JP2005093630A - Heat radiation structure of electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat radiation structure of electronic equipment for miniaturizing the structure as a whole and radiating heat efficiently at all times. <P>SOLUTION: In the electronic equipment comprising a printed-circuit board 11 in which electrical heating components are mounted on the surface, and an enclosure 10 for accommodating the printed-circuit board 11; a support member 12 in an elastic body for supporting the printed-circuit board 11 inside the enclosure is mounted, in contact with the enclosure at a specified position in the enclosure with a fixed area, and a heat-conductive path is formed from the electrical heating components 15 to the enclosure 10 via the support member 12, thus miniaturizing the entire structure and achieving the radiation structure of the electronic equipment for radiating heat efficiently at all times. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a heat dissipation structure for an electronic device including a printed circuit board on which a heat generating electronic component is mounted, and particularly to an electronic device that enables efficient heat dissipation of the heat generating electronic component while achieving overall downsizing. It relates to a heat dissipation structure.

  In general, a printed circuit board accommodated in an electronic device is mounted with a heat generation type electronic component (hereinafter referred to as “heat generation component”) such as a so-called LSI or a large-scale integrated circuit or a power transistor. Therefore, it is necessary to secure a heat dissipation path inside the electronic device. And this heat radiation path is comprised by heat conduction, heat transfer, and radiation.

  In general, a sufficient ventilation path as shown in FIG. 6 is secured in the housing, and air flows in the ventilation path. Therefore, the heat transmitted from the heat generating component via the air is radiated to the outside of the casing through the vent hole 50c provided in the casing. Specifically, as shown in FIG. 6, heat generated by the heat generating component 55 as a heat source is mainly transferred through the air inside the housing in which the heat generating component is accommodated (in the figure, in the vicinity of the heat generating component). (See thick arrow representing heat transfer above)). Further, part of the heat generated in the heat generating component 55 is transmitted to the printed circuit board via the lead wire by heat conduction. Most of the heat transferred to the printed circuit board 51 is transferred through the air inside the housing and radiated to the outside through the vent 50c, but part of the heat is transferred to the housing. Thus, the heat that has reached the housing through various heat transfer paths is dissipated by heat transfer and radiation from the housing surface to the external air.

  On the other hand, the remaining part of the heat generated by the heat generating component 55 is transmitted to the housing 50 by heat conduction inside the electronic device (see thin line arrows representing heat conduction of the printed circuit board 51 and the support pillar 57 in the figure). Further, the remaining part of the heat is transmitted to the housing by radiation (see the heat radiation arrow in the vicinity of the heat generating component 55 in the figure). The heat reaching the housing 50 is dissipated by heat transfer through the surrounding air (air inside the apparatus to which the housing 50 is attached) (see the heat transfer arrow above the housing in the figure).

  Specific known examples of such a heat dissipation structure of an electronic device include one that promotes convection of the air inside the casing by the rotation of a fan to increase heat transfer efficiency, and a printed circuit board through a heat conductor. There is a known structure (for example, refer to Patent Document 1) in which heat is transmitted to a heat radiating plate provided outside the housing to radiate heat from the heat radiating plate to the outside air.

Japanese Patent Laid-Open No. 7-106782 (page 2-3, FIG. 2)

  However, the conventional heat dissipation structure has the following problems.

  First, in the conventional heat dissipation structure using heat transfer of the air inside the casing, heat is mainly dissipated using heat transfer by ventilation, so the amount of heat release depends on the flow of airflow inside the housing. For this reason, if the space of the ventilation path is reduced, the resistance of the air flow is increased, the ventilation is hindered, and heat is not dissipated. Therefore, the structure must ensure a ventilation path and the entire electronic device cannot be reduced in size.

  In the natural air cooling technology, since it is necessary to match the standard of heat dissipation to the parts with the strictest temperature specifications, the heat dissipation is too much for other parts.

  Therefore, the former conventional electronic device heat dissipation structure that mainly uses natural air cooling technology, which is fundamental in heat dissipation, cannot be said to increase the heat dissipation efficiency to the limit. It was an obstacle to the transformation.

  On the other hand, the structure shown in Patent Document 1 actively transmits heat to a heat radiating plate having a certain heat radiating area provided at a predetermined position outside the housing through the heat conductor as a part of the heat radiating body. It is not something you use. Further, since the heat radiating plate is specially provided outside the housing, the size of the entire electronic device is increased accordingly. Furthermore, when installing the electronic apparatus, it must be installed in a place where the outside air can be sufficiently touched around the heat sink, which is restricted by installation space.

