JP2012227350A - Cooling structure for heating component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling structure for a heating component which can cool down efficiently and surely even when the heating component is disposed at a location that is hard to cool down by an original cooling fan, such as a location away from the original cooling fan equipped in a housing of equipment, and a location that is hard to receive a blow from the cooling fan.SOLUTION: A cooling structure is provided in the interior of a housing 1 of equipment. In the cooling structure, a circuit board 2 having heating components 3A, 3B and 3C mounted thereon, and a metal plate 1a of the housing are disposed with a distance therebetween. At least one cooling fan 6B that blows air toward the metal plate 1a of the housing is disposed between the circuit board 2 and the metal plate 1a of the housing. The heating components 3A, 3B and 3C and the metal plate 1a of the housing are connected to each other via thermal conductors 4 and 5. The heat generated from the heating components 3A, 3B and 3C is transmitted through the thermal conductors 4 and 5 to the metal plate 1a of the housing. The heat transmitted to the metal plate 1a is efficiently radiated with the blow from the cooling fan 6B. This ensures cooling of the heating components even when they are located at locations that are hard to receive the blow from the original cooling fan.

Description

  The present invention relates to a cooling structure for a heat generating component, and more specifically, even when a heat generating component is disposed in a place where it is difficult to cool with an original cooling fan installed inside a device casing, it can be efficiently cooled. It relates to a cooling structure.

  Conventional electronic devices are usually equipped with a cooling fan inside the casing, and air is blown to heat-generating components with this cooling fan, or air inside the casing is exhausted to the outside with this cooling fan, The heat-generating parts are cooled.

  For example, inside the casing of the recording / reproducing apparatus, a loader board mounted with a heat generating component such as a main IC is bridged between the VCR and the loader, and the gap between the VCR and the loader is disposed on the rear wall of the casing as a ventilation path. A cooling fan (exhaust fan) is known that cools heat-generating components by exhausting air inside the housing (Patent Document 1).

  In addition, a circuit board on which a heating element is mounted is disposed inside the housing of the electronic device, a heat dissipation member is provided adjacent to the heating element, and a structure that forms a small cross-sectional area air passage is opposed to the circuit board. It is also known that the heating element is cooled by disposing the air introduced from the air intake hole of the housing to the air passage through the heat radiating member from the exhaust hole by the cooling fan provided in the exhaust hole of the housing. (Patent Document 2).

  On the other hand, by providing a rigid board with a heat generating component inside the metal housing of the electronic device, and connecting the heat generating component to the wall of the housing through a heat transfer material, There is also known one that cools a heat-generating component by radiating heat (Patent Document 3).

JP 2008-130149 A JP 2007-188599 A JP 2010-109247 A

  However, as in the past, when cooling a heat-generating component by blowing air to the heat-generating component with a cooling fan installed inside the housing of the electronic device, the heat-generating component is far away from the cooling fan, or other components are on the wall. When the heat generation component is difficult to wind, there is a problem that the heat generation component cannot be cooled sufficiently.

  Further, as in Patent Documents 1 and 2, an air passage is formed inside the housing, a heat generating component is arranged in the middle, and the heat generating component is cooled by exhausting through the air passage with a cooling fan (exhaust fan). In this case, there is a problem in that the heat-generating component arranged at a location outside the air passage cannot be sufficiently cooled.

  On the other hand, when the heat generating component is connected to the wall portion of the metal casing through the heat transfer material as in Patent Document 3, and the heat generating component is cooled by radiating heat from the casing, the heat dissipation of the casing is performed. When the area is insufficient, there is a problem in that the heat generating parts cannot be cooled sufficiently.

  The present invention has been made under the above circumstances, and the problem to be solved is inherently a place where the distance from the original cooling fan installed in the casing of the device is long, a place where it is difficult to blow, etc. It is an object of the present invention to provide a cooling structure for a heat generating component that can efficiently and reliably cool a heat generating component even in a case where the heat generating component is disposed at a location that is difficult to cool with the above cooling fan.

