TW201422135A - Electronic device - Google Patents
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Abstract
Description
本發明是有關於一種電子裝置,且特別是有關於一種配置有一導風罩的電子裝置。 The present invention relates to an electronic device, and more particularly to an electronic device configured with an air hood.
近年來隨著電腦科技的突飛猛進,使得電腦之運作速度不斷地提高,並且電腦主機內部之電子元件的發熱功率亦不斷地攀升。為了預防電腦主機之內部的電子元件過熱,而導致電子元件發生暫時性或永久性的失效,必須提供足夠的散熱效能給電腦內部之電子元件。因此,對於高發熱功率之熱源,例如中央處理單元、繪圖晶片、北橋晶片及南橋晶片等,通常會加裝散熱鰭片組來降低這些熱源之溫度。並且,為了讓散熱鰭片組所吸收的熱量能夠充份地散出機殼之外,機殼內部的熱對流效率就顯得格外地重要。 In recent years, with the rapid advancement of computer technology, the operation speed of computers has been continuously improved, and the heating power of electronic components inside computer mainframes has continuously increased. In order to prevent the electronic components inside the computer host from overheating, the electronic components may be temporarily or permanently disabled, and sufficient heat dissipation performance must be provided to the electronic components inside the computer. Therefore, for heat sources with high heating power, such as central processing units, graphics wafers, north bridge wafers, and south bridge wafers, heat sink fins are usually added to reduce the temperature of these heat sources. Moreover, in order to allow the heat absorbed by the heat sink fins to be sufficiently dispersed out of the casing, the heat convection efficiency inside the casing is particularly important.
特別以伺服器來說,由於伺服器必須具備足夠的穩定度與可靠度,才能夠避免所提供的服務中斷。因此,在伺服器的機殼內部通常還會配置有輔助散熱的導流結構,以增加熱對流的效率。舉例來說,可將一導風罩配置於伺服器的主機板上,風扇配置於主機板的一側且連通於導風罩,自風扇所吹出的氣流經過導風罩內部,而將主機板上電子元件的產熱隨著導風罩所導引之氣流而散逸出機殼之外。如此一來,伺服器的溫度得以降低,便能夠穩定運作。 Especially for the server, since the server must have sufficient stability and reliability, the service interruption provided can be avoided. Therefore, a flow guiding structure for assisting heat dissipation is usually disposed inside the casing of the server to increase the efficiency of heat convection. For example, an air hood can be disposed on the motherboard of the server, and the fan is disposed on one side of the motherboard and communicates with the air hood. The airflow blown from the fan passes through the inside of the air hood, and the motherboard is The heat generated by the upper electronic component escapes from the casing as the airflow guided by the air hood. In this way, the temperature of the server can be reduced, and the operation can be stabilized.
為了增加散熱鰭片組與熱源之間的熱交換,在一定容積下,散熱鰭片的數量越多使得散熱面積越大而能帶走越多的熱量。然而,由於散熱鰭片過密,對於氣流而言接近於一障礙物,大部分的氣流會繞過此散熱鰭片組,僅有一小部分的氣流自散熱鰭片之間通過,如此,可能導致散熱鰭片組所接觸的熱源發生散熱不良的狀況。 In order to increase the heat exchange between the heat dissipation fin group and the heat source, the larger the number of heat dissipation fins, the larger the heat dissipation area and the more heat can be taken away under a certain volume. However, since the heat sink fins are too dense, close to an obstacle for the airflow, most of the airflow bypasses the heat sink fin group, and only a small portion of the airflow passes between the heat sink fins, thus possibly causing heat dissipation. The heat source that the fin group contacts is in a poor heat dissipation condition.
本發明提供一種電子裝置,可降低發生散熱不良的機率。 The present invention provides an electronic device capable of reducing the probability of occurrence of poor heat dissipation.
