WO2023203750A1 - Electronic control device - Google Patents

Electronic control device Download PDF

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Publication number
WO2023203750A1
WO2023203750A1 PCT/JP2022/018539 JP2022018539W WO2023203750A1 WO 2023203750 A1 WO2023203750 A1 WO 2023203750A1 JP 2022018539 W JP2022018539 W JP 2022018539W WO 2023203750 A1 WO2023203750 A1 WO 2023203750A1
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Prior art keywords
heat
electronic control
control device
circuit board
component
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PCT/JP2022/018539
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French (fr)
Japanese (ja)
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善彦 後藤
心哉 河喜多
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日立Astemo株式会社
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Priority to PCT/JP2022/018539 priority Critical patent/WO2023203750A1/en
Publication of WO2023203750A1 publication Critical patent/WO2023203750A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to the structure of an electronic control device, and particularly relates to a technique that is effective when applied to an electronic control device in which heat-generating components are mounted.
  • Electronic control devices installed in vehicles such as automobiles usually include electronic components made of semiconductor components and heat-generating components of electronic circuits on a circuit board.
  • microcontrollers hereinafter referred to as microcontrollers
  • ADAS advanced driving assistant systems
  • ADAS advanced driver assistance systems
  • Patent Document 1 discloses that a heat dissipating member (thermal conductive sheet 111) having higher thermal conductivity than air is provided at a location (first portion 4a) remote from the NAND memory 10 for the drive control circuit (controller) 4 on the board 8. An idea has been disclosed for suppressing radiant heat transfer to the NAND memory 10 by providing a radiator and restricting the direction of heat radiation.
  • low heat resistant components electronic components with low heat resistance such as semiconductor memory (hereinafter simply referred to as low heat resistant components) are placed near high heat generating components such as microcontrollers (hereinafter simply referred to as heat generating components).
  • heat generating components electronic components with low heat resistance
  • semiconductor memory hereinafter simply referred to as semiconductor memory
  • microcontrollers hereinafter simply referred to as heat generating components
  • a structure is required to radiate heat from each component.
  • a heat sink In general electronic control equipment, in order to dissipate heat from each component, a heat sink is often attached to the component via thermal paste, or the component is connected to a metal casing via thermal paste, and then the component is connected to the metal casing. Low heat resistant components are protected by dissipating heat from the installed heat dissipation fins.
  • an object of the present invention is to provide an electronic control device having an electronic board in which a heat generating component and a low heat resistant component are mounted on the same board, which can suppress heat transfer from the heat generating component to the low heat resistant component. It is about providing.
  • the present invention provides a heat generating component, a low heat resistant component connected to the heat generating component by a communication line, a circuit board on which the heat generating component and the low heat resistant component are mounted, and a circuit board on which the heat generating component and the low heat resistant component are mounted.
  • a casing that accommodates a board, and a heat transfer suppressing part that suppresses or blocks heat transfer from the heat generating component to the low heat resistant component in a region between the heat generating component and the low heat resistant component.
  • the heat transfer suppressing section has an opening formed in the circuit board, and the opening is located in a region between the heat generating component and the low heat resistant component of the circuit board, where the communication line is It is characterized in that it is formed in an area where it is not placed.
  • an electronic control device having an electronic board in which a heat generating component and a low heat resistant component are mounted on the same board, an electronic control device capable of suppressing heat transfer from the heat generating component to the low heat resistant component is realized. be able to.
  • electronic control devices can be made smaller and lighter by eliminating the need for heat dissipation components such as heat sinks, reducing the number of heat dissipation components, and even allowing the use of resin materials for the housing. It can contribute to cost reduction and cost reduction.
  • FIG. 1 is a perspective view of an electronic board mounted inside an electronic control device according to Example 1 of the present invention.
  • FIG. 2 is a top view of the electronic board of FIG. 1; 3 is a sectional view taken along line A-A' in FIG. 2.
  • FIG. 3 is a sectional view taken along line B-B' in FIG. 2.
  • FIG. FIG. 2 is a cross-sectional view showing the internal structure of an electronic control device according to a second embodiment of the present invention.
  • FIG. 1 is a perspective view of an electronic board 10 mounted inside the electronic control device of this embodiment.
  • FIG. 2 is a top view of the electronic board 10 of FIG. 1.
  • 3 is a cross-sectional view taken along line A-A' in FIG. 2
  • FIG. 4 is a cross-sectional view taken along line B-B' in FIG.
  • the electronic board 10 is housed in the casing 5 as described later in Example 2 (FIG. 5).
  • the electronic control device 11 is configured.
  • the electronic board 10 of this embodiment includes a circuit board 1, a heat generating component 2, and a low heat resistant component 3 as main components.
  • a printed circuit board (PCB board) or the like is used, in which a fine wiring pattern is formed using a metal such as copper on the surface of an insulating base material.
  • the heat generating component 2 and the low heat resistant component 3 are mounted on a wiring pattern (not shown) formed on the circuit board 1 by soldering or the like.
  • a typical example of the heat generating component 2 is a microcomputer. Furthermore, a typical example of the low heat resistant component 3 is a memory. Although not shown, electronic components such as a power IC and an electrolytic capacitor are also mounted on the circuit board 1 in addition to a microcomputer and a memory.