  An object of the present invention is to provide a heat dissipation structure for an electronic device that can reduce the overall structure of the electronic device and can always efficiently dissipate heat.

  In order to solve the above-described problems, a heat dissipation structure for an electronic device according to the present invention includes a printed circuit board having a heat generating component mounted on a surface thereof, and a heat dissipation structure for an electronic device including a housing for accommodating the printed circuit board. The heat conductive support member of the elastic body that supports the inside of the housing is attached to a predetermined position inside the housing while being in contact with the housing with a certain area, and the heat from the heat-generating component to the housing is supported via the support member. A conduction path is formed.

  By adopting such a configuration, the heat generating component and the housing can be connected mainly by heat conduction, and the heat of the heat generating component is conducted and radiated to the housing without passing through the air inside the housing. In this case, the required ventilation path inside the housing can be reduced. Thereby, the whole housing | casing can be made small and it becomes possible to implement | achieve size reduction of an electronic device. In addition, since the entire housing can be regarded as a heating element, there is no restriction on installation space unlike an electronic device having a heat sink in part.

  According to a second aspect of the present invention, there is provided a heat dissipating structure for an electronic device, wherein the heat dissipating structure of the electronic device includes a printed circuit board having a heat generating component mounted on the surface and a housing for accommodating the printed circuit board. A heat conductive support member, which is an elastic body that supports the inside of the body, is attached to a predetermined position inside the housing while being in contact with the housing with a certain area, and the first member from the heat generating component to the housing is supported via the support member. In addition to forming a heat conduction path, an elastic heat conductive spacer is interposed between the heat generating component and the housing while keeping contact with both the heat generating electronic component and the housing with a certain area, and through the spacer A second heat conduction path from the heat generating component to the housing is formed.

  In addition to the heat dissipation structure of the electronic device according to claim 1, direct heat conduction from the heat generating component to the housing is achieved by directly connecting the heat generating component to the housing through an elastic heat conductive spacer. Can do. As a result, since the temperature rise inside the electronic device can be further suppressed and the internal temperature can be made uniform as compared with the heat dissipation structure of the electronic device according to claim 1, the heat dissipation efficiency is further improved.

  As described above, according to the heat dissipation structure for an electronic device according to the present invention, the air inside the housing of the electronic device does not flow, and heat can be dissipated even if heat cannot be released by heat transfer to the internal air. The entire space can be reduced by eliminating the ventilation path from the interior space of the housing and saving space accordingly. In addition, by connecting the heat-generating component to the printed circuit board and the case and considering the entire case as a single heating element, heat can be radiated from the heat-generating component directly to the outside of the electronic device, so the temperature inside the electronic device rises. The internal temperature can be made uniform while suppressing the heat dissipation efficiency of the electronic equipment. As a result, it is possible to sufficiently dissipate even a small electronic device in which the space inside the electronic device is small and internal air does not flow, that is, a small electronic device in which heat dissipation due to heat transfer of the internal air cannot be expected. .

  Hereinafter, a heat dissipation structure for an electronic device according to an embodiment of the present invention will be described with reference to the drawings.

  As shown in FIG. 1, a heat dissipation structure 1 for an electronic device according to an embodiment of the present invention includes a printed circuit board 11 having a heat generating electronic component (hereinafter simply referred to as “heat generating component”) 15 mounted on a surface, An elastic support member 12 that includes a housing 10 that accommodates the substrate 11 and supports the printed circuit board 11 inside the housing is attached to a predetermined position inside the housing while being in contact with the housing 10 with a certain area. Yes.

  The housing 10 has a thin box body in which an upper case 10a and a lower case 10b made of a material having excellent thermal conductivity such as aluminum are fitted, and various electronic components (only the heat generating component 15 is shown in the figure). ) And a support member 12 that supports the printed board 11 are sandwiched and accommodated between the cases.

  The printed circuit board 11 has a width and a depth corresponding to the housing 10 and is a support member 12 made of an elastic body such as heat transfer rubber so that the printed circuit board 11 is located at substantially the center in the height direction inside the housing. It is supported.

