JP2008191975A - Information equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide information equipment for efficiently cooling electronic components without substantially warming electronic components whose heat generation is low by the heat of electronic components whose heat generation is high. <P>SOLUTION: An upper portion chassis 7 made of metal is disposed in a front case 5 of an equipment main body 1, a circuit substrate 10 with many electronic components 15 mounted thereon is attached on the chassis 7, a radiating member 11, made of metal with high heat conductivity, surrounding and covering the substrate 10, is attached on the chassis 7, and a blowing air fan 9 is attached at a bowing air opening 32 disposed at a rear case 6 of the main body 1. Accordingly, a radiating member 11 absorbs the heat generated from the components 15 on the substrate 10 to radiate the heat outside the member 11, and cools the outer surface of the member 11 by open air blown from the fan 9. Thereby, the fan 9 does not flow the heat of electronic components 15a-15f whose heat generation is high into the member 11, hardly warms the electronic components whose heat generation is low, and efficiently cools the components 15. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an information device for processing information such as a personal computer and a workstation, and more particularly to an information device having a cooling function for cooling the inside of the device body.

2. Description of the Related Art Conventionally, in information devices such as personal computers, as described in Patent Document 1, heat sinks that are heat dissipation members are provided on both front and back sides of a circuit board that is a motherboard, and the surface of the circuit board between the heat sinks. A blower fan is provided on the heat sink that faces the component mounting surface side where the electronic component is mounted. The heat of the electronic component mounted on the circuit board is dissipated by the heat sink, and air is sent between the heat sinks by the blower fan. There is one configured to cool an electronic component mounted on the.
JP 2004-246896 A

  In such a conventional information device, not all of the various electronic components mounted on the circuit board are highly exothermic, but only a plurality of electronic components that are part of them are highly exothermic. For this reason, if the air is sent between the heat sinks with the blower fan, the heat of the highly heated electronic component is sent to the low heat generated electronic component by the blower fan, There is a problem that an electronic component with low heat generation is heated.

  The problem to be solved by the present invention is to provide an information device capable of efficiently cooling an electronic component without substantially heating the electronic component with low heat generation by heat of the electronic component with high heat generation.

In order to solve the above problems, the present invention includes the following components.
According to the first aspect of the present invention, there is provided a device main body including a front case and a rear case, a metal chassis provided in the front case of the device main body, and various electronic components attached to the chassis. A large number of circuit boards mounted on the chassis, a metal heat dissipating member with high thermal conductivity that covers and surrounds the circuit board, and a ventilation opening provided in the rear case of the device body And an air blower that sends outside air to the outer surface of the heat radiating member.

  The invention according to claim 2 is the information device according to claim 1, wherein a large number of heat dissipating fins are provided on the outer surface of the heat dissipating member.

  The invention according to claim 3 is the information equipment according to claim 1 or 2, wherein the blower fan rotates at a low speed.

  According to a fourth aspect of the present invention, the heat dissipating member is provided with a plurality of heat dissipating protrusions that are in thermal contact with a plurality of electronic components having high heat generation among the many electronic components mounted on the circuit board. The information device according to claim 1, wherein the information device is an information device.

  The invention according to claim 5 is the information device according to claim 4, wherein the plurality of heat dissipating protrusions are each provided with a hollowed portion opened on an outer surface of the heat dissipating member. .

  According to a sixth aspect of the present invention, a heat conducting member having higher thermal conductivity than the heat radiating member is provided between the plurality of heat radiating protrusions and the plurality of electronic components corresponding thereto. The information device according to claim 4, wherein the information device is an information device.

  According to a seventh aspect of the present invention, in the plurality of electronic parts having a high heat generation, the heat radiation protrusion corresponding to the electronic part having the highest heat generation has a plurality of locations in the peripheral portion thereof by a screw member for adjusting the chassis. The information device according to claim 4, wherein the information device is attached to the chassis by adjusting a pressing force with respect to the electronic component by tightening to the chassis.

  According to an eighth aspect of the present invention, a high electronic component group that stands up with respect to the circuit board among the plurality of electronic components having high heat generation is provided at a predetermined position of the circuit board. 8. The member is provided with an outside air introduction opening for introducing outside air from the blower fan to the inside of the heat radiating member, corresponding to the high electronic component group. The information device according to any one of the above.