  • heat generation of a heat generating component means heat generation to the extent that it causes thermal interference to other electronic components placed nearby on the same circuit board 1, and is not necessarily limited to heat generation above a specific temperature. It's not a thing.
  • low heat resistance of low heat resistant parts means that the upper limit of temperature at which the operation and performance of electronic parts can be guaranteed is lower than that of other electronic parts, and is not limited to a specific temperature. .
  • a heat transfer suppressing section 100 that suppresses or blocks heat transfer from the heat generating component 2 to the low heat resistant component 3 is provided on the circuit board 1 in a region between the heat generating component 2 and the low heat resistant component 3.
  • the heat transfer suppressing section 100 has a plurality of openings 4 formed in the circuit board 1 .
  • the configuration of the electronic board 10 will be explained in more detail using the top view of FIG. 2.
  • the heat generating component 2 and the low heat resistant component 3 are mounted on the circuit board 1.
  • the heat generating component 2 and the low heat resistant component 3 are connected via a communication line 8 arranged on the circuit board 1, and exchange data with each other.
  • the low heat resistant component (memory) 3 needs to perform high-speed data communication with the heat generating component (microcomputer) 2, It is placed near the component (microcomputer) 2.
  • the heat transfer suppressing section 100 is composed of two heat transfer suppressing areas 100a and a meandering wiring area 100b arranged between them.
  • a plurality of openings 4 are provided in the heat transfer suppression area 100a.
  • the opening 4 is formed as a substantially rectangular slit in an area of the circuit board 1 where the communication line 8 is not arranged.
  • the opening 4 has a long and narrow opening 4b (first and an elongated opening 4a (second opening) in the Y direction of the circuit board 1, that is, the direction perpendicular to the arrangement direction of the heat generating components 2 and the low heat resistant components 3. arranged alternately.
  • the communication line 8 is connected to the area between the opening 4b (first opening) elongated in the X direction of the circuit board 1 and the opening 4a (second opening) elongated in the Y direction of the circuit board 1. It is located in
  • the circuit board 1 is composed of a laminated board in which six layers from the L1 layer to the L6 layer are laminated, and the openings 4a and 4b extend from the front side to the back side of the laminated board. It is formed as a penetrating slit.
  • the communication line 8 is installed as a meandering meandering wiring in an area where the opening 4 is not formed in the area between the heat generating component 2 and the low heat resistant component 3 of the circuit board 1. You can also place it.
  • the wiring length can be easily adjusted by changing the shape and number of meandering lines.
  • the individual shape of the opening 4 is not limited to a substantially rectangular slit, but may be substantially circular (in cross-sectional view) as long as it can suppress or block heat transfer from the heat generating component 2 to the low heat resistant component
  • the hole may be formed into a cylindrical shape) or a substantially triangular shape (triangular prism shape when viewed in cross section).
  • FIG. 5 is a sectional view showing the internal structure of the electronic control device 11 of this embodiment.
  • the electronic board 10 described in the first embodiment is housed inside the casing 5.
  • a heat generating component 2 and a low heat resistant component 3 are mounted on the electronic board 10 through solder joints 7 .
  • the heat transfer suppressing part 100 also includes a direction perpendicular to the circuit board 1 from the circuit board 1 toward the surface of the casing 5 facing the circuit board 1.
  • a heat conductive member 6 extending to is provided.
  • the heat of the heat generating component 2 is transmitted to the housing 6 via the thermal conductive member 6, and the heat is radiated. be able to.
  • the heat conductive member 6 may be provided inside the casing 5 so as to serve as a wall that shields a region where the heat generating component 2 is arranged and a region where the low heat resistant component 3 is arranged.
  • the heat conductive member 6 as a heat shielding wall, it is possible to block radiant heat from the heat generating component 2 to the low heat resistant component 3, and more effectively suppress heat transfer from the heat generating component 2 to the low heat resistant component 3. Or it can be blocked.
  • the present invention is not limited to the above-described embodiments, and includes various modifications.
  • the embodiments described above are described in detail to explain the present invention in an easy-to-understand manner, and the present invention is not necessarily limited to having all the configurations described.
  • it is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment and it is also possible to add the configuration of another embodiment to the configuration of one embodiment.

Abstract

Provided is an electronic control device that has an electronic board on which both a heat-generating component and a low-heat-resistant component are mounted and that is capable of suppressing heat transfer from the heat-generating component to the low-heat-resistant component. This electronic control device is characterized by: comprising a heat-generating component, a low-heat-resistant component connected to the heat-generating component by means of communication lines, a circuit board on which the low-heat-resistant component and the heat-generating component are mounted, and a case accommodating the circuit board; and having a heat-transfer suppression section for suppressing or blocking heat transfer from the heat-generating component to the low-heat-resistant component in a region between the heat-generating component and the low-heat-resistant component, wherein the heat-transfer suppression section has openings formed in the circuit board, and the openings are formed in areas where the communication lines are not disposed in the region between the heat-generating component and the low-heat-resistant component of the circuit board.