  In the present embodiment, the heat generating component 15 mounted on the printed circuit board 11 is an LSI (Large Scale Integrated Circuit), but may be a heat generating component made of an active element such as a thermistor or a triac. In addition to the heat-generating component 15 shown in the figure, a number of ordinary electronic components such as resistors and capacitors are mounted on the printed board 11 although not shown here. Further, a heat sink 15a is attached to the heat generating component 15 (illustrated schematically in FIG. 1). On the other hand, a heat spread pattern and a wiring pattern (hereinafter collectively referred to as “heat spread pattern 11 a”) are printed on the surface of the printed circuit board 11. The heat spread pattern 11a extends from the heat generating component 15 to the peripheral edge of the printed board 11 on the printed board. Then, the heat of the heat generating component 15 is once accumulated in the heat sink 15a and then transferred to the entire board via the heat spread pattern 11a, or efficiently transferred directly to the peripheral edge of the printed board 11 via the heat spread pattern 11a. It is supposed to heat up. In FIG. 1, the heat spread pattern 11 a is drawn along the cross-sectional hatched portion of the printed circuit board 11. 11a is appropriately formed in an optimal pattern shape on the printed circuit board so as to obtain excellent heat conduction characteristics.

  Both end edges of the printed circuit board 11 are closely fixed to the housing 10 via the support member 12 as described above over the entire width direction. The support member 12 is made of an elastic body having excellent heat conductivity such as a heat conductive rubber, and has a C-shaped cross section as shown in FIG. And the edge part 11b of the printed circuit board 11 is engage | inserted in the groove part 12b of the supporting member 12, and the groove part 12b of the supporting member 12 and the edge part 11b of the printed circuit board 11 are contacting in a fixed area. Further, the upper and lower surfaces and one side surface of the outer wall surface of the support member 12 are in contact with the upper case 10a and the lower case 10b of the housing 10 with a certain area. Note that the groove width of the groove portion 12 b of the support member 12 is smaller than the thickness of the printed circuit board 11, and the groove portion 12 b of the support member 12 is preferably in close contact with the side edge of the printed circuit board 11 when the printed circuit board 11 is fitted into the support member 12. . Further, the distance between the upper and lower surfaces of the support member 12 is also larger than the height inside the housing, and when the support member 12 is sandwiched between the upper and lower cases 10a and 10b, the upper and lower surfaces of the support member 12 are in contact with the upper case 10a and the lower case 10a. It is preferable to be in close contact with the case 10b. Moreover, it is preferable that each component has a dimensional relationship such that the side surface of the support member 12 is in close contact with the housing 10 when the printed circuit board 11 is fitted in the groove 12 b of the support member 12 and accommodated in the housing 10. Thereby, a sufficient adhesion area can be secured without generating an extra air layer between the printed circuit board 11 and the support member 12 and between the support member 12 and the housing 10, and the printed circuit board 11, the support member 12, A main heat conduction path can be formed between the housings 10 (see the thick arrows indicating heat conduction in FIG. 1).

  Next, the operation based on this structure will be described. As described above, the heat dissipation structure 1 of the electronic device according to the present embodiment transmits heat from the heat generating component 15 that is a heat source to the heat sink 15a or the heat spread pattern 11a of the printed board 11 to diffuse the heat to the entire printed board. Go. Heat is transmitted from the printed circuit board 11 to the housing 10 mainly from the support member 12 to the housing 10 by heat conduction, and the entire housing becomes a pseudo heat generating body and dissipates to the outside (thick arrows indicating heat conduction in FIG. 1). reference). In addition to this, secondarily, heat is transmitted from the entire printed circuit board surface to the housing 10 by heat radiation or heat transfer, and is radiated to the outside (see thin line arrows indicating heat radiation and heat transfer in FIG. 1).

  As described above, compared with the heat dissipation path in the heat dissipation structure 5 of the conventional electronic device, the heat generating component 15 that is a heat source and the housing 10 are connected by heat conduction, and the ratio of heat conduction is increased. Thus, it becomes unnecessary to adopt a heat dissipation structure that relies on heat transfer that depends only on the presence of air inside the housing. This is a transition from the state where heat transfer and heat dissipation are performed with thick arrows representing heat transfer in FIG. 5 to the state where heat transfer and heat dissipation are performed with thick arrows representing heat conduction in FIG. I can understand that. As a result, the heat dissipation efficiency can be increased to the limit, and the electronic device itself can be miniaturized. This can also be understood from the fact that the size of the entire housing in FIG. 1 is smaller than the size of the entire housing in FIG.

