was often very high. Only 100 ~ 200 watts of heat dissipation requirements are required. In accordance with this past design pattern, multiple heat pipes and different sets of heat dissipation fins are often used to solve the high temperature phenomenon. This phenomenon cannot effectively reduce manufacturing costs, and Nor can it effectively solve the heat dissipation problem.

As the current heat pipe manufacturing technology continues to improve and the cooling power continues to increase, it is really necessary to improve past design habits to reduce costs.

In view of this, providing improvements to the heat dissipation devices used for electronic components in the past, coupled with some new design considerations to reduce thermal groups, can effectively solve the heat dissipation problem.

In order to effectively solve the aforementioned design method of the present invention, under the condition of effectively saving costs and optimizing the heat dissipation capability of the heat dissipation module. The heat pipe is a single heat pipe, and the heat dissipating fin group uses only two heat dissipating fin groups manufactured by a heat dissipating fin mold. Finally, the design of the laminar flow structure is used to reduce the heat group of the heat dissipation module to optimize the heat dissipation capacity.

A heat-dissipating device used in the present invention includes: a heat-dissipating device used in the present invention, comprising: a base plate; a first heat-dissipating fin group and a second heat-dissipating fin group; Neatly arranged perforations are provided; and a heat pipe connected to the first and second heat dissipation fin groups of the base plate includes: a heat absorption section combined with the base plate; a first heat radiation section passing through the first fin group Said perforation; a second exothermic section passing through said perforation of the second fin group; a first connecting section connecting the heat absorbing section and the first exothermic section; a second connecting section connecting the heat absorbing section and the second exothermic section Segment; wherein it is parallel to the heat absorption segment, and the first connection segment and the second connection segment are perpendicular to the heat absorption segment.

According to a first embodiment of the present invention, the second heat dissipation fin group and the first heat dissipation fin group have a horizontal translation relationship between left and right.

According to the second embodiment of the present invention, the second heat dissipation fin group and the first heat dissipation fin group have a horizontal translation relationship after being rotated horizontally by an angle of 180 degrees.

In a third embodiment of the present invention, the second heat dissipation fin group and the first heat dissipation fin group have a horizontal translation relationship after being flipped by an angle of 180 degrees.

Furthermore, the first heat dissipation fin group and the second heat dissipation fin group of the present invention are arranged in a dislocated manner, so that natural or forced convection airflow passes through the first fin group and enters the second fin. Because the laminar flow structure is damaged after the chip group to reduce the thermal resistance of the heat dissipation module, the fourth embodiment of the present invention places the second heat dissipation fin group and the first heat dissipation fin group in a slightly inconsistent misalignment. Way together.

Furthermore, the design of the heat dissipation fin group of the present invention has an inclined surface angle, so that even when the heat dissipation fin group is placed in parallel, it does not need to be intentionally misplaced and can cause misalignment between the fins, allowing natural convection or forced After the convective air flows through the first fin group and enters the second fin group, the laminar structure is destroyed to reduce the thermal resistance of the heat dissipation module.

1‧‧‧ floor

11‧‧‧ trench

2‧‧‧ heat pipe

21‧‧‧The first exothermic section

22‧‧‧Second Exothermic Section

23‧‧‧Endothermic section

24‧‧‧The first connection section

25‧‧‧Second connection section

3‧‧‧The first heat dissipation fin group

31‧‧‧ fins

32‧‧‧perforation

4‧‧‧Second heat dissipation fin group

41‧‧‧ fins

42‧‧‧perforation

100‧‧‧Cooling device

The following further describes the present invention with reference to the accompanying drawings: FIG. 1 is an assembly diagram of the first embodiment of the present invention; FIG. 2 is an exploded view of the first embodiment of the present invention; and FIG. 3 is a second embodiment of the present invention Fig. 4 is an exploded view of the second embodiment of the present invention; Fig. 5 is an exploded view of the third embodiment of the present invention; Fig. 6 is an exploded view of the third embodiment of the present invention; Assembly drawing of the fourth embodiment of the invention; FIG. 8 is an exploded assembly view of the fifth embodiment of the invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings and component symbols. The general practitioner of the present invention can implement it after reading the description of the present invention in detail.

