JP2014003788A - Control board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a control board which can sufficiently radiate heat even when a heat quantity of an electronic apparatus is high.SOLUTION: A control board according to the present invention includes: an air-tight case which has an electronic apparatus housing section in which a high-temperature air dedicated passage and a low-temperature air dedicated passage are formed; and a ventilation cooling section which is provided on a side closer to the high-temperature air dedicated passage than the low-temperature air dedicated passage of the air-tight case via a side wall of the air-tight case and has a dust-proof electronic apparatus housing section. Heat can be sufficiently radiated even when a heat quantity of an electronic apparatus is high because a heat quantity in the air-tight case can be made low by housing a dust-proof electronic apparatus in the ventilation cooling section provided in the outside of the air-tight case. Since the electronic apparatus disposed in the low-temperature air dedicated passage is suppressed from being heated by the high-temperature air of the dust-proof electronic apparatus housing section by providing the dust-proof electronic apparatus housing section on a far side from the low-temperature air dedicated passage of the electronic apparatus housing section, heat can be sufficiently radiated even when the heat quantity of the electronic apparatus is high.

Description

  The present invention relates to a control panel that houses electronic equipment.

  A conventional control panel houses an electronic device in an airtight housing in order to improve a dustproof function or a waterproof function. In such a control panel, when the amount of heat generated by the contained electronic device is small, it is possible to sufficiently dissipate heat by natural air cooling from the outer wall of the control panel. When the amount of heat generation increases, heat dissipation becomes insufficient. Therefore, a method has been proposed in which a heat pipe is provided between electronic devices to transport heat inside the control panel to the outside (see, for example, Patent Document 1).

Japanese Patent Laid-Open No. 7-35485 (paragraphs [0014]-[0034], FIG. 1-3)

  In the conventional control panel, since it is difficult for the heat pipe disposed between the electronic devices to be in thermal contact with the electronic device having a complicated shape, there is a problem that heat radiation is insufficient.

  The present invention has been made to solve the above-described problems, and provides a control panel that can sufficiently dissipate heat even when an electronic device generates a large amount of heat.

  The control panel according to the present invention includes an airtight housing having an electronic device housing portion in which a dedicated passage for high temperature air and a dedicated passage for low temperature air are formed, and a side closer to the dedicated passage for high temperature air than the dedicated passage for low temperature air in the hermetic housing And a ventilation / cooling unit that is provided through a side wall of the airtight housing and has a dust-proof electronic device housing.

  The present invention can reduce the amount of heat generated in the airtight housing by housing the dust-proof electronic device in the ventilation cooling unit provided outside the airtight housing, and therefore the amount of heat generated by the electronic device is large. But it can dissipate enough heat. In addition, by providing the dust-resistant electronic device housing section on the side far from the low-temperature air passage of the electronic device housing section, the electronic devices disposed in the low-temperature air passage are heated by the high-temperature air of the dust-proof electronic device housing section. Therefore, even when the electronic device generates a large amount of heat, the heat can be sufficiently radiated.

It is side surface sectional drawing of the control panel which concerns on Embodiment 1 of this invention. It is a figure which shows the heat exchanger of the control panel which concerns on Embodiment 1 of this invention. It is a figure which shows the example of the other heat exchanger of the control panel which concerns on Embodiment 1 of this invention. It is side surface sectional drawing of the control panel which concerns on Embodiment 2 of this invention. It is a figure which shows the heat radiator of the control panel which concerns on Embodiment 2 of this invention. It is a figure which shows the example of the other heat sink of the control panel which concerns on Embodiment 2 of this invention. It is a figure which shows the modification of the control panel which concerns on Embodiment 2 of this invention.

