JP6386848B2 - Electronic equipment, support stand for electronic equipment - Google Patents

Description

  The present invention relates to a heat dissipation structure for an electronic device.

  In Patent Document 1, as shown in FIG. 11, a vent 96 is provided on the upper surface of a housing 95 that houses the disc player 93, a vent 97 is provided on the lower surface, a vent 99 is provided on one side, and the other side is provided. A conventional technique is disclosed in which a heat sink 95 is provided, a vent hole 98 is provided in a circuit board 94 in the housing, and a power IC 91 (heating element) is attached to the heat sink 95 to dissipate the power IC 91.

Japanese Published Patent Publication “Japanese Patent Laid-Open No. 2003-157669” (Publication Date: May 30, 2003)

  In the above prior art, the heat transmitted from the power IC 91 to the heat sink 95 is dissipated by the air flow from the vent 97 to the vent 96 through the vent 98, but the temperature inside the casing is high, In actual use conditions, the air flow is often poor, and there is a problem that a sufficient heat dissipation effect cannot be obtained.

  An object of the present invention is to enhance a heat dissipation effect in an electronic device.

  The electronic device is installed inside the housing, on the other surface of the substrate facing the heating element with the substrate sandwiched between the substrate, the heating element mounted on one surface of the substrate. A heat transfer material and a heat dissipation plate in contact with the heat transfer material, and a first ventilation portion including a ventilation hole penetrating the first surface is provided on the first surface of the housing; The first ventilation portion is in contact with the first ventilation portion.

  In this electronic apparatus, since the heat radiating plate comes into contact with the outside air through the vent of the first ventilation portion, the heat transferred from the heating element to the heat radiating plate through the heat transfer material can be directly released to the outside air. . Moreover, the heat transmitted from the heat sink to the first ventilation portion can be released to the outside air through the vent. Thereby, the heat dissipation effect in an electronic device can be improved.

In Embodiment 1, it is the perspective view which looked at the communication apparatus from the back surface side in the state which cut off the back surface side half. (A) is a perspective view including the 6th surface (back surface) of a communication apparatus in Embodiment 1. FIG. FIG. 2B is a perspective view including the first surface of the communication device in the first embodiment. (C) is a perspective view including the 5th surface (front) of a communication apparatus in Embodiment 1. FIG. FIG. 3 is a cross-sectional view of the communication device when viewed from a plane parallel to the third surface in FIG. 2 (viewed from the third surface 3 side) in the first embodiment. In Embodiment 2, it is the perspective view which looked at the support stand and the communication apparatus from the front side in the state which cut off each front side half. FIG. 10 is a perspective view showing how to attach a communication device to a support base in the second embodiment. In Embodiment 2, it is the perspective view which looked at the support stand and the communication apparatus from the back surface side. FIG. 10 is a cross-sectional view (viewed from the third surface side) when the communication device is cut along a plane parallel to the third surface in FIG. 9 in the third embodiment. In Embodiment 4, it is sectional drawing when the support stand and the communication apparatus were cut | disconnected by the surface parallel to the back surface (viewed from the back surface side). In Embodiment 5, it is sectional drawing (viewed from the back surface side) when a communication apparatus is cut | disconnected by the surface parallel to a back surface. In Embodiment 6, it is the perspective view which looked at the communication apparatus from the back surface side in the state which cut off the back surface side half. It is a perspective view which shows the structure of the conventional electronic device.

  The embodiment of the present invention will be described below with reference to FIGS.

[Embodiment 1]
FIG. 1 is a perspective view of the communication device 20 as viewed from the back surface side in a state where a half of the back surface side is cut off in the first embodiment. FIG. 2B is a perspective view including the first surface 1 of the communication device 20 in the first embodiment. FIG. 2C is a perspective view including the fifth surface 5 (front surface) of the communication device 20 according to the first embodiment. FIG. 3 is a cross-sectional view illustrating the configuration of the communication device 20 according to the first embodiment in the depth direction (from the fifth surface 5 that is the front surface toward the sixth surface 6 that is the rear surface).

