JP2008234346A - Electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic equipment in which dust of a heat sink can be easily removed. <P>SOLUTION: A portable computer includes a body casing; a CPU mounted in the body casing; a heat pipe thermally connected to the CPU; a first heat sink 60 thermally connected to the heat pipe; a fan unit 40; and a second heat sink 70. The first heat sink 60 includes a plurality of fins 61 aligned at predetermined intervals; and a box-shaped support member 63 for supporting the fins 61, including a ventilation port. The second heat sink 70 includes a fin-to-fin insert part 74 to be inserted between the fins 61. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to an electronic device, and more particularly to an electronic device including a cooling unit that cools a heating element such as a CPU.

  A heating element such as a CPU is incorporated in an electronic device such as a personal computer.

If the heating element generates excessive heat, the CPU performance cannot be fully exhibited, and cooling is necessary.

  As a means for cooling the heating element, for example, a heat receiving portion that receives heat from the heating element and a radiation fin are thermally connected by a heat pipe to transmit heat to the radiation fin side, and the radiation fin is forcibly air-cooled by a cooling fan. The method is known.

In Patent Document 1 (Japanese Patent Laid-Open No. 2005-321287), a plurality of heat dissipating fins are arranged side by side, and a heat dissipating means including a heat sink that conducts heat of the heat generating component through the electronic component material and the heat pipe, A cooling fan that blows air to the heat sink, and a cooling unit that includes an inclined portion on the end surface of the heat sink that is an inflow portion with respect to the air flow by the cooling fan, with the end portion of each radiating fin inclined in the same direction. It is disclosed.
JP 2005-321287 A

  In the cooling unit disclosed in Patent Document 1, dust hardly adheres to the heat sink.

However, since it is impossible to completely prevent the dust from adhering, the dust adheres with the passage of time. In this case, the technique of Patent Document 1 cannot reduce the trouble of removing the actually attached dust. Moreover, since the inclined part is formed on the end surface of the heat sink, the air permeability in the heat sink is deteriorated, and the cooling performance may be deteriorated.

  This invention is made | formed in view of the said situation, and it aims at providing the electronic device which can remove the dust of a heat sink efficiently.

  In order to achieve the above object, an electronic apparatus according to the present invention includes a housing, a heating element mounted in the housing, a heat pipe thermally connected to the heating element, and a thermal connection to the heat pipe. A first heat sink having a plurality of first fins aligned at a predetermined interval and a box-shaped support member that supports the fins and has ventilation holes; A fan unit that cools the heat sink, and a second heat sink that is provided between the first heat sink and the fan unit and has an inter-fin insertion portion that is inserted between the first fins. It is characterized by that.

  Another electronic device of the present invention includes a housing, a heating element mounted in the housing, a heat pipe thermally connected to the heating element, and a heat sink thermally connected to the heat pipe. A first heat sink having a plurality of first fins aligned at a predetermined interval, a box-shaped support member that supports the fins and has ventilation holes, and cools the first heat sink. And a fan unit provided between the first heat sink and the fan unit, and a second heat sink having an inter-fin insertion portion to be inserted between the first fins. Further, an opening is provided to allow the second heat sink in the housing to be taken out from the outside of the housing.

  It is possible to efficiently remove dust from the heat sink.

  Hereinafter, with reference to the drawings, an embodiment of an electronic device according to the present invention will be described by taking, for example, a case where it is applied to a portable computer which is one of electronic devices.

  FIG. 1 is a perspective view of a portable computer according to an embodiment of the present invention. The portable computer 1 includes a main body unit 2, a display unit 3, and a hinge mechanism 4.

  The main body 2 has a flat, substantially box-shaped main body housing 20. An operation unit such as a keyboard 21, a pointing device 22, and switches is provided on the upper surface 201 side of the main body housing 20.