Hereinafter, a control panel according to the present invention will be described with reference to the drawings.
In the following description, an electronic device will be described by taking a power conversion control panel as an example, but it goes without saying that the present invention can also be applied to a control panel equipped with an electronic device for other purposes. In the description of each embodiment, terms indicating directions (for example, “front”, “back”, “left”, “right”, etc.) are used as appropriate, but the present invention is not limited by these terms. . Moreover, in each figure, the same code | symbol is attached | subjected to the same member or the same part. Moreover, illustration is abbreviate | omitted suitably about the fine structure. In addition, overlapping descriptions are simplified or omitted as appropriate.

Embodiment 1 FIG.
The structure of the control panel according to the first embodiment will be described below.
FIG. 1 is a side cross-sectional view of the control panel according to the first embodiment. As shown in FIG. 1, the control panel 100 includes an airtight housing 1 having an electronic device housing portion 2, a heat radiating portion 3, a ventilation cooling portion 4 having a dust-resistant electronic device housing portion 5, and a pedestal 6. Is done. The airtight housing 1, the heat radiating portion 3, and the ventilation / cooling portion 4 may be an integral structure or a separate housing. In FIG. 1, the front of the control panel is shown on the left side, and the back of the control panel is shown on the right side.

  The electronic device housing portion 2 of the hermetic housing 1 houses an electronic device 7 with a small amount of heat generation and an electronic device 8 with a large amount of heat generation. A heat exchanger 9 that dissipates heat from the electronic device housing portion 2 to the heat radiating portion 3 is provided at the boundary with the heat radiating portion 3 above the electronic device housing portion 2. The electronic device 7 with a small amount of heat generation is provided on the front door 10 side. Moreover, the electronic device 8 with a large calorific value is provided below the ventilation cooling unit 4 side. A partition plate 11 is provided above between the electronic device 7 that generates a small amount of heat and the electronic device 8 that generates a large amount of heat. The partition plate 11 forms a low-temperature air exclusive passage 12 where the low-temperature air cooled by the heat exchanger 9 descends and a high-temperature air exclusive passage 13 where the high-temperature air heated by the electronic device rises. A plurality of partition plates 11 may be used, and the high-temperature air exclusive passage 13 may be divided into a plurality of portions to rectify the airflow. In addition, the electronic device 7 with a small amount of heat generation may be attached to the surface of the partition plate 11 on the low-temperature air dedicated passage 12 side.

  The dustproof electronic device 14 is housed in the dustproof electronic device housing 5 of the ventilation / cooling unit 4. The dust-resistant electronic device 14 is, for example, a reactor, a resistor, a capacitor, or the like. A side wall 15 of the airtight housing 1 is provided on a surface where the electronic device housing portion 2 and the dust-resistant electronic device housing portion 5 are in contact with each other. An intake ventilation port 16 and an exhaust ventilation port 17 that are provided with measures against inflow of rainwater and allow ventilation are provided in any or all of the rear and left and right side walls of the ventilation cooling unit 4. In addition, since the ventilation cooling part 4 is provided with the side wall 15 in the front, and access is bad at the time of maintenance etc., it is good to provide the back door 18 for exclusive use on the back.

  The heat dissipating part 3 has an open upper surface and / or side surface. As a measure against wind and rain, solar radiation, and dust, a top plate 19 is preferably provided on the upper surface. In addition, a panel 20 having an opening such as a wire mesh or a punching metal is preferably provided on the opened surface.

  The pedestal 6 secures stability during installation and raises the control panel 100 so that rainwater or the like does not flow in. In addition, the wiring for communicating or energizing from the electronic device of the electronic device housing part 2 and the electronic device of the dust-proof electronic device housing unit 5 to the outside may be routed below the pedestal 6 through the opening. It may be pulled out in the lateral direction through a notch provided in a part.

