CN109121294B - Circuit board structure and electronic equipment - Google Patents
Circuit board structure and electronic equipment Download PDFInfo
- Publication number
- CN109121294B CN109121294B CN201811156325.3A CN201811156325A CN109121294B CN 109121294 B CN109121294 B CN 109121294B CN 201811156325 A CN201811156325 A CN 201811156325A CN 109121294 B CN109121294 B CN 109121294B
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- circuit board
- groove
- electronic components
- board structure
- circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a circuit board structure which comprises a first circuit board and a second circuit board arranged on the surface of the first circuit board, wherein at least one of the first circuit board and the second circuit board is provided with a groove, the first circuit board and the second circuit board are welded and fixed, and an accommodating space for accommodating electronic components is formed at the groove. The invention also discloses an electronic device. Above-mentioned scheme can solve present circuit board structure and have the great problem of the welding degree of difficulty.
Description
Technical Field
The invention relates to a circuit board structure and electronic equipment.
Background
With the development of electronic equipment and the improvement of user requirements, more and more electronic components are integrated in the current electronic equipment, so that the functions of the electronic equipment are more and more. In consideration of portability of electronic devices, the overall size of the electronic devices is generally small, so that the integration level of electronic components in the electronic devices is higher and higher, and it is particularly necessary to fully utilize the space in the housing of the electronic devices.
Most of electronic components in the electronic equipment are arranged on a circuit board of the electronic equipment, so that the integration level of the current electronic equipment is higher and higher, and the integration level of the circuit board is higher and higher. The size of the whole electronic device is limited, the area of the circuit board cannot be enlarged, and the circuit board is generally arranged into at least two layers in order to arrange more electronic components on the circuit board, so that a three-dimensional circuit board structure is formed. Under the condition, the circuit board structure in the electronic equipment is a stacked structure, so that the occupied area of the circuit board is favorably reduced, and meanwhile, the space for arranging electronic components on the circuit board can be increased.
Referring to fig. 1, fig. 1 is a schematic diagram of a typical circuit board structure. In the structure shown in fig. 1, the first circuit board 101 is supported on the third circuit board 103 through the second circuit board 102, and the second circuit board 102 plays a role of supporting, so that an accommodating space 104 is formed between the first circuit board 101 and the second circuit board 102. In a specific design process, electronic components 105 may be mounted on both the first circuit board 101 and the second circuit board 102 facing the accommodating space 104.
The second circuit board 102 plays a role of electrically connecting the first circuit board 101 and the third circuit board 103, solder points are designed on the board surfaces of the two sides of the second circuit board 102, and corresponding pads are arranged at the positions of the first circuit board 101 and the third circuit board 103 opposite to the solder points. The soldering process between the circuit boards has a high requirement on the flatness of the circuit boards, and poor flatness of the second circuit board 102 affects the soldering quality. Because the face of the both sides of second circuit board 102 all needs the welding, the heat that produces in the welding process can lead to second circuit board 102 local heating and take place deformation, when the welding of one side of second circuit board 102 was accomplished, often leads to the roughness of the face of second circuit board 102 opposite side to receive bad influence, and then can influence the welding of the face of the opposite side of second circuit board 102, it is thus obvious that there is the great problem of the welding degree of difficulty in present circuit board structure.
Disclosure of Invention
The invention discloses a circuit board structure, which aims to solve the problem that the existing circuit board structure is difficult to weld.
In order to solve the problems, the invention adopts the following technical scheme:
the circuit board structure comprises a first circuit board and a second circuit board arranged on the board surface of the first circuit board, at least one of the first circuit board and the second circuit board is provided with a groove, and the first circuit board and the second circuit board are welded and fixed and are butted at the groove to form an accommodating space for mounting electronic components.
Electronic equipment, including the casing with set up circuit board structure in the casing, circuit board structure be above-mentioned circuit board structure.
