TWI429390B - Electronic equipment - Google Patents

Description

Electronic equipment

The present invention relates to an electronic device, and more particularly to an electronic device having a heat dissipation function.

In the conventional embedded computer module, a centrifugal fan is respectively disposed on the motherboard and the display card to remove heat generated by the motherboard and the components of the display card. Also, additional system fans are required to introduce external airflow into the embedded computer module for heat dissipation.

However, the centrifugal fan of the conventional embedded computer module itself has a high cost, and the power consumption is large due to the excessive number of fans.

The present invention provides an electronic device for solving the problems of the prior art, including a first circuit board, a first heat sink, a second circuit board, a second heat sink, a cover member, and a fan. The first heat sink contacts the first circuit board to dissipate heat from the first circuit board, wherein the first heat sink includes a plurality of first fins. The second circuit board is parallel to the first circuit board, wherein the second circuit board and the first fins define at least one first heat dissipation channel. The second heat sink contacts the second circuit board to dissipate heat from the second circuit board, wherein the second heat sink includes a plurality of second fins. The cover member covers the second heat sink, wherein the cover member and the second fins define at least one second heat dissipation channel. a fan is disposed at the end of the first heat dissipation channel and the second heat dissipation channel, and the fan drives an airflow through the first heat dissipation channel and the second heat dissipation channel to remove the first circuit board and the The heat generated by the second board.

In this embodiment, the cost is lower because a lower cost axial fan is used instead of the centrifugal fan. Moreover, the first heat sink and the second heat sink can be effectively dissipated at the same time through a single axial flow fan, so that different motherboards and display cards are respectively dissipated compared to two or more centrifugal fans of the prior art. Can save the use of at least one fan. In addition, since the present invention uses a single axial flow fan for heat dissipation, the fan can face the vent on the housing, and thus can even replace the conventional system fan, further saving fan cost and reducing power consumption.

Referring to FIG. 1 , an electronic device 100 according to an embodiment of the present invention includes a first circuit board 110 , a first heat sink 120 , a second circuit board 130 , a second heat sink 140 , a cover 150 , and A fan 160.

The first heat sink 120 contacts the first circuit board 110 to dissipate heat from the integrated circuit on the first circuit board 110. The first heat sink 120 includes a plurality of first fins 121. The second heat sink 140 contacts the second circuit board 130 to dissipate heat from the integrated circuit on the second circuit board 130. The second heat sink 140 includes a plurality of second fins 141. The second circuit board 130 is parallel to the first circuit board 110.

The second circuit board 130 and the first fins 121 define at least one first heat dissipation channel 122. The cover member 150 covers the second heat sink 140 , wherein the cover member 150 and the second fins 141 define at least one second heat dissipation channel 142 . The fan 160 is disposed at an end of the first heat dissipation channel 122 and the second heat dissipation channel 142. The air outlet of the fan 160 is opposite to the end of the first heat dissipation channel 122 and the second heat dissipation channel 142, whereby the fan 160 drives an airflow through the first heat dissipation channel 122 and the second heat dissipation channel 142. To remove heat generated by the first circuit board 110 and the second circuit board 130.

Referring to Fig. 2, there is shown the complete structure of the electronic device 100 of the embodiment of the present invention after assembly. The electronic device 100 further includes a housing 170, wherein the first circuit board 110, the first heat sink 120, the second circuit board 130, the second heat sink 140, the cover member 150, and the fan 160 are In the housing 170. The housing includes a first vent 171 and a second vent 172. The first vent 171 corresponds to the fan 160, and the airflow 10 enters the housing 170 from the first vent 171 while flowing through the first heat dissipation channel 121 and the second heat dissipation channel 141, and from the first The two vents 172 exit the housing 170 to carry heat away from the housing 170.

In this embodiment, the fan 160 is an axial fan, the first circuit board 110 is a motherboard, and the second circuit board 130 is a display card. The fan 160 can abut or be adjacent to the first circuit board 110 and the side of the second circuit board 130. The fan 160 abuts or is adjacent to the first heat dissipation channel 122 and the second heat dissipation channel 142. unit. Referring to Figures 1 and 2, the cover member 150 is a windshield covering the side 161 of the fan 160. The cover 150 has a notch 151, and the notch 151 corresponds to the tuyere of the fan 160 to avoid affecting the fan 160 to guide the airflow.