(Configuration of communication device 20)
As shown in FIGS. 1 to 3, the housing 10 of the communication device 20 (electronic device) has, for example, a rectangular parallelepiped shape, and is perpendicular to the first surface 1 and the second surface 2 and the first surface 1 that are parallel to each other. The third surface 3 and the fourth surface 4 are parallel to each other, and the fifth surface 6 and the sixth surface 6 are perpendicular to the first surface 1 and the third surface 3 and parallel to each other.

  In the communication device 20, the area of the first surface 1 = the area of the second surface 2> the area of the fifth surface 5 = the area of the sixth surface 6> the area of the third surface 3 = the area of the fourth surface 4. As shown in FIG. 2, the fifth surface 5 is the front surface and the sixth surface 6 is the back surface.

  The first surface 1 is provided with a first ventilation portion 11 including a plurality of ventilation holes 11h extending from the outside of the housing to the inside of the housing (through the first surface 1), and protrusions 19a to 19d. The first ventilation portion 11 has a fin structure (horizontal fin structure) in which a plurality of fins f parallel to the fifth surface (front surface) are arranged, and a gap between adjacent fins f becomes a vent 11h. The protrusions 19a to 19d are arranged in the vicinity of the four corners of the first surface 1 (see FIG. 2B), and the communication device 20 includes the protrusions 19a to 19d as four legs, and the first surface 1 is the lower surface. Thus, it is possible to place the second surface 2 horizontally. In this horizontal position, the third surface 3 and the fourth surface 4 are both side surfaces.

  The second surface 2 is provided with a second ventilation portion 12 including a plurality of vent holes 12h extending from the outside of the housing to the inside of the housing (through the second surface 2). The second ventilation portion 12 has a slit structure (lateral slit structure) in which a plurality of slits parallel to the direction from the third surface 3 toward the fourth surface 4 are arranged, and each slit serves as a vent hole 12h.

  As shown in FIGS. 1 to 2, the third surface 3 is provided with a third ventilation portion 13 including a plurality of vent holes extending from the outside of the housing to the inside of the housing (through the third surface 3). The third ventilation portion 13 has a slit structure in which a plurality of slits parallel to the direction from the first surface 1 toward the second surface 2 are arranged.

  As shown in FIG. 2A, a power switch 22 and an external terminal connection portion 23 are provided on the sixth surface 6 (back surface).

  As shown in FIG. 2C, the fifth surface 5 (front surface) is provided with a remote control light receiving portion 24 and a front ventilation portion 15 including a plurality of ventilation holes extending from the outside of the housing to the inside of the housing. The front vent 15 has a slit structure in which a plurality of slits parallel to the direction from the first surface 1 to the second surface 2 are arranged.

  Inside the housing 10, there are a substrate 7 disposed in parallel with the first surface 1 and the second surface 2, a circuit chip 14 and a connector 16 mounted on the front surface of the substrate 7, and the back surface of the substrate 7. A heat transfer material 8 disposed so as to face (oppose) the circuit chip 14 with the substrate 7 interposed therebetween, a heat radiating plate 9 in contact with the heat transfer material 8, and a sword-mount heat sink provided on the circuit chip 14 18, a plate-like low heat-resistant element 17 connected to the connector 16 and arranged parallel to the substrate 7, and an NFC (Near Field Communication) substrate arranged on the back side (inside the housing) of the second surface 2 21 is provided. The NFC substrate 21 is provided with an NFC element (not shown).

  The circuit chip 14 is a heating element such as a processor. The heat sink 9 is made of a metal material such as iron, aluminum, copper, and stainless steel, and has a function of supporting the substrate 7 and the like in the housing 10.

  The heat radiating plate 9 is disposed so as to be in contact with the first ventilation portion 11, and the heat radiating plate 9 comes into contact with the outside air through the plurality of vent holes 11 h of the first ventilation portion 11.