Description

電子制御装置electronic control unit
　本発明は、電子制御装置の構造に係り、特に、内部に発熱部品が搭載される電子制御装置に適用して有効な技術に関する。 The present invention relates to the structure of an electronic control device, and particularly relates to a technique that is effective when applied to an electronic control device in which heat-generating components are mounted.
　自動車等の車両に搭載される電子制御装置には、通常、回路基板上に、半導体部品からなる電子部品や電子回路の発熱部品を備えている。特に、最近の先進運転支援システム（ADAS：Advanced Driving Assistant System）に用いられる電子制御装置に搭載されるマイクロコントローラ（以下、マイコンと表記する）においては、高性能化により発熱量が増加する傾向にある。 Electronic control devices installed in vehicles such as automobiles usually include electronic components made of semiconductor components and heat-generating components of electronic circuits on a circuit board. In particular, microcontrollers (hereinafter referred to as microcontrollers) installed in electronic control units used in recent advanced driving assistant systems (ADAS) tend to generate more heat due to higher performance. be.
　また、先進運転支援システム（ADAS）においては、地図データ等の大容量データを扱う必要性があるため、DRAMやフラッシュメモリなどの外付け大容量半導体メモリを搭載する必要がある。これらの半導体メモリは、高速でデータ通信をする関係上、電子基板上でマイコンの近傍に配置する必要があるが、他の電子部品と比較して、耐熱温度が低いものが多い。 In addition, in advanced driver assistance systems (ADAS), it is necessary to handle large amounts of data such as map data, so it is necessary to install external large capacity semiconductor memory such as DRAM or flash memory. These semiconductor memories need to be placed close to the microcontroller on an electronic board in order to perform high-speed data communication, but many of them have lower heat resistance than other electronic components.
　本技術分野の背景技術として、例えば、特許文献１のような技術がある。特許文献１には、基板８上にあるドライブ制御回路（コントローラ）４に対し、NANDメモリ１０から離れた箇所（第一部分４ａ）に空気よりも熱伝導率の高い放熱部材（熱伝導シート１１１）を設け、放熱方向を制限することで、NANDメモリ１０への放射熱伝達を抑制するアイデアが開示されている。 As background technology in this technical field, there is, for example, a technology such as Patent Document 1. Patent Document 1 discloses that a heat dissipating member (thermal conductive sheet 111) having higher thermal conductivity than air is provided at a location (first portion 4a) remote from the NAND memory 10 for the drive control circuit (controller) 4 on the board 8. An idea has been disclosed for suppressing radiant heat transfer to the NAND memory 10 by providing a radiator and restricting the direction of heat radiation.
特開２０１６－７１２６９号公報JP 2016-71269 Publication
　上述したように、マイコン等の高発熱部品（以下、単に発熱部品と表記する）の近傍に、半導体メモリ等の耐熱性の低い電子部品（以下、単に低耐熱部品と表記する）を配置する電子基板を有する電子制御装置において、発熱部品の発熱から低耐熱部品を保護しようとする場合、各部品を放熱する構造が必要である。 As mentioned above, electronic components with low heat resistance such as semiconductor memory (hereinafter simply referred to as low heat resistant components) are placed near high heat generating components such as microcontrollers (hereinafter simply referred to as heat generating components). In an electronic control device having a board, when trying to protect low heat-resistant components from heat generated by heat-generating components, a structure is required to radiate heat from each component.
　一般的な電子制御装置では、多くの場合、各部品を放熱するために、放熱グリスを介して部品にヒートシンクを取り付けたり、放熱グリスを介して部品を金属筐体に接続し、金属筐体に設置された放熱フィンから放熱することで低耐熱部品を保護している。 In general electronic control equipment, in order to dissipate heat from each component, a heat sink is often attached to the component via thermal paste, or the component is connected to a metal casing via thermal paste, and then the component is connected to the metal casing. Low heat resistant components are protected by dissipating heat from the installed heat dissipation fins.
　しかしながら、ヒートシンクや放熱フィンの追加は、電子制御装置の重量増加やコスト上昇に繋がり、車載用の電子制御装置に対する小型軽量化、低コスト化の要求に反することになる。 However, the addition of heat sinks and heat dissipation fins increases the weight and cost of the electronic control device, which goes against the demands for smaller, lighter, and lower cost electronic control devices for vehicles.
　また、上記特許文献１の技術では、発熱部品であるドライブ制御回路（コントローラ）４からNANDメモリ１０への熱伝達をある程度低減することはできるが、ドライブ制御回路（コントローラ）４とNANDメモリ１０は、基板８上で隣接して配置されているため、熱伝達の抑制には改善の余地がある。 Further, in the technology of Patent Document 1, it is possible to reduce the heat transfer from the drive control circuit (controller) 4, which is a heat generating component, to the NAND memory 10 to some extent, but the drive control circuit (controller) 4 and the NAND memory 10 are , are arranged adjacent to each other on the substrate 8, there is room for improvement in suppressing heat transfer.
　そこで、本発明の目的は、発熱部品と低耐熱部品とが同一基板上に実装される電子基板を有する電子制御装置において、発熱部品から低耐熱部品への熱伝達を抑制可能な電子制御装置を提供することにある。 SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic control device having an electronic board in which a heat generating component and a low heat resistant component are mounted on the same board, which can suppress heat transfer from the heat generating component to the low heat resistant component. It is about providing.
