JPS5974741U - Cooling structure for semiconductor devices - Google Patents
Cooling structure for semiconductor devicesInfo
- Publication number
- JPS5974741U JPS5974741U JP17084682U JP17084682U JPS5974741U JP S5974741 U JPS5974741 U JP S5974741U JP 17084682 U JP17084682 U JP 17084682U JP 17084682 U JP17084682 U JP 17084682U JP S5974741 U JPS5974741 U JP S5974741U
- Authority
- JP
- Japan
- Prior art keywords
- cooling structure
- semiconductor devices
- heating element
- semiconductor device
- partition plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 5
- 238000001816 cooling Methods 0.000 title claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000009423 ventilation Methods 0.000 claims description 3
- 238000005192 partition Methods 0.000 claims description 2
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体装置の冷却構造を示す断面側面図
、第２図は、この考案の一実施例による半導体装置の冷
却構造を示す断面側面図である。
１・・・上側発熱体、２・・・下側発熱体、３・・・換
気扇、４・・・仕切板、５・・・半導体装置。なお、図
中、同一符号は同−又は相当部分を示す。FIG. 1 is a cross-sectional side view showing a conventional cooling structure for a semiconductor device, and FIG. 2 is a cross-sectional side view showing a cooling structure for a semiconductor device according to an embodiment of the invention. DESCRIPTION OF SYMBOLS 1... Upper heating element, 2... Lower heating element, 3... Ventilation fan, 4... Partition plate, 5... Semiconductor device. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
体間を仕切板にて熱的にしゃ断し、且つ上記各発熱体の
通風路に対し共通の換気扇を設けたことを特徴とする半
導体装置の冷却構造。A semiconductor device having a plurality of heating elements, characterized in that each heating element is thermally isolated by a partition plate, and a common ventilation fan is provided for the ventilation path of each heating element. cooling structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17084682U JPS5974741U (en) | 1982-11-09 | 1982-11-09 | Cooling structure for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17084682U JPS5974741U (en) | 1982-11-09 | 1982-11-09 | Cooling structure for semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5974741U true JPS5974741U (en) | 1984-05-21 |
Family
ID=30372853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17084682U Pending JPS5974741U (en) | 1982-11-09 | 1982-11-09 | Cooling structure for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5974741U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54133883A (en) * | 1978-04-07 | 1979-10-17 | Nec Corp | Cooling system |
-
1982
- 1982-11-09 JP JP17084682U patent/JPS5974741U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54133883A (en) * | 1978-04-07 | 1979-10-17 | Nec Corp | Cooling system |
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