  The second ventilation portion 12 is provided so as to face the first ventilation portion 11 with the circuit chip 14 and the heat sink 18 interposed therebetween.

  Further, the exhaust heat space sandwiched between the first ventilation portion 11 and the second ventilation portion 12 is closer to the fourth surface 4 than the third surface 3, and the low heat resistance element 17 and the NFC substrate 21 are , Located on the third surface side of the exhaust heat space.

(Effect of communication device 20)
In the communication device 20, the heat radiating plate 9 comes into contact with the outside air through the plurality of vents 11 h of the first ventilation portion 11, so that the heat transferred from the circuit chip 14 to the heat radiating plate 9 through the heat transfer material 8 is transferred. Direct escape to the open air. Moreover, the heat transmitted from the heat sink 9 to the first ventilation part 11 can be released to the outside air through the ventilation hole 11h. Thereby, the heat dissipation effect in the communication device 20 can be enhanced.

  In the communication device 20, since the protrusions 19 a to 19 d are provided on the first surface 1, a clearance is secured between the housing 10 and the mounting surface during horizontal placement with the first surface 1 as a lower surface. It is possible to ensure the ventilation performance of the ventilation part 11. Therefore, the possibility that the first ventilation portion 11 is blocked by an obstacle, dust, or the like is reduced, and a high heat dissipation effect can be ensured. The clearance between the housing 10 and the mounting surface is preferably 3 to 5 mm or more.

  In the communication device 20, the second ventilation portion 12 on the second surface 2 is provided so as to face the first ventilation portion 11 with the circuit chip 14 and the heat sink 18 interposed therebetween. Therefore, it can escape from the 2nd ventilation part 12 located in the board | substrate front surface side, and can improve the thermal radiation effect more. Further, even if the vent 11h of the first vent 11 is blocked for some reason, heat can be radiated from the vent 12h of the second vent 12, and the vent 12h of the second vent 11 for some reason. Even if it is blocked, heat can be radiated from the vent 11h of the first vent.

  In the communication device 20, an NFC substrate 21 is provided on the back side of the second surface 2. Although the NFC substrate 21 needs to be provided close to the second surface 2 that is the upper surface of the housing due to the characteristics of short-range communication, heat is radiated from the first ventilation portion 11 of the first surface 1 that is the lower surface of the housing and the second The present embodiment in which the increase in the temperature near the surface 12 is suppressed is very advantageous for ensuring the reliability of an NFC element having generally low heat resistance.

  In the communication device 20, the low heat resistance element 17 and the NFC substrate 21 are provided so as to be located on the third surface side with respect to the exhaust heat space sandwiched between the first ventilation portion 11 and the second ventilation portion 12. Thus, by arranging the low heat resistant element 17 and the NFC substrate 21 apart from the exhaust heat space, the influence of the heat received by the low heat resistant element 17 and the NFC substrate 21 can be suppressed, and the reliability thereof can be improved. it can.

  Further, since the low heat resistant element 17 is also separated from the substrate 7 by the connector 16 (on a different plane from the substrate 7), the influence of the heat received by the low heat resistant element 17 is further suppressed, and its reliability is improved. Can be increased.

  In the communication device 20, since the first ventilation part 11 has a fin structure, the contact area between the first ventilation part 11 and the outside air can be increased, and the heat transmitted from the heat sink 9 to the first ventilation part 11. Can quickly escape to the open air. In addition, the fin structure has an advantage that dust and the like are not easily clogged.

[Embodiment 2]
FIG. 4 is a perspective view of the support base 30 and the communication device 20 as viewed from the front side in a state where the front half of each is cut off in the second embodiment. FIG. 5 is a perspective view showing how the communication device 20 is attached to the support base 30 in the second embodiment. FIG. 6 is a perspective view of the support base 30 and the communication device 20 viewed from the back side in the second embodiment.

