WO2023203750A1 - Dispositif de commande électronique - Google Patents

Dispositif de commande électronique Download PDF

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Publication number
WO2023203750A1
WO2023203750A1 PCT/JP2022/018539 JP2022018539W WO2023203750A1 WO 2023203750 A1 WO2023203750 A1 WO 2023203750A1 JP 2022018539 W JP2022018539 W JP 2022018539W WO 2023203750 A1 WO2023203750 A1 WO 2023203750A1
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WO
WIPO (PCT)
Prior art keywords
heat
electronic control
control device
circuit board
component
Prior art date
Application number
PCT/JP2022/018539
Other languages
English (en)
Japanese (ja)
Inventor
善彦 後藤
心哉 河喜多
Original Assignee
日立Astemo株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立Astemo株式会社 filed Critical 日立Astemo株式会社
Priority to PCT/JP2022/018539 priority Critical patent/WO2023203750A1/fr
Publication of WO2023203750A1 publication Critical patent/WO2023203750A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to the structure of an electronic control device, and particularly relates to a technique that is effective when applied to an electronic control device in which heat-generating components are mounted.
  • Electronic control devices installed in vehicles such as automobiles usually include electronic components made of semiconductor components and heat-generating components of electronic circuits on a circuit board.
  • microcontrollers hereinafter referred to as microcontrollers
  • ADAS advanced driving assistant systems
  • ADAS advanced driver assistance systems
  • Patent Document 1 discloses that a heat dissipating member (thermal conductive sheet 111) having higher thermal conductivity than air is provided at a location (first portion 4a) remote from the NAND memory 10 for the drive control circuit (controller) 4 on the board 8. An idea has been disclosed for suppressing radiant heat transfer to the NAND memory 10 by providing a radiator and restricting the direction of heat radiation.
  • low heat resistant components electronic components with low heat resistance such as semiconductor memory (hereinafter simply referred to as low heat resistant components) are placed near high heat generating components such as microcontrollers (hereinafter simply referred to as heat generating components).
  • heat generating components electronic components with low heat resistance
  • semiconductor memory hereinafter simply referred to as semiconductor memory
  • microcontrollers hereinafter simply referred to as heat generating components
  • a structure is required to radiate heat from each component.
  • a heat sink In general electronic control equipment, in order to dissipate heat from each component, a heat sink is often attached to the component via thermal paste, or the component is connected to a metal casing via thermal paste, and then the component is connected to the metal casing. Low heat resistant components are protected by dissipating heat from the installed heat dissipation fins.
  • an object of the present invention is to provide an electronic control device having an electronic board in which a heat generating component and a low heat resistant component are mounted on the same board, which can suppress heat transfer from the heat generating component to the low heat resistant component. It is about providing.
  • the present invention provides a heat generating component, a low heat resistant component connected to the heat generating component by a communication line, a circuit board on which the heat generating component and the low heat resistant component are mounted, and a circuit board on which the heat generating component and the low heat resistant component are mounted.
  • a casing that accommodates a board, and a heat transfer suppressing part that suppresses or blocks heat transfer from the heat generating component to the low heat resistant component in a region between the heat generating component and the low heat resistant component.
  • the heat transfer suppressing section has an opening formed in the circuit board, and the opening is located in a region between the heat generating component and the low heat resistant component of the circuit board, where the communication line is It is characterized in that it is formed in an area where it is not placed.
  • an electronic control device having an electronic board in which a heat generating component and a low heat resistant component are mounted on the same board, an electronic control device capable of suppressing heat transfer from the heat generating component to the low heat resistant component is realized. be able to.
  • electronic control devices can be made smaller and lighter by eliminating the need for heat dissipation components such as heat sinks, reducing the number of heat dissipation components, and even allowing the use of resin materials for the housing. It can contribute to cost reduction and cost reduction.
  • FIG. 1 is a perspective view of an electronic board mounted inside an electronic control device according to Example 1 of the present invention.
  • FIG. 2 is a top view of the electronic board of FIG. 1; 3 is a sectional view taken along line A-A' in FIG. 2.
  • FIG. 3 is a sectional view taken along line B-B' in FIG. 2.
  • FIG. FIG. 2 is a cross-sectional view showing the internal structure of an electronic control device according to a second embodiment of the present invention.
  • FIG. 1 is a perspective view of an electronic board 10 mounted inside the electronic control device of this embodiment.
  • FIG. 2 is a top view of the electronic board 10 of FIG. 1.
  • 3 is a cross-sectional view taken along line A-A' in FIG. 2
  • FIG. 4 is a cross-sectional view taken along line B-B' in FIG.
  • the electronic board 10 is housed in the casing 5 as described later in Example 2 (FIG. 5).
  • the electronic control device 11 is configured.
  • the electronic board 10 of this embodiment includes a circuit board 1, a heat generating component 2, and a low heat resistant component 3 as main components.
  • a printed circuit board (PCB board) or the like is used, in which a fine wiring pattern is formed using a metal such as copper on the surface of an insulating base material.
  • the heat generating component 2 and the low heat resistant component 3 are mounted on a wiring pattern (not shown) formed on the circuit board 1 by soldering or the like.
  • a typical example of the heat generating component 2 is a microcomputer. Furthermore, a typical example of the low heat resistant component 3 is a memory. Although not shown, electronic components such as a power IC and an electrolytic capacitor are also mounted on the circuit board 1 in addition to a microcomputer and a memory.
  • heat generation of a heat generating component means heat generation to the extent that it causes thermal interference to other electronic components placed nearby on the same circuit board 1, and is not necessarily limited to heat generation above a specific temperature. It's not a thing.