FIG. 2 is a view showing the heat exchanger 9. As shown in FIG. 2, the heat exchanger 9 is a double-sided finned heat sink 22 composed of a fin 23 having a straight shape or a pin shape and a heat receiving plate 24, and an opening provided on the upper plate 21 of the airtight housing 1. It is attached to. Since the periphery of the opening and the heat receiving plate 24 are in close contact with each other, the airtightness of the airtight housing 1 is maintained.
FIG. 3 is a diagram illustrating an example of another heat exchanger 9. As shown in FIG. 3, a finned heat pipe 25 including a fin 23, a heat receiving plate 24, and a heat pipe 26 may be attached to an opening provided in the upper plate 21 of the airtight housing 1. The greater the number of fins 23 and heat pipes 26, the better the heat dissipation efficiency. The shape of the heat pipe 26 may be a U shape or an L shape.
The heat exchanger 9 includes two heat sinks with single-side fins or heat pipes with single-side fins provided with fins 23 and heat pipes 26 on a base plate (not shown). It may be provided between the two. Further, the heat exchanger 9 may be attached not to the upper plate 21 of the airtight housing 1 but to the upper side wall of the electronic device housing 2 or the side wall provided on the upper side. The fins 23 may be inclined at right angles to the heat receiving plate 24 and the heat pipe 26.

Next, the operation of the control panel according to the first embodiment will be described. Here, the case where the heat exchanger 9 shown in FIG. 3 is used as the heat exchanger 9 will be described, and the description of the case where another heat exchanger 9 is used will be omitted.
The high-temperature air heated by the electronic device 8 with a large amount of generated heat rises in the high-temperature air dedicated passage 13 between the side wall 15 and the partition plate 11 and reaches the heat exchanger 9. At this time, because the partition plate 11 separates the high temperature air dedicated passage 13 and the low temperature air dedicated passage 12, the high temperature air rises without hindering the lowering of the low temperature air.

  The high-temperature air heats the fins 23 of the heat exchanger 9 and the temperature of the heat receiving plate 24 rises. As the temperature of the heat receiving plate 24 rises, the heat pipe 26 attached to the heat receiving plate 24 is heated. As a result, the liquid in the heat pipe 26 undergoes a phase change to steam and receives latent heat, and the steam pressure in a region in contact with the heat receiving plate 24 in the heat pipe 26 increases. The steam pressure in the region in contact with the heat receiving plate 24 in the heat pipe 26 becomes higher than the steam pressure in the region in which the fins 23 in the heat pipe 26 are provided, and the steam that has received the latent heat has the fins 23 in the heat pipe 26. Move to the selected area. The steam is condensed in the region where the fins 23 are provided, and the received latent heat is released and propagates to the fins 23, so that the temperature of the fins 23 rises. Due to the temperature difference between the air between the fins 23 and the fins 23, the heat of the fins 23 propagates to the air between the fins 23, and the temperature of the air between the fins 23 rises. Buoyancy is generated in the air between the fins 23 due to a temperature difference from the surrounding low-temperature air, and the air between the fins 23 rises. Since the ambient low-temperature air is sucked in ascending, ambient low-temperature air is continuously supplied between the fins 23. On the other hand, the elevated high temperature air is discharged from the upper surface and / or the side surface of the heat radiating unit 3. Further, the vapor in the heat pipe 26 changes into a liquid state due to condensation, moves toward the heat receiving plate 24 by the action of gravity, and repeatedly receives the latent heat of the high-temperature air in the electronic device housing 2.

  The low-temperature air in the electronic device housing 2 cooled by the heat exchanger 9 descends in the low-temperature air exclusive passage 12 between the front door 10 and the partition plate 11. The low-temperature air reaches the electronic device 8 having a large heat generation amount while cooling the electronic device 7 having a small heat generation amount provided in the low-temperature air dedicated passage 12, and cools the electronic device 8 having a large heat generation amount.