　上記課題を解決するために、本発明は、発熱部品と、前記発熱部品と通信線により接続される低耐熱部品と、前記発熱部品と前記低耐熱部品とが搭載される回路基板と、前記回路基板を収容する筐体と、を備え、前記発熱部品と前記低耐熱部品との間の領域に、前記発熱部品から前記低耐熱部品への熱伝達を抑制もしくは遮断する熱伝達抑制部を有し、前記熱伝達抑制部は、前記回路基板に形成された開口部を有し、前記開口部は、前記回路基板の前記発熱部品と前記低耐熱部品との間の領域の内、前記通信線が配置されていない領域に形成されることを特徴とする。 In order to solve the above problems, the present invention provides a heat generating component, a low heat resistant component connected to the heat generating component by a communication line, a circuit board on which the heat generating component and the low heat resistant component are mounted, and a circuit board on which the heat generating component and the low heat resistant component are mounted. a casing that accommodates a board, and a heat transfer suppressing part that suppresses or blocks heat transfer from the heat generating component to the low heat resistant component in a region between the heat generating component and the low heat resistant component. , the heat transfer suppressing section has an opening formed in the circuit board, and the opening is located in a region between the heat generating component and the low heat resistant component of the circuit board, where the communication line is It is characterized in that it is formed in an area where it is not placed.
　本発明によれば、発熱部品と低耐熱部品とが同一基板上に実装される電子基板を有する電子制御装置において、発熱部品から低耐熱部品への熱伝達を抑制可能な電子制御装置を実現することができる。 According to the present invention, in an electronic control device having an electronic board in which a heat generating component and a low heat resistant component are mounted on the same board, an electronic control device capable of suppressing heat transfer from the heat generating component to the low heat resistant component is realized. be able to.
　これにより、発熱部品から低耐熱部品への熱干渉による低耐熱部品の誤動作や性能低下を防ぐことができ、電子制御装置の信頼性向上が図れる。 As a result, it is possible to prevent malfunctions and performance deterioration of low heat resistant components due to thermal interference from heat generating components to low heat resistant components, and the reliability of the electronic control device can be improved.
　また、ヒートシンク等の放熱部品が不要となる、或いは、放熱部品の部品点数を削減することができる、さらには、筐体に樹脂材料を用いることもできるようになるなど、電子制御装置の小型軽量化、低コスト化に寄与できる。 In addition, electronic control devices can be made smaller and lighter by eliminating the need for heat dissipation components such as heat sinks, reducing the number of heat dissipation components, and even allowing the use of resin materials for the housing. It can contribute to cost reduction and cost reduction.
　上記した以外の課題、構成及び効果は、以下の実施形態の説明により明らかにされる。 Problems, configurations, and effects other than those described above will be made clear by the description of the embodiments below.
本発明の実施例１に係る電子制御装置の内部に搭載される電子基板の斜視図である。1 is a perspective view of an electronic board mounted inside an electronic control device according to Example 1 of the present invention. 図１の電子基板の上面図である。FIG. 2 is a top view of the electronic board of FIG. 1; 図２のＡ－Ａ’断面図である。3 is a sectional view taken along line A-A' in FIG. 2. FIG. 図２のＢ－Ｂ’断面図である。3 is a sectional view taken along line B-B' in FIG. 2. FIG. 本発明の実施例２に係る電子制御装置の内部構造を示す断面図である。FIG. 2 is a cross-sectional view showing the internal structure of an electronic control device according to a second embodiment of the present invention.
　以下、図面を用いて本発明の実施例を説明する。なお、各図面において同一の構成については同一の符号を付し、重複する部分についてはその詳細な説明は省略する。 Embodiments of the present invention will be described below with reference to the drawings. Note that in each drawing, the same components are denoted by the same reference numerals, and detailed explanations of overlapping parts will be omitted.
　図１から図４を参照して、本発明の実施例１に係る電子制御装置について説明する。図１は、本実施例の電子制御装置の内部に搭載される電子基板１０の斜視図である。図２は、図１の電子基板１０の上面図である。図３は、図２のＡ－Ａ’断面図であり、図４は、図２のＢ－Ｂ’断面図である。 Embodiment 1 An electronic control device according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 4. FIG. 1 is a perspective view of an electronic board 10 mounted inside the electronic control device of this embodiment. FIG. 2 is a top view of the electronic board 10 of FIG. 1. 3 is a cross-sectional view taken along line A-A' in FIG. 2, and FIG. 4 is a cross-sectional view taken along line B-B' in FIG.
　なお、電子基板１０の構成を分かり易くするために、図１及び図２では図示を省略しているが、実施例２（図５）で後述するように、電子基板１０は筐体５に収容されて、電子制御装置１１を構成する。 Although illustration of the electronic board 10 is omitted in FIGS. 1 and 2 to make the configuration of the electronic board 10 easier to understand, the electronic board 10 is housed in the casing 5 as described later in Example 2 (FIG. 5). The electronic control device 11 is configured.
