TWI405532B - Heat-dissipation module and electronic device using the same - Google Patents

Abstract

A heat dissipation module and an electronic device using the same are provided. The electronic device includes a circuit board and the heat dissipation module. The circuit board has at least one heat generating element. The heat dissipation module is used to be disposed on the circuit board and includes a fan and a guiding cover. The fan and the guiding cover are used to be disposed on the circuit board. An orthogonal projection of the guiding cover on a first surface of the circuit board goes beyond an edge of the first surface while the guiding cover is disposed on the circuit board. An air flow generated by the fan passes through the passage generated by the guiding cover.

Description

Thermal module and electronic device with heat dissipation module

The present invention relates to a heat dissipation module and an electronic device having the heat dissipation module, and more particularly to a heat dissipation module and an electronic device having a flow guide cover.

In recent years, with the rapid advancement of computer technology, the operation speed of computers has been continuously improved, and the heating power of electronic components inside computer mainframes has continuously increased. In order to prevent the electronic components inside the computer host from overheating, the electronic components may be temporarily or permanently disabled, and sufficient heat dissipation performance must be provided to the electronic components inside the computer. Therefore, for electronic components with high heating power, a heat dissipation module is usually added to reduce the temperature of these electronic components.

FIG. 1 is a schematic diagram of a heat dissipation mechanism under a conventional dual display card architecture. Referring to FIG. 1, in order to pursue a high-performance display effect, the industry proposes an architecture for dual display card operation. At the same time, in order to ensure the normal operation of the display card 52 and the display card 54, the heat sink 62, the fan 64 and the cover 66 are respectively mounted on the display card 52 and the display card 54. A conventional cover 66 covers the heat sink 62 so that the airflow generated by the fan 64 fully enters the heat sink 62 and carries the heat away. However, from the direction of the air flow indicated by the arrow in Fig. 1, it is known that due to the lack of a good flow path design, the air flow exhibits an irregular course and cannot quickly carry away the heat. In particular, the airflow generated by the display card 52 and the two fans 64 on the display card 54 interfere with each other, further reducing the heat dissipation efficiency and jeopardizing the display performance and reliability of the display card 52 and the display card 54.

The invention provides a heat dissipation module for solving the problem of poor heat dissipation efficiency of the conventional heat dissipation module.

The present invention provides an electronic device for solving the problem that the efficiency and reliability of the electronic device are degraded due to poor heat dissipation efficiency of the conventional heat dissipation module.

The heat dissipation module of the present invention is used to dissipate heat from a circuit board. The heat dissipation module includes a fan and a shroud. The fan and the shroud are disposed on one side of the circuit board, and the orthographic projection of the shroud on a first surface of the circuit board exceeds a boundary of the first surface. A flow of air generated by the fan passes between the shroud and the boundary of the first surface.

The electronic device of the present invention includes a circuit board and the aforementioned heat dissipation module. The circuit board has at least one heat generating component.

In an embodiment of the invention, the circuit board is a display card.

In an embodiment of the invention, the fan blade rotates about a rotation axis that is not perpendicular to the first surface.

In an embodiment of the invention, the shroud has an air inlet, and the orthographic projection of the air inlet on the first surface covers the fan.

In an embodiment of the invention, the heat dissipation module further includes a heat sink having a plurality of heat dissipation fins. The heat sink is placed between the board and the fan. Further, the heat dissipation fins are, for example, trapezoidal.

In an embodiment of the invention, the circuit board is rectangular. The orthographic projection of the shroud on the first surface of the circuit board exceeds the long side of the first surface.

In an embodiment of the invention, the circuit board is rectangular. The orthographic projection of the shroud on the first surface of the circuit board exceeds the short side of the first surface.

Based on the above, in the heat dissipation module and the electronic device of the present invention, the airflow generated by the fan can be carried out through the boundary between the shroud and the circuit board. Therefore, the heat dissipation module has excellent heat dissipation efficiency and can improve the performance and reliability of the electronic device.

The above described features and advantages of the present invention will be more apparent from the following description.