The technical scheme adopted by the invention can achieve the following beneficial effects:
in the circuit board structure disclosed by the invention, the structures of the first circuit board and the second circuit board can be adjusted to enable at least one of the first circuit board and the second circuit board to be provided with the groove, and then the first circuit board and the second circuit board form an accommodating space at the groove, so that more electronic components are arranged in a three-dimensional structure formed by the first circuit board and the second circuit board. Compared with the prior art in which the accommodating space is formed by welding three circuit boards, the circuit board structure disclosed in the embodiment can form the accommodating space by using fewer circuit boards, so that the first circuit board and the second circuit board only need to be welded together in the welding and assembling process, and the welding difficulty can be reduced.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of a typical circuit board structure in the prior art;
fig. 2 is a schematic structural diagram of a first circuit board structure according to an embodiment of the disclosure;
FIG. 3 is a schematic structural diagram of a second circuit board shown in FIG. 2;
fig. 4 is a schematic structural diagram of a second circuit board structure according to an embodiment of the disclosure;
FIG. 5 is a schematic structural diagram of the second circuit board in FIG. 4;
FIG. 6 is a schematic structural diagram of a third circuit board structure according to an embodiment of the disclosure;
FIG. 7 is a schematic structural diagram of a fourth circuit board structure according to an embodiment of the disclosure;
fig. 8 is a schematic structural diagram of a fifth circuit board structure according to the embodiment of the present invention.
Description of reference numerals:
101-a first circuit board, 102-a second circuit board, 103-a third circuit board, 104-a containing space, 105-an electronic component;
110-first circuit board, 120-second circuit board, 121-groove, 130-containing space, 140-second circuit board, 141-groove, 142-opening, 150-containing space, 110 '-first circuit board, 120' -second circuit board;
210-first circuit board, 211-groove, 220-second circuit board, 230-accommodation space;
310-a first circuit board, 311-a first groove, 320-a second circuit board, 321-a second groove, 330-a containing space;
410-mounting base, 411-supporting part, 412-space, 420-screw.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.
The embodiment of the invention discloses a circuit board structure which comprises a first circuit board and a second circuit board, wherein the second circuit board is arranged on the board surface of the first circuit board and is welded and fixed with the first circuit board.
In this embodiment, at least one of the first circuit board and the second circuit board has a groove, and the first circuit board and the second circuit board are fixedly connected and form an accommodating space at the groove. Electronic components can be mounted on the board surface of the accommodating space formed by the first circuit board and the second circuit board. The structure can realize the distribution of electronic components in a three-dimensional space, and further can achieve higher integration level.
In the circuit board structure disclosed by the embodiment of the invention, the structures of the first circuit board and the second circuit board can be adjusted to enable at least one of the first circuit board and the second circuit board to be provided with the groove, and then the first circuit board and the second circuit board are butted to form an accommodating space at the groove, so that more electronic components are arranged in a three-dimensional structure formed by the first circuit board and the second circuit board. Compared with the prior art in which the accommodating space is formed by welding three circuit boards, the circuit board structure disclosed in the embodiment can form the accommodating space by using fewer circuit boards, so that the first circuit board and the second circuit board only need to be welded together in the welding and assembling process, and the welding difficulty can be reduced.
In addition, the whole circuit board structure is welded by the first circuit board and the second circuit board, so that the welding difficulty is reduced, and the circuit board structure is easier to disassemble and maintain when the subsequent circuit board structure is maintained.
In order to facilitate an understanding of the above, several more specific circuit board structures will now be described in conjunction with the accompanying drawings, based on the above description.
Referring to fig. 2, in the first circuit board structure disclosed in the embodiment of the present invention, a groove 121 is formed on a surface of the second circuit board 120 facing the first circuit board 110, and the surface of the first circuit board 110 facing the second circuit board 120 is a plane. The first circuit board 110 and the second circuit board 120 are fixedly connected by welding (soldering), and the surface of the first circuit board 110 facing the second circuit board 120 and the groove 121 form an accommodating space 130. The electronic component a disposed on the surface of the first circuit board 110 facing the second circuit board 120 is located in the accommodating space 130.
In the circuit board structure shown in fig. 2, only the second circuit board 120 is provided with the groove 121, as shown in fig. 3, and then the first circuit board 110 is butted with the second circuit board 120 to form the accommodating space 130, without performing structural adjustment on the first circuit board 110, so that the operation is simpler and more convenient.
Referring to fig. 2, the circuit board structure disclosed in the embodiment of the present invention may further include a mounting base 410, and the mounting base 410 may be regarded as a mounting bracket of the circuit board structure, so as to facilitate the mounting of the circuit board structure. The mounting base 410 has a supporting portion 411, the first circuit board 110 is lapped on the supporting portion 411, and the first circuit board 110 is fixedly connected with the supporting portion 411. The supporting portion 411 supports the whole circuit board structure, so that the whole circuit board structure forms a suspension structure, and finally, the electronic components are conveniently arranged on each board surface located on the outer side.
