JP4319174B2 - Electronic equipment cooling structure and copier - Google Patents

Description

  The present invention relates to a cooling structure for cooling heat generated from an electronic device, and more particularly to a copying machine having such a cooling structure.

  In recent years, precision devices such as copiers and information processing apparatuses are equipped with various electronic devices, and on the other hand, downsizing of the entire device is always required. For example, a copying machine has been proposed that is equipped not only with a conventional copying function but also with an image storage device capable of storing captured image data. In addition, many of the mounted electronic devices generate heat during operation, and it is necessary to efficiently cool them during operation. For this reason, in equipment that generates heat, forced cooling is performed by a cooling fan or the like. Naturally, if a cooling fan is installed for each device that generates heat, it will be possible to perform effective cooling, but adding a cooling fan will increase the size of the device, and vibration and noise generated from the device will also be generated. It will increase. In addition, among the devices incorporated in the device, there are devices that are extremely vulnerable to vibration, such as a hard disk drive, for example. It was necessary to improve the cooling efficiency.

  In order to improve the above-mentioned problem, for example, an internal cooling structure in which an opening is provided on the side adjacent to the substrate, a fixture for fixing main components constituting the information device is formed in a duct shape, and connected by a connecting member Has been proposed (see, for example, Patent Document 1). According to such an internal cooling structure, air is efficiently circulated by the duct-shaped fixture, and the fan can be downsized. Furthermore, it is said that each component acts in order from the upstream side without waste and is cooled evenly, so that the cooling efficiency can be improved and the cooling efficiency of the substrate can be improved.

  In addition, in a magnetic disk device composed of a hard disk drive body and a substrate, an electronic device housing in which a heat conductive member is inserted and adhered in the space between the hard disk drive body and the electronic components of the substrate or the hard disk drive body and the hard disk drive are mounted. There has been proposed a magnetic disk device in which a heat conductive member is inserted and adhered between body surfaces (see, for example, Patent Document 2). According to such a magnetic disk device, the heat generated by the electronic component is smoothly transmitted to the hard disk drive, which is a heat radiating part, via the heat conductive member, and the heat generated by the hard disk drive is transmitted by the heat radiating part via the heat conductive member. It is said that it can be transmitted smoothly to a case and the temperature rise of electronic components and hard disk drives can be suppressed.

In addition, a basic circuit board is mounted on the third main surface side of the housing sheet metal disposed in the central portion of the housing structure, and at least a part of peripheral devices is disposed on the fourth main surface side opposite to the third main surface. Arranged information equipment devices have been proposed (see, for example, Patent Document 3). According to such an information device apparatus, the peripheral device is disposed on the surface opposite to the surface of the housing sheet metal on which the basic circuit board is disposed by the housing sheet metal. It is said that the circuit board is not received, the distance from the outside of the main body is shortened, the heat is easily radiated to the outside air, and the cooling efficiency is improved.
JP 2001-195154 A JP-A-9-115279 JP 2003-208238 A

  However, in Patent Document 1, since the components provided on the downstream side of the flow path formed by the fixture are cooling air that has cooled all other components upstream thereof, the temperature of the cooling air is low. As a result, the heat dissipation efficiency decreases. Or there was a possibility of turning to heating. Moreover, in order to form a flow path as described above, there has been a problem that the arrangement position of each component is practically determined and functional arrangement cannot be performed. In addition, the substrate is cooled only from one surface where the fixture is provided, and there is a problem that the substrate is not directly cooled except for the portion where the fixture is provided.

  Further, in Patent Document 2, when the heat generation of the hard disk drive is increased, there is a problem that the electronic components on the board are rather heated. Further, since the electronic device casing is connected via a heat conducting member, vibration from the outside is directly transmitted to the hard disk drive, which causes a problem that the hard disk drive is damaged.

  Furthermore, in Patent Document 3, although the cooling efficiency of each electronic component such as the CPU of the basic circuit board is improved, the peripheral devices isolated by this and the sheet metal are densely packed, and the cooling efficiency is lowered. There was a problem. In addition, the hard disk drive, which is one of them, is densely packed, so that vibrations from other devices and the outside are transmitted, and the hard disk drive is damaged.

