CN209435534U - A kind of integrated form high pressure ballast electron plate - Google Patents
A kind of integrated form high pressure ballast electron plate Download PDFInfo
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- CN209435534U CN209435534U CN201821930518.5U CN201821930518U CN209435534U CN 209435534 U CN209435534 U CN 209435534U CN 201821930518 U CN201821930518 U CN 201821930518U CN 209435534 U CN209435534 U CN 209435534U
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Abstract
The utility model discloses a kind of integrated form high pressure ballast electron plates, solves existing integrated form high pressure ballast electron plate, heat dissipation effect is bad, solder joint caducous problem in power-up hot operation for a long time, it includes mainboard, mainboard top quadrangle offers threaded hole, mainboard top is welded with electronic component, mainboard top offers heat release hole close to electronic component surrounding, mainboard top is close to electronic component side embedded with mark, mainboard top is located at electronic component bottom outside and is equipped with seal assembly, mainboard bottom end is equipped with routing layer, routing layer bottom end is equipped with insulation board, insulation board top two sides are mounted on radiating subassembly, the utility model structure novel, it is skillfully constructed, solder joint can be prevented using seal assembly because of oxidation, vibration and foreign matter and occurring fall off the situation of short circuit, extend product in turn uses the longevity Life, can effectively improve the thermal diffusivity of electron plate during the work time using radiating subassembly.
Description
Technical field
The utility model relates to electron plate technical field, specially a kind of integrated form high pressure ballast electron plate.
Background technique
Electron plate is to be completed by various electronic components (capacitance resistance pcb board semiconductor inductance etc.) by operation assembly,
The electron plate for being assembled to form different function of different classes of electronic component, electron plate use mainly on household appliances,
It plays and carries out control and adjustment effect to whole, the function of household electrical appliances is all the control by electron plate and adjusting hair in the modern life
It shoots and, existing electron plate heat dissipation effect is bad, and solder joint is easy to fall off in power-up hot operation for a long time and vibration processes, influences
The service life of product.
How a kind of integrated form high pressure ballast electron plate is designed, and becoming us will currently solve the problems, such as.
Utility model content
For above situation, to overcome the shortcomings of existing technologies, the utility model provides a kind of integrated form high pressure ballast electricity
Daughter board, the existing integrated form high pressure ballast electron plate of effective solution, thermal effect is bad, and solder joint is in power-up hot operation for a long time
In caducous problem.
To achieve the above object, the utility model provides the following technical solutions: including mainboard, mainboard top quadrangle is opened
Equipped with threaded hole, mainboard top is welded with electronic component, and mainboard top offers heat release hole close to electronic component surrounding, main
Close to electronic component side embedded with mark, mainboard top is located at electronic component bottom outside and is equipped with sealing group on plate top
Part, mainboard bottom end are equipped with routing layer, and routing layer bottom end is equipped with insulation board, and insulation board top two sides are mounted on heat dissipation group
Part, insulation board top are mounted on resistance wire close to radiating subassembly two sides.
Preferably, the seal assembly includes gag lever post, card hole, sealing shroud and insulation fill stratum, gag lever post upper socket
Card hole is equipped with sealing shroud, and sealing shroud bottom end is equipped with insulation fill stratum.
Preferably, the radiating subassembly includes plastic shell, deflector, radiator fan, welding item and heat sink, outside plastics
Side is equipped with deflector outside shell, radiator fan is equipped with inside plastic shell, insulation board top is between plastic shell
Heat sink is welded with by welding item.
Preferably, the heat release hole is socketed insulation board and routing layer, is equipped with thermal insulation layer inside routing layer.
Preferably, the heat sink quantity is 3, and heat sink is a kind of copper structure.
Preferably, the resistance wire and radiator fan are electrically connected with alternating current.
The utility model structure novel, is skillfully constructed, using seal assembly can prevent solder joint because oxidation, vibration and it is different
Object and occurring falls off the situation of short circuit, and then extends the service life of product, can effectively improve electron plate using radiating subassembly
Thermal diffusivity during the work time.
Detailed description of the invention
Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this
Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.In the accompanying drawings:
Fig. 1 is the utility model overall structure diagram；
Fig. 2 is partial enlarged view at A in the utility model Fig. 1；
Fig. 3 is the utility model radiating subassembly schematic diagram；
Fig. 4 is the utility model circuit block diagram.