  As illustrated in FIG. 4, the communication device 20 can be placed vertically by holding the support surface 30 with the third surface 3 as a lower surface.

  As shown in FIG. 5, the support base 30 includes a plate-like horizontal portion 31 that is in contact with the placement surface, and a rectangular wall portion 32 (holding portion) that rises vertically from the end of the horizontal portion 31. Fixing holes 39 a to 39 d are provided at four corners of the portion 32.

  The configuration of the support base shown in FIG. 5 is merely an example, and any configuration may be used as long as the lower surface of the third surface 3 of the communication device 20 can hold the first surface 1 in the vertical direction.

  And by attaching the some protrusion 19a-19d of the 1st surface 1 of the communication apparatus 20 to the fixing holes (attachment part) 39a-39d of the wall part 32 using the fixing screws 35a-35d, it shows in FIG. As described above, the communication device 20 can be held on the support base 30 while forming the gap g between the third surface 3 and the horizontal portion 31 and the gap G between the first surface 1 and the wall portion 32. it can. The gap G or the gap g is preferably 3 to 5 mm or more.

  Further, the wall 32 is provided with an opening 33 at a position corresponding to the first ventilation part 11.

  When the communication device 20 is mounted vertically on the support base 30, the ventilation performance of the first ventilation portion 11 is ensured by the gap G and the opening 33. Therefore, as shown in FIG. Therefore, the heat transferred from the circuit chip 14 to the heat radiating plate 9 via the heat transfer material 8 can be directly released to the outside air. Moreover, the heat transmitted from the heat sink 9 to the first ventilation part 11 can be released to the outside air through the ventilation hole 11h. Thereby, the heat dissipation effect in the communication device 20 can be enhanced. Furthermore, since the first ventilation portion 11 can be vertically placed with the first surface 1 as a side surface while ensuring the ventilation performance of the first ventilation portion 11, the first ventilation portion 11 is less likely to be blocked by an obstacle, dust, or the like. Thus, a high heat dissipation effect can be secured.

  Further, as shown in FIG. 4, since the ventilation performance of the third ventilation part 13 is ensured by the gap g when placed vertically, the air from the third ventilation part 13 to the second ventilation part 12 as shown in FIG. 4. The heat dissipation effect can be further enhanced by the flow of heat (thermal convection).

  In the communication device 20, the exhaust heat space sandwiched between the first ventilation portion 11 and the second ventilation portion 12 is closer to the fourth surface 4 than the third surface 3, and the third surface 3 is more than this exhaust heat space. The low heat resistance element 17 and the NFC substrate 21 are provided in a space located on the side.

  4 and 5, the exhaust heat space is positioned above the casing, and the low heat resistance element 17 and the NFC element are positioned below the casing where the influence of heat is small. And the reliability of an NFC element can be improved.

  In addition, when the communication device 20 is mounted vertically on the support base 30, the protrusions 19a to 19d on the first surface 1 are hidden by the wall portion 32, and the appearance is excellent.

  Further, the gap G between the wall portion 32 and the first surface 1 enables heat dissipation from the entire first surface 1.

[Embodiment 3]
FIG. 7: is sectional drawing which shows the structure of the depth direction (The direction which goes to the 6th surface 6 which is a back surface from the 5th surface 5 which is a front surface) of the communication apparatus 20 concerning Embodiment 3 in Embodiment 3. FIG. . As shown in FIG. 7, the first ventilation portion 11 of the communication device 20 has a slit structure (lateral slit structure), that is, the first surface 1 of the housing 10 is directed from the third surface 3 to the fourth surface 4. A plurality of directional slits may be formed, and each slit may be used as a vent 11h.

[Embodiment 4]
FIG. 8 is a cross-sectional view (viewed from the back side) when the support base 30 and the communication device 20 are cut along a plane parallel to the back side in the fourth embodiment. As illustrated in FIG. 8, the communication device 20 according to the third embodiment (the first ventilation part 11 having a slit structure) is held vertically by the support base 30 according to the second embodiment. it can.