  The invention according to claim 9 is characterized in that a component partition portion surrounding the high electronic component group is provided at a peripheral portion of the outside air introduction opening of the heat radiating member. 8. The information device according to 8.

  The invention according to claim 10 is the information device according to claim 8 or 9, wherein a metal dustproof filter is provided in the outside air introduction opening of the heat radiating member.

  According to an eleventh aspect of the present invention, a memory mounting portion to which a memory board is detachably attached is provided at a location corresponding to the blower fan in the circuit board, and the memory board is inserted into the heat dissipation member. The information device according to claim 1, wherein a board replacement hole is provided in correspondence with the memory mounting portion.

  The invention according to claim 12 is the information device according to claim 11, wherein a dustproof lid is detachably attached to the substrate exchange hole of the heat radiating member.

  The invention according to claim 13 is the information device according to claim 12, wherein the dustproof lid is a metal plate or a metal dustproof filter having high thermal conductivity.

  According to a fourteenth aspect of the present invention, in the device main body, there is provided a main body partitioning portion that is attached to the chassis and is located below the heat dissipation member that covers the circuit board and partitions the upper and lower regions. The information device according to claim 1, wherein the information device is an information device.

  According to the present invention, when a large number of electronic components mounted on the circuit board generate heat, the heat is absorbed by the heat radiating member and radiated to the outside of the heat radiating member, and the heat is radiated by the outside air sent into the device body by the blower fan. The outer surface of the member can be cooled. As a result, the heat of the electronic component with high heat generation does not flow inside the heat dissipation member by the blower fan, so the electronic component with low heat generation is hardly heated by the heat of the electronic component with high heat generation, and the electronic component is efficiently Can be cooled. Also, the metal chassis and the metal heat dissipating member can prevent a large number of electronic components mounted on the circuit board from being disturbed by electromagnetic waves, and thus the electronic components can be well protected. .

Hereinafter, an embodiment of an information device to which the present invention is applied will be described with reference to FIGS.
As shown in FIG. 1, the information device includes a vertically long device main body 1, a display member 2 attached to the front surface of the device main body 1 (left front side surface in FIG. 1) so as to be vertically movable, and the display A display unit 3 incorporated in the member 2 for displaying information and a keyboard (none of which is shown) electrically connected to the device main body 1 by a connection cable are provided. The entire apparatus is operated and information is input, and the input information and information such as the processing result are displayed on the display unit 3 of the display member 2.

  As shown in FIG. 1, the display member 2 is formed in a rectangular box shape with a small thickness, and the display unit 3 is disposed therein, and the display unit 3 is disposed on the front surface (front surface in FIG. 1) of the display member 2. It is configured to be exposed from the provided display opening 2a to the front side, so that information displayed on the display unit 3 can be seen from the front side through the display opening 2a. In this case, the display unit 3 is a flat display panel such as a liquid crystal display panel or an EL (electroluminescence) display panel, and is configured to display information electro-optically. Further, at the edge of the display opening 2a on the front surface of the display member 2, operation units such as a power switch 2b and a fingerprint authentication detection unit 2c are provided.

  As shown in FIGS. 1 to 3, the device body 1 includes a front case 5 and a rear case 6. The front case 5 is made of synthetic resin, and as shown in FIGS. 1 to 4, the upper side is formed with a steep slope that is almost vertical, and the lower side is formed with a gentle slope with a front-down (lower left in FIG. 1). The intermediate portion is formed in a curved shape. The rear case 6 is also made of synthetic resin, and as shown in FIGS. 2 and 3, the front side (left side in FIG. 2) is formed in the same shape as the front case 5, and the rear side (right side in FIG. 2) is It is formed so as to be substantially vertical in a state of protruding rearward, and the blower fan 9 is attached to the back surface. Thereby, as shown in FIGS. 1 to 3, the device main body 1 is formed in a stable vertically long and substantially box shape with a wide depth on the bottom side and a narrow depth on the top side.