  The present invention has been made in view of the above-described circumstances, and can be efficiently and uniformly cooled by a minimum size and the number of cooling fans installed, and the apparatus space can be minimized. The present invention provides a cooling structure for electronic equipment and a copying machine having such a cooling structure.

In order to solve the above problems, the present invention proposes the following means.
The present invention provides a cooling structure for an electronic device in which a substrate and peripheral devices are mounted, and the substrate and the peripheral devices are cooled by a cooling fan, and the substrate and the peripheral devices are provided with cooling air blown from a cooling fan. It is characterized by being supported by a support plate with a gap serving as a flow path.

  According to the cooling structure of the electronic device according to the present invention, the substrate and the peripheral device are supported by the support plate with a predetermined gap, so that the cooling air of the cooling fan is not only the surface of the substrate and the peripheral device, The air is also blown into the gap between the support plate on the opposite side. For this reason, it is possible to cool the whole of the substrate and the peripheral devices, and it is possible to efficiently perform the cooling by the cooling fan.

  In the above invention, the substrate is supported on one side of the support plate, at least a part of the peripheral device is supported on the other side of the support plate, and the air blowing direction of the cooling fan is determined by the support plate. It is characterized by being set so as to be substantially parallel to the surface direction.

  According to the cooling structure for an electronic device according to the present invention, the installation area can be reduced by supporting the substrate and the peripheral device on both surfaces of the support plate. In addition to avoiding thermal influence on each other by supporting both sides of the support plate, both sides of the support plate are simultaneously cooled in parallel by blowing air substantially parallel to the surface direction of the support plate. Therefore, the cooling can be efficiently performed with the minimum size and the number of installed cooling fans.

  Furthermore, in the above-mentioned invention, at least one of the peripheral devices is a hard disk drive, and a heat-isolating and deformable vibration isolating member is inserted between the hard disk drive and the support plate. It is said.

  According to the cooling structure for an electronic device according to the present invention, since the deformable vibration isolating member is inserted in the hard disk drive, it is possible to prevent vibrations that adversely affect the hard disk drive from being transmitted from the support plate. it can. Furthermore, the heat generated from the hard disk drive is not only cooled by the cooling air in its outer casing, but is also transmitted to the heat-isolating vibration isolating member and radiated, or is transmitted from the vibration isolating member to the support plate. Since it dissipates heat, it can be efficiently cooled.

  Furthermore, in the above-mentioned invention, a heat radiation fin is connected to at least a part of the electronic component of the substrate so as to be substantially parallel to the blowing direction of the cooling fan.

  According to the cooling structure for an electronic device according to the present invention, the cooling fan cooling air can be more efficiently cooled by providing the heat dissipating fins in each of the electronic components of the board.

  Also, a copying machine is proposed in which the cooling structure for any electronic device in the above-described invention is mounted on a machine body.

  According to the copying machine according to the present invention, since the electronic device cooling structure capable of efficiently cooling in a space-saving manner is mounted, the copying machine can be reduced in size and the cooling fan can be minimized. Therefore, vibration and noise can be suppressed.

  According to the present invention, there are gaps on both sides of the support plate, the substrate and peripheral devices are supported and cooled by the cooling fan, so that the cooling can be efficiently performed. Therefore, it is possible to minimize the number of installations and save space for the entire apparatus. In addition, by minimizing the size and number of cooling fans installed, power consumption can be reduced, and vibration and noise can be reduced. Furthermore, when a hard disk drive is provided in one of the peripheral devices, it is possible to effectively perform both vibration isolation and heat dissipation by providing a vibration isolation member. In the copying machine having such a cooling structure, it is possible to reduce the size, and to provide a low-cost copying machine that suppresses vibration and noise and reduces power consumption.