  The main body 2 is provided with a printed circuit board (motherboard) 5 incorporating an operation unit such as the keyboard 21 and the pointing device 22 and a CPU 51 (see FIG. 2) for controlling the display device 31. The CPU 51 is an example of a heating element of the present invention. The main body 2 is mounted with a cooling unit 10 (see FIG. 2) for cooling the CPU 51.

  The display unit 3 includes a flat, substantially box-shaped display unit housing 30. The display unit housing 30 has an opening on one surface, and a display screen of a display device 31 such as an LCD provided in the display unit 3 is exposed from the opening.

  The hinge mechanism 4 is provided in the back of the keyboard 21 of the main body 2 so as to connect the main body 2 and the display 3. The hinge mechanism 4 is provided so that the display unit 3 is rotatable between a position where the display unit 3 covers the keyboard 21 provided in the main body unit 2 and an open position.

  Next, the cooling unit 10 will be described. FIG. 2 is a perspective view of the portable computer 1 as viewed from the lower surface 202 side of the main body 2. FIG. 2 is an enlarged view of a part of the main body 2, and the inside of the main body 2 is displayed with the lower surface 202 and part of the side surface 203 of the main body 2 not being displayed.

  As shown in FIG. 2, the main body 2 has a cooling unit 10 mainly for cooling the heat generated by the CPU 51 in addition to the printed circuit board 5 (not shown in FIG. 2). The cooling unit 10 is supported by the printed circuit board 5 or the main body housing 20.

  The cooling unit 10 includes a heat receiving portion 11, a heat pipe 12, a first heat sink 60, a fan unit 40, and a second heat sink 70.

  The heat receiving part 11 is a flat member having a high thermal conductivity such as copper or aluminum. The heat receiving unit 11 is thermally connected to the CPU 51 via a heat conducting member such as grease. The heat receiving unit 11 plays a role of receiving heat generated by the CPU 51 and transmitting the heat to the heat pipe 12.

  The heat pipe 12 has a rod-like shape having end portions 12a and 12b, and plays a role of transmitting the heat of the CPU 51 received by the heat receiving portion 11 from the end portion 12a to the end portion 12b. The heat pipe 12 is a hollow tube filled with water. The heat received at the end 12a turns into water vapor, which is carried to the end 12b and cooled again by cooling the end 12b. It will carry heat by circulating up to 12b.

  The first heat sink 60 has a plurality of fins 61 (see FIG. 3), as will be described later, and releases the heat received from the heat pipe 12 to the outside by securing a thermal diffusion area. The heat pipe 12 passes through the first heat sink 60. The first heat sink 60 is preferably a member having high thermal conductivity such as copper or aluminum. Details of the shape of the first heat sink 60 will be described later.

  The fan unit 40 includes a casing 43 having an intake hole 42 and an exhaust hole 41 (see FIG. 3), and a fan (not shown) mounted in the casing. The fan unit 40 exhausts air sucked from the intake holes 42 through the exhaust holes 41 as the fan rotates. The fins of the first heat sink 60 and the exhaust holes 41 of the fan unit 40 are provided at opposing positions, and the air (exhaust air) exhausted from the fan unit 40 is directed toward the first heat sink 60 (in FIG. 3). Arrow X) is blown to promote thermal diffusion of the first heat sink 60, and exhaust air is discharged to the outside through an exhaust hole 204a provided in the side surface 204 of the main body housing 20.

  As will be described later, the second heat sink 70 has a plurality of inter-fin insertion portions 74 (see FIG. 3). The inter-fin insertion portion serves to remove dust attached to the fins of the first heat sink 60 by moving the second heat sink 70 in the vertical direction with respect to the lower surface 202. The second heat sink 70 is provided close to the first heat sink 60 and the fan unit 40. Accordingly, the second heat sink 70 serves as a duct for reliably sending the exhaust air from the fan unit 40 to the first heat sink 60. The second heat sink 70 reinforces the action of the first heat sink 60 as a heat sink by receiving heat from the first heat sink 60. The second heat sink 70 is preferably a member having a high thermal conductivity such as copper or aluminum. However, as will be described later, when the second heat sink 70 does not have the fins 71, it may be made of plastic or the like. Details of the shape of the second heat sink 70 will be described later.