　本実施例の電子基板１０は、図１及び図２に示すように、主要な構成として、回路基板１と、発熱部品２と、低耐熱部品３とを備えている。 As shown in FIGS. 1 and 2, the electronic board 10 of this embodiment includes a circuit board 1, a heat generating component 2, and a low heat resistant component 3 as main components.
　回路基板１には、絶縁体の基材の表面に銅などの金属で微細な配線パターンが形成されたプリント基板（ＰＣＢ基板）などが用いられる。発熱部品２と低耐熱部品３は、回路基板１上に形成された配線パターン（図示せず）上に、はんだ接合等により実装されている。 As the circuit board 1, a printed circuit board (PCB board) or the like is used, in which a fine wiring pattern is formed using a metal such as copper on the surface of an insulating base material. The heat generating component 2 and the low heat resistant component 3 are mounted on a wiring pattern (not shown) formed on the circuit board 1 by soldering or the like.
　発熱部品２の代表的な例としては、マイコンが挙げられる。また、低耐熱部品３の代表的な例としては、メモリが挙げられる。図示していないが、回路基板１には、マイコンやメモリ以外にも、電源ＩＣや電解コンデンサなどの電子部品も実装される。 A typical example of the heat generating component 2 is a microcomputer. Furthermore, a typical example of the low heat resistant component 3 is a memory. Although not shown, electronic components such as a power IC and an electrolytic capacitor are also mounted on the circuit board 1 in addition to a microcomputer and a memory.
　なお、発熱部品の「発熱」とは、同一の回路基板１上において近傍に配置された他の電子部品に熱干渉を及ぼす程度の発熱を意味し、必ずしも特定の温度以上の発熱に限定されるものではない。また、低耐熱部品の「低耐熱」とは、電子部品の動作及び性能を保証できる温度の上限が他の電子部品と比較して低いことを意味し、特定の温度に限定されるものではない。 Note that "heat generation" of a heat generating component means heat generation to the extent that it causes thermal interference to other electronic components placed nearby on the same circuit board 1, and is not necessarily limited to heat generation above a specific temperature. It's not a thing. In addition, "low heat resistance" of low heat resistant parts means that the upper limit of temperature at which the operation and performance of electronic parts can be guaranteed is lower than that of other electronic parts, and is not limited to a specific temperature. .
　回路基板１には、発熱部品２と低耐熱部品３との間の領域に、発熱部品２から低耐熱部品３への熱伝達を抑制もしくは遮断する熱伝達抑制部１００が設けられている。熱伝達抑制部１００は、回路基板１に形成された複数の開口部４を有している。 A heat transfer suppressing section 100 that suppresses or blocks heat transfer from the heat generating component 2 to the low heat resistant component 3 is provided on the circuit board 1 in a region between the heat generating component 2 and the low heat resistant component 3. The heat transfer suppressing section 100 has a plurality of openings 4 formed in the circuit board 1 .
　図２の上面図を用いて、電子基板１０の構成をより詳しく説明する。 The configuration of the electronic board 10 will be explained in more detail using the top view of FIG. 2.
　上述したように、回路基板１上には、発熱部品２と低耐熱部品３が実装されている。発熱部品２と低耐熱部品３は、回路基板１上に配置された通信線８を介して接続されており、相互にデータのやり取りを行う。 As described above, the heat generating component 2 and the low heat resistant component 3 are mounted on the circuit board 1. The heat generating component 2 and the low heat resistant component 3 are connected via a communication line 8 arranged on the circuit board 1, and exchange data with each other.
　例えば、発熱部品２がマイコンであり、低耐熱部品３がメモリであるような場合、低耐熱部品（メモリ）３は、発熱部品（マイコン）２と高速でデータ通信をする必要があるため、発熱部品（マイコン）２の近傍に配置される。 For example, if the heat generating component 2 is a microcomputer and the low heat resistant component 3 is a memory, the low heat resistant component (memory) 3 needs to perform high-speed data communication with the heat generating component (microcomputer) 2, It is placed near the component (microcomputer) 2.
　熱伝達抑制部１００は、２つの熱伝達抑制エリア１００ａと、その間に配置されたミアンダ配線エリア１００ｂとで構成されている。 The heat transfer suppressing section 100 is composed of two heat transfer suppressing areas 100a and a meandering wiring area 100b arranged between them.
　熱伝達抑制エリア１００ａには、複数の開口部４が設けられている。開口部４は、回路基板１の通信線８が配置されていない領域に、略矩形形状のスリットとして形成されている。 A plurality of openings 4 are provided in the heat transfer suppression area 100a. The opening 4 is formed as a substantially rectangular slit in an area of the circuit board 1 where the communication line 8 is not arranged.
　本実施例では、図２に示すように、開口部４は、回路基板１のＸ方向、すなわち回路基板１の発熱部品２と低耐熱部品３との配列方向に細長い開口部４ｂ（第１の開口部）と、回路基板１のＹ方向、すなわち発熱部品２と低耐熱部品３との配列方向と直交する方向に細長い開口部４ａ（第２の開口部）とを有しており、それぞれが交互に配置されている。 In this embodiment, as shown in FIG. 2, the opening 4 has a long and narrow opening 4b (first and an elongated opening 4a (second opening) in the Y direction of the circuit board 1, that is, the direction perpendicular to the arrangement direction of the heat generating components 2 and the low heat resistant components 3. arranged alternately.
