JPS6149462U - - Google Patents

Info

Publication number
JPS6149462U
JPS6149462U JP13461584U JP13461584U JPS6149462U JP S6149462 U JPS6149462 U JP S6149462U JP 13461584 U JP13461584 U JP 13461584U JP 13461584 U JP13461584 U JP 13461584U JP S6149462 U JPS6149462 U JP S6149462U
Authority
JP
Japan
Prior art keywords
semiconductor
stacked
heat shield
shield plate
stacks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13461584U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13461584U priority Critical patent/JPS6149462U/ja
Publication of JPS6149462U publication Critical patent/JPS6149462U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を示す側断面図、第
２図は従来例の側断面図、第３図は第２図Ａ−Ａ
断面図である。 １…半導体スタツク、２…半導体素子、３…冷
却フイン、４…熱遮蔽板、５…筐体。 Fig. 1 is a side sectional view showing one embodiment of the present invention, Fig. 2 is a side sectional view of a conventional example, and Fig. 3 is Fig. 2 A-A.
FIG. DESCRIPTION OF SYMBOLS 1... Semiconductor stack, 2... Semiconductor element, 3... Cooling fin, 4... Heat shielding plate, 5... Housing.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数個の半導体スタツクが筐体内に段積み配置
され、かつ、各半導体スタツク間に熱遮蔽板が斜
めに介装された半導体装置において、前記半導体
スタツクがそれぞれ傾斜して段積み配置されると
ともに、熱遮蔽板がそれぞれ上段の半導体スタツ
クの冷却フイン背面を覆う如く略平行に伸延する
ことを特徴とする半導体装置。 In a semiconductor device in which a plurality of semiconductor stacks are stacked in a housing and a heat shield plate is diagonally interposed between each semiconductor stack, the semiconductor stacks are stacked in a tilted manner, and A semiconductor device characterized in that each heat shield plate extends substantially parallel to cover the back surface of a cooling fin of an upper semiconductor stack.
JP13461584U 1984-09-05 1984-09-05 Pending JPS6149462U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13461584U JPS6149462U (en) 1984-09-05 1984-09-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13461584U JPS6149462U (en) 1984-09-05 1984-09-05

Publications (1)

Publication Number Publication Date
JPS6149462U true JPS6149462U (en) 1986-04-03

Family

ID=30693122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13461584U Pending JPS6149462U (en) 1984-09-05 1984-09-05

Country Status (1)

Country Link
JP (1) JPS6149462U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013046778A1 (en) * 2011-09-28 2013-04-04 三菱電機株式会社 Control board
JP2016054236A (en) * 2014-09-04 2016-04-14 株式会社明電舎 Cooling mechanism for electric power supply

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013046778A1 (en) * 2011-09-28 2013-04-04 三菱電機株式会社 Control board
CN103828153A (en) * 2011-09-28 2014-05-28 三菱电机株式会社 Control board
TWI493816B (en) * 2011-09-28 2015-07-21 Mitsubishi Electric Corp Control box
CN103828153B (en) * 2011-09-28 2016-11-02 三菱电机株式会社 Control dish
JP2016054236A (en) * 2014-09-04 2016-04-14 株式会社明電舎 Cooling mechanism for electric power supply

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