本發明提出一種電子裝置,包括一主機板、一第一處理器模組、一第二處理器模組、一第一記憶體模組、一第二記憶體模組、多個風扇及一導風罩。第一處理器模組與第二處理器模組設置於主機板上。第一記憶體模組設置於主機板上且位於第一處理器模組之一第一側。第二記憶體模組設置於主機板上且位於第一處理器模組之相對於第一側之一第二側。多個風扇設置於主機板之一側。導風罩設置於主機板上,導風罩包括相鄰的三個氣流通道,三個氣流通道分別連通於部分之這些風扇,第一處理器模組與第二處理器模組前後排列地位於其中一個氣流通道內,第一記憶體模組及第二記憶體模組分別位於另外兩個氣流通道內,第一處理器模組與第二處理器模組所位在氣流通道所對應的風扇之數量大於另外兩個氣流通道所對應的風扇之數量。 The present invention provides an electronic device including a motherboard, a first processor module, a second processor module, a first memory module, a second memory module, a plurality of fans, and a guide wind cover. The first processor module and the second processor module are disposed on the motherboard. The first memory module is disposed on the motherboard and located on a first side of the first processor module. The second memory module is disposed on the motherboard and located on a second side of the first processor module relative to the first side. A plurality of fans are disposed on one side of the motherboard. The air hood is disposed on the main board, and the air hood includes three adjacent air flow channels, and the three air flow channels are respectively connected to the fan. The first processor module and the second processor module are located in front and rear. In one of the airflow channels, the first memory module and the second memory module are respectively located in the other two airflow channels, and the first processor module and the second processor module are located in the airflow channel corresponding to the fan. The number is greater than the number of fans corresponding to the other two airflow channels.
在本發明之一實施例中,電子裝置更包括一第三記憶體模組及一第四記憶體模組。第三記憶體模組設置於主機板上且位於第二處理器模組之一第一側,且第三記憶體模組之局部或全部與第一記憶體模組位於同一個該氣流通道。第四記憶體模組設置於主機板上且位於第二處理器模組之相對於第一側之一第二側,且第四記憶體模組之局部或全部與第二記憶體模組位於同一個氣流通道。 In an embodiment of the invention, the electronic device further includes a third memory module and a fourth memory module. The third memory module is disposed on the motherboard and located on a first side of the second processor module, and part or all of the third memory module is located in the same airflow channel as the first memory module. The fourth memory module is disposed on the motherboard and located on a second side of the second processor module relative to the first side, and part or all of the fourth memory module is located on the second memory module The same air flow channel.
在本發明之一實施例中,上述之導風罩包括相對之一第一側及一第二側,導風罩之第一側鄰近於這些風扇,導風罩之第一側之寬度大於導風罩之第二側之寬度。 In an embodiment of the invention, the air hood includes a first side and a second side, and the first side of the air hood is adjacent to the fan, and the first side of the air hood is wider than the guide. The width of the second side of the hood.
在本發明之一實施例中,上述之導風罩包括多個肋片及一蓋板,這些肋片連接於蓋板,且導風罩被這些肋片分為三個氣流通道。 In an embodiment of the invention, the air hood includes a plurality of ribs and a cover plate, the ribs are connected to the cover plate, and the air hood is divided into three air flow passages by the ribs.
在本發明之一實施例中,上述之導風罩包括至少一定位部,各定位部設置於肋片或蓋板,用以對位於主機板或這些風扇之間。 In an embodiment of the invention, the air hood includes at least one positioning portion, and each positioning portion is disposed on the rib or the cover plate for being located between the motherboard or the fans.
在本發明之一實施例中,上述之主機板包括至少一電子零件,電子零件於主機板上之投影重疊於這些肋片之其中之一在主機板上之投影,部分之肋片懸空於主機板以避開電子零件。 In an embodiment of the invention, the motherboard includes at least one electronic component, and a projection of the electronic component on the motherboard overlaps a projection of one of the ribs on the motherboard, and a portion of the rib is suspended from the host Board to avoid electronic parts.
在本發明之一實施例中,電子裝置更包括多個儲存裝置,位於主機板之至少一側,未連通於這三個氣流通道之這些風扇所吹出之氣流適於經過這些儲存裝置。 In an embodiment of the invention, the electronic device further includes a plurality of storage devices located on at least one side of the motherboard, and the airflows blown by the fans that are not connected to the three airflow passages are adapted to pass through the storage devices.
在本發明之一實施例中,電子裝置更包括一第一散熱 鰭片組及一第二散熱鰭片組。第一散熱鰭片組熱接觸於第一處理器模組,第一散熱鰭片組位於導風罩之位於中央的氣流通道內。第二散熱鰭片組熱接觸於第二處理器模組,第二散熱鰭片組之局部或全部位於導風罩之位於中央的氣流通道內。 In an embodiment of the invention, the electronic device further includes a first heat dissipation a fin set and a second heat sink fin set. The first heat sink fin group is in thermal contact with the first processor module, and the first heat sink fin group is located in the central air flow channel of the air duct. The second heat sink fin group is in thermal contact with the second processor module, and part or all of the second heat sink fin group is located in the central air flow channel of the air duct.
