CN108712846A - The safe radiator structure of a kind of electronic equipment - Google Patents

The safe radiator structure of a kind of electronic equipment Download PDF

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Publication number
CN108712846A
CN108712846A CN201810530331.4A CN201810530331A CN108712846A CN 108712846 A CN108712846 A CN 108712846A CN 201810530331 A CN201810530331 A CN 201810530331A CN 108712846 A CN108712846 A CN 108712846A
Authority
CN
China
Prior art keywords
heat
dissipating housing
heat dissipating
hot channel
electronic equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201810530331.4A
Other languages
Chinese (zh)
Other versions
CN108712846B (en
Inventor
郑树春
范月华
郑菲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ma'anshan An Hui Zhi Electronic Technology Co Ltd
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Ma'anshan An Hui Zhi Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN201810530331.4A priority Critical patent/CN108712846B/en
Publication of CN108712846A publication Critical patent/CN108712846A/en
Application granted granted Critical
Publication of CN108712846B publication Critical patent/CN108712846B/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20181Filters; Louvers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses the safe radiator structures of a kind of electronic equipment, including insulating base, heat generating member, heat dissipating housing, shell, hot channel, supply fan and ventilation fan, the insulating base upper end is equipped with heat generating member and heat dissipating housing, heat dissipating housing both sides are symmetrically embedded to be equipped with side cover plate, side cover plate lower end is equipped with thermal fuse-link, insulating base lower end is equipped with insulating pad layer, conductive filler is equipped in heat dissipating housing, heat dissipating housing is equipped with cooling fin, shell is equipped with above insulating base, shell is equipped with hot channel, hot channel lower end is equipped with ventilation opening, supply fan and ventilation fan are respectively equipped in hot channel.The present invention promotes heat displacement, to protect electronic equipment internal component using the temperature diffusion of insulating pad layer isolation heat generating member;It is radiated by conductive filler, heat dissipating housing and cooling fin, forms windstream by increasing supply fan and ventilation fan and take away heat;Cover plate opens ventilation on the downside of high temperature, safer.

