201206323 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種電子設備，特別係有關於一種具 散熱功能的電子設備。 【先前技術】 在習知的嵌入式電腦模組中，在主機板與顯示卡上均 分別配設有離心式風扇以移除主機板以及顯示卡之元件所 產生的熱量。並且，尚須要額外的系統風扇，將外部氣流 引入嵌入式電腦模組以進行散熱。 然而，習知之嵌入式電腦模組的離心式風扇其本身成 本較高，並且由於風扇數量過多，功率消耗較大。 【發明内容】 本發明即為了欲解決習知技術之問題而提供之一種電 子設備，包括一第一電路板、一第一散熱器、一第二電路 板、一第二散熱器、一覆蓋件以及一風扇。第一散熱器接 觸該第一電路板，以對該第一電路板進行散熱，其中，該 第一散熱器包括複數個第一鰭片。第二電路板平行於該第 一電路板，其中，該第二電路板與該等第一鰭片定義至少 一第一散熱流道。第二散熱器接觸該第二電路板，以對該 第二電路板進行散熱，其中，該第二散熱器包括複數個第 二鰭片。覆蓋件覆蓋於該第二散熱器之上，其中，該覆蓋 件與該等第二鰭片定義至少一第二散熱流道。風扇設於該 第一散熱流道以及該第二散熱流道之端部，該風扇驅動一 氣流經過該第一散熱流道以及該第二散熱流道，以移除該 第一電路板以及該第二電路板所產生的熱量。 VIT10-0016I00-TW/0608-A42542-TWF 4 201206323 在此實施例中，由於使用成本較低的 心式風扇，因此成本較低。並且 ：二：取代離 -T古4 FI η主边啦早—個軸流風扇即 可有效同時對第—散熱器以及第 .〇 a 44., 狀…、DO進仃散熱，因此 :目較：¾知技術的兩個以上離心式風扇分別對不同的主機 板以及顯示卡進行散孰，可省去 冰，出於太欢少一個風扇的使用。此 外，由於本發明使用單一轴流式 μ ΛΛ . ^ 、堞扇進仃散熱，此風扇可 正對;ν又體上的透氣口，因此甚至 ^ r ^ ^ J取代^知的糸統風扇， 進y P‘風扇成本，並降低功率消杯。201206323 VI. Description of the Invention: [Technical Field] The present invention relates to an electronic device, and more particularly to an electronic device having a heat dissipation function. [Prior Art] In the conventional embedded computer module, a centrifugal fan is respectively disposed on the motherboard and the display card to remove heat generated by the motherboard and the components of the display card. Also, additional system fans are required to introduce external airflow into the embedded computer module for heat dissipation. However, the centrifugal fan of the conventional embedded computer module has a high cost itself, and the power consumption is large due to the excessive number of fans. SUMMARY OF THE INVENTION The present invention is an electronic device provided to solve the problems of the prior art, including a first circuit board, a first heat sink, a second circuit board, a second heat sink, and a cover member. And a fan. The first heat sink contacts the first circuit board to dissipate heat from the first circuit board, wherein the first heat sink includes a plurality of first fins. The second circuit board is parallel to the first circuit board, wherein the second circuit board defines at least one first heat dissipation flow path with the first fins. The second heat sink contacts the second circuit board to dissipate heat from the second circuit board, wherein the second heat sink includes a plurality of second fins. The cover member covers the second heat sink, wherein the cover member and the second fins define at least one second heat dissipation channel. a fan is disposed at the end of the first heat dissipation channel and the second heat dissipation channel, and the fan drives an airflow through the first heat dissipation channel and the second heat dissipation channel to remove the first circuit board and the The heat generated by the second board. VIT10-0016I00-TW/0608-A42542-TWF 4 201206323 In this embodiment, the cost is lower due to the use of a lower cost heart fan. And: 2: replace the -T ancient 4 FI η main side early - an axial fan can effectively simultaneously on the first radiator and the first 〇a 44., the shape..., DO into the heat, therefore: : 3⁄4 know the technology of two or more centrifugal fans to separate the different motherboards and display cards, can save ice, because of the use of a fan. In addition, since the present invention uses a single axial flow type μ ΛΛ . ^ , the fan fan heats up, the fan can be facing right; ν is a gas vent on the body, so even ^ r ^ ^ J replaces the known 糸 fan, Into the y P' fan costs, and reduce the power consumption cup.