The first diagram and the second diagram are combined diagrams according to the first embodiment of the present invention And an exploded view showing that the heat sink 100 of the present invention includes a base plate 1; a first heat sink fin group 3 and a second heat sink fin group 4 are placed on the base plate 1; and a heat pipe 2 connected to the base plate 1, The first heat radiation fin group 3 and the second heat radiation fin group 4, and the heat pipe 2 includes: a heat absorption section 23 combined with the bottom plate 1 and placed in a groove 11 provided in the bottom plate; a first heat radiation section 21 Is disposed in the first heat dissipation fin group 3 through the perforation 32 through the first fin group fin 31; the same second heat radiation section 22 passes through the perforation 42 through the second heat fin group fin 41 and The first connecting section 24 connects the heat absorbing section 23 and the first heat radiating section 21; the second connecting section 25 connects the heat absorbing section 23 and the second heat radiating section 22; The heat absorbing section 23 and the first heat radiating section 21 are parallel to the second heat radiating section 22.

In the first embodiment, in the first fin group 3 of the first fin group 3, there is a perforation 32 at the upper left side for the heat pipe 2 to pass through, and the middle of the fin 41 of the second fin group 4 at the upper left side is also There is a perforation 42 for the heat pipe 2 to pass through. Therefore, the second heat radiation fin group 4 and the first heat radiation fin group 3 are in a translation relationship. The two heat radiation fin groups are located at the positions of the perforations 32 and 42 of the heat pipes. It is on the same horizontal line, so there is no doubt that the first heat dissipation fin group 3 and the second heat dissipation fin group 4 are cast using the same mold.

The third and fourth figures are a combined view and an exploded view of the second embodiment of the present invention, showing the heat sink 100 of the present invention. The internal configuration is almost the same as the first embodiment, except that the first fin is different. In the middle of the fins 31 of the group 3, there is a perforation 32 for the heat pipe to pass through, and for the middle of the fins 41 of the second fin group 4, there is also a perforation 42 for the heat pipe to pass through, so the second The heat dissipation fin group 4 and the first heat dissipation fin group 3 are directly horizontally rotated and then translated. The positions of the perforations 32 and 42 of the heat pipes in the two heat dissipation fin groups are on the same horizontal line. One cooling fin group 3 and the second cooling fin group 4 are used There is no doubt that the same mold was cast.

The fifth and sixth figures are a combined view and an exploded view of the third embodiment of the present invention, showing the heat sink 100 of the present invention. The internal configuration is almost the same as the first and second embodiments, except that the first and second embodiments are different. A fin group 31 of a fin group 3 has a perforation 32 to the lower right to the middle, and a fin 41 of the second fin group 4 has a perforation 42 to the upper left to the middle. Therefore, the second heat dissipation fin group 4 and the first heat dissipation fin group 3 are in a relationship of translation after being turned 180 degrees, and the positions of the perforations 32 and 42 of the heat pipes 2 of the two heat dissipation fin groups are high and low, and They are not on the same horizontal line, so there is no doubt that the first heat dissipation fin group 3 and the second heat dissipation fin group 4 are cast using the same mold.

In the heat dissipation device of the third embodiment of the present invention, since a single heat pipe scheme is adopted, the single heat pipe must be modified to be high on one side and low on the other side, and it needs to cooperate with the perforation of the heat dissipation fins. The fin turning method allows the design of the heat pipe to be inserted one by one, so that the fan is less likely to collect heat when blown from the side, so the perforations in the heat sink fin group must be carefully designed, and the symmetrical relationship must be considered.