In this way, by forming a circulation loop of air in the electronic device housing part 2 using the partition plate 11, air is stagnated in the panel and the internal air temperature rises on average as in the conventional control panel. In addition, it is not necessary to use excessive cooling means to keep the inside of the control panel below an arbitrary allowable temperature. That is, by consolidating the electronic devices 7 that generate a small amount of heat into the low-temperature air passage 12, the temperature of the space can be kept low, and therefore even when the allowable temperature of the electronic device provided in the space is low. Heat dissipation is sufficient.
In addition, by collecting the electronic devices 8 having a large amount of heat generation below the high-temperature air dedicated passage 13, the temperature difference of the high-temperature air in the high-temperature air dedicated passage 13 with respect to the surrounding air can be further increased. It is promoted more and heat dissipation can be made more efficient.
Further, for example, when the temperature of the ambient air is 30 ° C. and the allowable temperature of the electronic device 7 that generates a small amount of heat is 45 ° C., the conventional control panel must dissipate heat with a temperature difference of 15K. In such a control panel, it is possible to dissipate heat at a temperature difference of 30 K by setting the air temperature of the low temperature air passage 12 to 45 ° C. and the air temperature of the high temperature air passage 13 to 60 ° C. Therefore, the heat exchanger 9 Can be reduced in size. When the heat of the high-temperature air in the high-temperature air dedicated passage 13 is propagated to the low-temperature air in the low-temperature air dedicated passage 12, a heat insulating member may be provided on the partition plate 11.

  On the other hand, in the ventilation / cooling unit 4, the air temperature of the dust-proof electronic device housing portion 5 is increased by the dust-proof electronic device 14 housed in the dust-proof electronic device housing portion 5. Ambient air is sucked from an intake vent 16 provided below, and heated high-temperature air is discharged from an upper exhaust vent 17. Buoyancy occurs in the high-temperature air in the dust-proof electronic device housing 5 due to the temperature difference from the ambient air, so the ambient air is sucked from the intake vent 16 and the ambient low-temperature air is continuously supplied to the dust-proof electronic device 14. Is done.

As described above, in the control panel according to the first embodiment, the dust-proof electronic device 14 is accommodated in the ventilation cooling unit 4 provided outside the hermetic casing 1 so that the amount of heat generated in the hermetic casing 1 is reduced. Since it can be reduced, heat can be sufficiently dissipated even when the amount of heat generated by the electronic device is large.
Further, by providing the dust-resistant electronic device housing portion 5 on the side far from the low-temperature air dedicated passage 12 of the electronic device housing portion 2, the electronic device disposed in the low-temperature air dedicated passage 12 is connected to the dust-resistant electronic device housing portion 5. Therefore, it is possible to sufficiently dissipate heat even when the electronic device generates a large amount of heat.
In addition, when the temperature of the high-temperature air in the dust-proof electronic device housing 5 is higher than the temperature of the high-temperature air in the high-temperature air dedicated passage 13, the dust-proof electronic device housing 5 is used as the high-temperature air in the electronic device housing 2. By being provided on the side closer to the dedicated passage 13, the temperature difference between the dust-resistant electronic device housing portion 5 and the electronic device housing portion 2 is reduced, and the heat of the dust-resistant electronic device housing portion 5 is propagated to the electronic device housing portion 2. Therefore, it is possible to sufficiently dissipate heat from the electronic device in the electronic device housing portion 2.
In such a case, the heat of the high-temperature air in the dust-proof electronic device housing 5 is transmitted to the high-temperature air in the high-temperature air dedicated passage 13 through the side wall 15, and the temperature of the high-temperature air in the high-temperature air dedicated passage 13 is Since it further rises, the circulation of air in the electronic device housing part 2 is promoted, and the temperature difference from the ambient air in the heat exchanger 9 becomes large, so that the heat radiation of the electronic device housing part 2 is made more efficient.
If the temperature of the high-temperature air in the dust-proof electronic device housing 5 is too higher than the temperature of the high-temperature air in the high-temperature air dedicated passage 13, the temperature of the low-temperature air in the low-temperature air dedicated passage 12 is increased. Further, a heat insulating member may be provided on the partition plate 11.