　そして、通信線８は、回路基板１のＸ方向に細長い開口部４ｂ（第１の開口部）と、回路基板１のＹ方向に細長い開口部４ａ（第２の開口部）との間の領域に配置されている。 The communication line 8 is connected to the area between the opening 4b (first opening) elongated in the X direction of the circuit board 1 and the opening 4a (second opening) elongated in the Y direction of the circuit board 1. It is located in
　図３及び図４に、図２のＡ－Ａ’断面、Ｂ－Ｂ’断面をそれぞれ示す。図３及び図４に示すように、回路基板１はＬ１層からＬ６層までの６層が積層された積層基板で構成されており、開口部４ａ，４ｂは積層基板の表面側から裏面側を貫通するスリットとして形成されている。 3 and 4 show the A-A' cross section and the B-B' cross section of FIG. 2, respectively. As shown in FIGS. 3 and 4, the circuit board 1 is composed of a laminated board in which six layers from the L1 layer to the L6 layer are laminated, and the openings 4a and 4b extend from the front side to the back side of the laminated board. It is formed as a penetrating slit.
　電子制御装置に搭載する電子基板を、本実施例の電子基板１０のような構成とすることで、発熱部品２から低耐熱部品３への熱伝達を効果的に抑制もしくは遮断することができる。 By configuring the electronic board mounted on the electronic control device as the electronic board 10 of this embodiment, heat transfer from the heat generating component 2 to the low heat resistant component 3 can be effectively suppressed or blocked.
　なお、図２に示すように、通信線８は、回路基板１の発熱部品２と低耐熱部品３との間の領域の内、開口部４が形成されていない領域に、蛇行するミアンダ配線として配置しても良い。通信線８をミアンダ配線とすることで、蛇行の形状や数の変更により、配線長を容易に調整することができる。 As shown in FIG. 2, the communication line 8 is installed as a meandering meandering wiring in an area where the opening 4 is not formed in the area between the heat generating component 2 and the low heat resistant component 3 of the circuit board 1. You can also place it. By making the communication line 8 a meandering wiring, the wiring length can be easily adjusted by changing the shape and number of meandering lines.
　特に、図２のように、発熱部品２と低耐熱部品３とを複数本の通信線８で接続し、相互に高速でデータ通信を行う場合、全ての通信線８の配線長を等しくする必要があるため、配線長の調整が容易なミアンダ配線を採用するのが望ましい。 In particular, when the heat-generating component 2 and the low heat-resistant component 3 are connected by multiple communication lines 8 to perform high-speed data communication with each other as shown in FIG. 2, it is necessary to make the wiring lengths of all the communication lines 8 equal. Therefore, it is desirable to use meander wiring, which makes it easy to adjust the wiring length.
　また、開口部４の個々の形状は、略矩形形状のスリットに限定されるものではなく、発熱部品２から低耐熱部品３への熱伝達を抑制もしくは遮断することができれば、略円形（断面視した場合は円柱形状）や略三角形（断面視した場合は三角柱形状）などの開孔として形成しても良い。 Further, the individual shape of the opening 4 is not limited to a substantially rectangular slit, but may be substantially circular (in cross-sectional view) as long as it can suppress or block heat transfer from the heat generating component 2 to the low heat resistant component In this case, the hole may be formed into a cylindrical shape) or a substantially triangular shape (triangular prism shape when viewed in cross section).
　図５を参照して、本発明の実施例２に係る電子制御装置について説明する。図５は、本実施例の電子制御装置１１の内部構造を示す断面図である。 With reference to FIG. 5, an electronic control device according to a second embodiment of the present invention will be described. FIG. 5 is a sectional view showing the internal structure of the electronic control device 11 of this embodiment.
　本実施例では、実施例１で説明した電子基板１０を内部に搭載した電子制御装置１１の内部構造について説明する。 In this embodiment, the internal structure of an electronic control device 11 in which the electronic board 10 described in the first embodiment is mounted will be described.
　本実施例の電子制御装置１１は、図５に示すように、実施例１で説明した電子基板１０が筐体５の内部に収容されている。電子基板１０には、はんだ接合部７により発熱部品２及び低耐熱部品３が実装されている。また、熱伝達抑制部１００として、回路基板１の開口部（スリット）４に加えて、回路基板１から筐体５の回路基板１との対向面に向かって、回路基板１に対して垂直方向へ延伸する熱伝導部材６が設けられている。 In the electronic control device 11 of this embodiment, as shown in FIG. 5, the electronic board 10 described in the first embodiment is housed inside the casing 5. A heat generating component 2 and a low heat resistant component 3 are mounted on the electronic board 10 through solder joints 7 . In addition to the opening (slit) 4 of the circuit board 1, the heat transfer suppressing part 100 also includes a direction perpendicular to the circuit board 1 from the circuit board 1 toward the surface of the casing 5 facing the circuit board 1. A heat conductive member 6 extending to is provided.