Specific embodiment
1-3 is described in further details specific embodiment of the present utility model with reference to the accompanying drawing.
Embodiment one, is provided by Fig. 1, Fig. 2 and Fig. 3, the utility model mainboard 1, and 1 top quadrangle of mainboard offers threaded hole
2, threaded hole 2 can be fixed in electric appliance by bolt, and 1 top of mainboard is welded with electronic component 3, different classes of electricity
The assembly of sub- component 3 can form different function, and 1 top of mainboard offers heat release hole 4 close to 3 surrounding of electronic component,
For the heat dissipation of electron plate operation, 1 top of mainboard, embedded with mark 5, prevents people from welding close to 3 side of electronic component
Direction is mistaken when electronic component 3,1 top of mainboard is located at 3 bottom outside of electronic component and is equipped with seal assembly 6,1 bottom of mainboard
End is equipped with routing layer 11, and for the arrangement of circuit, 11 bottom end of routing layer is equipped with insulation board 12, and insulation board 12 prevents heat dissipation group
Part 13 and electronic component 3 generate static short, and 12 top two sides of insulation board are mounted on radiating subassembly 13,12 top of insulation board
It is mounted on resistance wire 20 close to 13 two sides of radiating subassembly, is damaged after preventing electron plate from making moist.
Embodiment two is provided by Fig. 2 on the basis of example 1, and seal assembly 6 includes gag lever post 7, card hole 8, sealing
Set 9 and insulation fill stratum 10,7 upper socket card hole 8 of gag lever post are equipped with sealing shroud 9, and 9 bottom end of sealing shroud is equipped with insulation filling
Layer 10, is fixed solder joint by seal assembly 6, and foreign matter is prevented to enter and fall off, and insulation fill stratum 10 improves the antioxygen of solder joint
The working performance of the property changed and low temperature.
Embodiment three is provided by Fig. 3 on the basis of example 1, and radiating subassembly 13 includes plastic shell 14, deflector
15, radiator fan 16, welding item 18 and heat sink 19,14 outside side of plastic shell are equipped with deflector 15, plastic shell 14
Inside is equipped with radiator fan 16, and 12 top of insulation board is welded with heat sink by welding item 18 between plastic shell 14
19。
Example IV, on the basis of example 1, heat release hole 4 are socketed insulation board 12 and routing layer 11, in routing layer 11
Portion is equipped with thermal insulation layer, and heat release hole 4 will play the effect of accessory heat dissipation, and the thermal insulation layer in routing layer 11 is produced between operational amplifier circuit
Raw temperature is isolated.
Embodiment five, on the basis of embodiment three, 19 quantity of heat sink is 3, and heat sink 19 is a kind of copper structure,
Heat sink 19 can cool down heat absorption, play good heat dissipation effect.
Embodiment six is provided on the basis of embodiment one and three by Fig. 4,16 city Jun Yu of resistance wire 20 and radiator fan
Electricity is electrically connected, and city supplies electricity to that electrical equipment is needed to provide electricity, and resistance wire 20 and radiator fan 16 is allowed to play a role.
In the present embodiment: radiator fan 16 uses EFB0412VHD radiator fan.
Working principle: people need when welding electron plate, and the various electronic components 3 of needs and mainboard 1 are taken out,
The instruction information for examining mark 5 prevents electronic component 3 anti-loaded, and various electronic components 3 are installed to master by welding
3 welding region of electronic component above plate 1, after being welded, weld leaves solder joint, and corresponding various electronic components 3 are big
Small sealing shroud 9 is taken out, and 9 four jiaos of the sealing shroud card holes 8 opened up and passes through 3 welding region of electronic component above mainboard 1
The gag lever post 7 of surrounding cooperates, and makes the top for making sealing shroud 9 be fixed on solder joint across electronic component 3, and sealing shroud 9 will weld
Point is fixed, and is prevented foreign matter from entering and fall off, is made electronic component 3 and the physical connection of mainboard 1 relatively reliable, 9 bottom of sealing shroud
The insulation fill stratum 10 at end improves the inoxidizability of solder joint and the working performance of low temperature, then in the insulation of 1 reverse side of mainboard installation
Radiating subassembly 13 is installed on plate 12, radiates when for work to electron plate, two radiator fans 16 is mounted on insulation board
On 12 tops two sides, the corresponding electronic component 3 of heat sink 19 is being welded on insulation board 12 by welding item 18, at work
Heat sink 19 absorbs the work calories of electron plate, and 16 blowing cold air of radiator fan radiate to electron plate and heat sink 19 cold
But, good heat dissipation effect is played, if electron plate can be opened resistance wire 20 and heated to electron plate, allowed by the time of tide
The electron plate of dampness is dried by heat, and radiator fan 16 plays the effect for dispelling aqueous vapor simultaneously.