  As shown in FIGS. 2 to 4, an upper chassis 7 and a lower chassis 8 are provided on the inner surface of the front case 5 in the device main body 1. The upper chassis 7 is made of a metal plate, and is attached substantially vertically from the upper part to the middle part of the inner surface of the front case 5 as shown in FIGS. A circuit board 10 is attached to the back surface (right side surface in FIG. 2) of the upper chassis 7, and a heat radiating member 11 is attached to cover the circuit board 10. In this state, the upper chassis 7 is configured to be covered with the rear case 6 attached to the back side of the front case 5 together with the circuit board 10 and the heat radiating member 11.

  The lower chassis 8 is made of a metal plate, and is attached so as to protrude substantially horizontally from the lower part of the inner surface of the front case 5 toward the back side (right side in FIG. 2), as shown in FIGS. Yes. As shown in FIGS. 2 to 4, an HDD (hard disk driver) 12, a DVD (digital versatile disk) driver 13, and a power supply unit 14 are located on the lower chassis 8 below the upper chassis 7. Is provided. The lower chassis 8 is also configured to be covered with the rear case 6 attached to the rear side of the front case 5 together with the HDD 12, the DVD driver 13, and the power supply unit 14.

  The circuit board 10 is a mother board, on which a large number of various electronic components 15 necessary for information processing are mounted, as shown in FIGS. As shown in FIG. 5, the electronic component 15 includes, for example, a CPU (central processing unit) 15a, a video semiconductor chip 15b, an interface semiconductor chip 15c, a LAN control controller 15d, and a display control semiconductor chip. Various components such as 15e, a coil group 15f, a capacitor group 15g, and a plurality of memory boards 15h are provided on the back surface (right side surface in FIG. 2) of the circuit board 10.

  In this case, the CPU 15a is a flat plate-like semiconductor component that generates the highest heat, and is provided in the middle portion on the right side of the back surface (front surface in FIG. 5) of the circuit board 10, as shown in FIG. The video semiconductor chip 15b is a flat plate-like component that generates less heat than the CPU 15a, and is provided at a substantially central portion on the back surface of the circuit board 10 sufficiently away from the CPU 15a. The interface semiconductor chip 15c is a flat plate-like component that generates less heat than the CPU 15a, similar to the video semiconductor chip 15b. The interface semiconductor chip 15c is provided a little on the left side of the video semiconductor chip 15b on the back surface of the circuit board 10. It has been.

  The LAN control controller 15d is a flat plate-like component that generates less heat than the CPU 15a, like the video semiconductor chip 15b, and is provided on the lower left side of the back surface of the circuit board 10. The display control semiconductor chip 15e is a flat plate-like component that generates less heat than the CPU 15a, like the video semiconductor chip 15b, and is provided above the video semiconductor chip 15b on the back surface of the circuit board 10. . The coil group 15 f is a plurality of coil components that generate less heat than the CPU 15 a, as with the video semiconductor chip 15 b, and is provided side by side in the middle portion on the upper side of the back surface of the circuit board 10.

  The capacitor group 15g, like the image semiconductor chip 15b, is a plurality of electrolytic capacitors that generate less heat than the CPU 15a, etc., and a plurality of high-electrons that are attached to the circuit board 10 in a columnar or box-like state. It is a component and is provided in a state of being arranged vertically and horizontally in the upper right corner on the back surface of the circuit board 10. The plurality of memory boards 15h are components with low heat generation in which a plurality of memory chips are mounted on the board. The plurality of memory boards 15h are detachably inserted into and attached to the memory attachment portion 16 provided on the lower right side of the back surface of the circuit board 10. It is configured as follows.

  Incidentally, the heat dissipating member 11 covering the circuit board 10 is a heat sink made of a metal having high thermal conductivity such as aluminum, copper, or an alloy thereof, and as shown in FIGS. The left side surface is formed in a substantially box shape, and thus covers the back side (left side in FIG. 6) of the circuit board 10 on which a large number of electronic components 15 are mounted and the periphery of the circuit board 10 on the upper chassis 7. It is configured to be attached. On the outer surface of the heat radiating member 11 (the left side surface in FIG. 6), a large number of heat radiating fins 17 for increasing the heat radiating area are formed so as to protrude outward with a predetermined distance in the vertical direction.