　筐体５の内部に、回路基板１と筐体５とを接続する熱伝導部材６を設けることで、発熱部品２の熱を、熱伝導部材６を介して筐体６へ伝達し、放熱することができる。 By providing a thermally conductive member 6 that connects the circuit board 1 and the housing 5 inside the housing 5, the heat of the heat generating component 2 is transmitted to the housing 6 via the thermal conductive member 6, and the heat is radiated. be able to.
　なお、熱伝導部材６は、筐体５の内部を、発熱部品２が配置されている領域と、低耐熱部品３が配置されている領域とを遮蔽する壁となるように設けても良い。熱伝導部材６を熱遮断壁として設置することで、発熱部品２から低耐熱部品３への輻射熱を遮断することができ、発熱部品２から低耐熱部品３への熱伝達をより効果的に抑制もしくは遮断することができる。 Note that the heat conductive member 6 may be provided inside the casing 5 so as to serve as a wall that shields a region where the heat generating component 2 is arranged and a region where the low heat resistant component 3 is arranged. By installing the heat conductive member 6 as a heat shielding wall, it is possible to block radiant heat from the heat generating component 2 to the low heat resistant component 3, and more effectively suppress heat transfer from the heat generating component 2 to the low heat resistant component 3. Or it can be blocked.
　なお、本発明は上記した実施例に限定されるものではなく、様々な変形例が含まれる。例えば、上記した実施例は本発明を分かりやすく説明するために詳細に説明したものであり、必ずしも説明した全ての構成を備えるものに限定されるものではない。また、ある実施例の構成の一部を他の実施例の構成に置き換えることが可能であり、また、ある実施例の構成に他の実施例の構成を加えることも可能である。また、各実施例の構成の一部について、他の構成の追加・削除・置換をすることが可能である。 Note that the present invention is not limited to the above-described embodiments, and includes various modifications. For example, the embodiments described above are described in detail to explain the present invention in an easy-to-understand manner, and the present invention is not necessarily limited to having all the configurations described. Furthermore, it is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment. Further, it is possible to add, delete, or replace a part of the configuration of each embodiment with other configurations.
　１…回路基板、２…発熱部品、３…低耐熱部品、４，４ａ，４ｂ…開口部（スリット）、５…筐体、６…熱遮断壁（熱伝導部材）、７…はんだ接合部、８…通信線、１０…電子基板、１１…電子制御装置、１００…熱伝達抑制部、１００ａ…熱伝達抑制エリア、１００ｂ…ミアンダ配線エリア。 1... Circuit board, 2... Heat generating component, 3... Low heat resistant component, 4, 4a, 4b... Opening (slit), 5... Housing, 6... Heat shielding wall (thermal conductive member), 7... Solder joint, 8... Communication line, 10... Electronic board, 11... Electronic control device, 100... Heat transfer suppression section, 100a... Heat transfer suppression area, 100b... Meander wiring area.

Claims (10)

  1. 　発熱部品と、
    　前記発熱部品と通信線により接続される低耐熱部品と、
    　前記発熱部品と前記低耐熱部品とが搭載される回路基板と、
    　前記回路基板を収容する筐体と、を備え、
    　前記発熱部品と前記低耐熱部品との間の領域に、前記発熱部品から前記低耐熱部品への熱伝達を抑制もしくは遮断する熱伝達抑制部を有し、
    　前記熱伝達抑制部は、前記回路基板に形成された開口部を有し、
    　前記開口部は、前記回路基板の前記発熱部品と前記低耐熱部品との間の領域の内、前記通信線が配置されていない領域に形成される電子制御装置。     heat generating parts,
    a low heat resistant component connected to the heat generating component by a communication line;
    a circuit board on which the heat generating component and the low heat resistant component are mounted;
    A casing that accommodates the circuit board,
    a heat transfer suppressing portion that suppresses or blocks heat transfer from the heat generating component to the low heat resistant component in a region between the heat generating component and the low heat resistant component;
    The heat transfer suppressing section has an opening formed in the circuit board,
    The opening is formed in a region of the circuit board between the heat generating component and the low heat resistant component, in which the communication line is not arranged.
  2. 　請求項１に記載の電子制御装置であって、
    　前記開口部は、前記回路基板の前記発熱部品と前記低耐熱部品との間の領域に、複数形成されている電子制御装置。     The electronic control device according to claim 1,
    In the electronic control device, a plurality of the openings are formed in a region between the heat generating component and the low heat resistant component of the circuit board.
  3. 　請求項２に記載の電子制御装置であって、
    　前記開口部は、略矩形形状である電子制御装置。     The electronic control device according to claim 2,
    In the electronic control device, the opening has a substantially rectangular shape.
  4. 　請求項３に記載の電子制御装置であって、
    　前記開口部は、前記回路基板の前記発熱部品と前記低耐熱部品との配列方向に細長い第１の開口部と、
    　前記配列方向と直交する方向に細長い第２の開口部とを有する電子制御装置。     The electronic control device according to claim 3,
    The opening is a first opening that is elongated in a direction in which the heat generating component and the low heat resistant component of the circuit board are arranged;
    an electronic control device having a second opening elongated in a direction perpendicular to the arrangement direction;
  5. 　請求項４に記載の電子制御装置であって、
    　前記第１の開口部および前記第２の開口部は、前記回路基板の前記発熱部品と前記低耐熱部品との間の領域に、交互に配置されている電子制御装置。     The electronic control device according to claim 4,
    The first opening and the second opening are arranged alternately in a region between the heat generating component and the low heat resistant component of the circuit board.