  Further, by reducing the size of the entire housing and narrowing the gap between the printed circuit board 11 and the housing 10, there is no interposition of a material that blocks radiation in the gap in design, and the printed circuit board 11. When the heat transmitted to radiates, it is not necessary to reduce the heat radiation efficiency by radiation.

  The heat dissipation structure of the electronic device according to the above-described embodiment forms a heat transfer path from the heat generating component 15 to the housing 10 via the heat spread pattern 11a and the support member 12, and the printed circuit board 11 by the support member 12. However, in addition to this, radiation from the printed board 11 may be effectively absorbed into the housing 10 by painting the inner surface of the housing with an appropriate material. Similarly, by coating the outer surface of the housing with an appropriate material, the heat once absorbed by the housing 10 may be radiated efficiently to the outside of the housing. It can be expected that a further secondary heat dissipation effect can be obtained by further adding such a configuration.

  Then, the modification of the thermal radiation structure of the electronic device concerning one Embodiment of this invention mentioned above is demonstrated. In addition, about the structure equivalent to the above-mentioned embodiment, an equivalent code | symbol is attached | subjected and detailed description is abbreviate | omitted.

  The heat dissipating structure 2 of the electronic device relating to the modified example of the embodiment described above is characterized in that an elastic body having thermal conductivity is interposed between the heat generating component 15 and the housing 10 in addition to the embodiment described above. is there. That is, as shown in FIG. 2, in a heat dissipation structure of an electronic device including a printed circuit board 11 with a heat generating component mounted on the surface and a housing 10 that accommodates the printed circuit board 11, the printed circuit board 11 is supported inside the housing. A heat conductive support member 12 made of an elastic body is attached to both sides of the inside of the housing while being in contact with the housing 10 with a certain area, and a first heat from the heat generating component 15 to the housing 10 via the support member 12. In the point which forms a conduction path, it is common with the heat dissipation structure concerning the above-mentioned embodiment. However, in this modified example, in addition to this, the spacer 17 made of an elastic member having excellent thermal conductivity between the heat generating component 15 and the housing 10 has a constant area with both the heat generating electronic component 15 and the housing 10. The second heat conduction path from the heat generating component 15 to the housing 10 is formed via the spacer 17 while being in contact.

  By directly dissipating heat from the heat generating component 15 to the housing 10 via the spacer 17, the amount of heat radiation to the outside is increased, and the rate of heat transfer from the surface of the printed circuit board to the housing 10 is further compared to the above-described embodiment. Decrease. As a result, the temperature rise inside the housing can be further suppressed. Thus, by reducing the rate of heat transfer through the air from the entire printed circuit board surface to the housing 10 while increasing the heat dissipation amount, the dependence on heat dissipation using heat transfer due to the flow of internal air is further reduced. Therefore, further downsizing of the entire electronic device can be achieved. In addition, there is an effect that the temperature inside the housing is made uniform.

  In addition, in the heat dissipation structure regarding the above-mentioned embodiment and its modification, as shown to a drawing, it had the structure which inserts the both ends edge part of the printed circuit board 11 in the support member 12, However, It is not necessarily limited to this, Print The entire peripheral edge of the substrate 11 may be fitted into the support member 12. For example, all the edges of the four sides of the printed circuit board 11 having a rectangular shape are fitted into the support member 12, and the support member 12 is sandwiched between the upper case 10a and the lower case 10b of the housing 10 to further increase the heat dissipation effect due to heat conduction. Can be increased. However, even in the configuration of the above-described embodiment in which both edge portions of the printed circuit board 11 are fitted into the support member 12, the heat generating component 15 to the housing 10 are mainly provided while securing a component mounting space on the printed circuit board. A sufficient effect can be achieved in that a heat conduction path can be formed.

Subsequently, the usefulness of the heat dissipation structure according to the present embodiment was confirmed by comparing the conventional structure related to the heat dissipation structure of the electronic device described above and the heat dissipation structure according to the present embodiment. In this comparative test, as a conventional heat dissipation structure (hereinafter referred to as “this comparative example”), the main heat dissipation method uses heat transfer by ventilation, and the heat dissipation path passes through internal air from the heat generating electronic components. In addition, a structure for radiating heat from the vent to the outside of the electronic device casing is provided. And from these comparative tests, it has been proved that the present comparative example has the following features.
(1) Transmission by ventilation accounts for most of heat dissipation.
(2) The heat dissipation performance depends on the air flow rate.
(3) Sufficient space is required for smooth ventilation.
(4) Temperature variation is large due to uneven air flow.