  Further, on the inner surface (the left side surface in FIG. 7) of the heat radiating member 11, as shown in FIGS. 7 and 9, among the many electronic components 15 mounted on the circuit board 10, a plurality of electronic components having high heat generation. 15, for example, CPU 15a, semiconductor chip 15b for video, semiconductor chip 15c for interface, controller 15d for LAN control, semiconductor chip 15e for display control, and heat radiation protrusions 18a to 18f corresponding to the coil group 15f, respectively, It is integrally formed in a state protruding toward the substrate 10.

  Among these heat radiation protrusions 18a to 18f, the heat radiation protrusion 18a corresponding to the CPU 15a having the highest heat generation is substantially a mortar having a larger outer shape than the other heat radiation protrusions 18b to 18f, as shown in FIGS. It is formed in a shape, and its front end surface is configured to be in thermal contact with the surface of the CPU 15 a via the heat conductive sheet 20. In this case, the thermal contact is a state in which the heat of the CPU 15a is transmitted to the heat radiating protrusion 18a, and the heat radiating protrusion 18a may be in direct contact with the CPU 15a, but is in contact via the heat conductive sheet 20. It is desirable.

  The heat conductive sheet 20 is a thin sheet made of carbon graphite having a higher thermal conductivity than the heat radiating member 11, and is attached to the front end surface of the heat radiating protrusion 18a as shown in FIGS. The heat generated by the high CPU 15a is reliably transmitted to the heat radiating protrusion 18a. Further, as shown in FIG. 7, the heat dissipating protrusion 18 a is formed in a substantially mortar shape, and as shown in FIG. 10, a hollow recess 21 is formed therein. The cut-out recess 21 is for increasing the heat dissipation efficiency of the heat dissipation protrusion 18a, and is open to the outer surface (lower surface in FIG. 10) of the heat dissipation member 11. Further, in the hollowed recess 21, a heat radiating fin 21 a is provided.

  Further, as shown in FIGS. 7, 9, and 10, the heat dissipating protrusion 18 a has a substantially cylindrical screw mounting portion 22 at a plurality of places, for example, four places in the peripheral portion thereof, from the inner surface of the heat dissipating member 11 to the circuit board. 10, the adjusting screw 23 is inserted into the screw mounting portion 22 and screwed into the upper chassis 7. By tightening the adjusting screw 23 in this state, the pressing force against the CPU 15 a is adjusted. It is configured to be attached to the upper chassis 7 with the front end surface of the heat radiating protrusion 18a pressed against the surface of the CPU 15a in an optimal state via the heat conductive sheet 20.

  Of the heat dissipation protrusions 18a to 18f, the heat dissipation protrusions 18b to 18f excluding the heat dissipation protrusion 18a corresponding to the CPU 15a, that is, among the plurality of electronic components 15 with high heat generation, for example, a semiconductor chip 15b for video. As shown in FIGS. 7 and 9, the semiconductor chip 15c for interface, the controller 15d for LAN control, the semiconductor chip 15e for display control, and the heat radiating protrusions 18b to 18f corresponding to the coil group 15f are almost as shown in FIGS. Like the heat dissipation protrusion 18a corresponding to the CPU 15a, each tip end surface is formed in a rectangular tube shape, and is configured to be in thermal contact with each of the electronic components 15b to 15f via the heat conductive sheet 24.

  Also in this case, as shown in FIGS. 7 and 10, the cutout recesses 25 are respectively formed in the heat dissipation protrusions 18 b to 18 f. The hollow recess 25 is also for increasing the heat dissipation efficiency of the heat dissipation protrusions 18b to 18f, and is open to the outer surface (lower surface in FIG. 10) of the heat dissipation member 11. Further, the heat conductive sheet 24 is a sheet having higher heat conductivity than the heat radiating member 11 and having elasticity, for example, a sheet having high heat conductivity in which a heat conductive material is mixed in an elastic base such as silicone. The heat radiation projections 18b to 18f are attached to the respective front end surfaces, elastically contacted with the respective electronic components 15b to 15f, and the heat of the electronic components 15b to 15f is transmitted to the heat radiation projections 18b to 18f in this state. Has been.

