TW201422135A - Electronic device - Google Patents

Abstract

An electronic device includes a motherboard, a first processor module, a second processor module, a first memory module, a second memory module, a plurality of fans and a wind shield is provided. The first and second processor modules are disposed on the motherboard. The first and second memory modules are disposed at two side of the first processor module. The wind shield includes three neighboring air channels connected through the fans, respectively. The first and second processor modules are sited in one of the air channels, and the first memory module and the second memory module are in another two air channels. Amount of fans corresponding to the air channel where the first and second processor modules are sited is larger than that of fans corresponding to another two air channel.

Description

Electronic device

The present invention relates to an electronic device, and more particularly to an electronic device configured with an air hood.

In recent years, with the rapid advancement of computer technology, the operation speed of computers has been continuously improved, and the heating power of electronic components inside computer mainframes has continuously increased. In order to prevent the electronic components inside the computer host from overheating, the electronic components may be temporarily or permanently disabled, and sufficient heat dissipation performance must be provided to the electronic components inside the computer. Therefore, for heat sources with high heating power, such as central processing units, graphics wafers, north bridge wafers, and south bridge wafers, heat sink fins are usually added to reduce the temperature of these heat sources. Moreover, in order to allow the heat absorbed by the heat sink fins to be sufficiently dispersed out of the casing, the heat convection efficiency inside the casing is particularly important.

Especially for the server, since the server must have sufficient stability and reliability, the service interruption provided can be avoided. Therefore, a flow guiding structure for assisting heat dissipation is usually disposed inside the casing of the server to increase the efficiency of heat convection. For example, an air hood can be disposed on the motherboard of the server, and the fan is disposed on one side of the motherboard and communicates with the air hood. The airflow blown from the fan passes through the inside of the air hood, and the motherboard is The heat generated by the upper electronic component escapes from the casing as the airflow guided by the air hood. In this way, the temperature of the server can be reduced, and the operation can be stabilized.

In order to increase the heat exchange between the heat dissipation fin group and the heat source, the larger the number of heat dissipation fins, the larger the heat dissipation area and the more heat can be taken away under a certain volume. However, since the heat sink fins are too dense, close to an obstacle for the airflow, most of the airflow bypasses the heat sink fin group, and only a small portion of the airflow passes between the heat sink fins, thus possibly causing heat dissipation. The heat source that the fin group contacts is in a poor heat dissipation condition.

The present invention provides an electronic device capable of reducing the probability of occurrence of poor heat dissipation.

The present invention provides an electronic device including a motherboard, a first processor module, a second processor module, a first memory module, a second memory module, a plurality of fans, and a guide wind cover. The first processor module and the second processor module are disposed on the motherboard. The first memory module is disposed on the motherboard and located on a first side of the first processor module. The second memory module is disposed on the motherboard and located on a second side of the first processor module relative to the first side. A plurality of fans are disposed on one side of the motherboard. The air hood is disposed on the main board, and the air hood includes three adjacent air flow channels, and the three air flow channels are respectively connected to the fan. The first processor module and the second processor module are located in front and rear. In one of the airflow channels, the first memory module and the second memory module are respectively located in the other two airflow channels, and the first processor module and the second processor module are located in the airflow channel corresponding to the fan. The number is greater than the number of fans corresponding to the other two airflow channels.

In an embodiment of the invention, the electronic device further includes a third memory module and a fourth memory module. The third memory module is disposed on the motherboard and located on a first side of the second processor module, and part or all of the third memory module is located in the same airflow channel as the first memory module. The fourth memory module is disposed on the motherboard and located on a second side of the second processor module relative to the first side, and part or all of the fourth memory module is located on the second memory module The same air flow channel.

In an embodiment of the invention, the air hood includes a first side and a second side, and the first side of the air hood is adjacent to the fan, and the first side of the air hood is wider than the guide. The width of the second side of the hood.

In an embodiment of the invention, the air hood includes a plurality of ribs and a cover plate, the ribs are connected to the cover plate, and the air hood is divided into three air flow passages by the ribs.

In an embodiment of the invention, the air hood includes at least one positioning portion, and each positioning portion is disposed on the rib or the cover plate for being located between the motherboard or the fans.