The utility model structure novel, is skillfully constructed, using seal assembly can prevent solder joint because oxidation, vibration and it is different
Object and occurring falls off the situation of short circuit, and then extends the service life of product, can effectively improve electron plate using radiating subassembly
Thermal diffusivity during the work time.
Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention, it is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic
It is equivalently replaced.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on,
It should be included within the scope of protection of this utility model.
Claims (6)
1. a kind of integrated form high pressure ballast electron plate, including mainboard (1), it is characterised in that: mainboard (1) the top quadrangle opens up
Have threaded hole (2), mainboard (1) top is welded with electronic component (3), and mainboard (1) top is opened close to electronic component (3) surrounding
Equipped with heat release hole (4), close to electronic component (3) side embedded with mark (5), mainboard (1) top is located at electronics on mainboard (1) top
Component (3) bottom outside is equipped with seal assembly (6), and mainboard (1) bottom end is equipped with routing layer (11), routing layer (11) bottom end
It is equipped with insulation board (12), insulation board (12) top two sides are mounted on radiating subassembly (13), and insulation board (12) top is close to scattered
Hot component (13) two sides are mounted on resistance wire (20).
2. a kind of integrated form high pressure ballast electron plate according to claim 1, which is characterized in that the seal assembly (6)
Including gag lever post (7), card hole (8), sealing shroud (9) and insulation fill stratum (10), gag lever post (7) upper socket card hole (8) installation
Have sealing shroud (9), sealing shroud (9) bottom end is equipped with insulation fill stratum (10).
3. a kind of integrated form high pressure ballast electron plate according to claim 1, which is characterized in that the radiating subassembly (13)
Including plastic shell (14), deflector (15), radiator fan (16), welding item (18) and heat sink (19), plastic shell (14)
External side is equipped with deflector (15), is equipped with radiator fan (16) inside plastic shell (14), insulation board (12) top is leaned on
Heat sink (19) are welded with by welding item (18) between nearly plastic shell (14).
4. a kind of integrated form high pressure ballast electron plate according to claim 1, which is characterized in that heat release hole (4) set
Insulation board (12) and routing layer (11) are connect, thermal insulation layer is installed inside routing layer (11).
5. a kind of integrated form high pressure ballast electron plate according to claim 3, which is characterized in that heat sink (19) number
Amount is 3, and heat sink (19) is a kind of copper structure.
6. a kind of integrated form high pressure ballast electron plate according to claim 1 or 3, which is characterized in that the resistance wire
(20) it is electrically connected with alternating current with radiator fan (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821930518.5U CN209435534U (en) | 2018-11-21 | 2018-11-21 | A kind of integrated form high pressure ballast electron plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821930518.5U CN209435534U (en) | 2018-11-21 | 2018-11-21 | A kind of integrated form high pressure ballast electron plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209435534U true CN209435534U (en) | 2019-09-24 |
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ID=67969664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821930518.5U Active CN209435534U (en) | 2018-11-21 | 2018-11-21 | A kind of integrated form high pressure ballast electron plate |
Country Status (1)
| Country | Link |
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| CN (1) | CN209435534U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112672498A (en) * | 2020-12-11 | 2021-04-16 | 中国北方发动机研究所(天津) | SMD circuit board |
-
2018
- 2018-11-21 CN CN201821930518.5U patent/CN209435534U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112672498A (en) * | 2020-12-11 | 2021-04-16 | 中国北方发动机研究所(天津) | SMD circuit board |
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