Specifically, the first circuit board 110 may be located between the second circuit board 120 and the mounting base 410, the surface of the first circuit board 110 away from the second circuit board 120 is provided with an electronic component B1, and the electronic component B1 is located in the space 412 between the mounting base 410 and the first circuit board 110.
For convenience of installation, in a preferred embodiment, two ends of the first circuit board 110 are respectively overlapped on the two supporting portions 411 and fixedly connected with the supporting portions 411, and the second circuit board 120 is located between the two supporting portions 411. Specifically, the first circuit board 110 may be fixedly connected to the supporting portion 411 by a screw 420. Of course, the first circuit board 110 and the supporting portion 411 may be fixedly connected in other manners, for example, the first circuit board 110 may be fixedly connected to the supporting portion 411 by adhesion.
In this embodiment, the second circuit board 120 may include at least two sub-circuit boards, at least two sub-circuit boards are stacked, and two adjacent sub-circuit boards are fixedly connected. Usually, two adjacent sub circuit boards are bonded by glue, and welding is avoided. At least two sub circuit boards are electrically connected through wires.
In this embodiment, electronic components may be mounted on the board surfaces of the two sides of the first circuit board, and electronic components may also be mounted on the board surfaces of the two sides of the second circuit board. Under this condition, the electronic components that set up on the relative face of first circuit board and second circuit board all can set up in accommodation space.
Referring to fig. 4, specifically, the board surfaces on the two sides of the first circuit board 110 are respectively provided with an electronic component a1 and an electronic component B1, and the board surfaces on the two sides of the second circuit board 140 are respectively provided with an electronic component C1 and an electronic component D1, that is, the board surface of the second circuit board 140 away from the first circuit board 110 is provided with an electronic component D1, and the bottom surface of the groove 141 of the second circuit board 140 is provided with an electronic component C1. Both the electronic component a1 and the electronic component C1 are provided in the accommodating space 150. In the above structure, the thickness of the second circuit board 140 may be increased, so that the depth of the groove 141 may be larger, and finally the formed accommodating space 150 may accommodate the electronic component a1 and the electronic component C1 at the same time. It is clear that the circuit board structure shown in fig. 4 enables more electronic components to be arranged, which further improves the integration.
As shown in fig. 4, the electronic component C1 is disposed on the bottom surface of the groove 141, so as to facilitate printing of solder paste on the bottom surface of the groove 141, preferably, referring to fig. 5, at least one end of the groove 141 is provided with an opening 142, the opening 142 is communicated with the space in the groove 141, during the operation, an operator or a processing device may extend into the groove 141 from the opening 142, and then the solder paste is printed on the bottom surface of the groove 141. The groove 141 with the above structure can facilitate the operation of printing solder paste without affecting the formation of the accommodating space 150.
Referring to fig. 6, fig. 6 is a schematic structural diagram of a third circuit board structure according to an embodiment of the disclosure. In the circuit board structure shown in fig. 6, a surface of the first circuit board 210 facing the second circuit board 220 may be formed with a groove 211, and a surface of the second circuit board 220 facing the first circuit board 210 may be a plane. The first circuit board 210 and the second circuit board 220 are fixedly connected by welding (soldering), and an accommodating space 230 is formed between the surface of the second circuit board 220 facing the first circuit board 210 and the groove 211. The electronic component a2 provided in the recess 211 is located in the accommodation space 230.
In the circuit board structure shown in fig. 6, only the first circuit board 210 is provided with the groove 211, and then the first circuit board 210 is butted with the second circuit board 220 to form the accommodating space 230, without performing structural adjustment on the second circuit board 220, so that the operation is simpler and more convenient. In fig. 6, no electronic component is disposed on the surface of the second circuit board 220 facing the first circuit board 210, and in an actual operation process, an electronic component may also be disposed on the surface of the second circuit board 220 facing the first circuit board 210.
Similarly, in order to print solder paste on the bottom surface of the groove 211 conveniently, at least one end of the groove 211 is provided with an opening, and an operator or process equipment can stretch into the groove 211 through the opening, so as to print solder paste on the bottom surface of the groove 211, thereby providing conditions for the subsequent setting of electronic components.
