CN112672498A - SMD circuit board - Google Patents
SMD circuit board Download PDFInfo
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- CN112672498A CN112672498A CN202011441907.3A CN202011441907A CN112672498A CN 112672498 A CN112672498 A CN 112672498A CN 202011441907 A CN202011441907 A CN 202011441907A CN 112672498 A CN112672498 A CN 112672498A
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- circuit board
- bonding pad
- board
- sub circuit
- pads
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- 238000003466 welding Methods 0.000 claims abstract description 12
- 238000012423 maintenance Methods 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012356 Product development Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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Abstract
The invention provides a surface-mounted circuit board which comprises a surface-mounted sub circuit board, a main circuit board and components, wherein the main circuit board is provided with the surface-mounted sub circuit board, a third bonding pad and the components, the surface-mounted sub circuit board comprises a sub circuit board printed board, a first bonding pad, a chamfer mark and a second bonding pad, a plurality of first bonding pads are arranged at the edge of the sub circuit board printed board, the upper surface of the first bonding pad is provided with the second bonding pad, the second bonding pad is used for welding the components, the first bonding pad is welded with the third bonding pad, the chamfer mark is arranged at the corner of the sub circuit board printed board, and a silk screen layer of the main circuit board is provided. The surface-mounted circuit board solves the problems of poor vibration and poor maintenance performance of the primary-secondary board structure, and has the advantages of simple and compact structure, convenient welding, low requirement and easy realization; the requirement of reliability of the installation is met, and the requirement of convenience in replacement of the functional modules brought by scheme adjustment is met.
Description
Technical Field
The invention belongs to the technical field of electronic control of diesel engines, and particularly relates to a patch type circuit board.
Background
Along with the development of the digital technology of the diesel engine, electronic and electrical parts are continuously increased, the system is more and more complex, adjustable parameters are more and more, and the requirement on compactness is higher and more. The requirement for fine adjustment is continuously increased, and in the product development process, the hardware parameters and the scheme of the functional module are adjusted more frequently. Therefore, a sub-motherboard combined circuit board structure is urgently needed, frequent adjustment of the functional modules is realized without affecting the main circuit board, namely: the local adjustment of the functional module, the main circuit board need not redesign, processing, production, welding to shorten production cycle, practice thrift manpower, material resources cost, save the expense. At present, a single-row pin daughter board welding and mother-daughter board combined circuit board structure on a mother board already exists, but due to the fact that the anti-overturning mechanical property of the single-row pin independently supporting daughter board is poor, the anti-vibration performance under a strong vibration environment is poor, and the situation that the single-row pin is broken due to vibration often occurs. Meanwhile, the daughter board maintenance and replacement manufacturability is poor.
Disclosure of Invention
In view of this, the present invention provides a surface mount circuit board to solve the problems of poor vibration and poor maintenance performance of the conventional mother-daughter board structure.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
the utility model provides a SMD circuit board, including SMD daughter board, main circuit board and components and parts, be equipped with SMD daughter board on the main circuit board, No. three pads and components and parts, SMD daughter board includes daughter board printed circuit board, a pad, chamfer sign and No. two pads, the edge of daughter board printed circuit board is equipped with a plurality of pads No. one, the upper surface is equipped with No. two pads, No. two pads are used for welding components and parts, a pad and No. three pad welding, daughter board printed circuit board bight is equipped with the chamfer sign, the silk screen layer of main circuit board is equipped with the sign that corresponds with the chamfer sign.
Furthermore, when the main circuit board is provided with a plurality of patch type sub circuit boards, the functions of the patch type sub circuit boards are the same.
Furthermore, when the main circuit board is provided with a plurality of patch type sub circuit boards, the functions of the patch type sub circuit boards are different.
Furthermore, the first bonding pad is a semicircular arc bonding pad.
Furthermore, the second bonding pad and the third bonding pad are rectangular bonding pads.
Furthermore, a hollow groove is formed in the main circuit board.
Compared with the prior art, the patch type circuit board has the following advantages:
(1) according to the surface mount type circuit board, the surface mount type sub circuit board is an independent module and forms a sub-board structure with the main circuit board, so that the problems of poor vibration and poor maintenance performance of the sub-board structure are solved, and the surface mount type circuit board is simple and compact in structure, convenient to weld, low in requirement and easy to realize; the requirement on the reliability of the installation is met, the requirement on convenience of replacement of the functional module caused by scheme adjustment is met, the functional module is adjusted without redesigning and manufacturing the whole main circuit board, and the cost is saved.
(2) According to the surface mount type circuit board, the chamfer mark is arranged at the corner of the printed board of the sub circuit board, the silk screen layer of the main circuit board is provided with the mark corresponding to the chamfer mark, and the surface mount type circuit board has an error-proofing function and is used for direction identification during welding.
(3) According to the patch type circuit board, the hollow groove avoids the situation that the electronic component penetrates through the contact pin of the printed board of the patch type sub circuit board, and short circuit is avoided.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate an embodiment of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural diagram of a patch type circuit board according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a patch type sub-circuit board according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a printed board of a daughter circuit board according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a main circuit board according to an embodiment of the present invention.