  6. 　請求項５に記載の電子制御装置であって、
    　前記通信線は、前記第１の開口部と前記第２の開口部との間の領域に配置されている電子制御装置。     The electronic control device according to claim 5,
    The communication line is arranged in an area between the first opening and the second opening.
  7. 　請求項６に記載の電子制御装置であって、
    　前記通信線は、前記発熱部品と前記低耐熱部品との間で蛇行するミアンダ配線である電子制御装置。     The electronic control device according to claim 6,
    In the electronic control device, the communication line is a meandering wiring that snakes between the heat generating component and the low heat resistant component.
  8. 　請求項１に記載の電子制御装置であって、
    　前記熱伝達抑制部は、前記回路基板から前記筐体の前記回路基板との対向面に向かって、前記回路基板に対して垂直方向へ延伸する熱伝導部材を有し、
    　前記熱伝導部材は、前記発熱部品の熱を前記筐体へ伝達する電子制御装置。     The electronic control device according to claim 1,
    The heat transfer suppressing portion includes a heat conductive member extending from the circuit board toward a surface of the casing facing the circuit board in a direction perpendicular to the circuit board,
    The heat conductive member is an electronic control device that transmits the heat of the heat generating component to the casing.
  9. 　請求項１に記載の電子制御装置であって、
    　前記熱伝達抑制部は、前記回路基板から前記筐体の前記回路基板との対向面に向かって、前記回路基板に対して垂直方向へ延伸する熱遮断壁を有し、
    　前記熱遮断壁は、前記発熱部品から前記低耐熱部品への輻射熱を遮断する電子制御装置。     The electronic control device according to claim 1,
    The heat transfer suppressing portion has a heat shielding wall extending from the circuit board toward a surface of the casing facing the circuit board in a direction perpendicular to the circuit board,
    The heat shielding wall is an electronic control device that blocks radiant heat from the heat generating component to the low heat resistant component.
  10. 　請求項１に記載の電子制御装置であって、
    　前記発熱部品は、マイコンであり、
    　前記低耐熱部品は、メモリである電子制御装置。     The electronic control device according to claim 1,
    The heat generating component is a microcomputer,
    The low heat resistant component is an electronic control device that is a memory.
PCT/JP2022/018539 2022-04-22 2022-04-22 Electronic control device WO2023203750A1 (en)

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Citations (10)

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JPS5567182A (en) * 1978-11-15 1980-05-21 Nippon Electric Co Heat transmitting printed circuit board
JPS5712965U (en) * 1980-06-24 1982-01-22
JPH02121397A (en) * 1988-10-31 1990-05-09 Toshiba Corp Heat radiating type hybrid circuit device
EP0727928A1 (en) * 1995-02-18 1996-08-21 Hewlett-Packard GmbH Electronic assembly having improved thermal characteristics
JPH10256677A (en) * 1997-03-13 1998-09-25 Nec Yonezawa Ltd Printed board
JP2006147333A (en) * 2004-11-19 2006-06-08 Toyoda Gosei Co Ltd Led-mounting printed circuit board
JP2006173243A (en) * 2004-12-14 2006-06-29 Fujitsu Ten Ltd Printed wiring board and heat dissipation structure of printed circuit board
US8335077B2 (en) * 2008-01-31 2012-12-18 Hewlett-Packard Development Company, L.P. Insulating aperture in printed circuit boards
CN103118491A (en) * 2012-10-05 2013-05-22 友达光电股份有限公司 Circuit board structure
JP2021005580A (en) * 2019-06-25 2021-01-14 日立オートモティブシステムズ株式会社 Electronic control device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5567182A (en) * 1978-11-15 1980-05-21 Nippon Electric Co Heat transmitting printed circuit board
JPS5712965U (en) * 1980-06-24 1982-01-22
JPH02121397A (en) * 1988-10-31 1990-05-09 Toshiba Corp Heat radiating type hybrid circuit device
EP0727928A1 (en) * 1995-02-18 1996-08-21 Hewlett-Packard GmbH Electronic assembly having improved thermal characteristics
JPH10256677A (en) * 1997-03-13 1998-09-25 Nec Yonezawa Ltd Printed board
JP2006147333A (en) * 2004-11-19 2006-06-08 Toyoda Gosei Co Ltd Led-mounting printed circuit board
JP2006173243A (en) * 2004-12-14 2006-06-29 Fujitsu Ten Ltd Printed wiring board and heat dissipation structure of printed circuit board
US8335077B2 (en) * 2008-01-31 2012-12-18 Hewlett-Packard Development Company, L.P. Insulating aperture in printed circuit boards
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JP2021005580A (en) * 2019-06-25 2021-01-14 日立オートモティブシステムズ株式会社 Electronic control device

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