  1 and 2 show an embodiment according to the present invention. FIG. 1 is a side view of a cooling structure of an image storage device (electronic device) mounted on a copying machine, and FIG. 2 is a plan view.

  As shown in FIGS. 1 and 2, the image storage device 1 (electronic device) is mounted on a machine body 3 of a copying machine 2. Such a cooling structure 1a of the image storage device 1 includes a substrate 6 on which electronic components such as a CPU 4 and an ASIC 5 are mounted, a hard disk drive 7 that stores captured image data, a substrate 6, the hard disk drive 7, and other necessary components. A supporting plate 8 that supports peripheral devices (not shown) and a cooling fan 9 that blows cooling air A are provided.

  As shown in FIG. 1, the substrate 6 has a surface 6 b opposite to the surface 6 a facing the support plate 8, and is fixed by screws 10 with a gap 11 on the one surface 8 a side of the support plate 8. Electronic components such as CPU 4 and ASIC 5 are provided on the surface 6 b of the substrate 6, and heat radiating fins 12 are provided in each electronic component so as to be substantially parallel to the blowing direction of the cooling fan 9. Such a substrate 6 is formed of, for example, glass epoxy. Further, the hard disk drive 7 includes a substrate 7 a, the mounting surface 7 b of the substrate 7 a is exposed on the side facing the support plate 8, and is fixed with a gap 13 on the other surface 8 b side of the support plate 8 by screws 10. Has been. Further, a vibration isolating member 14 is inserted into the gap 13 so as to be in close contact with the mounting surface 7 b of the substrate 7 a of the hard disk drive 7 and the other surface 8 b of the support plate 8. The anti-vibration member 14 is a material capable of absorbing deformable vibration, for example, a rubber sheet, and a material having a high thermal conductivity is preferable. The board 6 is provided with a connector 15, and the board 6 and the hard disk drive 7 are electrically connected by a connection cable 16. In addition, peripheral devices (not shown) necessary for the image storage device 1 are also fixed to the support plate 8 with screws with a gap. The gap 11 of the substrate 6, the gap 13 of the hard disk drive 7, and the gaps of other peripheral devices (not shown) have such a width that the cooling air A of the cooling fan 9 can be blown, more specifically about 1 cm. . The support plate 8 to which peripheral devices such as the substrate 6 and the hard disk drive 7 are fixed is fixed to the machine body 3 of the copying machine 2 with screws 17. The support plate 8 is preferably made of a material having such a strength as to support peripheral devices including the substrate 6 and the hard disk drive 7 and having high thermal conductivity, such as an iron plate. The cooling fan 9 is fixed to the machine main body 3 of the copying machine 2 independently of the support plate 8 and can blow air to both the one surface 8 a side and the other surface 8 b side of the support plate 8, and the blowing direction is the support plate 8. Are set to be substantially parallel to each other.

  Next, the operation of the cooling structure 1a of the image storage device 1 will be described. The image storage device 1 is operated, and the image data captured by the copying machine 2 is stored by the substrate 6 and the hard disk drive 7. The CPU 4, the ASIC 5, and the hard disk drive 7, which are electronic components of the substrate 6, generate heat during operation, and the cooling fan 9 blows cooling air A to both sides of the support plate 8 substantially in parallel. The cooling air A branched to the one surface 8 a side of the support plate 8 is further branched to the front surface 6 b side of the substrate 6 and the back surface 6 a side on the opposite side, so that the substrate 6 can be cooled on the entire surface of the substrate 6. Further, the cooling air A branched to the surface 6b side of the substrate 6 passes through the heat radiation fins 12 provided on the electronic components such as the CPU 4 and the ASIC 5, and directly cools the electronic components provided on the substrate 6 directly. Can do.

  Further, the cooling air A branched to the other surface 8 b side of the support plate 8 can directly cool the entire portion of the hard disk drive 7 that is not in contact with the vibration isolation member 14, and from the hard disk drive 7 to the vibration isolation member 14. The heat transferred to can also be dissipated. Furthermore, the heat transmitted from the vibration isolation member 14 to the support plate 8 can also be radiated by the cooling air A passing through both surfaces of the support plate 8. Here, various vibrations are generated inside the image storage device 1, and vibrations are given from the outside. The hard disk drive 7 is fixed via the support plate 8, and between the support plate 8. In addition, since the vibration isolating member 14 is interposed, the influence of vibration can be minimized.