In the first three embodiments, the first heat dissipation fin group 3 and the second heat dissipation fin group 4 are arranged side by side. This side by side method has a disadvantage. When the fan is in the first heat dissipation fin group 3 or the second The side of the radiating fin group 4 blows cold air to the fins. Due to the strong adhesive force in the boundary layer, the fluid velocity is low and the distribution is uneven, resulting in weak convection of the fluid in the normal direction. The main conduction method is conduction by air fluid, but the thermal conductivity of air fluid is not high, the thermal resistance of heat conduction is very large, and convection does not play much role, so the heat transfer of the velocity boundary layer is the fluid and the fins The main obstacle to convective heat exchange between walls is to reduce the thickness of the boundary layer or destroy the boundary layer in order to enhance the heat transfer capacity. Become the main factor of heat dissipation, so as to truly reduce the thermal resistance.

The seventh figure is a combination diagram according to the fourth embodiment of the present invention. Since the overall thermal resistance must be reduced in order to improve the heat dissipation efficiency of the heat dissipation module, the first heat dissipation fin group 3 and the second heat dissipation fin group 4 are adopted. , Placed in a side-by-side manner different from the previous three embodiments, that is, slightly adjusted to a slightly inconsistent misalignment, so that when the fan is from the side of the first cooling fin group toward the first cooling fin The space between the fins 31 of the fin group 3 and the fins 41 of the second heat radiating fin group 4 is sent to the air, because the fins 31 of the first heat radiating fin group 3 and the fins 41 of the second heat radiating fin group 4 are radiated. The discontinuous laminar flow structure causes the laminar flow structure to be destroyed, so as to truly reduce the thermal resistance.

The eighth figure is an exploded assembly view according to the fifth embodiment of the present invention. The heat dissipation fin groups of the first four embodiments are formed by aluminum extrusion, while the heat dissipation fins of the fifth embodiment are formed one by one. The separation type aluminum sheet is assembled to easily control the pitch of the fins to achieve irregular destruction of the laminar flow structure to reduce thermal resistance and improve heat dissipation efficiency.

Although the present invention has been disclosed as above by way of example, it is not intended to limit the present invention. In the heat sink of the present invention, the same set of heat sink fin molds can be used, whether it is translation or inversion or spaced up and down. Any person with ordinary knowledge in the technical field can make some modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of protection of the appended claims. .

Claims (7)

A heat-dissipating device includes: a base plate; a first heat-dissipating fin group and a second heat-dissipating fin group are placed on the base plate, and the fins are provided with perforations arranged in order; and a heat pipe connected to the base plate first and The second heat radiation fin group includes: a heat absorption section combined with the bottom plate; a first heat radiation section through the perforation of the first fin group; a second heat radiation section through the second fin group; Said perforation; a first connection section connecting the heat absorption section and the first heat radiation section; a second connection section connecting the heat absorption section and the second heat radiation section; wherein the heat absorption section is parallel to the first connection section The second connection section is perpendicular to the heat absorption section. The heat dissipating device according to claim 1, wherein the first heat dissipating fin group and the second heat dissipating fin group are made of a same heat dissipating fin mold. The heat dissipation device according to claim 2, wherein the second heat dissipation fin group and the first heat dissipation fin group have a horizontal translation relationship between left and right. The heat dissipating device according to claim 2, wherein the second heat dissipating fin group and the first heat dissipating fin group have a relationship of horizontal translation after being turned by an angle of 180 degrees, and the heat pipe is passed through. The heat dissipating device according to claim 2, wherein the second heat dissipating fin group and the first heat dissipating fin group have a horizontal translation relationship after being rotated horizontally by an angle of 180 degrees. The heat dissipation device according to claim 1, wherein the first heat dissipation fin group and the second heat dissipation fin group are separated from each other. Positioned in a way that allows natural or forced convection airflow to pass through the first fin group and enter the second fin group because the laminar structure is destroyed to reduce thermal resistance. The heat dissipating device according to claim 6, wherein the design of the heat dissipating fin group has an inclined surface angle so that the heat dissipating fin group can be misplaced when placed, allowing natural or forced convection airflow to pass through the first fin group and enter the first fin group. After the two-fin group, the laminar structure was destroyed to reduce the thermal resistance.