Description

The safe radiator structure of a kind of electronic equipment
Technical field
The present invention relates to the accessory of a kind of electronic equipment, the safe radiator structure of specifically a kind of electronic equipment.
Background technology
As the configuration performance of the radiating structure for electronic equipment such as smart mobile phone, tablet is increasingly stronger, volume is smaller and smaller, The performance requirement of configured electronic component (such as CPU, memory etc.) is also higher and higher.Moreover, electronic component is working It will produce a large amount of heat when (especially operating at full capacity), it, will be to electronic component if these heats distribute not in time Stability, service life etc. have a huge impact.
Currently, radiating structure for electronic equipment is usually using pcb board (i.e. printed wiring board) as the chassis of electronic component, Pcb board is equipped with several electronic components being electrically connected to each other, and is covered on each electronic component for avoiding signal The metallic shield of interference, radiating mode are:The heat that electronic component is sent out passes through in air transmitted to metallic shield To realize heat dissipation.However, the heat-conductive characteristic of air is poor so that heat is difficult to conduct to metallic shield and give out in time It goes, it is more serious to which the local area of radiating structure for electronic equipment can be caused to generate heat.In addition, the heat dissipation effect of metallic shield compared with Difference, further such that heat cannot be uniformly dispersed away portion, existing many electronic component internal arithmetic amounts are excessive to cause exception Adstante febre be easy to cause damage if heat is dredged not in time.
Invention content
The purpose of the present invention is to provide the safe radiator structures of a kind of electronic equipment, to solve to carry in above-mentioned background technology The problem of going out.
To achieve the above object, the present invention provides the following technical solutions:
The safe radiator structure of a kind of electronic equipment, including insulating base, heat generating member, heat dissipating housing, shell, hot channel, Supply fan and ventilation fan, insulating base upper end level, which is inlayed, is provided with heat generating member, and the insulating base lower end fitting is set It is equipped with insulating pad layer, the insulating base upper end is located at the heat generating member peripheral solder and is provided with heat dissipating housing, the heat dissipating housing two Symmetrically insertion is provided with side cover plate for side, welds to be provided with to heat between side cover plate lower end and the insulating base upper end and break Body, the heat dissipating housing is interior to be filled with conductive filler positioned at the heat generating member periphery, and the heat dissipating housing upper end, which is vertically inlayed, to be set Be equipped with cooling fin, be provided with shell above the insulating base, on the shell it is correspondings with the heat dissipating housing both sides run through be arranged There are hot channel, the hot channel lower end to be provided through ventilation opening, the ventilation opening is the willow leaf of multigroup rounded distribution Shape hole, the hot channel upper end, which is inlayed, is provided with filter cloth, and air inlet is connected in the hot channel in left side Fan is connected with ventilation fan, the control of the supply fan and the ventilation fan in the hot channel on right side Circuit is connected with permanent circuit, and the supply fan and the ventilation fan pass through the rotation with the hot channel lower end It is connected to rotation in the hot channel, the supply fan is dried to heat dissipating housing from top to bottom after being powered, and the ventilation fan is certainly Lower and upper outside exhaust.
As a further solution of the present invention:The insulating pad layer uses heat-insulated cotton paper.
As a further solution of the present invention:The heat dissipating housing is stainless steel shield.
As a further solution of the present invention:Side cover plate upper end is rotated by torsionspring and the heat dissipating housing upper end Connection, the side cover plate positioned at left side rotate clockwise tilting under torsionspring effect, are located at the side cover plate on right side Tilting is rotated counterclockwise under torsionspring effect.
As a further solution of the present invention:The thermal fuse-link coordinates the heat dissipating housing, the side cover plate and described Insulating base forms enclosure space.
As a further solution of the present invention:The conductive filler uses heat-conducting glue.
As a further solution of the present invention:The cooling fin horizontal distribution have it is multigroup, the cooling fin use copper foil material Matter.
As a further solution of the present invention:Hot channel lower end closed upper end opens.
Compared with prior art, the beneficial effects of the invention are as follows:When heat generating member, which is powered, to be run, a large amount of heat is generated, Heat is transferred to heat dissipating housing by conductive filler and radiates out by cooling fin, and the increase of insulating pad layer can avoid heat generating member Heat other regions in transfer spreading to electronic equipment from below, avoid the adverse effect caused by high temperature, in this way can be Ensure that the orientation of heat is transmitted while providing effective protection to heat generating member, is conducive to fast and safely effective fast cooling;At this time Start supply fan and ventilation fan, supply fan is dried to heat dissipating housing, and outside air after filter-cloth filtering from ventilation opening by blowing to Cooling fin on heat dissipating housing can take away heat, and ventilation fan is vented from bottom to top, and high temperature gas flow can be discharged to the outer of shell Side can quickly take away heat, high efficiency and heat radiation cooling so that supply fan and ventilation fan cooperatively form the directed flow of air-flow; When heat generating member encounters special circumstances and radiates extremely, heat can not be transmitted by conductive filler outward in time, at this time in heat dissipating housing Temperature quickly increases, and is broken under thermal fuse-link high temperature, and such side cover plate can be rotated to both sides respectively under torsionspring drive, The air-flow of directed flow can be directly entered by the way that in heat dissipating housing, high efficiency and heat radiation avoids heat generating member from damaging in this way, improve product Service life.
Description of the drawings