  • low heat resistance of low heat resistant parts means that the upper limit of temperature at which the operation and performance of electronic parts can be guaranteed is lower than that of other electronic parts, and is not limited to a specific temperature. .
  • a heat transfer suppressing section 100 that suppresses or blocks heat transfer from the heat generating component 2 to the low heat resistant component 3 is provided on the circuit board 1 in a region between the heat generating component 2 and the low heat resistant component 3.
  • the heat transfer suppressing section 100 has a plurality of openings 4 formed in the circuit board 1 .
  • the configuration of the electronic board 10 will be explained in more detail using the top view of FIG. 2.
  • the heat generating component 2 and the low heat resistant component 3 are mounted on the circuit board 1.
  • the heat generating component 2 and the low heat resistant component 3 are connected via a communication line 8 arranged on the circuit board 1, and exchange data with each other.
  • the low heat resistant component (memory) 3 needs to perform high-speed data communication with the heat generating component (microcomputer) 2, It is placed near the component (microcomputer) 2.
  • the heat transfer suppressing section 100 is composed of two heat transfer suppressing areas 100a and a meandering wiring area 100b arranged between them.
  • a plurality of openings 4 are provided in the heat transfer suppression area 100a.
  • the opening 4 is formed as a substantially rectangular slit in an area of the circuit board 1 where the communication line 8 is not arranged.
  • the opening 4 has a long and narrow opening 4b (first and an elongated opening 4a (second opening) in the Y direction of the circuit board 1, that is, the direction perpendicular to the arrangement direction of the heat generating components 2 and the low heat resistant components 3. arranged alternately.
  • the communication line 8 is connected to the area between the opening 4b (first opening) elongated in the X direction of the circuit board 1 and the opening 4a (second opening) elongated in the Y direction of the circuit board 1. It is located in
  • the circuit board 1 is composed of a laminated board in which six layers from the L1 layer to the L6 layer are laminated, and the openings 4a and 4b extend from the front side to the back side of the laminated board. It is formed as a penetrating slit.
  • the communication line 8 is installed as a meandering meandering wiring in an area where the opening 4 is not formed in the area between the heat generating component 2 and the low heat resistant component 3 of the circuit board 1. You can also place it.
  • the wiring length can be easily adjusted by changing the shape and number of meandering lines.
  • the individual shape of the opening 4 is not limited to a substantially rectangular slit, but may be substantially circular (in cross-sectional view) as long as it can suppress or block heat transfer from the heat generating component 2 to the low heat resistant component
  • the hole may be formed into a cylindrical shape) or a substantially triangular shape (triangular prism shape when viewed in cross section).
  • FIG. 5 is a sectional view showing the internal structure of the electronic control device 11 of this embodiment.
  • the electronic board 10 described in the first embodiment is housed inside the casing 5.
  • a heat generating component 2 and a low heat resistant component 3 are mounted on the electronic board 10 through solder joints 7 .
  • the heat transfer suppressing part 100 also includes a direction perpendicular to the circuit board 1 from the circuit board 1 toward the surface of the casing 5 facing the circuit board 1.
  • a heat conductive member 6 extending to is provided.
  • the heat of the heat generating component 2 is transmitted to the housing 6 via the thermal conductive member 6, and the heat is radiated. be able to.
  • the heat conductive member 6 may be provided inside the casing 5 so as to serve as a wall that shields a region where the heat generating component 2 is arranged and a region where the low heat resistant component 3 is arranged.
  • the heat conductive member 6 as a heat shielding wall, it is possible to block radiant heat from the heat generating component 2 to the low heat resistant component 3, and more effectively suppress heat transfer from the heat generating component 2 to the low heat resistant component 3. Or it can be blocked.
  • the present invention is not limited to the above-described embodiments, and includes various modifications.
  • the embodiments described above are described in detail to explain the present invention in an easy-to-understand manner, and the present invention is not necessarily limited to having all the configurations described.
  • it is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment and it is also possible to add the configuration of another embodiment to the configuration of one embodiment.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dispositif de commande électronique qui a une carte électronique sur laquelle à la fois un composant de génération de chaleur et un composant à faible résistance à la chaleur sont montés et qui est capable de supprimer le transfert de chaleur du composant de génération de chaleur au composant à faible résistance à la chaleur. Ce dispositif de commande électronique est caractérisé en ce qu'il comprend : un composant de génération de chaleur, un composant à faible résistance à la chaleur connecté au composant de génération de chaleur au moyen de lignes de communication, une carte de circuit imprimé sur laquelle sont montés le composant à faible résistance à la chaleur et le composant de génération de chaleur, et un boîtier recevant la carte de circuit imprimé ; et une section de suppression de transfert de chaleur pour supprimer ou bloquer le transfert de chaleur du composant de génération de chaleur au composant à faible résistance à la chaleur dans une région entre le composant de génération de chaleur et le composant à faible résistance à la chaleur, la section de suppression de transfert de chaleur ayant des ouvertures formées dans la carte de circuit imprimé, et les ouvertures étant formées dans des zones où les lignes de communication ne sont pas disposées dans la région entre le composant de génération de chaleur et le composant à faible résistance à la chaleur de la carte de circuit imprimé.
PCT/JP2022/018539 2022-04-22 2022-04-22 Dispositif de commande électronique WO2023203750A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/018539 WO2023203750A1 (fr) 2022-04-22 2022-04-22 Dispositif de commande électronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/018539 WO2023203750A1 (fr) 2022-04-22 2022-04-22 Dispositif de commande électronique