  6 to 9, the heat radiating member 11 has a capacitor group that is an electronic component group having a high height among the many electronic components 15 in which the outside air introduction opening 26 is mounted on the circuit board 10. It is provided corresponding to 15g. That is, as shown in FIG. 3 and FIG. 6, the outside air introduction opening 26 is provided at the upper right corner of the heat radiating member 11 in the region corresponding to the blower fan 9, 11 is configured to cool only the capacitor group 15g having a high height.

  As shown in FIGS. 8 and 9, a metal dustproof filter 27 through which the outside air passes is attached to the outside air introduction opening 26. Further, as shown in FIG. 6 and FIG. 7, a component partitioning portion 28 surrounding the periphery of the capacitor group 15 g having a high height is provided on the circuit board 10 from the inner surface of the heat radiating member 11. It is provided so as to protrude. The component partitioning portion 28 is configured to prevent outside air introduced from the outside air introduction opening 26 from flowing into a region other than the capacitor group 15g.

  Furthermore, as shown in FIGS. 6 to 9, the heat radiating member 11 is provided with a board replacement hole 30 corresponding to the memory mounting portion 16 of the circuit board 10. As shown in FIG. 12, the board replacement hole 30 is an opening through which the memory board 15 h is inserted when the memory board 15 h attached to the memory attachment part 16 is exchanged, and a blower fan attached to the rear case 6. 9 is provided at a predetermined location of the heat dissipating member 11 in a region corresponding to 9. Further, a dust cover 31 is detachably attached to the substrate replacement hole 30. The dust-proof lid 31 is a metal plate such as a metal having high thermal conductivity, such as aluminum, copper, or iron, and is detachably attached to the heat radiating member 11 with a screw or the like in a state where the substrate replacement hole 30 is closed.

  By the way, on the back surface (right side surface in FIG. 2) of the rear case 6 of the device body 1, as shown in FIGS. 2 and 3, the air blowing opening 32 has the heat radiation protrusions 18a, 18b, 18e of the heat radiation member 11, and the outside air. It is provided corresponding to the introduction opening 26 and the substrate exchange hole 30. The blower fan 9 is detachably attached to the blower opening 32 with screws or the like. The blower fan 9 is a low-speed fan that rotates slowly, slowly sends outside air into the rear case 6 to cool the outer surface of the heat radiating member 11, and from the outside air introduction opening 26 of the heat radiating member 11. It is configured to send outside air to the inside.

  In this case, as shown in FIG. 11, a plurality of discharge ports 34 for discharging the internal air to the outside are provided on both side surfaces of the rear case 6. Each of the plurality of discharge ports 34 is formed by forming a large number of slit-like elongated holes at predetermined intervals. Further, on the inner surface of the rear case 6, as shown in FIG. 11, an area having a circuit board 10 and a heat radiating member 11 attached to the upper chassis 7, an HDD 12 attached to the lower chassis 8, a DVD driver 13, A main body partitioning portion 35 is provided between the upper chassis 7 and the lower chassis 8 so as to partition the region having the power supply unit 14 vertically.

  According to such an information device, the device main body 1 including the front case 5 and the rear case 6, the metal upper chassis 7 provided in the front case 5 of the device main body 1, and the upper chassis 7 A circuit board 10 having a large number of electronic components 15 mounted thereon, a metal heat dissipating member 11 having a high thermal conductivity that is attached to the upper chassis 7 and covers the periphery of the circuit board 10, and a rear case of the device body 1 6 is provided with the blower fan 9 that is attached to the blower opening 32 provided in the airflow path 6 and sends outside air to the outer surface of the heat dissipation member 11, so that the heat generated from the electronic component 15 of the circuit board 10 can be efficiently radiated. it can.