2 is a schematic view showing the appearance of two sets of electronic devices according to an embodiment of the present invention, and FIG. 3 is a front view of the electronic device of FIG. Two sets of the electronic device 100 of the present embodiment are included in FIG. Referring to FIG. 2 and FIG. 3 , the electronic device 100 of the embodiment includes a circuit board 110 and a heat dissipation module 120 . The circuit board 110 has at least one heat generating component 112. Only one heating element 112 at the edge of the heat dissipation module 120 is shown in FIG. 3, but a number of heating elements 112 are still covered by the heat dissipation module 120 and are not seen in FIG. The heat dissipation module 120 of this embodiment includes a fan 122 and a flow guide cover 124. The fan 122 and the shroud 124 are disposed on one side of the circuit board 110. The shroud 124 forms a passage for the airflow generated by the fan 122 to pass, and the orthographic projection P12 of the shroud 124 on a first surface S12 of the circuit board 110 exceeds the boundary E12 of the first surface S12. That is, when the shroud 124 is disposed on the circuit board 110, at least a portion of the shroud 124 is beyond the boundary of the circuit board 110.

4 is a cross-sectional view of the electronic device of FIG. 2. Referring to FIG. 4, since at least a portion of the shroud 124 extends beyond the boundary of the circuit board 110, the airflow generated by the fan 122 (indicated by an arrow in FIG. 4) can pass through the boundary E12 of the shroud 124 and the first surface S12. between. In other words, the airflow generated by the fan 122 is not confined between the shroud 124 and the circuit board 110, but has a clear airflow direction, that is, between the boundary E12 of the shroud 124 and the first surface S12. The opening flows outward to carry heat away from the circuit board 110 so that heat does not circulate between the two boards.

Thereby, the electronic device 100 of the embodiment can establish an orderly airflow direction between the shroud 124 and the circuit board 110, and take away the heat generated by the heating element 112 on the circuit board 110 at the fastest speed. To improve the performance and reliability of the electronic device 100.

The circuit board 110 of this embodiment is exemplified by a display card, but the circuit board 110 can also be a memory module, a sound card or other circuit board. Due to the increasing demand for computing, such as nuclear energy test, climate prediction and virus prevention, powerful computing power is required. Therefore, the use of GPGPU (General Purpose Computing on Graphics Processing Units) is increasingly frequent, and many servers have used GPUs. Replace the CPU. On the other hand, in order to pursue the ultimate display performance, some users will assemble two circuit boards 110 for display functions, for example, connecting two circuit boards 110 by signal lines (not shown). Also known as scan line interlace (SLI). When working, one board 110 is responsible for processing the scan of odd-numbered pixels on the display, and the other board 110 is responsible for processing the scan of even-numbered pixels on the display for higher display performance. Another similar technique is called cross fire technology, which aims to improve display performance. However, since the two circuit boards 110 are in close proximity, in order to prevent the airflow generated by the two fans 122 from interfering with each other and reducing the heat dissipation efficiency, a baffle may be disposed between the boundary E12 of one of the circuit boards 110 and the other shroud 124. 130, in order to prevent the airflow generated by the left fan 122 from entering between the left circuit board 110 and the right side air deflector 124, and the heat is carried by the right side of the fan 122 to the right circuit board 110.

In the heat dissipation module 120 of the present embodiment, the fan 122 of the axial flow type is taken as an example, that is, the fan blade of the fan 122 rotates around a rotation axis A10, but not limited thereto, such as the circuit board is side by side in the server. The fan can be placed behind the chassis to allow airflow along the vertical board side by side. The rotation axis A10 of the fan 122 of the present embodiment is not perpendicular to the first surface S12, that is, the rotation axis A10 is not parallel to the normal line of the first surface S12. When the rotating shaft A10 of the fan 122 is not perpendicular to the first surface S12, the airflow generated by the fan 122 will be more uniformly turned in a single direction after encountering the first surface S12. In this embodiment, the direction of the rotating shaft A10 is specially arranged so that the airflow encounters the first surface S12 and substantially uniformly advances toward the opening between the airflow shroud 124 and the boundary E12 of the first surface S12 to obtain a comparison. Good heat dissipation efficiency. However, even if the rotating shaft A10 of the fan 122 is arranged to be perpendicular to the first surface S12, the airflow generated by the fan 122 can smoothly flow out from the opening between the boundary E12 of the first surface S12.

Referring to FIG. 3, the shroud 124 of the present embodiment has an air inlet P14, and the orthographic projection of the air inlet P14 on the first surface S12 covers the fan 122. The air inlet P14 helps to increase the air intake amount of the fan 122 to improve the heat dissipation efficiency. The heat dissipation module 120 of this embodiment may further include a heat sink 126 having a plurality of heat dissipation fins 126A. The heat sink 126 is disposed between the circuit board 110 and the fan 122. The heat sink 126 can be attached to the heat generating component 112 directly or via a thermal paste to conduct the heat generated by the heat generating component 112 in a conductive manner. The airflow generated by the fan 122 is then carried away in a convective manner. The heat sink 126 can further improve heat dissipation efficiency. In the present embodiment, in order to cooperate with the oblique mounting of the fan 122, the heat dissipating fin 126A is a trapezoidal example to provide a slope on which the fan 122 can be mounted, but the present invention is not limited thereto. In addition, the circuit board 110 of the present embodiment has a rectangular shape. The orthographic projection P12 of the shroud 124 on the first surface S12 of the circuit board 110 is beyond the long side of the first surface S12, that is, the airflow generated by the fan 122 flows outward from the long side of the first surface S12.