在本發明之一實施例中,風扇產生的氣流先流經第一處理器模組後再流經第二處理器模組,且第一散熱鰭片組之散熱鰭片的間距大於第二散熱鰭片組之散熱鰭片的間距。 In an embodiment of the present invention, the airflow generated by the fan flows through the first processor module and then flows through the second processor module, and the spacing of the heat dissipation fins of the first heat dissipation fin group is greater than the second heat dissipation. The spacing of the fins of the fin set.
基於上述,本發明之電子裝置將導風罩區分為三個氣流通道,搭配風扇連通於這三個氣流通道,並使第一散熱鰭片組、第一記憶體模組及第二記憶體模組分別位於三個氣流通道內,以強迫進入這三個氣流通道的氣流分別流經位於這三個氣流通道內的第一散熱鰭片組、第一記憶體模組及第二記憶體模組,可有效避免因第一散熱鰭片組之間的鰭片過密,使得氣流繞過第一散熱鰭片組,而導致第一處理器模組散熱不良的狀況。此外,由於第一處理器模組為電子裝置中的主要熱源之一,第一記憶體模組及第二記憶體模組為次要熱源,為了使第一散熱鰭片組所分配到的風量可足夠使第一處理器模組散熱,導風罩之位於中央的氣流通道所連通於這些風扇的數量分別大於導風罩之位於兩側的氣流通道所連通於這些風扇的數量,製造者可針對電子裝置內部的各熱源的產熱多寡而決定導風罩之各氣流通道所連通的風扇數量,以避免電子裝置中發生局部散熱 不良的狀況。 Based on the above, the electronic device of the present invention divides the air hood into three air flow passages, and the fan is connected to the three air flow passages, and the first heat dissipation fin group, the first memory module, and the second memory module are The groups are respectively located in the three airflow channels, and the airflow for forcing into the three airflow channels respectively flows through the first heat dissipation fin group, the first memory module and the second memory module located in the three airflow channels. Therefore, the fins between the first heat dissipation fin groups are prevented from being too dense, so that the airflow bypasses the first heat dissipation fin group, and the first processor module is in poor heat dissipation condition. In addition, since the first processor module is one of the main heat sources in the electronic device, the first memory module and the second memory module are secondary heat sources, and the air volume allocated to the first heat sink fin group is The first processor module is sufficient to dissipate heat, and the central airflow passage of the air duct is connected to the number of the fans, and the number of the air ducts on the two sides of the air duct is respectively connected to the number of the fans. The number of fans connected to the airflow passages of the air guiding hood is determined according to the heat generation of each heat source inside the electronic device to avoid local heat dissipation in the electronic device. Bad condition.
為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the present invention will be more apparent from the following description.
圖1是依照本發明之一實施例之一種電子裝置的示意圖。圖2是圖1之電子裝置之導風罩與主機板分離的示意圖。請參閱圖1及圖2,本實施例之電子裝置100包括一主機板110、一第一處理器模組120、一第一記憶體模組130、一第二記憶體模組135、多個風扇140、一導風罩150、一第二處理器模組160及一第一散熱鰭片組190。 1 is a schematic diagram of an electronic device in accordance with an embodiment of the present invention. 2 is a schematic view showing the air hood of the electronic device of FIG. 1 separated from the main board. Referring to FIG. 1 and FIG. 2 , the electronic device 100 of the embodiment includes a motherboard 110 , a first processor module 120 , a first memory module 130 , a second memory module 135 , and a plurality of The fan 140, a windshield 150, a second processor module 160, and a first heat sink fin set 190.
第一處理器模組120與第二處理器模組160設置於主機板110上。第一記憶體模組130設置於主機板110上且位於第一處理器模組120之一第一側122。第二記憶體模組135設置於主機板110上且位於第一處理器模組120之相對於第一側122之一第二側124。第一散熱鰭片組190熱接觸於第一處理器模組120。第二處理器模組160與這些風扇140之距離大於第一處理器模組120與這些風扇140的距離,也就是說,第一處理器模組120與第二處理器模組160前後排列地位於位於中央的氣流通道C內。風扇140設置於主機板110之一側。在本實施例中,風扇140的數量為七個,但風扇140的數量並不以此為限制。 The first processor module 120 and the second processor module 160 are disposed on the motherboard 110. The first memory module 130 is disposed on the motherboard 110 and located on a first side 122 of the first processor module 120. The second memory module 135 is disposed on the motherboard 110 and located on the second side 124 of the first processor module 120 relative to the first side 122 . The first heat dissipation fin set 190 is in thermal contact with the first processor module 120. The distance between the second processor module 160 and the fan 140 is greater than the distance between the first processor module 120 and the fan 140. That is, the first processor module 120 and the second processor module 160 are arranged one behind the other. Located in the central airflow channel C. The fan 140 is disposed on one side of the motherboard 110. In the present embodiment, the number of fans 140 is seven, but the number of fans 140 is not limited thereto.