Referring to fig. 7, a schematic structural diagram of a fourth circuit board structure disclosed in the embodiment of the present invention is shown in fig. 7, in the structure shown in fig. 7, grooves are respectively formed on opposite board surfaces of the first circuit board 310 and the second circuit board 320, the first groove 311 and the second groove 321 are respectively formed, after the first circuit board 310 and the second circuit board 320 are welded and fixed, a notch of the first groove 311 is butted with a notch of the second groove 321 to form an accommodating space 330, and a notch edge of the first groove 311 is welded and fixed with a notch edge of the second groove 321, so as to fixedly connect the first circuit board 310 and the second circuit board 320.
In the circuit board structure shown in fig. 7, the first circuit board 310 and the second circuit board 320 are both provided with a groove, and then the two grooves (i.e., the first groove 311 and the second groove 321) form the accommodating space 330, so that the space in the thickness direction of the first circuit board 310 and the second circuit board 320 can be fully utilized for hollowing, a larger space in the height direction (i.e., the thickness direction of the first circuit board 310 or the thickness direction of the second circuit board 320) is easier to form, and the accommodating space 330 can accommodate electronic components with a larger height.
As described above, the first circuit board 110 is overlapped on the supporting portion 411, thereby achieving a fixed connection with the supporting portion 411. Of course, the second circuit board 120 'may be lapped on the supporting portion 411, and the second circuit board 120' is fixedly connected to the supporting portion 411, in which case, the first circuit board 110 'is mounted on the basis of the second circuit board 120', as shown in fig. 8.
Based on the circuit board structure disclosed by the embodiment of the invention, the embodiment of the invention discloses electronic equipment, and the disclosed electronic equipment comprises a shell and a circuit board structure arranged in the shell, wherein the circuit board structure is the circuit board structure described above.
The electronic device disclosed in the embodiment of the present invention may be a tablet computer, a smart phone, a game machine, an electronic book reader, a wearable device (e.g., a smart watch), and the like, and the specific type of the electronic device is not limited in the embodiment of the present invention.
In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (9)
1. The circuit board structure is characterized by comprising a first circuit board and a second circuit board arranged on the surface of the first circuit board, wherein at least one of the first circuit board and the second circuit board is provided with a groove, the first circuit board and the second circuit board are welded and fixed, accommodating spaces for installing electronic components are formed at the positions of the grooves, the number of the accommodating spaces is 1,
a plurality of electronic components are arranged on at least one of the surface of the first circuit board opposite to the second circuit board and the surface of the second circuit board opposite to the first circuit board,
when a plurality of electronic components are arranged on the surface of the first circuit board opposite to the second circuit board, the plurality of electronic components arranged on the surface of the first circuit board opposite to the second circuit board are all positioned in the accommodating space,
when a plurality of electronic components are arranged on the surface of the second circuit board opposite to the first circuit board, the plurality of electronic components arranged on the surface of the second circuit board opposite to the first circuit board are all positioned in the accommodating space;
at least one end of the groove is provided with an opening, and the opening is used for allowing an operator or process equipment to stretch into the groove so as to print solder paste on the bottom surface of the groove.
2. The circuit board structure of claim 1, wherein the second circuit board has the recess formed on a surface thereof facing the first circuit board, and the surface of the first circuit board facing the second circuit board is a plane.
3. The circuit board structure according to claim 2, wherein the second circuit board comprises at least two sub-circuit boards, at least two of the sub-circuit boards are stacked, and adjacent two of the sub-circuit boards are fixedly connected.
4. The circuit board structure of claim 2, wherein the surface of the second circuit board facing away from the first circuit board and the bottom surface of the groove are provided with electronic components.
5. The circuit board structure of claim 1, wherein the groove is formed on the surface of the first circuit board facing the second circuit board, and the surface of the second circuit board facing the first circuit board is a plane.
6. The circuit board structure of claim 1, wherein the opposite surfaces of the first circuit board and the second circuit board are respectively provided with the grooves, the grooves are respectively a first groove and a second groove, the notch of the first groove is butted with the notch of the second groove to form the accommodating space, and the edge of the notch of the first groove is fixedly connected with the edge of the notch of the second groove by welding.
7. The circuit board structure according to claim 1, further comprising a mounting base, wherein the mounting base has a supporting portion, the first circuit board or the second circuit board is overlapped on the supporting portion and is fixedly connected with the supporting portion, the first circuit board is located between the second circuit board and the mounting base, and the electronic component on the surface of the first circuit board, which is away from the second circuit board, is located in a space between the first circuit board and the mounting base.