[Embodiment 5]
FIG. 9 is a cross-sectional view illustrating a configuration of the communication device 20 according to the fifth embodiment in a lateral direction (a direction from the third surface 3 that is one side surface toward the fourth surface 4 that is the other side surface). As shown in FIG. 9, the NFC board is not provided in the housing 10 of the communication device 20, and other configurations are the same as those in the first embodiment.

[Embodiment 6]
FIG. 10 is a perspective view of the communication device 20 as viewed from the back surface side in a state where a half of the back surface side is cut off in the sixth embodiment. As shown in FIG. 10, the structure of the first ventilation portion 11 of the housing 10 is a vertical slit structure, that is, a plurality of slits parallel to the direction from the front to the back are formed on the first surface 1 of the housing 10. And each slit can also be made into the vent hole 11h. In this case, as shown in FIG. 10, the structure of the second ventilation portion 12 of the housing 10 may be a slit structure (vertical slit structure) parallel to the direction from the front surface to the back surface of the communication device 20. It is good also as a horizontal slit structure like the form 1 (refer FIG. 1).

[Embodiment 7]
The embodiment of the present invention is not limited to the above. The 1st ventilation part 11 of the 1st surface 1 can also be made into a net structure instead of a fin structure or a slit structure. If it carries out like this, the distance of the heat sink 9 and external air will become small, and the heat of the heat sink 9 can be more directly released to external air. Further, a structure in which a plurality of punch holes are formed in the first surface 1 can also be adopted.

  Further, by providing a support member or the like for self-standing (for vertical placement) on the third surface 3 of the communication device 20, or by making the third surface 3 into a shape that enables vertical placement, the communication device 20 is A configuration in which the communication apparatus 20 can be installed vertically without a support base can also be employed.

  Moreover, the 1st-3rd ventilation part (11-13) and each ventilation opening of the front ventilation part 15 should just be 1 or more, and are not limited to multiple.

[Summary]
An electronic apparatus (communication device 20) according to aspect 1 of the present invention includes a substrate (7) and a heating element (circuit chip 14) mounted on one surface of the substrate (7) inside a housing (10). ), A heat transfer material (8) installed on the other surface of the substrate (7) facing the heating element (14) across the substrate (7), and the heat transfer material (8) A first ventilation portion (11) including a heat radiating plate (9) in contact with the first surface (1) of the housing (10) and including a vent hole (11h) penetrating the first surface (1). It is provided, The said heat sink (9) and the said 1st ventilation part (11) are contacting, It is characterized by the above-mentioned.

  In the above configuration, since the heat radiating plate comes into contact with the outside air through the plurality of vent holes of the first ventilation portion, the heat transferred from the heating element to the heat radiating plate through the heat transfer material can be directly released to the outside air. it can. Moreover, the heat transmitted from the heat sink to the first ventilation portion can be released to the outside air through the vent. Thereby, the heat dissipation effect in an electronic device can be improved.

  The electronic device (communication device 20) according to aspect 2 of the present invention is characterized in that the electronic device (communication device 20) can be installed in either a state where the first surface (1) is a lower surface or a state where it is a side surface.

  According to the said structure, a possibility that the 1st ventilation part may be obstruct | occluded with an obstruction, dust, etc. decreases, and a high heat dissipation effect can be ensured.

  In the electronic device (communication device 20) according to the third aspect of the present invention, the casing includes a second surface facing the first surface, and the second surface (2) includes the second surface (2). The second ventilation part (12) including the ventilation hole (12h) penetrating through is provided so as to face the heating element (circuit chip 14).

  According to the said structure, the heat of a heat generating body can be escaped also from the 2nd ventilation part located in the one surface (mounting surface) side of a board | substrate by a thermal convection, and a heat dissipation effect can be improved more. Further, even if the vent hole of the first ventilation part is blocked for some reason, heat can be radiated from the vent hole of the second ventilation part, and even if the vent hole of the second ventilation part is blocked for some reason, the first Heat can be radiated from the vent of the vent.