  In addition, as shown in FIG. 1, if the partition plate 11 is inclined and disposed, the low-temperature air exclusive passage 12 can be further widened, and the control panel can be miniaturized. In addition, when the temperature of the high-temperature air in the dust-resistant electronic device housing 5 is higher than the temperature of the high-temperature air in the high-temperature air dedicated passage 13, the partition plate 11 is disposed to be inclined so that the dust-proof electronic It becomes possible to propagate the heat of the high-temperature air in the device housing portion 5 by the high-temperature air in the high-temperature air dedicated passage 13, and the heat dissipation of the electronic device housing portion 2 is further improved.

  In addition, in order to prevent high temperature air discharged from the exhaust ventilation port 17 from flowing into the upper heat radiating portion 3, a reverse letter C or a horizontal or inclined guide plate 27 is provided on the upper portion of the rear door 18. It is better to guide the rising hot air to the left and right sides as seen from the back side.

  When the control panel 100 is installed outdoors, the temperature in the control panel rises due to the effects of solar radiation, so it is preferable to provide a heat shield on the upper surface and / or side surface. The heat shield plate provided on the side surface is convenient if provided directly on the front door 10 and / or the rear door 18. In this case, the guide plate 27 is preferably provided so as to close the space between the rear door 18 and the heat shield plate. Further, the heat shield plate may be a flat plate or a plate with an armor window cut and raised in a louver shape.

Embodiment 2. FIG.
The control panel according to the second embodiment will be described below.
FIG. 4 is a side sectional view of the control panel according to the second embodiment. As shown in FIG. 4, the control panel 200 includes an airtight housing 1 having an electronic device housing portion 2 composed of a high temperature allowable electronic device housing portion 28 and a low temperature allowable electronic device housing portion 29, a heat radiating portion 3, A ventilation cooling unit 4 having a dust-resistant electronic device housing 5 and a pedestal 6 are included.

  The high temperature allowable electronic device accommodating portion 28 is provided above the low temperature air passage 12 of the low temperature allowable electronic device accommodating portion 29 and accommodates the high temperature allowable electronic device. The high temperature allowable electronic device is a power module 30 made of IGBT or the like, a gate substrate 31 of the power module 30, a bus bar 32 for power transmission, and the like, and is an electronic device for power conversion.

  The low temperature allowable electronic device accommodating portion 29 accommodates the low temperature allowable electronic device and the capacitor 33 of the power module 30. A heat exchanger 9 that dissipates heat from the low temperature allowable electronic device to the heat radiating unit 3 is provided at the boundary with the heat radiating unit 3 above the low temperature allowable electronic device accommodating portion 29. The low temperature allowable electronic device includes an electronic device 7 that generates a small amount of heat and an electronic device 8 that generates a large amount of heat. The electronic device 7 with a small amount of heat generation is provided on the front door 10 side. Moreover, the electronic device 8 with a large calorific value is provided below the ventilation cooling unit 4 side. A partition plate 11 is provided above between the electronic device 7 that generates a small amount of heat and the electronic device 8 that generates a large amount of heat. As in the first embodiment, the low temperature allowable electronic device accommodating portion 29 is formed with the low temperature air dedicated passage 12 and the high temperature air dedicated passage 13, and the air of the low temperature allowable electronic device accommodating portion 29 is circulated.

