JP2005167112A - Electronic apparatus - Google Patents

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Publication number
JP2005167112A
JP2005167112A JP2003406811A JP2003406811A JP2005167112A JP 2005167112 A JP2005167112 A JP 2005167112A JP 2003406811 A JP2003406811 A JP 2003406811A JP 2003406811 A JP2003406811 A JP 2003406811A JP 2005167112 A JP2005167112 A JP 2005167112A
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Japan
Prior art keywords
printed circuit
circuit board
housing
base
electronic device
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JP2003406811A
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Japanese (ja)
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Toshio Nagao
敏男 長尾
Kunihiro Takenaka
国浩 竹中
Tetsuya Ito
徹也 伊藤
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Yaskawa Electric Corp
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Yaskawa Electric Corp
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Priority to JP2003406811A priority Critical patent/JP2005167112A/en
Publication of JP2005167112A publication Critical patent/JP2005167112A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic apparatus wherein a plurality of printed boards are attached easily in a laminating way to its housing and the attaching manhour thereof is so cut down as to be able to ground easily the printed boards to its housing. <P>SOLUTION: In the electronic apparatus D attached to a housing S and having a printed board 2 having electronic components E mounted, a plate-form base 1 is interposed between the printed board 2 and the housing S as to squeeze metal spacers 4 into the four corners of the base 1. Each spacer 4 is in circularly cylindrical form and has a step portion 4A having its end diameter smaller than its root diameter. Further, in opposite surface of the printed board 2 to the respective spacers 4 attached to the four corners of the base 1, attaching holes 2A for inserting thereinto the spacers 4 are bored so as to provide on the reverse-side surface of each printed board 2 to the housing S metal spring pins 3 for engaging therewith the spacers 4 inserted from the rear side of the attaching holes 2A of each printed board 2 into the front side thereof. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、電子部品を実装した複数の回路基板をねじ等の締結具により取り付ける電子装置に関する。   The present invention relates to an electronic device for attaching a plurality of circuit boards on which electronic components are mounted with fasteners such as screws.

従来、電子部品を実装した複数のプリント基板をねじ等の締結具により取り付ける電子装置は、図６のようになっている。
図６は第１従来技術によるプリント基板の取付状態を示す電子装置の分解斜視図である。
図において、２１はベース、２１Ａは雌ネジ部、２２はプリント基板、２２Ａは基板取付孔、２３はネジ、Ｄは電子装置、Ｅは電子部品である。
プリント基板２２とベース２１よりなる電子装置Ｄを組み立てる場合は、プリント基板２２の四隅に設けた基板取付孔２２Ａにネジ２３を通した後、ベース２１の四隅に設けた雌ネジ部２１Ａにねじ込んでプリント基板２２を保持するようになっている。また、プリント基板２２を接地する場合には、ベース２１を導電性材料で構成すると共に、プリント基板２２に設けた基板取付孔２２Ａの裏面（ベース２１との対向面）側に図示しない電極を設けるようにする。
さらに、図７は第１従来技術による上位プリント基板を有する電子装置を筐体に取り付けた場合の分解斜視図である。
図において、２５は上位プリント基板、２６はネジ、Ｓは筐体であり、筐体Ｓは底部のみを図示しており、開口部を構成する側部の図示を省略している。
図６で示した電子装置Ｄは単独で使用するものではなく、図７に示すように、電子装置Ｄの上部に信号の入出力や電源の供給を行うための上位プリント基板２５が設けられ、上位プリント基板２５の四隅に設けた基板取付孔（図示せず）にネジ２６を通した後、ネジ２６を電子装置Ｄ、筐体Ｓ側にねじこんで、上位プリント基板２５を固定するようになっている。 Conventionally, an electronic apparatus for attaching a plurality of printed circuit boards on which electronic components are mounted with fasteners such as screws is as shown in FIG.
FIG. 6 is an exploded perspective view of the electronic device showing the state of attachment of the printed circuit board according to the first prior art.
In the figure, 21 is a base, 21A is a female screw portion, 22 is a printed circuit board, 22A is a board mounting hole, 23 is a screw, D is an electronic device, and E is an electronic component.
When assembling the electronic device D composed of the printed circuit board 22 and the base 21, the screws 23 are passed through the board mounting holes 22 </ b> A provided at the four corners of the printed circuit board 22, and then screwed into the female screw portions 21 </ b> A provided at the four corners of the base 21. The printed circuit board 22 is held. When the printed circuit board 22 is grounded, the base 21 is made of a conductive material, and an electrode (not shown) is provided on the back surface (surface facing the base 21) of the substrate mounting hole 22A provided in the printed circuit board 22. Like that.
Further, FIG. 7 is an exploded perspective view when the electronic device having the upper printed circuit board according to the first prior art is attached to the housing.
In the figure, 25 is a high-order printed circuit board, 26 is a screw, and S is a housing. The housing S shows only the bottom portion, and the side portions constituting the opening are not shown.
The electronic device D shown in FIG. 6 is not used alone. As shown in FIG. 7, an upper printed circuit board 25 for inputting and outputting signals and supplying power is provided on the electronic device D. After the screws 26 are passed through board mounting holes (not shown) provided at the four corners of the upper printed circuit board 25, the screws 26 are screwed into the electronic device D and the housing S side to fix the upper printed circuit board 25. It has become.