  In the electronic device (communication device 20) according to the aspect 4 of the present invention, an NFC (Near Field Communication) element is provided in the casing (10) in the vicinity of the second surface (2). Features.

  In the above configuration, heat is radiated from the first ventilation portion provided on the first surface of the housing, and a high temperature rise near the second surface is suppressed. Suppressing the high temperature rise in the vicinity of the second surface, which is the top surface, is convenient for mounting NFC elements that generally need to be provided close to the top surface due to short-range communication characteristics, and generally have low heat resistance. , The reliability of the NFC element is improved.

  In the electronic device (20) according to the fifth aspect of the present invention, the housing connects the first surface (1) and the second surface (2), and the third surface (3) faces each other. And a fourth surface (4), and the third surface (3) is provided with a third ventilation portion (13) including a vent hole penetrating the third surface (3). To do.

  According to the said structure, the heat dissipation effect can be heightened more by the flow of the air from a 3rd ventilation part to a 2nd ventilation part at the time of vertical installation which uses the said 3rd surface as a lower surface.

  In the electronic device (communication device 20) according to the aspect 6 of the present invention, the exhaust heat space sandwiched between the first and second ventilation portions (11, 12) is a fourth surface (3) than the third surface (3). It is characterized by being close to 4).

  In the above configuration, the low heat resistance element and the NFC element are provided in the space located on the third surface side of the exhaust heat space, and the NFC element that is generally low heat resistance is provided. Furthermore, the heat-dissipating space is located above the casing when placed vertically with the third surface as the bottom surface, and the low heat resistance element and NFC element are arranged below the casing where the influence of heat is small. can do. Thereby, the reliability of a low heat resistance element or an NFC element can be improved.

  In the electronic device (communication device 20) according to the seventh aspect of the present invention, an NFC (Near Field Communication) element is provided inside the housing so as to be located on the third surface (3) side with respect to the exhaust heat space. It is characterized by.

  In the above configuration, the NFC element that is generally low heat resistant can be separated from the exhaust heat space. Furthermore, the heat exhaust space is positioned above the casing when the third surface is the lower surface, and the NFC element can be arranged below the casing where the influence of heat is small. This increases the reliability of the NFC element.

  In the electronic apparatus (communication device 20) according to the aspect 8 of the present invention, a plurality of protrusions (19a to 19d) protruding outward from the housing (10) are provided on the first surface (1). It is characterized by.

  According to the said structure, a clearance gap can be ensured between a mounting surface and a housing | casing at the time of horizontal placement which uses the said 1st surface as a lower surface, and a high heat dissipation effect can be ensured.

  The electronic apparatus (communication device 20) according to aspect 9 of the present invention is characterized in that the first ventilation portion (11) has a fin structure.

  In the above configuration, the contact area between the first ventilation portion and the outside air can be increased, and the heat transmitted from the heat sink to the first ventilation portion can be quickly released to the outside air. In addition, the fin structure has an advantage that dust and the like are not easily clogged.

  The electronic apparatus (communication device 20) according to the tenth aspect of the present invention is characterized in that the first ventilation portion (11) has a network structure.

  In the said structure, the distance of a heat sink and external air becomes small, and the heat of a heat sink can be more directly released to external air.

  A support base (30) according to aspect 11 of the present invention is a support base for holding the electronic device (communication device 20) according to aspect 5 of the present invention, the horizontal portion (31) in contact with the mounting surface, and the above It has a holding part (wall part 32) holding electronic equipment (communication device 20) so that the above-mentioned 3rd surface may become a bottom.

  According to the above configuration, the support device can hold the electronic device while forming the gap between the third surface of the electronic device and the horizontal portion, and the gap between the first surface and the holding portion, The ventilation performance of the 1st and 3rd ventilation part at the time of vertical installation can be ensured.

  In the support base (30) according to the twelfth aspect of the present invention, the holding part (32) has a structure exposing the first ventilation part (11).