In the heat radiating unit 3, a heat radiator 34 that radiates heat from the high temperature allowable electronic device accommodating portion 28 and a heat exchanger 9 that radiates heat from the low temperature allowable electronic device accommodating portion 29 are arranged side by side in the vertical direction.
The heat radiator 34 is provided on the side wall 35 of the high temperature allowable electronic device accommodating portion 28. FIG. 5 is a diagram showing the heat radiator 34. As shown in FIG. 5, a single-sided finned heat pipe 36 composed of the fins 23, the heat receiving plate 24, and the heat pipe 26 is attached to the opening provided in the side wall 35. Since the periphery of the opening and the heat receiving plate 24 are in close contact with each other, the airtightness of the airtight housing 1 is maintained. The shape of the heat pipe 26 may be L-shaped or U-shaped.
FIG. 6 is a diagram illustrating an example of another heat radiator 34. As shown in FIG. 6, a single-side finned heat sink 37 composed of the fins 23 and the heat receiving plate 24 may be mounted in an opening provided in the side wall 35.
The heat radiator 34 may have a configuration in which a heat pipe with a single-sided fin in which the fins 23 and the heat pipes 26 are provided on a base plate (not shown) or a heat sink with a single-sided fin is provided on the side surface of the side wall 35. Further, the radiator 34 may be attached not to the side wall 35 of the high temperature allowable electronic device accommodating portion 28 but to the upper plate 38 of the high temperature allowable electronic device accommodating portion 28.

  The power module 30 of the high temperature allowable electronic device accommodating portion 28 is attached to the heat receiving plate 24 of the radiator 34 or to the side wall 35 or the upper plate 38 of the high temperature allowable electronic device accommodating portion 28 so as to face the heat radiator 34.

  The high temperature permissible electronic device accommodating portion 28 and the low temperature permissible electronic device accommodating portion 29 communicate with each other in the airtight housing 1 so that they can communicate and / or energize. Since the capacitor 33 has a low allowable temperature and needs to be provided in the low temperature allowable electronic device storage portion 29, the capacitor 33 is disposed on the low temperature allowable electronic device storage portion 29 side at the boundary between the low temperature allowable electronic device storage portion 29 and the high temperature allowable electronic device storage portion 28. Provided.

  As shown in FIG. 4, the power module 30 of the high temperature allowable electronic device accommodating portion 28 and the capacitor 33 of the low temperature allowable electronic device accommodating portion 29 are connected using an L-shaped bus bar 32. By positioning the mounting surface of the capacitor 33 at the boundary between the high temperature allowable electronic device housing portion 28 and the low temperature air passage 12, the capacitor 33 is housed in the low temperature air passage 12, and the life of the capacitor 33 is extended.

  The gate substrate 31 is preferably accommodated in the low-temperature air exclusive passage 12, but is required to be connected with a short communication line so as not to cause a switching response delay, and thus is provided in the high-temperature allowable electronic device accommodating portion 28. Note that when no switching response delay occurs, the gate substrate 31 may be provided in the low-temperature air exclusive passage 12.

  As shown in FIG. 4, the power module 30, the bus bar 32, and the gate substrate 31 are preferably arranged in this order from the heat radiating unit 3 toward the front door 10 in the high temperature allowable electronic device housing unit 28. A heat insulating member 39 is preferably provided between the power module 30 and the gate substrate 31 as necessary. By sealing the gate substrate 31 with the heat insulating member 39, the ambient air around the gate substrate 31 can be lowered. Furthermore, the gate substrate 31 is preferably provided in the vicinity of the front door 10. In addition, a thermal sheet or the like may be provided between the gate substrate 31 and the front door 10 to promote heat dissipation. Further, a fin, a heat sink, or the like may be provided on a door or a wall surface around the gate substrate 31.

  When the L-shaped bus bar 32 is used, the high-temperature air rises upward from the horizontal portion of the bus bar 32. Therefore, as shown in FIG. 4, the heat insulating member 39 is preferably L-shaped. A combination of a vertical flat heat insulating member and a horizontal flat heat insulating member may be used. In FIG. 4, the horizontal portion of the bus bar 32 is provided so as to face the front door 10, but may be provided so as to face the back surface. In that case, since the high temperature air from the horizontal part of the bus bar 32 is suppressed from reaching the gate substrate 31, the L-shaped heat insulating member 39 may not be used.