導風罩150設置於主機板110上,在本實施例中,導風罩150包括相鄰的三個氣流通道C,三個氣流通道C分 別連通於部分之這些風扇140。並且,第一處理器模組120與第一散熱鰭片組190位於導風罩150之中央的氣流通道C內,第一記憶體模組130及第二記憶體模組135則分別位於兩側的氣流通道C內。當然,氣流通道C的數量可視不同電子裝置內部的熱源數量而異,不以上述為限制。 The air guiding cover 150 is disposed on the main board 110. In this embodiment, the air guiding cover 150 includes three adjacent air flow channels C, and three air flow channels C Do not connect to some of these fans 140. Moreover, the first processor module 120 and the first heat dissipation fin group 190 are located in the air flow channel C in the center of the air guiding cover 150, and the first memory module 130 and the second memory module 135 are respectively located on both sides. The air flow channel C is inside. Of course, the number of airflow channels C may vary depending on the number of heat sources inside the electronic device, and is not limited by the above.
由於第一處理器模組120為電子裝置100中的主要熱源之一,第一記憶體模組130及第二記憶體模組135為次要熱源,為了使第一散熱鰭片組190所分配到的風量可足夠使第一處理器模組120散熱,導風罩150之位於中央的氣流通道C所連通於這些風扇140的數量分別大於導風罩150之位於兩側的氣流通道C所連通於這些風扇140的數量。如圖1所示,位於圖面左方的氣流通道C連通於圖面最左方的一個風扇140,位於中央的氣流通道C連通於圖面自左方起的第二個至第四個風扇140,且位於圖面右方的氣流通道C連通於圖面自左方起的第五個風扇140。製造者可針對電子裝置100內部的各熱源的產熱多寡而決定導風罩150之各氣流通道C所連通的風扇140數量,以使電子裝置100內的各熱源之產熱均能與足夠的風量進行熱交換。 Since the first processor module 120 is one of the main heat sources in the electronic device 100, the first memory module 130 and the second memory module 135 are secondary heat sources, and the first heat dissipation fin group 190 is allocated. The airflow to the first processor module 120 is sufficient for the first processor module 120 to dissipate heat. The central airflow channel C of the air hood 150 is connected to the airflow channel C of the air hood 150 at the two sides. The number of these fans 140. As shown in FIG. 1 , the air flow channel C located on the left side of the drawing communicates with a fan 140 on the leftmost side of the drawing, and the air flow channel C located in the center communicates with the second to fourth fans from the left side of the drawing. 140, and the air flow channel C located on the right side of the drawing communicates with the fifth fan 140 from the left side of the drawing. The manufacturer can determine the number of fans 140 connected to the airflow passages C of the air duct 150 for the heat generation of each heat source inside the electronic device 100, so that the heat generated by each heat source in the electronic device 100 can be sufficient. The air volume is exchanged for heat.
在本實施例中,將第一記憶體模組130與第二記憶體模組135位在與第一處理器模組120及第二處理器模組160不同的氣流通道C中,便可視各氣流通道C所需的風量來以控制對應的風扇140運行狀況。舉例而言,第一處理器模組120與第二處理器模組160所位在氣流通道C所 對應的風扇140可有較大的轉速,以增進散熱效果。 In this embodiment, the first memory module 130 and the second memory module 135 are located in the airflow channel C different from the first processor module 120 and the second processor module 160, and The amount of air required by the airflow passage C is used to control the operation of the corresponding fan 140. For example, the first processor module 120 and the second processor module 160 are located in the airflow channel C. The corresponding fan 140 can have a large rotational speed to enhance the heat dissipation effect.