  Thus, by exposing the first ventilation part, the ventilation performance of the first ventilation part can be further enhanced.

  In the support base (30) according to the aspect 13 of the present invention, a plurality of protrusions (19a to 19d) are provided on the first surface (1) of the electronic device (communication device 20), and the holding portion (wall portion 32). ) Is provided with a plurality of attachment portions (fixing holes 39a to 39d) for attaching the plurality of protrusions (19a to 19d).

  According to the said structure, these processus | protrusions can be concealed, forming the clearance gap between a 1st surface and a holding | maintenance part by the some processus | protrusion of a 1st surface, and aesthetics also improve.

  The present invention is not limited to the above-described embodiments, and those obtained by appropriately modifying the above-described embodiments based on common general technical knowledge and those obtained by combining them are also included in the embodiments of the present invention.

  The present invention is suitable for a communication device, for example.

DESCRIPTION OF SYMBOLS 1 1st surface (of housing | casing) 2 2nd surface (of housing | casing) 3rd surface 3 (of housing | casing) 4th surface 5 (of housing | casing) 5th surface (front side)
6 6th surface (back side)
7 Substrate 8 Heat Transfer Material 9 Heat Dissipation Plate 10 Housing 11 First Vent 12 Second Vent 11h / 12h Vent 13 Third Vent
14 Circuit chip (heating element)
DESCRIPTION OF SYMBOLS 15 Front ventilation part 16 Connector 17 Low heat resistant element 18 Heat sink 19a-19d Protrusion 20 Communication apparatus (electronic device)
21 NFC board 22 Power switch 23 External terminal connection part 24 Remote control light receiving part 30 Support base 31 Horizontal part 32 Wall part (holding part)
33 opening 35a-35d fixing screw 39a-39d fixing hole (attachment part)
f Fin G g Clearance

Claims (11)

Inside the housing, a substrate, a heating element mounted on one surface of the substrate, a heat transfer material installed on the other surface of the substrate facing the heating element across the substrate, A heat sink in contact with the heat transfer material,
The first surface of the housing, the fins has a plurality lined fin structure, the first vent portion has a vent spacing adjacent the fin penetrates the first surface is provided, the heat dissipation plate And the first ventilation part are in contact with each other, and the heat radiating plate is in contact with outside air through the ventilation hole .   2. The electronic apparatus according to claim 1, wherein the electronic device can be installed in any of a state where the first surface is a lower surface and a state where the first surface is a side surface. The housing includes a second surface facing the first surface,
3. A second ventilation part including a ventilation hole penetrating the second surface is provided on the second surface of the casing so as to face the heating element. Electronic equipment.   The electronic apparatus according to claim 3, wherein an NFC (Near Field Communication) element is provided in the casing in proximity to the second surface. The housing includes a third surface and a fourth surface that connect the first surface and the second surface and face each other,
5. The electronic device according to claim 3, wherein a third ventilation portion including a ventilation hole penetrating the third surface is provided on the third surface of the casing.   The electronic apparatus according to claim 5, wherein the exhaust heat space sandwiched between the first and second ventilation portions is closer to the fourth surface than the third surface.   The electronic apparatus according to claim 6, wherein an NFC element is provided inside the casing so as to be positioned on the third surface side with respect to the exhaust heat space.   The electronic apparatus according to claim 1, wherein a plurality of protrusions protruding outward from the housing are provided on the first surface. A support base for holding the electronic device according to claim 5,
A support base for an electronic device, comprising: a horizontal portion that is in contact with a placement surface; and a holding portion that holds the electronic device such that the third surface is a lower surface. The support stand for an electronic device according to claim 9 , wherein the holding portion has a structure exposing the first ventilation portion. A plurality of protrusions are provided on the first surface of the electronic device,
The support table for an electronic device according to claim 9 , wherein the holding portion is provided with a plurality of attachment portions for attaching the plurality of protrusions.

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