TWI418292B - Electronic device - Google Patents

Description

Electronic equipment

The present invention relates to an electronic device, and more particularly to an electronic device having a heat dissipation function.

In the conventional embedded computer module, a centrifugal fan is respectively arranged on the motherboard and the display card to remove heat generated by the motherboard and the components of the display card. Moreover, the conventional embedded computer module requires an additional system fan to introduce external airflow into the embedded computer module for heat dissipation.

However, the conventional embedded computer module requires at least two centrifugal fans, and the power consumption is large and the cost is high due to the excessive number of fans.

The present invention provides an electronic device for solving the problems of the prior art, including a first circuit board, a second circuit board, a heat sink, and a fan. The first circuit board includes a first heat source. The second circuit board includes a second heat source parallel to the first circuit board, the first heat source being opposite the second heat source. The heat sink contacts the first heat source and the second heat source to dissipate heat from the first heat source and the second heat source, wherein at least one heat dissipation channel is formed in the heat sink. A fan is disposed at an end of the heat dissipation channel, and the fan drives a gas flow through the heat dissipation channel to remove heat generated by the first heat source and the second heat source.

In an embodiment of the invention, the wafer (heat source) on the second circuit is placed on the second surface (back surface) to contact the heat sink. Thereby, the first and second circuit boards can be simultaneously dissipated using only a single heat sink and a single fan. This saves the use of fans and radiators and reduces production costs.

Also, in another embodiment, the cost is lower due to the use of a lower cost axial fan instead of a centrifugal fan. Moreover, the heat sink can be effectively dissipated through a single axial fan, and the use of at least one fan can be omitted. In addition, since the present invention uses a single axial flow fan for heat dissipation, the fan can face the vent on the housing, and thus can even replace the conventional system fan, further saving fan cost and reducing power consumption.

Referring to FIGS. 1A and 1B, an electronic device 100 according to a first embodiment of the present invention includes a first circuit board 110, a second circuit board 120, a heat sink 130, and a fan 140.

The first circuit board 110 includes a first heat source (not shown). The second circuit board 120 includes a second heat source 121. The second circuit board 120 is parallel to the first circuit board 110. The first heat source (not shown) is opposite to the second heat source 121. The heat sink 130 contacts the first heat source (not shown) and the second heat source 121 to dissipate heat from the first heat source (not shown) and the second heat source 121, wherein at least the heat sink 130 is formed A heat dissipation channel 131. The fan 140 is a centrifugal fan. The air outlet of the fan 140 is opposite to the end of the heat dissipation channel 131. The fan 140 drives an airflow through the heat dissipation channel 131 to remove the first heat source (not shown) and the first The heat generated by the two heat sources 121.

In this embodiment, the first circuit board 110 is a motherboard, and the second circuit board 120 is a display card. The first heat source can be a processor (CPU) or any other wafer. The second heat source 121 is a display wafer. The second circuit board 120 further includes a connector 122, a first surface (front surface) 123, and a second surface (back surface) 124. The connector 122 is disposed on the first surface (front surface) 123. The second heat source 121 is disposed on the second surface (back surface) 124. In this embodiment, the wafers (heat sources) on the second circuit board 120 may all be disposed on the second surface (back surface) 124 to contact the heat sink 130.

The heat sink 130 further includes a heat conducting sheet 132, a windshield 133, and a plurality of fins 134. The fins 134 are covered by the windshield 133, and the fins 134 and the windshield 133 define a heat dissipation channel 131. The heat conducting sheet 132 contacts the second heat source 121 and the hood 133 to sufficiently guide the heat generated by the second heat source 121 to the heat sink 130.

In the above embodiment, the material of the hood 133 may be metal or other heat conductive material.

In the above embodiment, the outer shape of the heat sink 130 is substantially rectangular, but the above disclosure does not limit the present invention.

In the first embodiment of the present invention, the wafer (heat source) on the second circuit board is placed on the second surface (back surface) to contact the heat sink. Thereby, the first and second circuit boards can be simultaneously dissipated using only a single heat sink and a single fan. This saves the use of fans and radiators and reduces production costs.

Referring to FIG. 2A, there is shown an exploded view of the electronic device of the second embodiment of the present invention, which is different from the first embodiment of FIGS. 1A and 1B in that the fan 140' of the present embodiment is an axis. A flow fan is disposed at an end of the heat dissipation channel 131. The air outlet of the fan 140' is opposite to the end of the heat dissipation channel 131, whereby the fan 140' drives an airflow through the heat dissipation channel 131 to remove the first circuit board 110 and the second circuit board 120. The heat. The fan 140' can abut or be adjacent to the first circuit board 110 and the side of the second circuit board 120, and the fan 140' abuts or is adjacent to the end of the heat dissipation channel 131.