  That is, when a large number of electronic components 15 mounted on the circuit board 10 generate heat, the heat is absorbed by the heat radiating member 11 and radiated to the outside of the heat radiating member 11, and the outside air sent into the device main body 1 by the blower fan 9. Thus, the outer surface of the heat dissipation member 11 can be cooled. As a result, heat generated by the electronic component 15 with high heat generation, for example, the CPU 15a, the image semiconductor chip 15b, the interface semiconductor chip 15c, the LAN control controller 15d, the display control semiconductor chip 15e, and the coil group 15f is generated. Since the blower fan 9 does not flow inside the heat dissipation member 11, the heat of the electronic component 15 with high heat generation hardly heats the electronic component 15 with low heat generation, and the electronic component 15 can be efficiently cooled. .

  In this case, the circuit board 10 on which a large number of electronic components 15 are mounted is surrounded by the metal upper chassis 7 and the metal heat dissipation member 11. It is possible to prevent the component 15 from being damaged by electromagnetic waves, and thus the electronic component 15 can be well protected. In addition, since a large number of heat dissipating fins 17 are provided on the outer surface of the heat dissipating member 11, the heat dissipating area on the outer surface of the heat dissipating member 11 can be greatly increased, thereby increasing the heat dissipating efficiency of the heat dissipating member 11. be able to. In addition, since the heat dissipation efficiency of the heat radiating member 11 is high, the blower fan 9 can use a low-speed type that rotates slowly, so that there is little noise and vibration, low power consumption, and energy saving.

  In addition, among the many electronic components 15 mounted on the circuit board 10, the heat radiating member 11 includes a plurality of electronic components having high heat generation, such as a CPU 15a, a video semiconductor chip 15b, an interface semiconductor chip 15c, and a LAN control. The controller 15d for display, the semiconductor chip 15e for display control, and the coil group 15f are provided with a plurality of heat-dissipating protrusions 18a to 18f that are in thermal contact with each other through the heat conductive sheets 20 and 24, respectively. The heat generated by the plurality of electronic components 15a to 15f can be reliably transmitted to and absorbed by the plurality of heat dissipation protrusions 18a to 18f, and the plurality of electronic components 15a to 15f can be absorbed through the plurality of heat dissipation protrusions 18a to 18f. The heat generated by 15f can be efficiently radiated to the outside of the heat radiating member 11.

  In this case, since the heat conductive sheets 20 and 24 provided between the plurality of heat dissipation protrusions 18a to 18f and the plurality of electronic components 15a to 15f corresponding thereto have higher heat conductivity than the heat dissipation member 11, The heat generated by the plurality of electronic components 15a to 15f having high heat generation can be promptly transmitted to the heat radiating protrusions 18a to 18f so as not to leak to the surroundings. Moreover, since the hollow portions 21 and 25 opened on the outer surface of the heat radiating member 11 are respectively provided in the plurality of heat radiating protrusions 18a to 18f, the heat generated by the plurality of electronic components 15a to 15f having high heat generation is generated. When the heat is transmitted to the heat radiating protrusions 18a to 18f, the heat can be efficiently and reliably radiated to the outside of the heat radiating member 11 by the hollows 21 and 25.

  In particular, among the plurality of electronic components 15a to 15f having high heat generation, the heat radiation protrusion 18a corresponding to the electronic component having the highest heat generation, that is, the CPU 15a has a larger outer shape than the other heat radiation protrusions 18b to 18f. Since a plurality of locations in the peripheral portion are fastened to the upper chassis 7 by the adjustment screw 23, the radiating protrusion 18a is attached to the CPU 15a because the pressing force against the CPU 15a is adjusted to the upper chassis 7 with the adjustment screw 23 adjusted. The heat conduction sheet 20 can be pressed in an optimum state, and the heat generated by the CPU 15a having the highest heat generation can be more reliably transmitted to the heat radiation protrusion 18a, thereby further improving the heat radiation efficiency. be able to. In this case, since the radiation fins 21a are provided in the hollowed recess 21, the radiation efficiency can be improved by the radiation fins 21a.

  Further, among the plurality of electronic components 15a to 15g having high heat generation, a high electronic component group standing up with respect to the circuit substrate 10, that is, a capacitor group 15g, is provided at a predetermined portion of the circuit board 10, and a heat dissipation member 11, the outside air introduction opening 26 for introducing the outside air from the blower fan 9 into the heat radiating member 11 is provided corresponding to the capacitor group 15g having a high height. By taking outside air into the heat radiating member 11 from the outside air introduction opening 26, only the high capacitor group 15g that stands up with respect to the circuit board 10 can be satisfactorily cooled.