In an embodiment of the invention, the motherboard includes at least one electronic component, and a projection of the electronic component on the motherboard overlaps a projection of one of the ribs on the motherboard, and a portion of the rib is suspended from the host Board to avoid electronic parts.

In an embodiment of the invention, the electronic device further includes a plurality of storage devices located on at least one side of the motherboard, and the airflows blown by the fans that are not connected to the three airflow passages are adapted to pass through the storage devices.

In an embodiment of the invention, the electronic device further includes a first heat dissipation a fin set and a second heat sink fin set. The first heat sink fin group is in thermal contact with the first processor module, and the first heat sink fin group is located in the central air flow channel of the air duct. The second heat sink fin group is in thermal contact with the second processor module, and part or all of the second heat sink fin group is located in the central air flow channel of the air duct.

In an embodiment of the present invention, the airflow generated by the fan flows through the first processor module and then flows through the second processor module, and the spacing of the heat dissipation fins of the first heat dissipation fin group is greater than the second heat dissipation. The spacing of the fins of the fin set.

Based on the above, the electronic device of the present invention divides the air hood into three air flow passages, and the fan is connected to the three air flow passages, and the first heat dissipation fin group, the first memory module, and the second memory module are The groups are respectively located in the three airflow channels, and the airflow for forcing into the three airflow channels respectively flows through the first heat dissipation fin group, the first memory module and the second memory module located in the three airflow channels. Therefore, the fins between the first heat dissipation fin groups are prevented from being too dense, so that the airflow bypasses the first heat dissipation fin group, and the first processor module is in poor heat dissipation condition. In addition, since the first processor module is one of the main heat sources in the electronic device, the first memory module and the second memory module are secondary heat sources, and the air volume allocated to the first heat sink fin group is The first processor module is sufficient to dissipate heat, and the central airflow passage of the air duct is connected to the number of the fans, and the number of the air ducts on the two sides of the air duct is respectively connected to the number of the fans. The number of fans connected to the airflow passages of the air guiding hood is determined according to the heat generation of each heat source inside the electronic device to avoid local heat dissipation in the electronic device. Bad condition.

The above described features and advantages of the present invention will be more apparent from the following description.

1 is a schematic diagram of an electronic device in accordance with an embodiment of the present invention. 2 is a schematic view showing the air hood of the electronic device of FIG. 1 separated from the main board. Referring to FIG. 1 and FIG. 2 , the electronic device 100 of the embodiment includes a motherboard 110 , a first processor module 120 , a first memory module 130 , a second memory module 135 , and a plurality of The fan 140, a windshield 150, a second processor module 160, and a first heat sink fin set 190.

The first processor module 120 and the second processor module 160 are disposed on the motherboard 110. The first memory module 130 is disposed on the motherboard 110 and located on a first side 122 of the first processor module 120. The second memory module 135 is disposed on the motherboard 110 and located on the second side 124 of the first processor module 120 relative to the first side 122 . The first heat dissipation fin set 190 is in thermal contact with the first processor module 120. The distance between the second processor module 160 and the fan 140 is greater than the distance between the first processor module 120 and the fan 140. That is, the first processor module 120 and the second processor module 160 are arranged one behind the other. Located in the central airflow channel C. The fan 140 is disposed on one side of the motherboard 110. In the present embodiment, the number of fans 140 is seven, but the number of fans 140 is not limited thereto.

The air guiding cover 150 is disposed on the main board 110. In this embodiment, the air guiding cover 150 includes three adjacent air flow channels C, and three air flow channels C Do not connect to some of these fans 140. Moreover, the first processor module 120 and the first heat dissipation fin group 190 are located in the air flow channel C in the center of the air guiding cover 150, and the first memory module 130 and the second memory module 135 are respectively located on both sides. The air flow channel C is inside. Of course, the number of airflow channels C may vary depending on the number of heat sources inside the electronic device, and is not limited by the above.

