JPS58116235U - Heat dissipation device for electronic components - Google Patents
Heat dissipation device for electronic componentsInfo
- Publication number
- JPS58116235U JPS58116235U JP1307182U JP1307182U JPS58116235U JP S58116235 U JPS58116235 U JP S58116235U JP 1307182 U JP1307182 U JP 1307182U JP 1307182 U JP1307182 U JP 1307182U JP S58116235 U JPS58116235 U JP S58116235U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation device
- electronic components
- electronic component
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図および第２図はそれぞれこの考案の電子７部品の
厳然装置が適用される電子装置の外観斜視図および内部
ｉ親図、第３図は従来例を示す斜視図、第４図はこの考
案の一実施例を示す斜視図である。
、
６・・・電子部品、６ａ・・・放熱部、７・・・セラミ
ック製放熱フィン、７ａ・・・通気孔。−Figures 1 and 2 are respectively an external perspective view and an internal diagram of an electronic device to which the seven electronic component device of this invention is applied, Figure 3 is a perspective view of a conventional example, and Figure 4 is a perspective view of this electronic device. FIG. 1 is a perspective view showing an embodiment of the invention.
, 6... Electronic component, 6a... Heat radiation part, 7... Ceramic heat radiation fin, 7a... Ventilation hole. −
Claims (2)
固定したことを特徴とする部品の放熱装置。(1) A heat dissipation device for a component, characterized in that a ceramic heat dissipation fan is bonded and fixed to a heat dissipation section of an electronic component.
実用新案登録請求の範囲ｌ（’１１項記載の電子部品の
放熱装置。(2) The ceramic heat dissipation fin is a perforated plate.Claim 1 (A heat dissipation device for an electronic component as described in '11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1307182U JPS58116235U (en) | 1982-01-30 | 1982-01-30 | Heat dissipation device for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1307182U JPS58116235U (en) | 1982-01-30 | 1982-01-30 | Heat dissipation device for electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58116235U true JPS58116235U (en) | 1983-08-08 |
Family
ID=30025606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1307182U Pending JPS58116235U (en) | 1982-01-30 | 1982-01-30 | Heat dissipation device for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58116235U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6162795U (en) * | 1984-09-27 | 1986-04-28 | ||
| WO2002025731A1 (en) * | 2000-09-19 | 2002-03-28 | Matsushita Electric Industrial Co., Ltd. | Electronic equipment |
-
1982
- 1982-01-30 JP JP1307182U patent/JPS58116235U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6162795U (en) * | 1984-09-27 | 1986-04-28 | ||
| WO2002025731A1 (en) * | 2000-09-19 | 2002-03-28 | Matsushita Electric Industrial Co., Ltd. | Electronic equipment |
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