【實施方式】 ° 參…第1圖’其係顯示本發明實施例之電子設備刚 包括一第一電路板110、一第一散熱器120、一第二電路板 130 第一散熱器140、一覆蓋件150以及一風扇160。 第一散熱器120接觸該第一電路板11〇，以對該第一電 路板110上的積體電路進行散熱，其中，該第一散熱器120 包括複數個第一鰭片121。第二散熱器14〇接觸該第二電 路板130’以對該第二電路板130上的積體電路進行散熱， 其中，該第二散熱器140包括複數個第二鰭片141。第二 電路板130平行於該第一電路板11〇。 該第二電路板130與該等第一鳍片121定義至少一第 一散熱流道122。覆蓋件150覆蓋於該第二散熱器140之 上，其中，該覆蓋件150與該等第二鰭片141定義至少一 第二散熱流道M2。風扇160設於該第一散熱流道122以 及該第二散熱流道丨42之端部。風扇160的風口正對該第 一散熱流道122以及該第二散熱流道142之端部，藉此該 風扇160驅動一氣流經過該第一散熱流道122以及該第二 VIT10-0016IOO-TW/0608-A42542-TWF 5 201206323 散熱流道丨42 ’以移除該第一電路板110以及該第二電路 板130所產生的熱量。 參照第2圖，其係顯示本發明實施例之電子設備100 組裝後的完整結構。電子設備100更包括一殼體170 ’其 中，該第〆電路板110、該第一散熱器120、該第二電路板 130、該第二散熱器140、該覆蓋件150以及該風扇丨6〇係 設於該殼體170中。該殼體包括一第一透氣口 17丨以及一 第二透氣口 172。該第一透氣口 171對應該風扇160’該氣 流10從該第一透氣口 171進入該殼體170，同時流經該第 一散熱流道121以及該第二散熱流道141，並從該第二透 氣口 172離開該殼體170，以將熱量帶離該殼體170。 在此實施例中，該風扇160為軸流風扇，該第一電路 板110為主機板’該第二電路板130為顯示卡。該風扇160 可抵接或鄰近該第一電路板110以及該第二電路板130的 側邊，風扇160並抵接或鄰近於該第一散熱流道122以及 該第二散熱流道142之端部。搭配參照第1、‘·2圖，該覆蓋 件150為一風罩，遮蓋該風扇160的一側161。該覆蓋件 150並具有缺口 151 ’缺口 151對應風扇160的風口，以避 免影響風扇160引導氣流。 在此實施例中，由於使用成本較低的軸流風扇取代離 心式風扇，因此成本較低。並且，透過單一個軸流風扇即 可有效同時對第一散熱器以及第二散熱器進行散熱，因此 相較於習知技術的兩個以上離心式風扇分別對不同的主機 板以及顯示卡進行散熱，可省去至少一個風扇的使用。此 外，由於本發明使用單一軸流式風扇進行散熱，此風扇玎 VIT10-0016100-TW/0608-A42542-TWF 6 201206323 正對殼體上的透氣口，因此甚至可取代習知的系統風扇， 進一步節省風扇成本’並降低功率消耗。 g、在上述實施例中，覆蓋件150的材質可以爲金屬、塑 膠或其他#f，其主要功能為定義第二散熱流遂142。 在上述實施例中，第一散熱器120以及第二散熱器140 的外型大致上呈矩形，第_鳍片i2i以及第二W 141均 為=狀，第-散熱流道122以及第二散熱流遂142沿平 4向延伸’但上述揭露並未限制本發明。 if去在上述貫施例中’可省略系統風扇’但上述揭露 ίίΓ ，在—變形财，村視需要選擇增設系 在上述實施例中’氣流方向可以相反，亦 效果，上述揭露並未限制本發明。 月… 雖然本發明已以具體之較佳實施例揭露如上，然其並 非用以限定本發明，任何孰習此項枯蓺 、’、 明之精神和範圍内，仍可作些許的更動與獨飾，因此本發 明之保護範圍當視後附之申請專利範圍所界定 【圖式簡單說明】 ”''+° 第1圖係顯示本發明實施例之電子設備的爆炸圖；以 及 第2圖係顯示本發明實施例之電子設備組裝後的完整 結構。 【主要元件符號說明】 1〇〜氣流 1〇〇〜電子設備 VIT10-0016I00-TW/0608-A42542-TWF 7 201206323 110〜 第一 電路板 120〜 第一 散熱器 121〜 第一 鰭片 122〜 第一 散熱流道 130〜 第二 電路板 140〜 第二 散熱器 141〜 第二 鰭片 142〜 第二 散熱流道 150〜 覆蓋 件 151〜 缺口 160〜 風扇 161〜 側 170〜 殼體 171〜 第一 透氣口 172〜 第二 透氣口[Embodiment] The first embodiment of the present invention shows that the electronic device of the embodiment of the present invention includes a first circuit board 110, a first heat sink 120, a second circuit board 130, and a first heat sink 140. Cover 150 and a fan 160. The first heat sink 120 contacts the first circuit board 11A to dissipate heat from the integrated circuit on the first circuit board 110. The first heat sink 120 includes a plurality of first fins 121. The second heat sink 14 is in contact with the second circuit board 130' to dissipate heat from the integrated circuit on the second circuit board 130. The second heat sink 140 includes a plurality of second fins 141. The second circuit board 130 is parallel to the first circuit board 11A. The second circuit board 130 defines the at least one first heat dissipation channel 122 with the first fins 121. The cover member 150 covers the second heat sink 140, wherein the cover member 150 and the second fins 141 define at least one second heat dissipation channel M2. The fan 160 is disposed at the end of the first heat dissipation channel 122 and the second heat dissipation channel 42. The air outlet of the fan 160 is opposite to the end of the first heat dissipation channel 122 and the second heat dissipation channel 142, whereby the fan 160 drives an airflow through the first heat dissipation channel 122 and the second VIT10-0016IOO-TW /0608-A42542-TWF 5 201206323 The heat sink runner 42' removes the heat generated by the first circuit board 110 and the second circuit board 130. Referring to Fig. 2, there is shown the assembled structure of the electronic device 100 of the embodiment of the present invention. The electronic device 100 further includes a casing 170', wherein the second circuit board 110, the first heat sink 120, the second circuit board 130, the