Since the first processor module 120 is one of the main heat sources in the electronic device 100, the first memory module 130 and the second memory module 135 are secondary heat sources, and the first heat dissipation fin group 190 is allocated. The airflow to the first processor module 120 is sufficient for the first processor module 120 to dissipate heat. The central airflow channel C of the air hood 150 is connected to the airflow channel C of the air hood 150 at the two sides. The number of these fans 140. As shown in FIG. 1 , the air flow channel C located on the left side of the drawing communicates with a fan 140 on the leftmost side of the drawing, and the air flow channel C located in the center communicates with the second to fourth fans from the left side of the drawing. 140, and the air flow channel C located on the right side of the drawing communicates with the fifth fan 140 from the left side of the drawing. The manufacturer can determine the number of fans 140 connected to the airflow passages C of the air duct 150 for the heat generation of each heat source inside the electronic device 100, so that the heat generated by each heat source in the electronic device 100 can be sufficient. The air volume is exchanged for heat.

In this embodiment, the first memory module 130 and the second memory module 135 are located in the airflow channel C different from the first processor module 120 and the second processor module 160, and The amount of air required by the airflow passage C is used to control the operation of the corresponding fan 140. For example, the first processor module 120 and the second processor module 160 are located in the airflow channel C. The corresponding fan 140 can have a large rotational speed to enhance the heat dissipation effect.

In the present embodiment, the air hood 150 includes a first side 152 and a second side 154. The first side 152 of the air hood 150 is adjacent to the fans 140 to allow airflow from the fan 140 to flow into the airflow. Inside channel C. In this embodiment, the width of the first side 152 of the air hood 150 is greater than the width of the second side 154 of the air hood 150. This is because the number of fans 140 connected by the air flow channel C located at the center is large. The central airflow passage C has a wider opening on the first side 152 to simultaneously receive the air volume of the three fans 140. Of course, in other embodiments, the width relationship between the first side 152 and the second side 154 of the air hood 150 may not be limited thereto.

3 is a front perspective view of the air hood of the electronic device of FIG. 1. 4 is a perspective view of the reverse side of the air hood of the electronic device of FIG. 1. Referring to FIGS. 3 and 4 , the air guiding cover 150 includes a plurality of ribs 156 , a cover plate 158 and at least one positioning portion 159 . The ribs 156 are connected to the cover plate 158 , and the air guiding cover 150 is surrounded by the ribs 156 . Divided into these three airflow channels C. The air guiding cover 150 includes at least one positioning portion 159, and each positioning portion 159 can be disposed on the rib 156 or the cover plate 158 for being located between the motherboard 110 or the fans 140. In this embodiment, the number of the positioning portions 159 is two, which are respectively disposed on the cover plate 158. When the air guiding cover 150 is mounted on the motherboard 110, the positioning portion 159 is locked in the gap between the fans 140. To position the air hood 150.

In addition, since the motherboard 110 includes at least one electronic component 112, the electronic component 112 may be a component such as a capacitor or a resistor, but the type of the electronic component 112 is not limited thereto. When the air hood 150 is mounted on the motherboard 110 In the above, the projection of the electronic component 112 on the motherboard 110 may overlap the projection of one of the ribs 156 on the motherboard 110. That is, the ribs 156 may be caught by the electronic components 112 and cannot be firmly erected on the motherboard 110. In order to avoid the above situation, a portion of the rib 156 is suspended from the motherboard 110 to avoid the electronic component 112. In the present embodiment, the rib 156 includes a notch 156a at a position to be suspended from the motherboard 110, and the rib 156 passes through the notch. 156a avoids the electronic component 112, and the ribs 156 can still be erected on the motherboard 110 by other portions.

In addition, in the embodiment, the electronic device 100 further includes a third memory module 170, a fourth memory module 175, and a second heat sink fin group 195. The second heat dissipation fin group 195 is in thermal contact with the second processor module 160, and a portion of the second heat dissipation fin group 195 is located in the centrally located air flow channel C of the air duct 150. As shown in FIG. 1 , in this embodiment, the airflow blown from the second to fifth fans 140 on the left side of the drawing surface passes through the first heat dissipation fin set 190 and then passes through the second heat dissipation fin set 195. .