在本實施例中,導風罩150包括相對之一第一側152及一第二側154,導風罩150之第一側152鄰近於這些風扇140,以使自風扇140吹出的氣流流入氣流通道C內。在本實施例中,導風罩150之第一側152之寬度大於導風罩150之第二側154之寬度,這是由於位於中央的氣流通道C所連通的風扇140數量較多,因此位於中央的氣流通道C在第一側152有較寬的開口以同時接收三個風扇140的風量。當然,在其他實施例中,導風罩150之第一側152與第二側154的寬度關係可不以此為限制。 In the present embodiment, the air hood 150 includes a first side 152 and a second side 154. The first side 152 of the air hood 150 is adjacent to the fans 140 to allow airflow from the fan 140 to flow into the airflow. Inside channel C. In this embodiment, the width of the first side 152 of the air hood 150 is greater than the width of the second side 154 of the air hood 150. This is because the number of fans 140 connected by the air flow channel C located at the center is large. The central airflow passage C has a wider opening on the first side 152 to simultaneously receive the air volume of the three fans 140. Of course, in other embodiments, the width relationship between the first side 152 and the second side 154 of the air hood 150 may not be limited thereto.
圖3是圖1之電子裝置之導風罩的正面立體示意圖。圖4是圖1之電子裝置之導風罩的反面立體示意圖。請參閱圖3及圖4,導風罩150包括多個肋片156、一蓋板158及至少一定位部159,這些肋片156連接於蓋板158,且導風罩150被這些肋片156分為這三個氣流通道C。導風罩150包括至少一定位部159,各定位部159可設置於肋片156或蓋板158,用以對位於主機板110或這些風扇140之間。在本實施例中,定位部159的數量為兩個,分別設置於蓋板158上,當導風罩150裝設於主機板110上時,定位部159卡固於風扇140之間的空隙,以使導風罩150定位。 3 is a front perspective view of the air hood of the electronic device of FIG. 1. 4 is a perspective view of the reverse side of the air hood of the electronic device of FIG. 1. Referring to FIGS. 3 and 4 , the air guiding cover 150 includes a plurality of ribs 156 , a cover plate 158 and at least one positioning portion 159 . The ribs 156 are connected to the cover plate 158 , and the air guiding cover 150 is surrounded by the ribs 156 . Divided into these three airflow channels C. The air guiding cover 150 includes at least one positioning portion 159, and each positioning portion 159 can be disposed on the rib 156 or the cover plate 158 for being located between the motherboard 110 or the fans 140. In this embodiment, the number of the positioning portions 159 is two, which are respectively disposed on the cover plate 158. When the air guiding cover 150 is mounted on the motherboard 110, the positioning portion 159 is locked in the gap between the fans 140. To position the air hood 150.
此外,由於主機板110包括至少一電子零件112,電子零件112可以是電容或是電阻等元件,但電子零件112之種類並不以此為限制。當導風罩150裝設於主機板110 上時,電子零件112於主機板110上之投影可能會重疊於這些肋片156之其中之一在主機板110上之投影。也就是說,肋片156可能被這些電子零件112卡到而無法穩固地立起於主機板110上。為了避免上述狀況,部分之肋片156懸空於主機板110以避開電子零件112,在本實施例中,肋片156在欲懸空於主機板110的位置包括一缺口156a,肋片156透過缺口156a以避開電子零件112,而肋片156仍可藉由其他部分立起於主機板110上。 In addition, since the motherboard 110 includes at least one electronic component 112, the electronic component 112 may be a component such as a capacitor or a resistor, but the type of the electronic component 112 is not limited thereto. When the air hood 150 is mounted on the motherboard 110 In the above, the projection of the electronic component 112 on the motherboard 110 may overlap the projection of one of the ribs 156 on the motherboard 110. That is, the ribs 156 may be caught by the electronic components 112 and cannot be firmly erected on the motherboard 110. In order to avoid the above situation, a portion of the rib 156 is suspended from the motherboard 110 to avoid the electronic component 112. In the present embodiment, the rib 156 includes a notch 156a at a position to be suspended from the motherboard 110, and the rib 156 passes through the notch. 156a avoids the electronic component 112, and the ribs 156 can still be erected on the motherboard 110 by other portions.
此外,在本實施例中,電子裝置100更、一第三記憶體模組170、一第四記憶體模組175及一第二散熱鰭片組195。第二散熱鰭片組195熱接觸於第二處理器模組160,第二散熱鰭片組195之局部位於導風罩150之位於中央的氣流通道C內。如圖1所示,在本實施例中,自圖面左方之第二個至第五個風扇140吹出的氣流會先經過第一散熱鰭片組190之後再經過第二散熱鰭片組195。 In addition, in the embodiment, the electronic device 100 further includes a third memory module 170, a fourth memory module 175, and a second heat sink fin group 195. The second heat dissipation fin group 195 is in thermal contact with the second processor module 160, and a portion of the second heat dissipation fin group 195 is located in the centrally located air flow channel C of the air duct 150. As shown in FIG. 1 , in this embodiment, the airflow blown from the second to fifth fans 140 on the left side of the drawing surface passes through the first heat dissipation fin set 190 and then passes through the second heat dissipation fin set 195. .