  In order to solve the above-described problem, the cooling structure for a heat generating component according to the present invention includes a circuit board on which the heat generating component is mounted inside the housing of the device with a space between the metal plate of the housing, At least one cooling fan that blows air toward the metal plate of the housing is provided between the circuit board and the metal plate of the housing, and the heat generating component and the metal plate of the housing are connected by a heat conductor. It is characterized by.

  In the cooling structure of the present invention, it is desirable that the cooling fan be added separately from the original cooling fan installed inside the housing. In addition, it is desirable that a fan fixing shelf that can be ventilated is disposed between the circuit board and the metal plate of the housing and is attached to the metal plate of the housing, and the cooling fan is fixed to the fan fixing shelf.

  In the heat generating component cooling structure according to the present invention, heat from the heat generating component mounted on the circuit board is conducted to the metal plate of the housing through the heat conductor, and the heat conducted to the metal plate is supplied from the cooling fan. Since heat is efficiently dissipated by the air blowing, the heat-generating component can be reliably cooled even when the heat-generating component is disposed at a location far from the original cooling fan inside the housing or at a location where it is difficult for the wind to hit.

And, if the cooling fan is added separately from the original cooling fan installed inside the housing, by increasing the number of cooling fans according to the heat generation status from the heat generating parts, The cooling effect can be further improved.
In addition, a fan fixing shelf that can be freely ventilated is arranged between the circuit board and the metal plate of the housing and is attached to the metal plate of the housing. When the cooling fan is fixed to the fan fixing shelf, The expansion can be easily performed, and the fan fixing shelf can be ventilated, so that the air supply of the cooling fan is not hindered by the fan fixing shelf.

It is a schematic explanatory drawing which shows one Embodiment of the cooling structure of the heat-emitting component which concerns on this invention.

  Hereinafter, an embodiment of a heat generating component cooling structure according to the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic explanatory view showing an embodiment of a cooling structure for a heat generating component according to the present invention. In the figure, reference numeral 1 denotes a casing of an electronic device such as a DVD recorder. Inside, the circuit board 2 is disposed and fixed with a gap between the circuit board 2 and the metal plate 1 a constituting the top case of the housing 1.

  On the upper surface of the circuit board 2, a plurality of heat generating components 3A, 3B, 3C including a driver IC and a power transistor are mounted together with other electronic components (not shown), and these heat generating components are mounted. 3A, 3B, and 3C are connected to the metal plate 1a of the housing 1 through the heat conductor 4 or 5. Therefore, the heat generated from these heat generating components 3A, 3B, 3C is conducted to the metal plate 1a of the housing 1 through the heat conductor 4 or 5.

  The heat conductor 4 or 5 can be used without particular limitation as long as it has a high thermal conductivity capable of efficiently conducting heat generated from the heat generating components 3A, 3B, 3C to the metal plate 1a of the housing 1. In the embodiment, a commercially available double-sided adhesive heat dissipation sheet is used as the heat conductor 4, and a metal wire is used as the heat conductor 5. The former heat-dissipating sheet (heat conductor 4) can be easily adhered and fixed to the heat generating components 3A and 3B and the metal plate 1a of the housing 1 with adhesive force on both sides, but the latter metal wire (heat conductor 5) Since it is difficult to attach as it is, the heat conductive metal screw fixing members 5a and 5b are fixed to the heat generating component 3C and the metal plate 1a of the housing 1 with a heat conductive double-sided tape (not shown) or the like. Both ends of the conductor 5) are fixedly attached to the screw fixing members 5a and 5b with heat conductive metal screws 5c and 5c.

  An original cooling fan 6A that blows air to the heat generating components 3A, 3B, 3C on the circuit board 2 and other electronic components is attached to the air intake hole formed in the rear panel 1b of the housing 1. The cooling fan 6A The power supply line 6 a is connected to a DC power supply connector 7 A on the circuit board 2.

  A fan fixing shelf 8 is arranged between the metal plate 1 a constituting the top case of the housing 1 and the circuit board 2, and rising portions 8 a and 8 a at both ends of the fan fixing shelf 8 are screws 9 and 9. It is fixed to 1a. In addition to the original cooling fan 6A, a plurality of cooling fans 6B for blowing air toward the metal plate 1a of the housing 1 are added and fixed in parallel to the fan fixing shelf 8, and these cooling fans 6A are cooled. A power supply line 6b to the fan 6B is connected to a DC power supply connector 7B on the circuit board 2.