  Next, the structure of the first heat sink 60 and the second heat sink 70 will be described.

FIG. 3 is an exploded perspective view of the cooling unit 10. In FIG. 3, the heat receiving unit 11, the heat pipe 12, and the fan in the fan unit 40 are not illustrated for simplicity.

  As shown in FIG. 3, the first heat sink 60 includes a first fin group 62 composed of a plurality of plate-like fins 61, and a support member 63 that is a frame that supports the first fin group 62. It is composed of The support member 63 is a frame body surrounded by support plates 63a, 63b, 63c, and 63d. That is, the support member 63 has a substantially box-like shape that allows a pair of surfaces to open and ventilate.

  The support plate 63b and the support plate 63d have notches 63b1 and 63d1, respectively, on the second heat sink 70 side of the corners on the side where the support plate 63a is joined. The cutouts 63b1 and 63d1 are cut out so that the end portions of the plate 71a of the second heat sink 70 described later can be inserted.

  Each fin 61 is aligned in the longitudinal direction of the support plate 63a (or 63c) in parallel with the support plate 63b (or 63d). The fins 61 are spaced apart at a predetermined pitch (symbol P). By this alignment, a rectangular ventilation path is formed between the fins 61 so that the wind from the fan unit 40 can be ventilated in the arrow X direction. Further, the fin 61 has a notch having the same shape as the support member 63.

  The first heat sink 60 may be formed by integrally forming the first fin group 62 and the support member 63 instead of separate members. In addition, the first heat sink 60 is configured by a box-shaped support member 63 and a first fin group 62, and instead of a plate-shaped fin 61 and a support (not shown) provided at both ends of the fin 61. A U-shaped fin element having a U-shaped cross section with a plate may be laminated in the longitudinal direction so that a rectangular ventilation path is formed between the fins 61.

  On the other hand, the second heat sink 70 is a frame surrounded by plates 73a, 73b, 73c, 73d. That is, the second heat sink 70 has a substantially box-like shape that allows ventilation by opening a pair of surfaces.

  The length 73aL in the longitudinal direction of the plate 73a is the same as the length 63aL in the longitudinal direction of the support plate 63a. The end 73a1 of the plate 73a is inserted into the notches 63b1 and 63d1 of the support plate 63b and the support plate 63d and the notches of the fins 61. The plate 73b has the same length 73bL in the longitudinal direction as the length 63bL in the longitudinal direction of the support plate 63b (63d). However, the length 73bW in the short direction of the plate 73b is narrower than the length 73aW in the short direction of the plate 73a. The plate 73d is provided in the same shape as the plate 73b.

  The length in the longitudinal direction of the plate 73c is the same as the length 73aL in the longitudinal direction of the plate 73a. The length in the short direction of the plate 73c is the same as the length 73bW in the short direction of the plate 73b. However, the end portion 73c1 of the plate 73c is provided with a plurality of inter-fin insertion portions 74. When the length of this portion is included, it is wider than 73bW.

  The above-described length relationship is merely an example, and may be appropriately adjusted depending on the plate thickness of each member, the size of the clearance between components, and the like.

  FIG. 4 is a view of the first heat sink 60, the second heat sink 70, and the fan unit 40 as viewed from the support member 63b side. Also in FIG. 4, the heat receiving unit 11 and the heat pipe 12 are not illustrated, as in FIG. 3. As shown in FIG. 4, the height 40H of the casing of the fan unit 40 is slightly shorter than the length 73bL in the longitudinal direction of the plate 73b. As a result, the end 73 a 2 which is the end of the second heat sink 70 covers a part of the upper surface of the casing of the fan unit 40. Similarly, the length from the support plate 63c of the first heat sink 60 to the notch 63b1 is slightly shorter than 73bL. As a result, the end 73a1 is inserted into the notches 63b1 and 63d1 and the notches of the fins 61.

