CN218071899U

CN218071899U - Printed circuit board structure, testing device and electronic equipment

Info

Publication number: CN218071899U
Application number: CN202220888044.2U
Authority: CN
Inventors: 苏小燕; 黄茂涵
Original assignee: PAX Computer Technology Shenzhen Co Ltd
Current assignee: PAX Computer Technology Shenzhen Co Ltd
Priority date: 2022-04-15
Filing date: 2022-04-15
Publication date: 2022-12-16
Anticipated expiration: 2032-04-15

Abstract

The application belongs to the technical field of printed circuit boards, and provides a printed circuit board structure, testing arrangement and electronic equipment, wherein, the printed circuit board structure includes: the PCB comprises a PCB substrate, N independent bonding pads and a shared bonding pad, wherein the N independent bonding pads are arranged on the PCB substrate, and N is a positive integer; the shared bonding pad is arranged on the PCB substrate and is used for being respectively connected with the N independent bonding pads through N independent wires; n independent routing lines are arranged on the PCB substrate, and the PCB is packaged and divided into independent bonding pads and shared bonding pads, so that different circuits can use the same shared bonding pad, the shared bonding pads and the independent bonding pads are flexibly configured, the number of the shared bonding pads is saved, the saving of PCB space is realized, and more functions are compatible in the limited PCB space.

Description

Printed circuit board structure, testing device and electronic equipment

Technical Field

The application belongs to the technical field of printed circuit boards, and particularly relates to a printed circuit board structure, a testing device and electronic equipment.

Background

Along with the development of electronic information, the use of the PCB is more and more extensive, and various components and parts on the PCB are fixedly installed on the PCB mainly in a welding mode of a welding disc. The lead holes and the surrounding copper foil on the PCB are called pads. The pins of the components penetrate through the lead holes, are fixed on the PCB by soldering tin, and the copper foils of the bonding pads are connected through the printed wires, so that the electrical connection of the components on the PCB is completed, and the functions of the PCB are realized.

However, the space utilization of the PCB board in the market is unreasonable, and more functions cannot be realized in smaller equipment, which greatly limits the application prospect of the PCB board.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the application is to provide a printed circuit board structure, a testing device and an electronic device, so as to solve the problem that the utilization of the space of a PCB board in the prior art is unreasonable.

In order to achieve the above object, a first aspect of embodiments of the present application also provides a printed wiring board structure,

the printed wiring board structure includes:

a PCB substrate;

n independent pads are arranged on the PCB substrate, and N is a positive integer;

the common bonding pad is arranged on the PCB substrate and is used for being respectively connected with the N independent bonding pads through N independent wires;

and the N independent wires are arranged on the PCB substrate.

In one embodiment, the printed wiring board structure further includes:

and the packaging assembly is used for packaging the PCB substrate.

In one embodiment, the N independent pads are respectively disposed in the edge region of the PCB substrate with the common pad as a center.

In one embodiment, N of the individual pads are symmetrically disposed about the common pad.

In one embodiment, N independent bonding pads are arranged in parallel, and the distance between every two adjacent independent bonding pads is larger than 1mm.

In one embodiment, the N independent pads are respectively arranged on two sides of the PCB substrate;

and both sides of the PCB substrate are provided with at least one shared bonding pad, and the independent bonding pad on each side is connected with the corresponding shared bonding pad through the corresponding independent routing.

In one embodiment, each independent wire is connected with at least one component.

In one embodiment, a resistor is connected to at least one of the independent wires, and a capacitor is connected to at least one of the independent wires.

The second aspect of the embodiments of the present application further provides a testing apparatus, wherein the testing apparatus includes the printed wiring board structure according to any one of the above-mentioned items.

The third aspect of the embodiments of the present application further provides an electronic device, where the electronic device includes the printed wiring board structure according to any one of the above-mentioned items.

The application provides a printed wiring board structure, testing arrangement and electronic equipment, wherein, the printed wiring board structure includes: the PCB comprises a PCB substrate, N independent bonding pads and a shared bonding pad, wherein the N independent bonding pads are arranged on the PCB substrate, and N is a positive integer; the shared bonding pad is arranged on the PCB substrate and is used for being respectively connected with the N independent bonding pads through N independent wires; the N independent wires are arranged on the PCB substrate, and the PCB package is divided into the independent pads and the shared pads, so that different circuits can use the same shared pad, the shared pads and the independent pads are flexibly configured, the number of the shared pads is saved, the space saving of the PCB is realized, and more functions are compatible in the limited PCB space.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of a printed wiring board structure provided in an embodiment of the present application;

fig. 2 is an exploded schematic view of a printed wiring board structure provided in an embodiment of the present application;

fig. 3 is a schematic structural diagram of another printed circuit board structure according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of another printed circuit board structure according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of another printed circuit board structure according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of another printed circuit board structure according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of another printed circuit board structure according to an embodiment of the present disclosure.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of and not restrictive on the broad application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the application and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be constructed in operation as a limitation of the application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

Printed Circuit Boards (PCBs) are providers of electrical connections for electronic components. In recent years, with the rapid development of modern electronic technology, most devices such as communication devices and the like have been further reduced in size and made more compact, and this trend requires built-in optical devices to be also reduced in size and made more compact, and thus a plurality of circuit boards need to be accommodated inside.