  The number of cooling fans 6B to be added may be determined according to the amount of heat generated from the heat generating components 3A, 3B, 3C (in other words, the amount of heat conducted to the metal plate 1a of the housing 1). ) Is not large, at least one cooling fan 6B may be added.

  In addition, the fan fixing shelf 8 has, for example, a lattice-like shape having a rectangular opening that can be ventilated in the vertical direction (at least in the direction from the circuit board 2 to the metal plate 1a) so as not to hinder the blowing of the cooling fan 6B. It is desirable to use a shelf, or a ventilable shelf having a circular opening having a size corresponding to the blade portion of the cooling fan 6B.

  In this embodiment, a DC power supply connector 7A to the original cooling fan 6A and a DC power supply connector 7B to the added cooling fan 6B are provided on the circuit board 2. A power supply board (not shown) may be installed separately from the board 2, and both DC power supply connectors 7A and 7B may be provided on the power supply board.

  When the heat generating component cooling structure as described above is used, heat generated from the heat generating components 3A, 3B, 3C mounted on the circuit board 2 is conducted to the metal plate 1a of the housing 1 through the heat conductors 4, 5, Since the heat conducted to the metal plate 1a is efficiently dissipated by blowing air from the added cooling fan 6B to the metal plate 1a, the heat generating components 3A, 3B, 3C are removed from the original cooling fan 6A inside the housing 1. Even when it is arranged at a distant place or a place where it is difficult for the wind to hit, the heat generating components 3A, 3B, 3C can be reliably cooled.

  When the heat generation amount from the heat generating components 3A, 3B, 3C is not so large, only one cooling fan 6B is added, and when the heat generation amount from the heat generating components 3A, 3B, 3C is large, a plurality of cooling fans 6B are installed. If the number of cooling fans 6B to be added is appropriately determined in accordance with the heat generation status from the heat generating parts, such as adding, the heat generating parts 3A, 3B, 3C can be efficiently cooled without waste.

  Further, as in this embodiment, as the fan fixing shelf 8 that can be freely ventilated, a lattice-shaped fan fixing shelf having a rectangular opening or a fan fixing shelf formed by arranging a plurality of circular openings is used as a metal plate of the housing 1. If attached to the back side of 1a, the cooling fan 6B can be easily added using the square opening or the circular opening of the fan fixing shelf, and the cooling fan 6B supplies air to the metal plate 1a of the housing 1 Can be reliably cooled even if there is a large amount of heat generated from the heat generating components 3A, 3B, 3C.

  In this embodiment, the cooling fan 6B and the metal plate 1a of the housing 1 are opposed to each other, and the cooling fan 6B is configured to blow at right angles to the metal plate 1a. You may comprise so that the cooling fan 6B may be installed inclining and it may blow in the diagonal direction with respect to the metal plate 1a. When the air is blown obliquely in this way, the area where the wind hits the metal plate 1a is increased, so that there is an advantage that the cooling effect can be exhibited over a wider range.

DESCRIPTION OF SYMBOLS 1 Case 1a Metal plate of a case 2 Circuit board 3A, 3B, 3C Heat generating component 4 Thermal conductor (heat dissipation sheet)
5 Thermal conductor (metal wire)
6A Original cooling fan 6B Additional cooling fan 8 Ventable fan fixing shelf

Claims (3)

  At least one cooling fan that blows air toward the metal plate of the housing is arranged inside the device housing with a gap between the circuit board on which the heat generating components are mounted and the metal plate of the housing. A heat generating component cooling structure provided between a substrate and a metal plate of a housing, wherein the heat generating component and the metal plate of the housing are connected by a heat conductor.   The cooling structure according to claim 1, wherein the cooling fan is a cooling fan added separately from the original cooling fan installed in the housing.   The fan fixing shelf which can be freely ventilated is disposed between the circuit board and the metal plate of the housing and is attached to the metal plate of the housing, and the cooling fan is fixed to the fan fixing shelf. The cooling structure according to claim 1 or 2.

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