  With the above configuration, the fan unit 40, the second heat sink 70, and the first heat sink 60 can form a ventilation path with almost no gap. In other words, the second heat sink 70 plays a role as a duct, and the exhausted air from the fan unit 40 is guided to the first heat sink 60.

  FIG. 5 shows an application example of the second heat sink. Similar to the first heat sink 60, the second heat sink 70 shown in FIG. That is, as shown in FIG. 5, the second heat sink includes a second fin group 72 composed of a plurality of plate-like fins 71 and a support member that is a frame body that supports the second fin group 72. A second heat sink 70 ′ composed of 73 may be used. Here, it is preferable that the fin 72 is opposed to the fin 61 so that the ventilation direction is the same. Further, the inter-fin insertion portion 74 is preferably provided so as to be on the end portion 73c1 and between the fins 72. That is, it is preferable that the ventilation direction and the pitch between fins are the same.

  This is because the first heat sink 60 and the second heat sink 70 have substantially the same ventilation direction to reduce the ventilation resistance. Further, when the pitch Q of the second fins 71 of the second heat sink 70 is substantially the same as the pitch P of the fins 61 of the first heat sink 60, the air flow from the fan unit 40 to the first heat sink 60 is performed. This is because the resistance can be reduced.

  With the above configuration, the exhaust air from the fan unit 40 does not resist the passage of air in the X direction (see FIG. 3), and the inter-fin insertion portion 74 efficiently removes dust between the fins 61. Can be removed.

  FIG. 6 is a perspective view showing how the second heat sink is attached and detached. FIG. 6 is also an enlarged view of a part of the main body 2 as shown in FIG. 2, and the inside of the main body 2 is displayed with the lower surface 202 and the side surface 203 of the main body 2 hidden. . In FIG. 6, the second heat sink is a second heat sink 70 ′ having fins 71. However, since the attachment / detachment method is common to the second heat sink 70, both the second heat sink 70 and the second heat sink 70 'will be described as "second heat sink 70".

  For simplicity, the frame of the second heat sink 70 shows the same length in the short direction of each plate, and the inter-fin insertion portion 74 is omitted. Further, the notches 63b1 and 63d1 are omitted from the first heat sink 60 for the sake of simplicity.

  As shown in FIG. 6, the second heat sink 70 is disposed between the exhaust hole 41 of the fan unit 40 and the first heat sink 60 so as to be detachable in the direction of reference sign Z. Since the second heat sink 70 is detachable, the surface of the second fin group 72 is from the surface of the exhaust hole 41 of the fan unit 40 or the first fin group 62 of the first heat sink 60. For example, it is provided in a length separated by about 0.1 mm to 3 mm.

  The second heat sink 70 is disposed and fixed between the exhaust hole 41 of the fan unit 40 and the first fin group 62 of the first heat sink 60. As a method of fixing the second heat sink 70, it is conceivable to attach the second heat sink 70 to a part of the housing 2 using a double-sided tape (not shown). Further, the lid body and the main body housing are clamped by a clamping member (not shown) provided in a part of the main body housing 20, or the second heat sink 70 replacement (not shown) provided in the housing 2 is closed. It may be configured to be sandwiched between 20.

  Next, the operation of the portable computer 1 will be described. FIG. 7 is a diagram showing the operation of the portable computer 1. FIG. 7 is a view seen from the exhaust hole 204 a side of the main body housing 20 in FIG. 6, and shows the first heat sink 60 and the second heat sink 70.

FIG. 7 shows the first heat sink 60 by a solid line and the second heat sink 70 by a broken line.

Note that the fin 71 is not shown in the second heat sink in order to facilitate understanding of the function and effect of the inter-fin insertion portion 74.

  In FIG. 7, FIG. 7A shows a case where the second heat sink 70 is fixed to the main body housing 20. FIG. 7B illustrates a state in the middle of removing the second heat sink 70 from the first heat sink 60 in the Z direction. FIG. 7C shows a state where the second heat sink 70 is completely detached from the first heat sink 60.