Printed circuit boards, however, are also becoming more widely used in the electronics field. The most common device packaging modes in the printed circuit board are 0805 and 1206 packages (0805 packages and 1206 packages are mainly different in mechanical size, the device size of 0805 packages is 80mil × 50mil in length × width, and the device size of 1206 packages is 120mil × 60mm in length × width), but compatible pads in the prior art are only formed by reducing 1206 package spacing and pad inner spacing so as to be compatible with 0805 devices, so that the probability of displacement of 0805 after reflow soldering is increased, and the packaging structure of each device on the printed circuit board can only be used for mounting incoming materials of the device.

Therefore, the PCB on the market at present has unreasonable space utilization, cannot realize more functions in smaller equipment, and greatly limits the application prospect of the PCB.

In order to solve the above technical problem, a first aspect of the embodiments of the present application further provides a printed circuit board structure, as shown in fig. 1, the printed circuit board structure includes: PCB base plate, N independent pad and sharing pad.

Specifically, N independent pads are disposed on the PCB substrate 100, N is a positive integer, the common pad is disposed on the PCB substrate 100, and the common pad is used for connecting the N independent pads through the N independent wires, respectively; wherein, N independent wires are disposed on the PCB substrate 100.

In this embodiment, N independent pads are disposed on the PCB substrate 100 and used for connecting N components, where N components connected by the N independent pads may be the same or different. The number of the independent bonding pads is N, and N is a positive integer, and it can be understood that the naming mode of the N independent bonding pads is as follows: a first independent pad 11, a second independent pad 12, \ 8230, and an Nth independent pad 1N. In the embodiment, the application requirements of different printed circuit boards can be met by arranging the N independent bonding pads, the application scene of the printed circuit boards is expanded, and the functions of the different printed circuit boards are met.

In this embodiment, the common pad is used to connect N independent pads respectively through N independent traces. For example, referring to fig. 1, the first common pad 21 is connected to the first individual pad 11 by a first individual trace, the first common pad 21 is connected to the second individual pad 12 by a second individual trace, and so on. The first independent wire and the second independent wire are not communicated and are not connected with each other, so that the shared bonding pad can be sequentially connected to the N independent bonding pads, each independent bonding pad is sequentially and sequentially controlled, and the function corresponding to each independent bonding pad is realized.

Through setting up the sharing pad and connecting N independent pads respectively through N independent lines of walking, reduced the quantity of sharing pad, can be so that the more reasonable utilization in space on the PCB board, can further reduce PCB base plate 100's size, increase printed wiring board's application prospect.

In one embodiment, the PCB substrate 100 is a basic material for manufacturing a PCB, and generally, the PCB substrate 100 is a Copper Clad Laminate, and the single-sided and double-sided printed boards are manufactured by selectively performing processes such as via-machining, electroless Copper-plating, electro-Copper-plating, and etching on a substrate material, i.e., a Copper Clad Laminate (CCL), to obtain a desired circuit pattern.

The other type of multilayer printed board is also manufactured by using a core thin copper-clad foil board as a base, and alternately laminating and bonding the conductive pattern layers and the prepregs together at one time to form interconnection among more than 3 conductive pattern layers. The PCB substrate 100 has functions of conduction, insulation, and support, and has a wide application range.

In one embodiment, the PCB substrate 100 may be any one of a phenol PCB paper substrate, a composite PCB substrate, a glass fiber PCB substrate, and a metal substrate.

In one embodiment, the phenolic PCB paper substrate is composed of pulp wood pulp and the like, and is sometimes called as paperboard, V0 board, flame retardant board, 94HB and the like, and its main material is wood pulp fiber paper, and is a PCB board synthesized by pressing phenolic resin. XPC, FR-1, FR-2, FE-3 and the like are common in the phenolic PCB paper substrate.