  Further, when the cooling fan 9 is operated, vibration is generated from the cooling fan 9, but the cooling fan 9 and the substrate 6 fixed to the support plate 8, the hard disk drive 7 and other peripheral devices are independent of the copying machine 2. Since it is fixed to the machine body 3, it is not affected by the vibration generated by the cooling fan 9, and therefore, the separation between the cooling fan 9 and the substrate 6, the hard disk drive 7 and other peripheral devices is minimized. The cooling efficiency can be increased and the device space can be reduced.

Although the cooling structure 1a of the image storage device 1 has been described above, it is possible to cool efficiently by fixing peripheral devices such as the heat generating substrate 6 and the hard disk drive 7 to the support plate 8 with a gap. . Also, by providing peripheral devices such as the substrate 6 and the hard disk drive 7 on both sides of the support plate 8, the installation area of the apparatus can be reduced, the apparatus space can be reduced, and the cooling range of the cooling fan 9 can be reduced. be able to. For this reason, the size and the number of installed cooling fans 9 can be minimized, vibration and noise can be suppressed, power consumption can be suppressed, and the device space can be further reduced. Further, by inserting a vibration isolating member 14 between the hard disk drive 7 and the support plate 8, heat can be efficiently radiated, and vibration is transmitted to prevent the hard disk drive 7 from being damaged. Can do.
Further, in the copying machine 2 equipped with such a cooling structure 1a of the image storage device 1, the size of the cooling fan 9 can be reduced and the number of the cooling fans 9 can be minimized. It is possible to provide a device that minimizes noise and suppresses power consumption.

  As mentioned above, although embodiment of this invention was explained in full detail with reference to drawings, the concrete structure is not restricted to this embodiment, The design change etc. of the range which does not deviate from the summary of this invention are included.

  In the present embodiment, the image storage device 1 mounted on the copying machine 2 has been described. However, the present invention is not limited to this. The present invention is applied to all electronic devices including at least a substrate and peripheral devices that require efficient cooling. In addition, although the heat dissipating fins 12 are provided in each of the electronic components of the substrate 6, it may be provided at least in part.

It is a side view of the cooling structure of the image storage device of the embodiment of the present invention. It is a front view of the cooling structure of the image storage device of the embodiment of the present invention.

Explanation of symbols

1 Image storage device (electronic equipment)
1a Cooling structure 2 Copying machine 3 Machine body 4 CPU (electronic parts)
5 ASIC (electronic parts)
6 Substrate 7 Hard disk drive (peripheral device)
8 Support plate 9 Cooling fan 11, 13 Crevice 12 Radiation fin 14 Anti-vibration member A Cooling air

Claims (4)

A cooling structure for an electronic device in which a substrate and a peripheral device are mounted, and the substrate and the peripheral device are cooled by a cooling fan,
The substrate and the peripheral device have a gap serving as a flow path for cooling air blown from a cooling fan, and are supported by a support plate .
A cooling structure for an electronic device , wherein at least one of the peripheral devices is a hard disk drive, and a thermally conductive and deformable vibration isolating member is inserted between the hard disk drive and the support plate. . The electronic device cooling structure according to claim 1,
The substrate is supported on one side of the support plate, at least a part of the peripheral device is supported on the other side of the support plate, and the blowing direction of the cooling fan is parallel to the surface direction of the support plate. An electronic device cooling structure characterized by being set as follows. 3. The electronic device cooling structure according to claim 1, wherein at least a part of the electronic component of the substrate is connected to a heat radiating fin in parallel with the blowing direction of the cooling fan. A cooling structure for electronic equipment. 4. A copying machine, wherein the electronic device cooling structure according to claim 1 is mounted on a machine body.

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