  During operation of the portable computer 1, the second heat sink 70 is disposed between the exhaust hole 41 of the fan unit 40 and the first fin group 62 of the first heat sink 60 as shown in FIG. ing.

  When the portable computer 1 is operated, the CPU 51 of the printed circuit board 5 generates heat. The heat of the CPU 51 is received by the heat receiving unit 11. The heat received by the heat receiving unit 11 is transferred to the first fin group 62 of the first heat sink 60 through the heat pipe 12. Each fin 61 of the first fin group 62 diffuses the heat received from the heat pipe 12. Since the first heat sink 60 is provided facing the exhaust hole 204a of the main body housing 20, heat is released to the outside through the exhaust hole 204a.

  On the other hand, during the operation of the portable computer 1, the fan in the fan unit 40 is appropriately controlled to rotate. In order to cool the first fin group 62, the fan unit 40 is rotated and blown in the direction of the arrow X in FIG. That is, when the fan in the fan unit 40 rotates, wind is sent out from the exhaust hole 41. The air blown from the fan unit 40 is sent to the first fin group 62 of the first heat sink 60 via the second heat sink 70 disposed between the fan unit 40 and the first heat sink 60. Thereby, the heat diffusion of the fin 61 is further made efficient by the air blown from the fan unit 40. That is, the fin 61 is further cooled.

  Here, since the air blown from the fan unit 40 includes dust, the dust adheres to the first heat sink 60.

  In this case, as shown in FIG. 7B, the second heat sink 70 is moved vertically upward (Z1 direction), and the first heat sink 60, the fan unit 40, and the like are brought into the state shown in FIG. Remove completely from between. At this time, the inter-fin insertion portion 74 inserted between the fins 61 moves from the lower part to the upper part of the fins 61. By the movement of the inter-fin insertion portion 74, dust attached to the fin 61 is removed and can be removed by the inter-fin insertion portion 74. Generally, more dust on the fins 61 adheres to the fan unit 40 side than to the exhaust hole 204a side. Therefore, most of the dust on the first heat sink 60 can be efficiently removed by the inter-fin insertion portion 74.

  Here, the reason why the inter-fin insertion portion 74 is provided not on the first heat sink 60 but on the second heat sink 70 so that the second heat sink 70 can be attached and detached is as follows. That is, unlike the first heat sink 60, the removed second heat sink 70 has a simple fin structure to which the heat pipe 12 is not connected. Therefore, the attached dust can be easily removed by washing with water or air blowing. Because you can.

  That is, when the fins 71 are not provided on the second heat sink 70, the dust attached to the first heat sink 60 by the inter-fin insertion portion 74 can be removed by movement in the Z1 direction. Further, in the case where the fin 71 is provided on the second heat sink 70, not only can the inter-fin insertion portion 74 remove dust attached to the first heat sink 60, but the removed second heat sink 70 can be washed with water. The dust adhering to the second heat sink 70 itself can be easily removed by air blow.

  When the fins 71 are also provided on the second heat sink 70, more dust is generally attached to the second heat sink 70 near the exhaust hole 41 of the fan unit 40. In the second heat sink 70, the air guide surface on the fan unit 40 side of the second fin group 72 is slightly separated from the exhaust hole 41 of the fan unit 40 in order to secure a space for inserting and removing the second heat sink 70. Yes. For this reason, dust tends to adhere to the air guide surface on the fan unit 40 side of the second fin group 72 of the second heat sink 70.

  FIG. 8 shows an application example for efficiently attaching and detaching the second heat sink 70. In order to facilitate attachment / detachment of the second heat sink 70 described above, an opening 202A from which the second heat sink 70 can be taken out may be provided in the main body housing 20 as shown in FIG.