In one embodiment, the composite PCB substrate is also called a powder board, and is made of wood pulp fiber paper or cotton pulp fiber paper as a reinforcing material, and glass fiber cloth as a surface layer reinforcing material, wherein the two materials are made of flame retardant epoxy resin. The composite substrate comprises single-sided half glass fibers 22F, CEM-1, double-sided half glass fiber plates CEM-3 and the like, wherein the CEM-1 and the CEM-3 are the most common composite substrates at present. The composite PCB substrate has the advantages of low cost, corrosion resistance, long service life and the like.

In one embodiment, the fiberglass PCB substrate, also known as epoxy board, fiberglass board, FR4, fiberboard, etc., is formed using epoxy resin as a binder and fiberglass cloth as a reinforcement material. The circuit board has higher working temperature and little influence by environment, is usually used for a double-sided PCB, but has higher price compared with a composite PCB substrate, and the common thickness is 1.6MM. The substrate is suitable for various power supply boards and high-level circuit boards, and is widely applied to computers, peripheral equipment, communication equipment and the like. The glass fiber PCB substrate has the advantages of high temperature resistance, small environmental influence and the like.

In one embodiment, referring to fig. 2, the printed wiring board structure further includes: the package assembly 200, the package assembly 200 is used for packaging the PCB substrate 100.

Specifically, the packaging assembly comprises connecting the bonding pad of the wafer to the pin of the frame pad by using an ultrafine metal wire or conductive resin, so that N independent pads are connected with the common pad, the common pad can be connected with an external circuit to form an integrated circuit with a specific specification, and finally, the printed circuit board is packaged and protected by using a plastic shell so as to protect the chip element on the printed circuit board from being damaged by external force. The printed circuit board can be better protected from the influence of the external environment by adding the packaging assembly, the service life of the printed circuit board is prolonged, and the cost is saved.

In one embodiment, the N independent pads are respectively disposed at the edge region of the PCB substrate 100 centering on the common pad.

In this embodiment, the N independent pads are respectively disposed around the common pad, so that routing between the common pad and the N independent pads can be simplified, routing between the common pad and the N independent pads is simpler and clearer, and routing between the common pad and the N independent pads is more neat and beautiful.

In this embodiment, set up N independent pad in PCB base plate 100's border region, can be in the inspection and the maintenance of going on by maintainer in the future, if find that certain a component goes wrong, also make things convenient for the maintenance to change more, have advantages such as convenient save time.

In one embodiment, the N independent pads are symmetrically arranged with the common pad.

In this embodiment, the N independent pads are respectively symmetrically arranged with respect to the common pad, so that routing between the common pad and the N independent pads can be simplified, routing between the common pad and the N independent pads is simpler and clearer, and routing between the common pad and the N independent pads is more neat and beautiful.

Specifically, referring to fig. 3, the first common pad 21 is located at a central position of the PCB substrate 100, and the first individual pad 11, the second individual pad 12, the third individual pad 13, the fourth individual pad 14, the fifth individual pad 15, and the sixth individual pad 16 are symmetrically disposed with respect to the first individual pad. N independent pads are respectively arranged symmetrically relative to the shared pad, so that the overall structure of the printed circuit board is more balanced and is not easy to deform, the printed circuit board is in a relatively balanced state under the condition of no external interference, and the application scenes of the printed circuit board can be increased.

In one embodiment, the N independent bonding pads are arranged in parallel, and the distance between the adjacent independent bonding pads is larger than 1mm.

In this embodiment, when the printed circuit board is in operation, because each component generates electromagnetic interference when being powered on, the printed circuit board may generate differential mode interference or common mode interference. The reason for generating the differential mode interference or the common mode interference is that corresponding common mode interference current and differential mode interference current exist in different components on the single board PCB.

In the embodiment, the N independent bonding pads are arranged in parallel, and the distance between every two adjacent independent bonding pads is larger than 1mm, so that each independent bonding pad can work independently, and the mutual influence between the adjacent independent bonding pads is reduced.

In one embodiment, the N independent pads are respectively disposed on two sides of the PCB substrate 100, and at least one common pad is disposed on each of the two sides of the PCB substrate 100, and the independent pad on each side is connected to the corresponding common pad through the corresponding independent trace.

In this embodiment, both sides of the PCB substrate 100 are respectively provided with an independent pad and a common pad, and each independent pad is connected with the corresponding common pad through an independent trace. The independent pads can be connected with the common pads arranged on the same side of the PCB through independent wiring, and the independent pads can also be connected with the common pads arranged on the other side of the PCB, so that different functions are realized, different application requirements are met, the independent pads and the corresponding common pads are connected through corresponding independent wiring, the space of the PCB is further saved, and the size of a printed circuit board is reduced.

In one embodiment, each individual trace has at least one component connected thereto.