second heat sink 140, the cover 150, and the fan 丨6〇 It is disposed in the housing 170. The housing includes a first vent 17 丨 and a second vent 172. The first air vent 171 corresponds to the fan 160'. The airflow 10 enters the housing 170 from the first air vent 171 while flowing through the first heat dissipation channel 121 and the second heat dissipation channel 141, and from the first The two vents 172 exit the housing 170 to carry heat away from the housing 170. In this embodiment, the fan 160 is an axial fan, and the first circuit board 110 is a motherboard. The second circuit board 130 is a display card. The fan 160 can abut or be adjacent to the first circuit board 110 and the side of the second circuit board 130. The fan 160 abuts or is adjacent to the first heat dissipation channel 122 and the second heat dissipation channel 142. unit. Referring to the first and second figures, the cover 150 is a windshield covering the side 161 of the fan 160. The cover member 150 has a notch 151 ” notch 151 corresponding to the tuyere of the fan 160 to avoid affecting the fan 160 to guide the airflow. In this embodiment, the cost is lower because a lower cost axial fan is used instead of the centrifugal fan. Moreover, the first heat sink and the second heat sink can be effectively dissipated at the same time through a single axial flow fan, so that different motherboards and display cards are respectively dissipated compared to two or more centrifugal fans of the prior art. Can save the use of at least one fan. In addition, since the present invention uses a single axial fan for heat dissipation, the fan 玎VIT10-0016100-TW/0608-A42542-TWF 6 201206323 is facing the vent on the housing, so it can even replace the conventional system fan, further Save fan costs' and reduce power consumption. g. In the above embodiment, the material of the cover member 150 may be metal, plastic or other #f, and its main function is to define the second heat dissipation flow 142. In the above embodiment, the first heat sink 120 and the second heat sink 140 have a substantially rectangular shape, and the first fins i2i and the second W 141 have a shape, a first heat dissipation channel 122 and a second heat dissipation. The flow 142 extends in a flat 4 direction 'but the above disclosure does not limit the invention. If in the above example, 'the system fan can be omitted' but the above disclosure ίίΓ, in the case of - deformation, the village needs to select the addition system in the above embodiment, the direction of the airflow can be reversed, and the effect, the above disclosure does not limit this invention. </ RTI> Although the invention has been described above in terms of specific preferred embodiments, it is not intended to limit the invention, and may be modified and modified in the spirit and scope of the invention. Therefore, the scope of protection of the present invention is defined by the scope of the appended claims [simplified description of the drawings] "'' + ° Fig. 1 shows an exploded view of the electronic device of the embodiment of the present invention; and Fig. 2 shows The complete structure of the electronic device after assembly according to the embodiment of the present invention. [Main component symbol description] 1〇~Airflow 1〇〇~Electronic device VIT10-0016I00-TW/0608-A42542-TWF 7 201206323 110~ First circuit board 120~ The first heat sink 121 to the first heat sink 130 to the first heat sink 130 to the second heat sink 130 to the second heat sink 141 to the second heat sink 141 to the second heat sink 150 142 to the second heat sink 150 〜 ~ Fan 161 ~ Side 170 ~ Housing 171 ~ First vent 172 ~ Second vent
VIT10-0016I00-TW/0608-A42542-TWFVIT10-0016I00-TW/0608-A42542-TWF