In this embodiment, the cost is lower because a lower cost axial fan is used instead of the centrifugal fan. Moreover, the first heat sink and the second heat sink can be effectively dissipated at the same time through a single axial flow fan, so that different motherboards and display cards are respectively dissipated compared to two or more centrifugal fans of the prior art. Can save the use of at least one fan. In addition, since the present invention uses a single axial flow fan for heat dissipation, the fan can face the vent on the housing, and thus can even replace the conventional system fan, further saving fan cost and reducing power consumption.

In the above embodiment, the material of the cover member 150 may be metal, plastic or other materials, and its main function is to define the second heat dissipation flow path 142.

In the above embodiment, the first heat sink 120 and the second heat sink 140 are substantially rectangular in shape, and the first fin 121 and the second fin 141 are flat, the first heat dissipation channel 122 and the second. The heat dissipation runners 142 extend in parallel directions, but the above disclosure does not limit the invention.

Although the system fan can be omitted in the above embodiment, the above disclosure does not limit the present invention. In a modification, an additional system fan can be selected as needed.

In the above embodiments, the direction of the air flow may be reversed, and the heat dissipation effect may also be provided. The above disclosure does not limit the present invention.

Although the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the invention, and those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

10. . . airflow

100. . . Electronic equipment

110. . . First board

120. . . First radiator

121. . . First fin

122. . . First heat dissipation channel

130. . . Second circuit board

140. . . Second radiator

141. . . Second fin

142. . . Second heat dissipation channel

150. . . Cover

151. . . gap

160. . . fan

161. . . side

170. . . case

171. . . First vent

172. . . Second vent

1 is an exploded view showing an electronic device of an embodiment of the present invention;

Fig. 2 is a view showing the complete structure of the electronic device of the embodiment of the present invention after assembly.

10. . . airflow

100. . . Electronic equipment

110. . . First board

120. . . First radiator

121. . . First fin

122. . . First heat dissipation channel

130. . . Second circuit board

140. . . Second radiator

141. . . Second fin

142. . . Second heat dissipation channel

150. . . Cover

151. . . gap

160. . . fan

161. . . side

Claims (12)

An electronic device includes: a first circuit board; a first heat sink contacting the first circuit board to dissipate the first circuit board, wherein the first heat sink includes a plurality of first fins; a second circuit board parallel to the first circuit board, wherein the second circuit board and the first fins define at least one first heat dissipation channel; a second heat sink contacts the second circuit board, Cooling the second circuit board, wherein the second heat sink includes a plurality of second fins; a cover member overlying the second heat sink, wherein the cover member and the second fins The film defines at least one second heat dissipation channel; and a fan disposed at the end of the first heat dissipation channel and the second heat dissipation channel, the fan driving an airflow through the first heat dissipation channel and the second heat dissipation a flow path to remove heat generated by the first circuit board and the second circuit board. The electronic device of claim 1, further comprising a casing, the casing comprising a first vent, wherein the first circuit board, the first heat sink, the second circuit board, The second heat sink, the cover member and the fan are disposed in the housing, and the first air vent is facing the fan. The electronic device of claim 2, wherein the housing further comprises a second venting port, the airflow entering the housing from the first venting port, while flowing through the first heat dissipating flow path and the a second heat dissipation channel exits the housing from the second vent to carry heat away from the housing. The electronic device of claim 1, wherein the fan is an axial fan. The electronic device of claim 1, wherein the first circuit board is a motherboard. The electronic device of claim 5, wherein the second circuit board is a display card. The electronic device of claim 1, wherein the fan abuts the side of the first circuit board and the second circuit board. The electronic device of claim 1, wherein the cover member is a windshield that covers one side of the fan. The electronic device of claim 1, wherein the first fins and the second fins are flat. The electronic device of claim 9, wherein the first heat dissipation channel and the second heat dissipation channel extend in a parallel direction. The electronic device of claim 9, wherein the first fins and the second fins are parallel to a vertical plane that is perpendicular to the first circuit board and the second circuit board. The electronic device of claim 1, wherein the first heat dissipation channel and the second heat dissipation channel are separated by the second circuit board.