As shown in FIG. 1 , in this embodiment, the airflow generated by the fan 140 first flows through the first processor module 120 and then flows through the second processor module 160, and the heat dissipation fins of the first heat dissipation fin group 190 The pitch of the sheets is greater than the pitch of the heat dissipation fins of the second heat dissipation fin group 195. Since the heat dissipation effect is related to the speed of the airflow, if the heat dissipation fins on the front side of the airflow passage C (the heat dissipation fins of the first heat dissipation fin group 190) are too dense, the flow velocity will become slower after the airflow, which will affect the rear heat dissipation. The heat dissipation effect of the fins (second heat sink fin group 195). Therefore, in the embodiment, the distance between the heat dissipation fins of the first heat dissipation fin group 190 of the fan 140 is wider, and the airflow still has a faster flow after passing through the airflow. Speed; on the other hand, the temperature does not become very high after the airflow quickly flows through the fins.

The third memory module 170 is disposed on the motherboard 110 and located on the first side 162 of the second processor module 160, and a portion of the third memory module 170 is located in the same state as the first memory module 130. Air flow channel C. That is to say, the airflow blown from the leftmost fan 140 of the drawing surface passes through the first memory module 130 and then passes through the third memory module 170.

The fourth memory module 175 is disposed on the motherboard 110 and located on the second side 164 of the second processor module 160 relative to the first side 162, and the second memory module 175 is partially and second memory The body module 135 is located in the same air flow channel C. That is to say, the airflow blown from the fifth fan 140 on the left side of the drawing passes through the second memory module 135 and then passes through the fourth memory module 175.

In this embodiment, the second heat dissipation fin set 195, the third memory module 170, and the fourth memory module 175 are only partially located in the three air flow passages C of the air duct 150, when the airflow flows out. After the three air flow channels C, they can be mixed and then flow out to the electronic device 100. Of course, in other embodiments, the length of the first side 152 to the second side 154 of the air hood 150 may be lengthened, so that the entire second processor module 160 and the entire second heat sink fin group 195 are located in the air hood. In the air flow channel C at the center of the 150, the entire third memory module 170 and the first memory module 130 are located in the air flow channel C on the side of the air hood 150, and the entire fourth memory module 175 and the second The memory module 135 is located in the air flow channel C on the other side of the air hood 150 such that the three air flow channels C do not mix before flowing out of the electronic device 100. The length of the first side 152 to the second side 154 of the air hood 150 Not limited to this.

In addition, as shown in FIG. 1 , in the embodiment, the electronic device 100 further includes a plurality of storage devices 180 located on at least one side of the motherboard 110 . Since the storage device 180 generates heat during operation, the fans 140 (the first and second fans 140 on the right side of the surface) that are not connected to the three air flow passages C can be set toward the storage devices 180. The heat generated by the operation of the storage device 180 is carried away by the airflow blown by the storage device 180.

In summary, the electronic device of the present invention divides the air hood into three airflow passages, and communicates with the fan through the three airflow passages, and makes the first heat dissipation fin set, the first memory module, and the second memory. The body modules are respectively located in the three airflow channels, and the airflow for forcing into the three airflow channels respectively flows through the first heat dissipation fin group, the first memory module and the second memory in the three airflow channels. The module can effectively prevent the fins between the first heat dissipation fin groups from being too dense, so that the airflow bypasses the first heat dissipation fin group, and the first processor module is in poor heat dissipation condition. In addition, since the first processor module is one of the main heat sources in the electronic device, the first memory module and the second memory module are secondary heat sources, and the air volume allocated to the first heat sink fin group is The first processor module is sufficient to dissipate heat, and the central airflow passage of the air duct is connected to the number of the fans, and the number of the air ducts on the two sides of the air duct is respectively connected to the number of the fans. The number of fans connected to each airflow passage of the air duct is determined for the amount of heat generated by each heat source inside the electronic device, so as to avoid local heat dissipation failure in the electronic device.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

C‧‧‧Air passage

100‧‧‧Electronic devices

110‧‧‧ motherboard

112‧‧‧Electronic parts

120‧‧‧First processor module

122‧‧‧ first side

124‧‧‧ second side

130‧‧‧First Memory Module

135‧‧‧Second memory module

140‧‧‧fan

150‧‧‧wind hood

152‧‧‧ first side

154‧‧‧ second side

156‧‧‧ Ribs

156a‧‧ ‧ gap

158‧‧‧ cover

159‧‧‧ Positioning Department

160‧‧‧Second processor module

162‧‧‧ first side

164‧‧‧ second side

170‧‧‧ third memory module

175‧‧‧fourth memory module

180‧‧‧Storage device

190‧‧‧First heat sink fin set

195‧‧‧Second heat sink fin set

1 is a schematic diagram of an electronic device in accordance with an embodiment of the present invention.