Next, the operation of the control panel according to the second embodiment will be described. Here, the case where the radiator 34 shown in FIG. 5 is used as the radiator 34 will be described, and the description of the case where another radiator 34 is used will be omitted.
When the control panel 200 is activated, the power module 30, the gate substrate 31 and the bus bar 32 of the high temperature allowable electronic device accommodating portion 28, the capacitor 33 of the low temperature allowable electronic device accommodating portion 29, the electronic device 7 having a small amount of heat generation, and the electronic having a large amount of heat generation. The dust-proof electronic device 14 in the device 8 and the dust-proof electronic device housing 5 generates heat.

When the power module 30, the gate substrate 31, and the bus bar 32 of the high temperature allowable electronic device housing portion 28 generate heat, the temperature of the heat receiving plate 24 of the radiator 34 rises and heat is transmitted to the heat pipe 26 attached to the heat receiving plate 24. . Similar to the heat exchanger 9 of the first embodiment, the heat of the heat pipe 26 propagates to the surrounding air, and the power module 30, the gate substrate 31, and the bus bar 32 are cooled.
When the capacitor 33, the electronic device 7 with a small heat generation amount, and the electronic device 8 with a large heat generation amount generate heat, the air in the low temperature allowable electronic device storage portion 29 circulates as in the first embodiment. Then, the capacitor 33, the electronic device 7 having a small heat generation amount, and the electronic device 8 having a large heat generation amount are cooled.
When the dust-proof electronic device 14 in the dust-proof electronic device housing 5 generates heat, ambient air is sucked from the intake vent 16 and the dust-proof electronic device 14 is cooled, as in the first embodiment.

  Since most of the heat generated in the high temperature allowable electronic device accommodating portion 28 is generated in the power module 30, most of the heat generated in the high temperature allowable electronic device accommodating portion 28 is radiated by the radiator 34, but part of the heat generated in the power module 30. Is propagated to the air in the high temperature allowable electronic device accommodating portion 28 or the gate substrate 31 or the bus bar 32 itself generates heat, so that the air temperature of the high temperature allowable electronic device accommodating portion 28 is increased. The high temperature allowable electronic device accommodating portion 28 communicates with the low temperature allowable electronic device accommodating portion 29 in the hermetic casing 1 for convenience of installation and wiring of the electronic device. Since the air has a lower density than the low-temperature air in the low-temperature air dedicated passage 12, the air stays in the high-temperature allowable electronic device housing portion 28. That is, since the high temperature air in the high temperature allowable electronic device accommodating portion 28 is suppressed from flowing into the low temperature air dedicated passage 12, the low temperature allowable electronic device disposed in the low temperature allowable electronic device accommodating portion 29 is not adversely affected.

As described above, in the control panel according to the second embodiment, the high temperature allowable electronic device accommodating portion 28 is provided in the electronic device accommodating portion 2, and the high temperature allowable electronic device is directly radiated by the radiator 34 separate from the heat exchanger 9. Therefore, it is possible to reduce the heat generation amount of the low-temperature allowable electronic device housing portion 29, and it is possible to sufficiently dissipate heat even when the heat generation amount of the electronic device is large.
Further, by providing the heat radiator 34 of the high temperature allowable electronic device housing portion 28 above the heat exchanger 9 of the low temperature allowable electronic device housing portion 29, the air flow generated by the heat radiation of the heat radiator 34 and the heat radiation of the heat exchanger 9 can be reduced. Since air circulation of the radiator 34 is promoted by the generated airflow, heat dissipation is further improved.

  The control panel according to the second embodiment includes an airtight housing 1 having an electronic device housing portion 2 composed of a high temperature allowable electronic device housing portion 28 and a low temperature allowable electronic device housing portion 29, a heat radiating portion 3, The ventilation / cooling unit 4 having the dust-resistant electronic device housing 5 and the pedestal 6 are configured. However, when the heat generation amount of the electronic device is small, the ventilation / cooling unit 4 is configured like a control panel 300 shown in FIG. May be omitted.