Description of reference numerals:
1-a patch type sub-circuit board; 2-a sub-circuit board printed board; pad No. 3-one; 4-chamfering mark; 5-a main circuit board; 6-pad number two; 7-hollow out grooves; 8-components; 9-bond pad No. three.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
A patch type circuit board is disclosed, as shown in figures 1 to 4, the patch type circuit board comprises a patch type sub circuit board 1, a main circuit board 5 and components and parts 8, a plurality of patch type sub circuit boards 1, a third bonding pad 9 and the components and parts 8 are arranged on the main circuit board 5, the patch type sub circuit board 1 comprises a sub circuit board printed board 2, a first bonding pad 3, a chamfer mark 4 and a second bonding pad 6, a plurality of first bonding pads 3 are arranged at the edge of the sub circuit board printed board 2, a second bonding pad 6 is arranged on the upper surface of the sub circuit board printed board, the second bonding pad 6 is used for welding the components and parts, the first bonding pad 3 is welded with the third bonding pad 9, a chamfer mark 4 is arranged at the corner of the sub circuit board printed board 2, and a silk screen layer of the main circuit board.
Preferably, the first bonding pad 3 is a semicircular arc bonding pad, and the second bonding pad 6 and the third bonding pad 9 are rectangular bonding pads; the welding is convenient, the welding process requirement is low, and the realization is easy.
In one or more real-time examples, the chip-type sub circuit boards 1 are independent modules and form a mother-son board structure with the main circuit board 5, one main circuit board 5 can be provided with a plurality of chip-type sub circuit boards 1, and the chip-type sub circuit boards 1 can have the same or different functions.
In one or more real-time examples, the main circuit board 5 is provided with a hollow-out groove 7, and if the patch-type sub circuit board 1 adopts a direct-insertion type electronic component, the hollow-out groove 7 needs to be provided for avoiding a pin of the electronic component on the back of the sub circuit board printed board 2 and avoiding short circuit. In one or more embodiments, if the surface-mounted sub-circuit board 1 employs surface-mounted components, the main circuit board 5 can be provided as a full-page, without the need for the hollowed-out groove 7.
The scheme well solves the problems of poor vibration and poor maintenance performance of the primary and secondary plate structure, and has the advantages of simple and compact structure, convenient welding, low requirement and easy realization, and is a conventional process. The requirement of reliability of the installation is met, and the requirement of convenience in replacement of the functional modules brought by scheme adjustment is met. The functional module is adjusted, the redesign and the manufacture of a whole main circuit board are not needed, and the cost is saved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (6)
1. A SMD circuit board, its characterized in that: including paster formula sub circuit board, main circuit board and components and parts, be equipped with paster formula sub circuit board on the main circuit board, No. three pads and components and parts, paster formula sub circuit board includes sub circuit board printed board, a pad, chamfer sign and No. two pads, the edge of sub circuit board printed board is equipped with a plurality of pads No. two, the upper surface is equipped with No. two pads, No. two pads are used for welding components and parts, a pad welds with No. three pads, sub circuit board printed board bight is equipped with the chamfer sign, the silk screen layer of main circuit board is equipped with the sign that corresponds with the chamfer sign.
2. The surface mount circuit board of claim 1, wherein: when the main circuit board is provided with a plurality of patch type sub circuit boards, the functions of the patch type sub circuit boards are the same.
3. The surface mount circuit board of claim 1, wherein: when the main circuit board is provided with a plurality of patch type sub circuit boards, the functions of the patch type sub circuit boards are different.
4. The surface mount circuit board of claim 1, wherein: the first bonding pad is a semicircular arc bonding pad.
5. The surface mount circuit board of claim 1, wherein: and the second bonding pad and the third bonding pad are rectangular bonding pads.
6. The surface mount circuit board of claim 1, wherein: the main circuit board is provided with a hollow groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011441907.3A CN112672498A (en) | 2020-12-11 | 2020-12-11 | SMD circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011441907.3A CN112672498A (en) | 2020-12-11 | 2020-12-11 | SMD circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112672498A true CN112672498A (en) | 2021-04-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011441907.3A Pending CN112672498A (en) | 2020-12-11 | 2020-12-11 | SMD circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112672498A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5456843B2 (en) * | 2012-05-24 | 2014-04-02 | 三菱電機株式会社 | Power supply |
| CN204316868U (en) * | 2014-09-30 | 2015-05-06 | 上海移远通信技术有限公司 | The integrated structure of circuit board |
| CN105516407A (en) * | 2015-12-21 | 2016-04-20 | 惠州Tcl移动通信有限公司 | Mobile terminal and circuit board assembly thereof |
| US20160163610A1 (en) * | 2013-08-28 | 2016-06-09 | Qubeicon Ltd. | Semiconductor die and package jigsaw submount |
| US20170019998A1 (en) * | 2015-07-16 | 2017-01-19 | Delphi Technologies, Inc. | Circuit board assembly and method of manufacturing same |
| CN209435534U (en) * | 2018-11-21 | 2019-09-24 | 佛山市埃斯朗电器制造有限公司 | A kind of integrated form high pressure ballast electron plate |
-
2020
- 2020-12-11 CN CN202011441907.3A patent/CN112672498A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5456843B2 (en) * | 2012-05-24 | 2014-04-02 | 三菱電機株式会社 | Power supply |
| US20160163610A1 (en) * | 2013-08-28 | 2016-06-09 | Qubeicon Ltd. | Semiconductor die and package jigsaw submount |
| CN204316868U (en) * | 2014-09-30 | 2015-05-06 | 上海移远通信技术有限公司 | The integrated structure of circuit board |
| US20170019998A1 (en) * | 2015-07-16 | 2017-01-19 | Delphi Technologies, Inc. | Circuit board assembly and method of manufacturing same |
| CN105516407A (en) * | 2015-12-21 | 2016-04-20 | 惠州Tcl移动通信有限公司 | Mobile terminal and circuit board assembly thereof |
| CN209435534U (en) * | 2018-11-21 | 2019-09-24 | 佛山市埃斯朗电器制造有限公司 | A kind of integrated form high pressure ballast electron plate |
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Application publication date: 20210416 |