2 is a schematic view showing the air hood of the electronic device of FIG. 1 separated from the main board.

3 is a front perspective view of the air hood of the electronic device of FIG. 1.

4 is a perspective view of the reverse side of the air hood of the electronic device of FIG. 1.

C‧‧‧Air passage

100‧‧‧Electronic devices

110‧‧‧ motherboard

112‧‧‧Electronic parts

120‧‧‧First processor module

122‧‧‧ first side

124‧‧‧ second side

130‧‧‧First Memory Module

135‧‧‧Second memory module

140‧‧‧fan

150‧‧‧wind hood

152‧‧‧ first side

154‧‧‧ second side

156‧‧‧ Ribs

156a‧‧ ‧ gap

158‧‧‧ cover

159‧‧‧ Positioning Department

160‧‧‧Second processor module

162‧‧‧ first side

164‧‧‧ second side

170‧‧‧ third memory module

175‧‧‧fourth memory module

180‧‧‧Storage device

190‧‧‧First heat sink fin set

195‧‧‧Second heat sink fin set

Claims (9)

An electronic device includes: a motherboard; a first processor module disposed on the motherboard; a second processor module disposed on the motherboard; a first memory module disposed on the motherboard The first memory module is disposed on the first side of the first processor module. The second memory module is disposed on the motherboard and located on the first side of the first processor module. a second side; a plurality of fans disposed on one side of the motherboard; and an air hood disposed on the motherboard, the air hood including three adjacent airflow channels, the three airflow channels respectively The first processor module and the second processor module are respectively disposed in one of the airflow channels, and the first memory module and the second memory module are respectively connected to the fans. In the other two airflow channels, the number of the fans corresponding to the airflow channel of the first processor module and the second processor module is greater than the number of the other two airflow channels. The number of fans. The electronic device of claim 1, further comprising: a third memory module disposed on the motherboard and located on a first side of the second processor module, and the third memory Part or all of the body module is located in the same airflow channel as the first memory module; and a fourth memory module is disposed on the motherboard and located opposite to the second processor module One side of the first side, and the fourth memory Part or all of the body module is located in the same air flow channel as the second memory module. The electronic device of claim 1, wherein the air hood includes a first side and a second side, the first side of the air hood being adjacent to the fan, the air hood The width of the first side is greater than the width of the second side of the air hood. The electronic device of claim 1, wherein the air hood comprises a plurality of ribs and a cover plate, the ribs are connected to the cover plate, and the air hood is divided by the ribs The three air flow channels. The electronic device of claim 4, wherein the air guiding cover comprises at least one positioning portion, each positioning portion is disposed on the rib or the cover plate for facing the motherboard or the fan between. The electronic device of claim 4, wherein the motherboard comprises at least one electronic component, and the projection of the electronic component on the motherboard overlaps a projection of one of the ribs on the motherboard A portion of the ribs are suspended from the motherboard to avoid the electronic component. The electronic device of claim 1, further comprising: a plurality of storage devices located on at least one side of the motherboard, and the airflow blown by the fans not connected to the three airflow passages is adapted to pass through the airflow Some storage devices. The electronic device of claim 1, further comprising: a first heat dissipation fin set, the first heat dissipation fin set is located at the center of the air guide cover Within the airflow passage; A second heat-dissipating fin set is in thermal contact with the second processor module, and part or all of the second heat-dissipating fin set is located in the central airflow channel of the air guiding hood. The electronic device of claim 8, wherein a portion of the airflow generated by the fans first flows through the first processor module and then flows through the second processor module, and the first heat sink fin The spacing of the heat dissipation fins of the chip group is greater than the spacing of the heat dissipation fins of the second heat dissipation fin group.