  In this case, since the component partitioning portion 28 surrounding the high-capacity capacitor group 15g is provided at the peripheral edge of the outside air introduction opening 26, the capacitor group 15g is cooled by the outside air sent by the blower fan 9. Even so, the heat can be prevented from flowing to a region other than the capacitor group 15g, and thus the electronic components 15 other than the capacitor group 15g can be prevented from being warmed. Further, since the outside air introduction opening 26 is provided with a metal dustproof filter 27, the dustproof filter 27 can prevent the dust from being sent into the condenser group 15 g and introduces the outside air into the heat radiating member 11. Even if the opening 26 is provided, since the dustproof filter 27 is made of metal, the capacitor group 15g can be well protected so that the capacitor group 15g is not damaged by electromagnetic waves.

  In addition, a memory attachment portion 16 to which the memory board 15h is detachably attached is provided at a position corresponding to the blower fan 9 in the circuit board 10, and the heat radiating member 11 has a board exchange hole through which the memory board 15h is inserted. 30 is provided corresponding to the memory mounting portion 16, and when replacing the memory board 15h, if the blower fan 9 is removed from the rear case 6 of the device body 1, as shown in FIG. Since the hole 30 can be exposed to the outside, the memory substrate 15h can be easily and easily replaced through the substrate replacement hole 30 without removing the rear case 6 and the heat dissipation member 11.

  In this case, since the dustproof lid 31 is detachably attached to the substrate replacement hole 30 of the heat radiating member 11, the dustproof lid 31 can prevent dust from entering the heat radiating member 11. In addition, since the dust-proof lid 31 is a metal plate having high thermal conductivity, even if the substrate replacement hole 30 is closed with the dust-proof lid 31, a heat dissipation effect can be ensured, and the heat dissipation member 11 can have the substrate replacement hole 30. Even if the dustproof cover 31 is a metal plate, the memory substrate 15h can be satisfactorily protected so that the memory substrate 15h is not damaged by electromagnetic waves.

  Further, in the device main body 1, an area having the circuit board 10 and the heat radiating member 11 attached to the upper chassis 7, and an area having the HDD 12, the DVD driver 13, and the power supply unit 14 attached to the lower chassis 8. Since the main body partitioning portion 35 for partitioning up and down is provided between the upper chassis 7 and the lower chassis 8, it is possible to prevent the heat on the upper chassis 7 side from being transmitted to the lower chassis 8 side. Thus, the heat generated in the circuit board 10 and the heat radiating member 11 attached to the upper chassis 7 and the heat generated in the HDD 12, the DVD driver 13 and the power supply unit 14 attached to the lower chassis 8 are bad for each other. Can be reliably prevented.

  In the above-described embodiment, the case where the dustproof lid 31 made of a metal plate is detachably attached to the board replacement hole 30 provided in the heat radiating member 11 is described. However, the present invention is not limited thereto, and for example, the dustproof lid 31 is made of metal. A dustproof filter may be used. Even if configured in this manner, the dust-proof filter can prevent dust from entering the heat-radiating member 11 as in the above-described embodiment, and even if the dust-proof filter 31 is attached to the board replacement hole 30, the heat-dissipation effect can be obtained. Can be secured, and the memory substrate 15h can be satisfactorily protected by a metal dustproof filter so that the memory substrate 15h is not damaged by electromagnetic waves.