Fig. 1 is the structural schematic diagram of the safe radiator structure of a kind of electronic equipment.
Fig. 2 be a kind of electronic equipment safe radiator structure in heat dissipating housing structural schematic diagram.
Fig. 3 be a kind of electronic equipment safe radiator structure in ventilation opening structural schematic diagram.
In figure:1- insulating bases, 2- heat generating members, 3- insulating pad layers, 4- heat dissipating housings, 41- side cover plates, 42- thermal fuse-links, 5- Conductive filler, 6- cooling fins, 7- shells, 8- hot channels, 81- ventilation openings, 82- filter clothes, 83- supply fans, 84- ventilation fans.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
Please refer to Fig.1~3, in the embodiment of the present invention, the safe radiator structure of a kind of electronic equipment, including insulating base 1, Heat generating member 2, heat dissipating housing 4, shell 7, hot channel 8, supply fan 83 and ventilation fan 84,1 upper end level edge of the insulating base It is embedded and is equipped with heat generating member 2, the heat generating member 2 is heat-generating electronic elements, and the fitting of 1 lower end of the insulating base is provided with insulating pad layer 3, the insulating pad layer 3 uses heat-insulated cotton paper, the arbitrary diffusion couple of heat other areas when the heat generating member 2 can be avoided to work in this way Domain has an impact, and the increase of the insulating pad layer 3 can allow the heat of the heat generating member 2 to have fixed delivery direction, to profit In effective control, 1 upper end of the insulating base is located at 2 peripheral solder of the heat generating member and is provided with heat dissipating housing 4, the heat dissipating housing 4 For stainless steel shield, symmetrically insertion is provided with side cover plate 41 to 4 both sides of the heat dissipating housing, and 41 upper end of side cover plate passes through torsion Turn spring and the rotation connection of 4 upper end of the heat dissipating housing, the side cover plate 41 for being located at left side is clockwise under torsionspring effect Rotation tilts, and the side cover plate 41 positioned at right side rotates counterclockwise tilting under torsionspring effect, under the side cover plate 41 Welding is provided with thermal fuse-link 42 between end and 1 upper end of the insulating base, the thermal fuse-link 42 coordinate the heat dissipating housing 4, The side cover plate 41 and the insulating base 1 form enclosure space, are filled out positioned at 2 periphery of the heat generating member in the heat dissipating housing 4 It fills and is provided with conductive filler 5, the conductive filler 5 uses heat-conducting glue, the heat in the heat generating member 2 to pass through the conductive filler 5, which are transferred to the heat dissipating housing 4, is diffused, and 4 upper end of the heat dissipating housing, which is vertically inlayed, is provided with cooling fin 6,6 water of the cooling fin Divide equally and be furnished with multigroup, the cooling fin 6 uses copper foil material, and the cooling fin 6 can promote the heat dissipation of the heat dissipating housing 4 to imitate Rate, the top of the insulating base 1 are provided with shell 7, on the shell 7 it is corresponding with 4 both sides of the heat dissipating housing be provided through it is scattered Heat pipeline 8,8 lower end closed upper end of the hot channel open, and 8 lower end of the hot channel is provided through ventilation opening 81, institute The wicker leaf shape hole that ventilation opening 81 is multigroup rounded distribution is stated, 8 upper end of the hot channel, which is inlayed, is provided with filter cloth 82, is located at It is connected with supply fan 83 in the hot channel 8 in left side, is connected in the hot channel 8 on right side Ventilation fan 84, the supply fan 83 and the control circuit of the ventilation fan 84 are connected with permanent circuit, the air inlet wind Fan 83 and the ventilation fan 84 with being rotatably connected in the hot channel 8 for 8 lower end of the hot channel by rotating, institute It states after supply fan 83 is powered and dries from top to bottom to heat dissipating housing 4, the exhaust outward from bottom to top of the ventilation fan 84 is formed in this way Cross-ventilation can take away heat.
The present invention operation principle be:When heat generating member 2, which is powered, to be run, a large amount of heat is generated, heat is filled out by heat conduction 5 are filled to be transferred to heat dissipating housing 4 and come out by the heat dissipation of cooling fin 6, the increase of insulating pad layer 3 can avoid the heat of heat generating member 2 from Other regions in the transfer spreading to electronic equipment of lower section avoid the adverse effect caused by high temperature, in this way can be to heat generating member 2 Ensure that the orientation of heat is transmitted while effective protection is provided, is conducive to fast and safely effective fast cooling;Start air inlet at this time Fan 83 and ventilation fan 84, supply fan 83 are dried to heat dissipating housing 4, and outside air is blown after being filtered by filter cloth 82 from ventilation opening 81 Cooling fin 6 on heat dissipating housing 4 can take away heat, and ventilation fan 84 is vented from bottom to top, can be discharged to high temperature gas flow outer The outside of shell 7 can quickly take away heat so that supply fan 83 and ventilation fan 84 cooperatively form the directed flow of air-flow, high Imitate radiating and cooling;When heat generating member 2 encounters special circumstances and radiates extremely, heat can not be transmitted by conductive filler 5 outward in time, Temperature quickly increases in heat dissipating housing 4 at this time, is broken under 42 high temperature of thermal fuse-link, such side cover plate 41 energy under torsionspring drive Enough to be rotated respectively to both sides, the air-flow of such directed flow can be directly entered by the way that in heat dissipating housing 4, high efficiency and heat radiation avoids generating heat Part damages, and improves the service life of product.
The standardized element that the present invention uses can commercially, and shaped piece is according to specification and attached drawing note Load can carry out customized, and the specific connection type of each part is all made of ripe in the prior art bolt, rivet, welding etc. Conventional means, machinery, part and equipment are all made of in the prior art, conventional model, in addition circuit connection uses the prior art Middle conventional connection type, this will not be detailed here.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power Profit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent requirements of the claims Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art The other embodiment being appreciated that.