Publications (1)

Publication Number Publication Date
WO2023203750A1 true WO2023203750A1 (fr) 2023-10-26

Family

ID=88419453

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2022/018539 WO2023203750A1 (fr) 2022-04-22 2022-04-22 Dispositif de commande électronique

Country Status (1)

Country Link
WO (1) WO2023203750A1 (fr)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5567182A (en) * 1978-11-15 1980-05-21 Nippon Electric Co Heat transmitting printed circuit board
JPS5712965U (fr) * 1980-06-24 1982-01-22
JPH02121397A (ja) * 1988-10-31 1990-05-09 Toshiba Corp 放熱型混成回路装置
EP0727928A1 (fr) * 1995-02-18 1996-08-21 Hewlett-Packard GmbH Ensemble électronique possédant de meilleures caractéristiques thermiques
JPH10256677A (ja) * 1997-03-13 1998-09-25 Nec Yonezawa Ltd プリント基板
JP2006147333A (ja) * 2004-11-19 2006-06-08 Toyoda Gosei Co Ltd Ｌｅｄ実装用プリント基板
JP2006173243A (ja) * 2004-12-14 2006-06-29 Fujitsu Ten Ltd プリント配線板、及びプリント回路板の放熱構造
US8335077B2 (en) * 2008-01-31 2012-12-18 Hewlett-Packard Development Company, L.P. Insulating aperture in printed circuit boards
CN103118491A (zh) * 2012-10-05 2013-05-22 友达光电股份有限公司 电路板结构
JP2021005580A (ja) * 2019-06-25 2021-01-14 日立オートモティブシステムズ株式会社 電子制御装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5567182A (en) * 1978-11-15 1980-05-21 Nippon Electric Co Heat transmitting printed circuit board
JPS5712965U (fr) * 1980-06-24 1982-01-22
JPH02121397A (ja) * 1988-10-31 1990-05-09 Toshiba Corp 放熱型混成回路装置
EP0727928A1 (fr) * 1995-02-18 1996-08-21 Hewlett-Packard GmbH Ensemble électronique possédant de meilleures caractéristiques thermiques
JPH10256677A (ja) * 1997-03-13 1998-09-25 Nec Yonezawa Ltd プリント基板
JP2006147333A (ja) * 2004-11-19 2006-06-08 Toyoda Gosei Co Ltd Ｌｅｄ実装用プリント基板
JP2006173243A (ja) * 2004-12-14 2006-06-29 Fujitsu Ten Ltd プリント配線板、及びプリント回路板の放熱構造
US8335077B2 (en) * 2008-01-31 2012-12-18 Hewlett-Packard Development Company, L.P. Insulating aperture in printed circuit boards
CN103118491A (zh) * 2012-10-05 2013-05-22 友达光电股份有限公司 电路板结构
JP2021005580A (ja) * 2019-06-25 2021-01-14 日立オートモティブシステムズ株式会社 電子制御装置

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