如圖1所示,在本實施例中,風扇140產生的氣流先流經第一處理器模組120後再流經第二處理器模組160,且第一散熱鰭片組190之散熱鰭片的間距大於第二散熱鰭片組195之散熱鰭片的間距。由於散熱效果與氣流的速度有關,如果位於氣流通道C前側的散熱鰭片(第一散熱鰭片組190之散熱鰭片)過密,氣流流經後流速會變得較慢,會影響後側散熱鰭片(第二散熱鰭片組195)的散熱效果。因此,在本實施例中,靠近風扇140的第一散熱鰭片組190的散熱鰭片之間距較寬,會使氣流經過後仍具有較快流 速;另一方面,氣流快速流過鰭片後溫度也不會變得很高。 As shown in FIG. 1 , in this embodiment, the airflow generated by the fan 140 first flows through the first processor module 120 and then flows through the second processor module 160, and the heat dissipation fins of the first heat dissipation fin group 190 The pitch of the sheets is greater than the pitch of the heat dissipation fins of the second heat dissipation fin group 195. Since the heat dissipation effect is related to the speed of the airflow, if the heat dissipation fins on the front side of the airflow passage C (the heat dissipation fins of the first heat dissipation fin group 190) are too dense, the flow velocity will become slower after the airflow, which will affect the rear heat dissipation. The heat dissipation effect of the fins (second heat sink fin group 195). Therefore, in the embodiment, the distance between the heat dissipation fins of the first heat dissipation fin group 190 of the fan 140 is wider, and the airflow still has a faster flow after passing through the airflow. Speed; on the other hand, the temperature does not become very high after the airflow quickly flows through the fins.
第三記憶體模組170設置於主機板110上且位於第二處理器模組160之一第一側162,且第三記憶體模組170之局部與第一記憶體模組130位於同一個氣流通道C。也就是說,自圖面之最左邊的風扇140吹出的氣流會先經過第一記憶體模組130之後再經過第三記憶體模組170。 The third memory module 170 is disposed on the motherboard 110 and located on the first side 162 of the second processor module 160, and a portion of the third memory module 170 is located in the same state as the first memory module 130. Air flow channel C. That is to say, the airflow blown from the leftmost fan 140 of the drawing surface passes through the first memory module 130 and then passes through the third memory module 170.
第四記憶體模組175設置於主機板110上且位於第二處理器模組160之相對於第一側162之一第二側164,且第四記憶體模組175之局部與第二記憶體模組135位於同一個氣流通道C。也就是說,自圖面左方第五個風扇140吹出的氣流會先經過第二記憶體模組135之後再經過第四記憶體模組175。 The fourth memory module 175 is disposed on the motherboard 110 and located on the second side 164 of the second processor module 160 relative to the first side 162, and the second memory module 175 is partially and second memory The body module 135 is located in the same air flow channel C. That is to say, the airflow blown from the fifth fan 140 on the left side of the drawing passes through the second memory module 135 and then passes through the fourth memory module 175.
在本實施例中,由於第二散熱鰭片組195、第三記憶體模組170及第四記憶體模組175分別僅以局部位於導風罩150之三個氣流通道C內,當氣流流出於這三個氣流通道C之後便可混合後再流出於電子裝置100。當然,在其他實施例中,亦可加長導風罩150之第一側152至第二側154的長度,使整個第二處理器模組160及整個第二散熱鰭片組195位於導風罩150之中央的氣流通道C內,整個第三記憶體模組170與第一記憶體模組130位於導風罩150之側邊的氣流通道C內,整個第四記憶體模組175與第二記憶體模組135位於導風罩150之另一側的氣流通道C內,以使這三個氣流通道C在流出於電子裝置100之前均不混流。導風罩150之第一側152至第二側154的長度 不以此為限制。 In this embodiment, the second heat dissipation fin set 195, the third memory module 170, and the fourth memory module 175 are only partially located in the three air flow passages C of the air duct 150, when the airflow flows out. After the three air flow channels C, they can be mixed and then flow out to the electronic device 100. Of course, in other embodiments, the length of the first side 152 to the second side 154 of the air hood 150 may be lengthened, so that the entire second processor module 160 and the entire second heat sink fin group 195 are located in the air hood. In the air flow channel C at the center of the 150, the entire third memory module 170 and the first memory module 130 are located in the air flow channel C on the side of the air hood 150, and the entire fourth memory module 175 and the second The memory module 135 is located in the air flow channel C on the other side of the air hood 150 such that the three air flow channels C do not mix before flowing out of the electronic device 100. The length of the first side 152 to the second side 154 of the air hood 150 Not limited to this.