8. The circuit board structure according to claim 7, wherein two ends of the first circuit board are respectively lapped on the two supporting portions and are fixedly connected with the supporting portions, and the second circuit board is located between the two supporting portions.
9. Electronic equipment, characterized in that it comprises a housing and a circuit board structure arranged inside the housing, the circuit board structure being the circuit board structure of any of claims 1-8.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811156325.3A CN109121294B (en) | 2018-09-29 | 2018-09-29 | Circuit board structure and electronic equipment |
| PCT/CN2019/107751 WO2020063643A1 (en) | 2018-09-29 | 2019-09-25 | Circuit board structure and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811156325.3A CN109121294B (en) | 2018-09-29 | 2018-09-29 | Circuit board structure and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109121294A CN109121294A (en) | 2019-01-01 |
| CN109121294B true CN109121294B (en) | 2020-09-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811156325.3A Active CN109121294B (en) | 2018-09-29 | 2018-09-29 | Circuit board structure and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109121294B (en) |
| WO (1) | WO2020063643A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110165443B (en) * | 2019-05-24 | 2021-10-22 | 维沃移动通信有限公司 | Circuit board stacking structure, mounting method and terminal |
| CN110621122A (en) * | 2019-09-03 | 2019-12-27 | Oppo（重庆）智能科技有限公司 | Manufacturing method of multilayer circuit board, multilayer circuit board and electronic equipment |
| CN110958771B (en) * | 2019-12-10 | 2021-02-12 | 维沃移动通信有限公司 | Integrated circuit board and electronic equipment |
| CN113645759B (en) * | 2021-08-09 | 2024-03-12 | 维沃移动通信有限公司 | Circuit board assembly, electronic equipment and processing method of circuit board assembly |
| CN113727514A (en) * | 2021-08-26 | 2021-11-30 | 维沃移动通信有限公司 | Circuit board assembly and electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010005313A1 (en) * | 1999-12-22 | 2001-06-28 | Shigetsugu Muramatsu | Unit interconnection substrate, interconnection substrate, mount structure of electronic parts, electronic device, method for mounting electronic parts, and method for manufacturing electronic device |
| JP2005167112A (en) * | 2003-12-05 | 2005-06-23 | Yaskawa Electric Corp | Electronic apparatus |
| US7638866B1 (en) * | 2005-06-01 | 2009-12-29 | Rockwell Collins, Inc. | Stacked packaging designs offering inherent anti-tamper protection |
| CN104335342A (en) * | 2012-03-13 | 2015-02-04 | 英特尔公司 | Microelectronic device attachment on a reverse microelectronic package |
| CN204377298U (en) * | 2015-02-03 | 2015-06-03 | 广东美的暖通设备有限公司 | For household electrical appliance circuit board mounting structure and there are its household electrical appliance |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001267710A (en) * | 2000-03-15 | 2001-09-28 | Sony Corp | Electronic circuit device and multilayer printed wiring board |
| US7444737B2 (en) * | 2006-12-07 | 2008-11-04 | The Boeing Company | Method for manufacturing an antenna |
| US9331058B2 (en) * | 2013-12-05 | 2016-05-03 | Apple Inc. | Package with SoC and integrated memory |
-
2018
- 2018-09-29 CN CN201811156325.3A patent/CN109121294B/en active Active
-
2019
- 2019-09-25 WO PCT/CN2019/107751 patent/WO2020063643A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010005313A1 (en) * | 1999-12-22 | 2001-06-28 | Shigetsugu Muramatsu | Unit interconnection substrate, interconnection substrate, mount structure of electronic parts, electronic device, method for mounting electronic parts, and method for manufacturing electronic device |
| JP2005167112A (en) * | 2003-12-05 | 2005-06-23 | Yaskawa Electric Corp | Electronic apparatus |
| US7638866B1 (en) * | 2005-06-01 | 2009-12-29 | Rockwell Collins, Inc. | Stacked packaging designs offering inherent anti-tamper protection |
| CN104335342A (en) * | 2012-03-13 | 2015-02-04 | 英特尔公司 | Microelectronic device attachment on a reverse microelectronic package |
| CN204377298U (en) * | 2015-02-03 | 2015-06-03 | 广东美的暖通设备有限公司 | For household electrical appliance circuit board mounting structure and there are its household electrical appliance |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109121294A (en) | 2019-01-01 |
| WO2020063643A1 (en) | 2020-04-02 |
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