FIG. 5 is a front elevational view of an electronic device according to another embodiment of the present invention. Referring to FIG. 5, the electronic device 200 of the present embodiment is similar to the electronic device 100 of FIG. 3, except that the orthographic projection 222 of the shroud 224 of the present embodiment on the first surface S12 of the circuit board 110 exceeds the first surface. The short side of S12, that is, the airflow generated by the fan 222, flows outward from the short side of the first surface S12.

In summary, in the heat dissipation module and the electronic device of the present invention, a part of the airflow cover extends beyond the range of the circuit board, and the airflow generated by the fan can pass heat through the opening of the airflow cover and the circuit board. Bring out. Therefore, the heat dissipation airflow of the heat dissipation module has a regular flow direction, which can enhance the heat dissipation efficiency and improve the performance and reliability of the electronic device.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

52, 54. . . graphics card

62. . . heat sink

64. . . fan

66. . . Cover

100, 200. . . Electronic device

110. . . Circuit board

112. . . Heating element

120, 220. . . Thermal module

122, 222. . . fan

124, 224. . . Shroud

126. . . heat sink

126A. . . Heat sink fin

130. . . Baffle

S12. . . First surface

P12. . . Front projection of the shroud

P14. . . Inlet

E12. . . First surface boundary

A10. . . Rotating shaft

FIG. 1 is a schematic diagram of a heat dissipation mechanism under a conventional dual display card architecture.

2 is a schematic view showing the appearance of two sets of electronic devices according to an embodiment of the present invention.

3 is a front elevational view of the electronic device of FIG. 2.

4 is a cross-sectional view of the electronic device of FIG. 2.

FIG. 5 is a front elevational view of an electronic device according to another embodiment of the present invention.

100. . . Electronic device

110. . . Circuit board

120. . . Thermal module

122. . . fan

124. . . Shroud

126. . . heat sink

126A. . . Heat sink fin

130. . . Baffle

S12. . . First surface

E12. . . First surface boundary

A10. . . Rotating shaft

Claims (9)

a heat dissipation module for dissipating heat to a circuit board and having a first surface, the heat dissipation module comprising: a fan disposed on one side of the circuit board, the side being directly facing the first surface; a shroud disposed on the side of the circuit board and forming a passage through which the airflow generated by the fan is guided away from the circuit board; and a baffle disposed on the first surface of the circuit board a second surface for isolating the airflow generated by the fan and the second surface of the circuit board; wherein an orthographic projection of the shroud on the first surface of the circuit board exceeds the first surface The border. The heat dissipation module of claim 1, wherein the fan blade rotates about a rotation axis that is not perpendicular to the first surface. The heat dissipation module of claim 1, wherein the air flow cover has an air inlet, and an orthographic projection of the air inlet on the first surface covers the fan. The heat dissipation module of claim 1, further comprising a plurality of heat dissipation fins, wherein the heat dissipation fins are disposed between the circuit board and the fan. The heat dissipation module of claim 4, wherein the side surfaces of the heat dissipation fins are trapezoidal. The heat dissipation module of claim 1, wherein the circuit board has a rectangular shape, and the flow guide is positive on the first surface of the circuit board. Projecting beyond the long side of the first surface. The heat dissipation module of claim 1, wherein the circuit board has a rectangular shape, and the orthographic projection of the flow guide on the first surface of the circuit board exceeds a short side of the first surface. An electronic device comprising: a circuit board having at least one heat generating component; and a heat dissipation module according to any one of claims 1 to 7. a heat dissipation module for dissipating heat to a circuit board and having a first surface, the heat dissipation module comprising: a fan disposed on a first side of the circuit board; a shroud disposed at the a second side of the circuit board and forming a channel through which the airflow generated by the fan is guided away from the circuit board; and a baffle disposed on the second surface of the circuit board opposite to the first surface, and The airflow generated by the fan is isolated from the second surface of the circuit board; wherein an orthographic projection of the shroud on the surface of the circuit board exceeds a boundary of the first surface.