  DESCRIPTION OF SYMBOLS 1 Airtight housing | casing, 2 Electronic equipment accommodating part, 3 Heat radiating part, 4 Ventilation cooling part, Dust-proof electronic equipment accommodating part, 6 Base, 7 Electronic device with little calorific value, 8 Electronic device with much calorific value, 9 Heat exchange 10 Front door, 11 Partition plate, 12 Low-temperature air passage, 13 High-temperature air passage, 14 Dust-resistant electronic equipment, 15 Side wall, 16 Air intake vent, 17 Exhaust air vent, 18 Back door, 19 Top plate, 20 Panel, 21 Upper plate, 22 Heat sink with double-sided fin, 23 Fin, 24 Heat receiving plate, 25 Heat pipe with fin, 26 Heat pipe, 27 Guide plate, 28 High temperature allowable electronic device accommodating portion, 29 Low temperature allowable electronic device accommodating portion, 30 Power module, 31 Gate substrate, 32 Busbar, 33 Capacitor, 34 Radiator, 35 Side wall, 36 Heat pipe with single-sided fin, 37 pieces The heat sink with fins, 38 top plate, 39 a heat insulating member, 100 control panel 200 control panel 300 control panel.

Claims (12)

An airtight housing having an electronic device housing portion formed with a passage dedicated to high-temperature air and a passage dedicated to low-temperature air;
A ventilation cooling unit provided on a side closer to the high-temperature air dedicated passage than the low-temperature air dedicated passage of the airtight housing via a side wall of the hermetic housing, and having a dust-resistant electronic device housing portion;
A control panel comprising: The air temperature of the dust-proof electronic device housing is higher than the air temperature of the high-temperature air dedicated passage,
The control panel according to claim 1. In the electronic device housing portion, a high temperature allowable electronic device housing portion is provided above at least one of the high temperature air dedicated passage and the low temperature air dedicated passage.
The control panel according to claim 1 or 2, characterized in that A heat exchanger for cooling the high-temperature air in the high-temperature-acceptable electronic device housing portion and a high-temperature air dedicated passage is provided in parallel with each other,
The control panel according to claim 3. At least one of the radiator of the high temperature permissible electronic device housing section and the heat exchanger that cools the high temperature air of the high temperature air dedicated passage is at least one of a plate, a heat pipe attached to the surface of the plate, and a fin It consists of one side and
The plate is fixed so as to close an opening provided on an outer wall surface of the hermetic casing or to be in close contact with an outer wall surface of the hermetic casing,
The control panel according to claim 3 or 4, characterized by the above. The high temperature allowable electronic device housing portion is provided with a power module, a gate substrate of the power module, and a heat insulating member that suppresses heat propagation from the power module to the gate substrate. Item 6. The control panel according to any one of Items 3 to 5. A power module is provided in the high temperature allowable electronic device accommodating portion,
The capacitor connected to the power module is provided in the low-temperature air dedicated passage.
The control panel according to any one of claims 3 to 6, wherein The high temperature allowable electronic device housing portion includes a power module, a bus bar connecting the power module and a capacitor, a gate substrate of the power module, and a heat insulating member for suppressing heat propagation from the bus bar to the gate substrate. Is provided,
The control panel according to any one of claims 3 to 7, wherein The side wall of the airtight housing between the ventilation cooling unit and the passage for exclusive use of high-temperature air has an inclined surface.
The control panel according to any one of claims 1 to 8, characterized in that: A heat insulating member that suppresses the propagation of heat from the ventilation cooling section to the high-temperature air dedicated passage is provided,
The control panel according to any one of claims 1 to 9, wherein A door is provided in the airtight housing, and a door different from the door is provided in the ventilation cooling unit.
The control panel according to any one of claims 1 to 10, wherein: A guide plate is provided for deflecting air discharged from the ventilation cooling unit from a heat exchanger that cools high-temperature air in the high-temperature air dedicated passage.
The control panel according to any one of claims 1 to 11, wherein:

Images