Specifically, every independently walk and all be connected with at least one components and parts on the line, each components and parts correspond an independent pad, and through walking the line independently with different components and parts and being connected through the difference, can realize the function of different components and parts to realize different functions, satisfy different application demand.

In one embodiment, a resistor is connected to at least one independent wire, and a capacitor is connected to at least one independent wire.

In the embodiment, the resistor and the capacitor are connected to the independent wires, so that the filtering function is realized, the resistor and the capacitor are welded through different independent bonding pads and then connected to one shared bonding pad, the number of the shared bonding pads is reduced, and the cost is reduced.

In one embodiment, referring to fig. 4, the printed wiring board may perform circuit testing during the debugging stage with the second common pad 22 through the first independent pad 11 and the pull-up resistor R1, through the second independent pad 12 and the pull-down resistor R2, and through the third independent pad 13 and the capacitor C1, but the actual circuit is not used. By adopting the design scheme, the printed circuit board needs one shared bonding pad and three independent bonding pads instead of 6 bonding pads (6 bonding pads are needed for 3 RC filters), and the space of 2 bonding pads is saved.

In one embodiment, referring to fig. 5, the printed wiring board needs to implement two compatible designs, that is, the third common pad 23 is connected to the resistor R3 through the third independent pad 13 to implement the first function, and the third common pad 23 is connected to the resistor R4 through the fourth independent pad 14 to implement the second function as needed, so that two optional functions are implemented.

In one embodiment, referring to fig. 6, the printed wiring board includes two common pads and five independent pads, wherein the two common pads are the fourth common pad 24 and the fifth common pad 25.

In the present embodiment, the fifth individual pad 15 is connected to the resistor R5 through the fourth common pad 24, and extends from the sixth individual pad 16, and the eighth individual pad 18 is connected to the ninth individual pad 19 through the fifth common pad 25 and the resistor R7. The eighth individual pad 18 is connected through the fifth common pad 25 and the resistor R6, and comes out of the seventh individual pad 17, thereby reducing the number of common pads and thus reducing the cost.

In one embodiment, referring to fig. 7, the fourth common pad 24 and the fifth common pad 25 are connected, and the fifth individual pad 15 is led out from the eighth individual pad 18 through the fourth common pad 24 and the fifth common pad 25. Thereby reducing the number of common pads and thus reducing costs.

The embodiment of the application also provides a testing device, which comprises the printed circuit board structure as described in any one of the above items.

An embodiment of the present application further provides an electronic device, which includes the printed circuit board structure as described in any one of the above.

The application provides a printed wiring board structure, testing arrangement and electronic equipment, wherein, the printed wiring board structure includes: the PCB comprises a PCB substrate 100, N independent bonding pads and a common bonding pad, wherein the N independent bonding pads are arranged on the PCB substrate 100, and N is a positive integer; the common bonding pad is arranged on the PCB substrate 100 and is used for being respectively connected with the N independent bonding pads through the N independent wires; on PCB base plate 100 was located to N independent routes, through dividing the PCB encapsulation into independent pad and sharing pad, can be so that different circuits use same sharing pad, carry out the nimble configuration of sharing pad and independent pad, practiced thrift the number of sharing pad, realized the saving in PCB space, more functions have been compatible in limited PCB space.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A printed wiring board structure, characterized in that the printed wiring board structure comprises:

a PCB substrate;

the shared bonding pad is arranged on the PCB substrate and is used for being respectively connected with the N independent bonding pads through N independent wires;

and the N independent wires are arranged on the PCB substrate.

2. The printed wiring board structure of claim 1, wherein said printed wiring board structure further comprises:

and the packaging assembly is used for packaging the PCB substrate.

3. The printed wiring board structure of claim 1, wherein N of the independent pads are respectively provided in edge regions of the PCB substrate centering on the common pad.

4. A printed wiring board structure as in claim 3 wherein N of said individual pads are symmetrically disposed about said common pad.

5. The printed wiring board structure of claim 1, wherein N of said individual pads are juxtaposed and the distance between adjacent individual pads is greater than 1mm.

6. The printed wiring board structure of claim 1, wherein N of said independent pads are respectively provided on both sides of said PCB substrate;

7. A printed wiring board structure as in claim 1, wherein at least one component is connected to each of said individual traces.

8. A printed wiring board structure as claimed in claim 7, wherein a resistor is connected to at least one of said independent traces, and a capacitor is connected to at least one of said independent traces.

9. A testing device, characterized in that it comprises a printed wiring board structure according to any of claims 1-8.

10. An electronic device characterized by comprising the printed wiring board structure according to any one of claims 1 to 8.