On the other hand, as the heat dissipation structure of the above-described embodiment (hereinafter referred to as “this example”), heat conduction was used for the main heat dissipation method, and the heat dissipation path was made of parts and printed circuit boards and heat transfer rubber. A structure in which heat is radiated from the housing to the outside via the support member is adopted. And from these comparative tests, it has been proved that the features of this example have the following points.
(1) A heat generating electronic component is connected to a printed circuit board and a casing, and the entire casing is regarded as a single heating element for efficient heat dissipation to the outside of the electronic device.
(2) Since the internal temperature is made uniform and heat can be transferred through the entire casing, it is suitable for miniaturization.

  Hereinafter, since the comparative test of this example and this comparative example was performed from several viewpoints, the content of this test will be specifically described.

  First, a comparative test between the two in terms of heat dissipation measures will be described.

  For example, as shown in FIG. 3A, when heat-generating components A, B, C, and D are mounted on a printed circuit board of an electronic device and the electronic device is operated under specific operating conditions, only the C-component generates heat. Consider the case where the specification value is exceeded. FIG. 3B shows the specification value and heat generation temperature of each heat generating component when heat is radiated by the heat dissipation structure in this comparative example, and FIG. 3C shows each heat generation when heat is radiated by the heat dissipation structure in this embodiment. It shows the specification value and heat generation temperature of parts.

First, as an initial state, it is assumed that the specification value over of the C component is t ₀ ° C. In FIG. 3, the hatching band that rises to the left of each component is a specification value that indicates the allowable heat generation temperature of each component, and the hatching band that rises to the right indicates the actual heat generation temperature of each component. Accordingly, it can be seen that only the heat generating component C has an actual heat generation temperature higher than the specification value by t ₀ ° C.

In this case, as shown in FIG. 3B, in this comparative example, heat transfer such as the ventilation air flow is performed so as to lower the temperature by t ₀ ° C (the hatched band of fine dots in FIG. 3B). It was cooling by measures to increase. In FIG. 3B, the hatched band of fine dots coincides with the cooling temperature t ₀ ° C for uniformly cooling each component.

That is, in this comparative example, the inside of the electronic device casing was cooled as a whole, and the temperature of each component was lowered by t ₀ ° C as the specification value of the C component exceeded. Therefore, if this comparative example is a natural air cooling type, vents are provided everywhere in the electronic device casing, and if it is a forced air cooling type, it has a fan with a larger capacity than necessary, and there is sufficient margin for the specification value. Unnecessary excessive cooling is performed on the D component (see the margin t ₁ ° C in FIG. 3B regarding the D component).

On the other hand, in this embodiment, when the specification value over C component is t ₀ ° C (see the hatched band of coarse dots and the hatched band of fine dots in FIG. 3C), as shown in FIG. In addition, most of t ₀ ° C is dissipated to the housing by heat conduction to lower the temperature (see the rough dot hatching band shown only in the heat generating component C in FIG. 3C). The entire casing is cooled by increasing the heat transfer such as the ventilation airflow for the necessary cooling amount that is still insufficient (the fine dots that are the slight bands shown in each heat generating component in FIG. 3C). (See hatching area for). As a result, the cooling of the entire casing is minimized, and there is no need to provide an extra vent hole or a clearly unnecessary large-capacity fan as in this comparative example.

This can also be understood from the fact that the width of the fine hatching band in FIG. 3C where each heat generating component should be uniformly cooled is considerably smaller than that in FIG. 3B. Further, margin t ₂ regarding the heat generating component D is smaller than the margin t ₁ in FIG. 3 (b).

  Subsequently, as a second comparative test, as shown in FIGS. 4 and 5, the heat dissipation effect was confirmed by simulation between this comparative example and this example. Regarding the present example, the heat dissipation structure of the electronic device according to the above-described embodiment is referred to as “Example 1”, and the heat dissipation structure of the electronic device according to the modification is referred to as “Example 2”. Further, FIG. 4A shows the temperature distribution inside the electronic device due to the heat dissipation structure of the present comparative example, and FIG. 4B shows the temperature distribution inside the electronic device due to the heat dissipation structure of the first embodiment. FIG. 4C shows the temperature distribution inside the electronic apparatus with the heat dissipation structure 2. Each area indicates a region in a specific temperature range in the housing.

  In comparison simulation 1, as shown in FIG. 4, the temperature of a general IC such as a CPU as a heat generating component was compared.