It is the perspective view which showed one Embodiment of the information equipment to which this invention is applied. It is the disassembled perspective view which looked at the apparatus main body of the information apparatus of FIG. 1 diagonally from the back side. FIG. 3 is an exploded perspective view showing the apparatus main body of FIG. It is the perspective view which showed the front case side in FIG. It is the front view which showed the back side of the circuit board of FIG. It is the disassembled perspective view which showed the circuit board and heat radiating member in FIG. FIG. 7 is an exploded perspective view in which the circuit board and the heat dissipation member are reversed left and right in FIG. 6. It is the perspective view of the heat radiating member which showed the state which attached the dustproof filter and the dustproof cover to the external air introduction opening part and board | substrate exchange hole of the heat radiating member of FIG. It is the front view which showed the inner surface side of the heat radiating member of FIG. It is an expanded sectional view of the principal part in the AA arrow of FIG. It is the perspective view which looked at the rear case of FIG. 2 from the front side. FIG. 4 is a perspective view showing a state in which the device main body is assembled and the memory board is replaced in FIG. 3.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Apparatus main body 5 Front case 6 Rear case 7 Upper chassis 8 Lower chassis 9 Blower fan 10 Circuit board 11 Heat radiation member 15 Electronic component 15a CPU (central processing unit)
15b Semiconductor chip for video 15c Semiconductor chip for interface 15d Controller for LAN control 15e Semiconductor chip for display control 15f Coil group 15g Capacitor group 15h Memory substrate 16 Memory mounting portion 17 Heat radiation fins 18a to 18f Heat radiation protrusions 20, 24 Heat conduction sheet 21, 25 Hollow recess 23 Adjustment screw 26 Open air introduction opening 27 Dust filter 28 Parts partition 30 Substrate replacement hole 31 Dust cover 32 Blowing opening 34 Discharge port 35 Main body partition

Claims (14)

A device body consisting of a front case and a rear case;
A metal chassis provided in the front case of the device body;
A circuit board mounted on this chassis and mounted with various electronic components,
A metal heat dissipating member with high thermal conductivity that is attached to the chassis and surrounds and surrounds the circuit board,
An information device comprising: a blower fan that is attached to a blower opening provided in the rear case of the device body and sends outside air to an outer surface of the heat radiating member.   The information device according to claim 1, wherein a large number of heat dissipating fins are provided on an outer surface of the heat dissipating member.   The information device according to claim 1, wherein the blower fan rotates at a low speed.   The heat dissipating member is provided with a plurality of heat dissipating protrusions that are in thermal contact with a plurality of electronic components having high heat generation among the many electronic components mounted on the circuit board. The information apparatus in any one of 1-3.   5. The information device according to claim 4, wherein the plurality of heat radiating protrusions are each provided with a hollow portion that is opened on an outer surface of the heat radiating member.   5. A heat conducting member having a higher thermal conductivity than the heat radiating member is provided between the plurality of heat radiating protrusions and the plurality of electronic components corresponding thereto, respectively. 5. The information device according to 5.   Among the plurality of electronic components with high heat generation, the heat dissipation projection corresponding to the electronic component with the highest heat generation is tightened to the chassis by a screw member for adjustment at a plurality of locations in the periphery thereof, so that the electronic component The information device according to claim 4, wherein the information device is attached to the chassis by adjusting a pressing force to the chassis. The predetermined part of the circuit board is provided with a group of electronic parts with a high height that stands up with respect to the circuit board among the plurality of electronic parts with high heat generation,
5. The heat radiating member is provided with an outside air introduction opening for introducing outside air from the blower fan to the inside of the heat radiating member, corresponding to the high electronic component group. Information equipment in any one of -7.   The information device according to claim 8, wherein a component partition portion that surrounds the electronic component group having a high height is provided at a peripheral edge portion of the heat radiation member in the outside air introduction opening.   The information device according to claim 8 or 9, wherein a metal dustproof filter is provided in the outside air introduction opening of the heat radiating member. A memory mounting portion to which the memory board is detachably attached is provided at a location corresponding to the blower fan in the circuit board,
The information device according to any one of claims 1 to 10, wherein the heat radiating member is provided with a substrate exchange hole through which the memory substrate is inserted, corresponding to the memory mounting portion.   The information device according to claim 11, wherein a dustproof lid is detachably attached to the substrate exchange hole of the heat radiating member.   The information device according to claim 12, wherein the dustproof lid is a metal plate or a metal dustproof filter having high thermal conductivity.   The main body partition part which is located in the lower part of the heat dissipation member which is attached to the chassis and covers the circuit board and partitions the upper and lower regions is provided in the device main body. 14. The information device according to any one of 13.

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