Claims (8)

1. the safe radiator structure of a kind of electronic equipment, including insulating base (1), heat generating member (2), heat dissipating housing (4), shell (7), Hot channel (8), supply fan (83) and ventilation fan (84), which is characterized in that insulating base (1) upper end level, which is inlayed, to be set It is equipped with heat generating member (2), insulating base (1) the lower end fitting is provided with insulating pad layer (3), insulating base (1) the upper end position The heat generating member (2) peripheral solder is provided with heat dissipating housing (4), symmetrically insertion is provided with side cover plate for heat dissipating housing (4) both sides (41), welding is provided with thermal fuse-link (42) between side cover plate (41) lower end and the insulating base (1) upper end, described to dissipate It is filled with conductive filler (5) positioned at the heat generating member (2) periphery in heat cover (4), heat dissipating housing (4) upper end is vertically inlayed It is provided with cooling fin (6), is provided with shell (7) above the insulating base (1), on the shell (7) and the heat dissipating housing (4) Both sides, which correspond to, is provided through hot channel (8), and hot channel (8) lower end is provided through ventilation opening (81), described logical Air port (81) is the wicker leaf shape hole of multigroup rounded distribution, and hot channel (8) upper end, which is inlayed, is provided with filter cloth (82), position In being connected with supply fan (83) in the hot channel (8) in left side, it is located in the hot channel (8) on right side and connects It connects and is provided with ventilation fan (84), the supply fan (83) is connected with permanent circuit with the control circuit of the ventilation fan (84) It connects, the supply fan (83) and the ventilation fan (84) with the hot channel (8) lower end by being rotatably connected on institute Rotation in hot channel (8) is stated, the supply fan (83) is dried to heat dissipating housing (4) from top to bottom after being powered, the ventilation fan (84) exhaust outward from bottom to top.
2. the safe radiator structure of a kind of electronic equipment according to claim 1, which is characterized in that the insulating pad layer (3) heat-insulated cotton paper is used.
3. the safe radiator structure of a kind of electronic equipment according to claim 1, which is characterized in that the heat dissipating housing (4) For stainless steel shield.
4. the safe radiator structure of a kind of electronic equipment according to claim 1, which is characterized in that the side cover plate (41) Upper end is rotatablely connected by torsionspring and the heat dissipating housing (4) upper end, is located at the side cover plate (41) in left side in torsion bullet Tilting is rotated clockwise under spring effect, the side cover plate (41) positioned at right side rotates counterclockwise under torsionspring effect sticks up It rises.
5. the safe radiator structure of a kind of electronic equipment according to claim 1, which is characterized in that the thermal fuse-link (42) heat dissipating housing (4), the side cover plate (41) and the insulating base (1) is coordinated to form enclosure space.
6. the safe radiator structure of a kind of electronic equipment according to claim 1, which is characterized in that the conductive filler (5) heat-conducting glue is used.
7. the safe radiator structure of a kind of electronic equipment according to claim 1, which is characterized in that the cooling fin (6) Horizontal distribution have it is multigroup, the cooling fin (6) use copper foil material.
8. the safe radiator structure of a kind of electronic equipment according to claim 1, which is characterized in that the hot channel (8) lower end closed upper end opens.
CN201810530331.4A 2018-05-29 2018-05-29 Safe heat radiation structure of electronic equipment Active CN108712846B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810530331.4A CN108712846B (en) 2018-05-29 2018-05-29 Safe heat radiation structure of electronic equipment

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Application Number Priority Date Filing Date Title
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CN108712846A true CN108712846A (en) 2018-10-26
CN108712846B CN108712846B (en) 2022-03-25

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110248499A (en) * 2019-07-06 2019-09-17 陕西理工大学 A kind of pcb board welding fixture auxiliary tool and its application method
CN111785158A (en) * 2020-06-23 2020-10-16 汤米熊技术(深圳)有限公司 Adopt radiating electron station board of graphite alkene
CN115226353A (en) * 2022-07-26 2022-10-21 珠海格力电器股份有限公司 Electrical box, control method and air conditioner

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006292269A (en) * 2005-04-11 2006-10-26 Matsushita Electric Ind Co Ltd Cooling device
JP2012227350A (en) * 2011-04-20 2012-11-15 Funai Electric Co Ltd Cooling structure for heating component
CN206909013U (en) * 2017-04-28 2018-01-19 北京华光浩阳科技有限公司 The radiator structure of a kind of electronic equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006292269A (en) * 2005-04-11 2006-10-26 Matsushita Electric Ind Co Ltd Cooling device
JP2012227350A (en) * 2011-04-20 2012-11-15 Funai Electric Co Ltd Cooling structure for heating component
CN206909013U (en) * 2017-04-28 2018-01-19 北京华光浩阳科技有限公司 The radiator structure of a kind of electronic equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110248499A (en) * 2019-07-06 2019-09-17 陕西理工大学 A kind of pcb board welding fixture auxiliary tool and its application method
CN110248499B (en) * 2019-07-06 2022-03-18 陕西理工大学 Auxiliary tool for PCB welding jig and using method thereof
CN111785158A (en) * 2020-06-23 2020-10-16 汤米熊技术(深圳)有限公司 Adopt radiating electron station board of graphite alkene
CN115226353A (en) * 2022-07-26 2022-10-21 珠海格力电器股份有限公司 Electrical box, control method and air conditioner

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