  The temperature of a general IC such as a CPU is normally 74.4 ° C. in the heat dissipation structure according to this comparative example (refer to the area 1 in FIG. 4A), but in this embodiment 1, 65 ° C. .1 ° C. (refer to the area 2 area in FIG. 4B), in Example 2, it was possible to cool to 55.6 ° C. (refer to the area 3 area in FIG. 4C). . Therefore, it has been found that a heat radiation component of the general IC can obtain a sufficient heat radiation effect with the heat radiation structure according to the first embodiment. Further, it was found that the internal temperatures were averaged in Examples 1 and 2 as compared with this Comparative Example.

  Subsequently, in the comparative simulation 2, as shown in FIG. 5, the temperature of the power supply IC was compared as a high heat generating component.

  In the case of this power supply IC, in the case of the heat dissipation structure according to this comparative example, the normal heat generation temperature is 71.0 ° C. (see area 1 ′ in FIG. 5A). Although it became ° C (refer to area 1 ″ in FIG. 5B), the heat dissipation structure related to Example 2 was able to dissipate heat up to 65.4 ° C. (see area 2 ′ in FIG. 5C). ).

  As is clear from the above, it was found that the high heat-generating component has a small amount of heat dissipation in the heat dissipating structure of the first embodiment and cannot be dissipated sufficiently, but is sufficiently dissipated in the heat dissipating structure of the second embodiment. Therefore, it was possible to confirm the usefulness of the heat dissipating structure of Example 2 when dissipating high heat generating components such as a power supply IC.

  In comparison simulation 2 as well, it was found that in Examples 1 and 2, the internal temperatures other than the high heat part were averaged compared to Comparative Example 1.

  As a result of comparing the effects of the present invention by simulation as described above, it has been clarified that an increase in the amount of heat radiation is recognized in the case of this example. That is, according to the heat dissipation structure related to Example 1, it was found that the heat dissipation effect is insufficient in terms of heat dissipation of the high heat-generating component, but a sufficient heat dissipation effect is recognized in a normal IC. Moreover, according to the heat radiating structure regarding the present Example 2, it was found that the heat radiating effect was sufficiently recognized even with high heat-generating components.

  The present invention can be applied to a heat dissipation structure of all electronic devices that are provided with heat generating electronic components such as a large-scale integrated circuit (LSI), a triac, and a thyristor inside the housing and that need to be downsized as a whole.

It is sectional drawing which showed the thermal radiation structure of the electronic device concerning one Embodiment of this invention. It is sectional drawing which showed the modification of the thermal radiation structure of the electronic device shown in FIG. It is a figure for demonstrating the effect | action of the thermal radiation structure of the electronic device in FIG. Temperature distribution diagram of the present comparative example when a comparative test was performed (FIG. 4A), temperature distribution diagram of the first embodiment (FIG. 4B), temperature distribution diagram of the second embodiment (FIG. c)). FIG. 5 is a temperature distribution diagram corresponding to FIG. 4 showing the temperature distribution of this comparative example and Examples 1 and 2 when another comparative test is performed. It is sectional drawing which showed the heat dissipation structure of the conventional electronic device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 2 Heat dissipation structure of electronic device 10 Case 10a Upper case 10b Lower case 11 Printed circuit board 11a Heat spread pattern 12 Support member 12b Groove part 15 Heat generating component 15a Heat sink 17 Spacer

Claims (2)

In a heat dissipation structure of an electronic device including a printed circuit board on which heat-generating components are mounted on the surface, and a housing that accommodates the printed circuit board,
An elastic heat conductive support member that supports the printed circuit board inside the housing is attached to a predetermined position inside the housing while being in contact with the housing with a certain area, and the heat generation via the support member. A heat dissipation structure for an electronic device, wherein a heat conduction path from a component to the housing is formed. In a heat dissipation structure of an electronic device including a printed circuit board on which heat-generating components are mounted on the surface, and a housing that accommodates the printed circuit board,
An elastic heat conductive support member that supports the printed circuit board inside the housing is attached to a predetermined position inside the housing while being in contact with the housing with a certain area, and the heat generation via the support member. Forming a first heat conduction path from the component to the housing;
An elastic thermal conductive spacer is interposed between the heat-generating component and the housing while being in contact with both the heat-generating electronic component and the housing with a certain area, and the housing from the heat-generating component through the spacer. A heat dissipation structure for electronic equipment, wherein a second heat conduction path to a body is formed.

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