The fins 134 are shown in FIG. 2A, and the fins 134 and the hood 133 define a heat dissipation channel 131. In the above embodiment, the fins 134 are all flat, but the above disclosure does not limit the present invention.

Referring to Fig. 2B, there is shown the complete structure of the electronic device of the second embodiment of the present invention after assembly. The electronic device 100 further includes a housing 150, wherein the first circuit board 110, the second circuit board 120, the heat sink 130, and the fan 140' are disposed in the housing 150. The housing 150 includes a first vent 151 and a second vent 152. The first vent 151 corresponds to the fan 140 ′. The airflow 10 enters the housing 150 from the first vent 151 , flows through the heat dissipation channel 131 , and exits the housing 150 from the second vent 152 . To carry heat away from the housing 150.

In this embodiment, the cost is lower because a lower cost axial fan is used instead of the centrifugal fan. Moreover, the heat sink can be effectively dissipated through a single axial fan, and the use of at least one fan can be omitted. In addition, since the present invention uses a single axial flow fan for heat dissipation, the fan can face the vent on the housing, and thus can even replace the conventional system fan, further saving fan cost and reducing power consumption.

Although the system fan can be omitted in the above embodiment, the above disclosure does not limit the present invention. In a modification, an additional system fan can be selected as needed.

In the above embodiments, the direction of the air flow may be reversed, and the heat dissipation effect may also be provided. The above disclosure does not limit the present invention.

Although the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100. . . Electronic equipment

110. . . First board

120. . . Second circuit board

121. . . Heat source

122. . . Connector

123. . . First surface

124. . . Second surface

130. . . heat sink

131. . . Cooling runner

132. . . Thermal sheet

133. . . wind cover

134. . . Fin

140, 140’‧‧‧ fans

150‧‧‧shell

151‧‧‧First vent

152‧‧‧Second vent

1A and 1B are views showing an explosion of an electronic apparatus according to a first embodiment of the present invention;

2A is an exploded view showing an electronic device of a second embodiment of the present invention;

Fig. 2B is a view showing the entire structure of the electronic device of the second embodiment of the present invention after assembly.

100. . . Electronic equipment

110. . . First board

120. . . Second circuit board

122. . . Connector

123. . . First surface

124. . . Second surface

130. . . heat sink

132. . . Thermal sheet

133. . . wind cover

140. . . fan

Claims (9)

An electronic device includes: a first circuit board including a first heat source; a second circuit board including a second heat source, the second circuit board being parallel to the first circuit board, the first heat source and the first a heat source opposite to the first heat source and the second heat source for dissipating heat to the first heat source and the second heat source, wherein at least one heat dissipation channel is formed in the heat sink; and a fan The fan is configured to drive an airflow through the heat dissipation channel to remove heat generated by the first heat source and the second heat source. The heat sink further includes a heat conductive sheet. a hood and a plurality of fins, the fins being covered by the hood, the fins and the hood defining the heat dissipation channel, the heat conductive sheet contacting the second heat source and the hood to The heat generated by the second heat source is sufficiently directed to the heat sink. The electronic device of claim 1, wherein the first circuit board is a motherboard. The electronic device of claim 2, wherein the second circuit board is a display card. The electronic device of claim 3, wherein the second heat source is a display wafer. The electronic device of claim 3, wherein the second circuit board further comprises a connector, a first surface, and a second surface, wherein the connector is disposed on the first surface, the first Two heat sources are disposed on the second surface. The electronic device of claim 1, wherein the fan is a centrifugal fan, and a tuyere of the fan is opposite to an end of the heat dissipation channel. The electronic device of claim 1, wherein the fan is an axial fan, and the fan abuts the side of the first circuit board and the second circuit board, and a fan of the fan is facing The end of the heat dissipation runner. The electronic device of claim 7, further comprising a casing, the casing comprising a first vent, wherein the first circuit board, the heat sink, the second circuit board, and the fan The first vent is disposed in the housing, and the first vent is facing the fan. The electronic device of claim 8, wherein the housing further comprises a second venting port, the airflow entering the housing from the first venting port, flowing through the heat dissipating flow path, and from the The two vents exit the housing to carry heat away from the housing.