此外,如圖1所示,在本實施例中,電子裝置100更包括多個儲存裝置180,位於主機板110之至少一側。由於儲存裝置180在運作時會產熱,未連通於這三個氣流通道C之這些風扇140(如圖面上右方的第一個及第二個風扇140)可朝向這些儲存裝置180來設置,以使其所吹出之氣流經過儲存裝置180而帶走儲存裝置180運作時的產熱。 In addition, as shown in FIG. 1 , in the embodiment, the electronic device 100 further includes a plurality of storage devices 180 located on at least one side of the motherboard 110 . Since the storage device 180 generates heat during operation, the fans 140 (the first and second fans 140 on the right side of the surface) that are not connected to the three air flow passages C can be set toward the storage devices 180. The heat generated by the operation of the storage device 180 is carried away by the airflow blown by the storage device 180.
綜上所述,本發明之電子裝置將導風罩區分為三個氣流通道,搭配風扇連通於這三個氣流通道,並使第一散熱鰭片組、第一記憶體模組及第二記憶體模組分別位於三個氣流通道內,以強迫進入這三個氣流通道的氣流分別流經位於這三個氣流通道內的第一散熱鰭片組、第一記憶體模組及第二記憶體模組,可有效避免因第一散熱鰭片組之間的鰭片過密,使得氣流繞過第一散熱鰭片組,而導致第一處理器模組散熱不良的狀況。此外,由於第一處理器模組為電子裝置中的主要熱源之一,第一記憶體模組及第二記憶體模組為次要熱源,為了使第一散熱鰭片組所分配到的風量可足夠使第一處理器模組散熱,導風罩之位於中央的氣流通道所連通於這些風扇的數量分別大於導風罩之位於兩側的氣流通道所連通於這些風扇的數量,製造者可針對電子裝置內部的各熱源的產熱多寡而決定導風罩之各氣流通道所連通的風扇數量,以避免電子裝置中發生局部散熱不良的狀況。 In summary, the electronic device of the present invention divides the air hood into three airflow passages, and communicates with the fan through the three airflow passages, and makes the first heat dissipation fin set, the first memory module, and the second memory. The body modules are respectively located in the three airflow channels, and the airflow for forcing into the three airflow channels respectively flows through the first heat dissipation fin group, the first memory module and the second memory in the three airflow channels. The module can effectively prevent the fins between the first heat dissipation fin groups from being too dense, so that the airflow bypasses the first heat dissipation fin group, and the first processor module is in poor heat dissipation condition. In addition, since the first processor module is one of the main heat sources in the electronic device, the first memory module and the second memory module are secondary heat sources, and the air volume allocated to the first heat sink fin group is The first processor module is sufficient to dissipate heat, and the central airflow passage of the air duct is connected to the number of the fans, and the number of the air ducts on the two sides of the air duct is respectively connected to the number of the fans. The number of fans connected to each airflow passage of the air duct is determined for the amount of heat generated by each heat source inside the electronic device, so as to avoid local heat dissipation failure in the electronic device.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
C‧‧‧氣流通道 C‧‧‧Air passage
100‧‧‧電子裝置 100‧‧‧Electronic devices
110‧‧‧主機板 110‧‧‧ motherboard
112‧‧‧電子零件 112‧‧‧Electronic parts
120‧‧‧第一處理器模組 120‧‧‧First processor module
122‧‧‧第一側 122‧‧‧ first side
124‧‧‧第二側 124‧‧‧ second side
130‧‧‧第一記憶體模組 130‧‧‧First Memory Module
135‧‧‧第二記憶體模組 135‧‧‧Second memory module
140‧‧‧風扇 140‧‧‧fan
150‧‧‧導風罩 150‧‧‧wind hood
152‧‧‧第一側 152‧‧‧ first side
154‧‧‧第二側 154‧‧‧ second side
156‧‧‧肋片 156‧‧‧ Ribs
156a‧‧‧缺口 156a‧‧ ‧ gap
158‧‧‧蓋板 158‧‧‧ cover
159‧‧‧定位部 159‧‧‧ Positioning Department
160‧‧‧第二處理器模組 160‧‧‧Second processor module
162‧‧‧第一側 162‧‧‧ first side
164‧‧‧第二側 164‧‧‧ second side
170‧‧‧第三記憶體模組 170‧‧‧ third memory module
175‧‧‧第四記憶體模組 175‧‧‧fourth memory module
180‧‧‧儲存裝置 180‧‧‧Storage device
190‧‧‧第一散熱鰭片組 190‧‧‧First heat sink fin set
195‧‧‧第二散熱鰭片組 195‧‧‧Second heat sink fin set
圖1是依照本發明之一實施例之一種電子裝置的示意圖。 1 is a schematic diagram of an electronic device in accordance with an embodiment of the present invention.