  The opening 202A includes a rectangular hole 202D and a lid support 202B that surrounds the hole 202D and is recessed from the surface of the lower surface 202. The lid support portion 202B has an insertion hole 202C through which a screw can be inserted. A lid 202E can be fitted into the lid support 202B of the opening 202A. The lid 202E is provided with an insertion hole 202F through which a screw can be inserted. The lid 202E and the lid support portion 202B of the opening 202A can be fixed by inserting a screw (not shown) through the insertion hole 202F and the insertion hole 202C.

  If the main body 2 is provided with the opening 202A from which the second heat sink 70 can be taken out, the second heat sink 70 can be taken out easily and the size of the opening 202A leading to a decrease in strength of the main body 2 can be obtained. This is preferable because it can be minimized.

  In other words, in an electronic device in which a conventional cooling unit including an electronic component that does not have the second heat sink 70, a heat pipe, a cooling fan, and a first heat sink is built in, the case is used for removing dust from the first heat sink. If the opening is provided, the opening is large and the strength of the housing may be greatly reduced. On the other hand, since the opening 202A of the main body 2 of the portable computer 1 may be a small opening from which the second heat sink 70 can be taken out, a decrease in strength of the main body 2 can be minimized.

  In order to facilitate the insertion / removal of the second heat sink 70 to / from the main body 2, for example, a configuration in which a handle (not shown) for insertion / removal is attached to the plate 73 a may be adopted. Further, the cooling unit 10 may be removed from the upper surface 201 side of the main body housing 20.

1 is a perspective view of a portable computer according to an embodiment of the present invention. The perspective view which looked at the portable computer 1 from the lower surface 202 side of the main-body part 2. FIG. FIG. 3 is a developed perspective view of the cooling unit 10. The figure which looked at the 1st heat sink 60 from the support member 63b side. An application example of the second heat sink 70. The perspective view which showed the mode of attachment or detachment of the 2nd heat sink. The figure which showed the effect | action of the portable computer 1. FIG. An application example for efficiently attaching and detaching the second heat sink 70.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Portable computer 10 Cooling unit 11 Heat receiving part 12 Heat pipe 2 Main body part 20 Main body part housing | casing 201 Upper surface 202 Lower surface 203 Side surface 204 Side surface 204a Exhaust hole 21 Keyboard 22 Pointing device 3 Display part 30 Display part housing | casing 31 Display device 4 Hinge mechanism 40 Fan unit 41 Exhaust hole 42 Intake hole 43 Casing 5 Printed circuit board 51 CPU
60 first heat sink 61 fin 62 first fin group 63 support member 63a support plate 63a
63b1, 63d1 Notches 70, 70 ′ Second heat sink 73a Plate 73a
74 Inter-fin insertion portion 202A Opening portion 202B Lid support portion 202C Insertion hole 202D Hole 202E Lid 202F Lid insertion hole

Claims (4)

A housing,
A heating element mounted in the housing;
A heat pipe thermally connected to the heating element;
A heat sink thermally connected to the heat pipe, the heat sink having a plurality of first fins arranged at a predetermined interval, and a box-shaped support member having a ventilation hole supporting the fins. Heat sink
A fan unit for cooling the first heat sink;
An electronic apparatus comprising: a second heat sink provided between the first heat sink and the fan unit and having an inter-fin insertion portion inserted between the first fins. 2. The electron according to claim 1, wherein a plurality of the inter-fin insertion portions 74 are provided in alignment, and the alignment interval is the same as the alignment interval of the first fins of the first heat sink. machine. The electronic device according to claim 1, wherein the second heat sink has a plurality of second fins arranged so that a ventilation direction substantially coincides with the first heat sink. A housing,
A heating element mounted in the housing;
A heat pipe thermally connected to the heating element;
A heat sink thermally connected to the heat pipe, the heat sink having a plurality of first fins arranged at a predetermined interval, and a box-shaped support member having a ventilation hole supporting the fins. Heat sink
A fan unit for cooling the first heat sink;
A second heat sink provided between the first heat sink and the fan unit and having an inter-fin insertion portion inserted between the first fins;
An electronic device, wherein the housing is provided with an opening through which the second heat sink in the housing can be taken out from the outside of the housing.

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