圖2是圖1之電子裝置之導風罩與主機板分離的示意圖。 2 is a schematic view showing the air hood of the electronic device of FIG. 1 separated from the main board.
圖3是圖1之電子裝置之導風罩的正面立體示意圖。 3 is a front perspective view of the air hood of the electronic device of FIG. 1.
圖4是圖1之電子裝置之導風罩的反面立體示意圖。 4 is a perspective view of the reverse side of the air hood of the electronic device of FIG. 1.
C‧‧‧氣流通道 C‧‧‧Air passage
100‧‧‧電子裝置 100‧‧‧Electronic devices
110‧‧‧主機板 110‧‧‧ motherboard
112‧‧‧電子零件 112‧‧‧Electronic parts
120‧‧‧第一處理器模組 120‧‧‧First processor module
122‧‧‧第一側 122‧‧‧ first side
124‧‧‧第二側 124‧‧‧ second side
130‧‧‧第一記憶體模組 130‧‧‧First Memory Module
135‧‧‧第二記憶體模組 135‧‧‧Second memory module
140‧‧‧風扇 140‧‧‧fan
150‧‧‧導風罩 150‧‧‧wind hood
152‧‧‧第一側 152‧‧‧ first side
154‧‧‧第二側 154‧‧‧ second side
156‧‧‧肋片 156‧‧‧ Ribs
156a‧‧‧缺口 156a‧‧ ‧ gap
158‧‧‧蓋板 158‧‧‧ cover
159‧‧‧定位部 159‧‧‧ Positioning Department
160‧‧‧第二處理器模組 160‧‧‧Second processor module
162‧‧‧第一側 162‧‧‧ first side
164‧‧‧第二側 164‧‧‧ second side
170‧‧‧第三記憶體模組 170‧‧‧ third memory module
175‧‧‧第四記憶體模組 175‧‧‧fourth memory module
180‧‧‧儲存裝置 180‧‧‧Storage device
190‧‧‧第一散熱鰭片組 190‧‧‧First heat sink fin set
195‧‧‧第二散熱鰭片組 195‧‧‧Second heat sink fin set
Claims (9)
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TW101144567A TW201422135A (en) | 2012-11-28 | 2012-11-28 | Electronic device |
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TW101144567A TW201422135A (en) | 2012-11-28 | 2012-11-28 | Electronic device |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106125870A (en) * | 2016-07-08 | 2016-11-16 | 英业达科技有限公司 | Server |
CN106502340A (en) * | 2016-11-02 | 2017-03-15 | 英业达科技有限公司 | Server |
CN109960380A (en) * | 2017-12-22 | 2019-07-02 | 鸿富锦精密电子(天津)有限公司 | Wind scooper, cabinet and electronic device using the wind scooper |
US20220322568A1 (en) * | 2021-04-06 | 2022-10-06 | Aewin Technologies Co., Ltd. | Heat dissipation device |
-
2012
- 2012-11-28 TW TW101144567A patent/TW201422135A/en unknown
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106125870A (en) * | 2016-07-08 | 2016-11-16 | 英业达科技有限公司 | Server |
CN106502340A (en) * | 2016-11-02 | 2017-03-15 | 英业达科技有限公司 | Server |
CN106502340B (en) * | 2016-11-02 | 2019-06-28 | 英业达科技有限公司 | Server |
CN109960380A (en) * | 2017-12-22 | 2019-07-02 | 鸿富锦精密电子(天津)有限公司 | Wind scooper, cabinet and electronic device using the wind scooper |
US20220322568A1 (en) * | 2021-04-06 | 2022-10-06 | Aewin Technologies Co., Ltd. | Heat dissipation device |
US11696419B2 (en) * | 2021-04-06 | 2023-07-04 | Aewin Technologies Co., Ltd. | Heat dissipation device |
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