次に第２従来技術について説明する。
図８は第２従来技術を示す電子装置の分解斜視図、図９は図８の取付状態を示す側断面図である。
図において、３１はケース本体、３２は蓋体、３３はプリント基板である。
電子装置は、一面に開口を有する略箱状のケース本体３１と、このケース本体３１に取り付けられて開口３１Ｂを閉塞する略板状の蓋体３２と、この蓋体３２の裏面に取り付けられて電子部品Ｅを実装する部品実装面３３Ａを裏面に向けたプリント基板３３とより構成されており、略板状の蓋体３２とプリント基板３３はそれぞれの基板取付部３２Ｂおよび取付孔３３Ｂにより、略箱状のケース本体３１と略板状の蓋体３２はそれぞれの取付孔３１Ａおよび連結孔３２Ａによりねじ等の取付具により固定されている。
このように、電子装置はプリント基板３３を蓋体３２に取り付けた後、ケース本体３１と蓋体３２を取り付ける構成になっている（例えば、特許文献１参照）。
特開平８−２２２８６０号公報（第４頁、第１図、第２図） Next, the second prior art will be described.
FIG. 8 is an exploded perspective view of the electronic device showing the second prior art, and FIG. 9 is a side sectional view showing the attached state of FIG.
In the figure, 31 is a case body, 32 is a lid, and 33 is a printed circuit board.
The electronic device includes a substantially box-shaped case body 31 having an opening on one surface, a substantially plate-shaped lid body 32 that is attached to the case body 31 and closes the opening 31B, and is attached to the back surface of the lid body 32. The component mounting surface 33A for mounting the electronic component E is composed of a printed circuit board 33 with the back surface facing the rear surface. The substantially plate-like lid body 32 and the printed circuit board 33 are approximately formed by respective substrate mounting portions 32B and mounting holes 33B. The box-shaped case main body 31 and the substantially plate-shaped lid body 32 are fixed by attachments such as screws through the respective attachment holes 31A and the connection holes 32A.
As described above, the electronic device is configured to attach the case main body 31 and the lid 32 after the printed circuit board 33 is attached to the lid 32 (see, for example, Patent Document 1).
JP-A-8-222860 (Page 4, FIGS. 1 and 2)

しかしながら、第１従来技術はプリント基板をベースに対してねじにより取り付けるため、上位プリント基板のように複数のプリント基板を重ねて取り付ける場合には工数がかかり、ねじの締め忘れや緩みなどの問題が発生するという問題があった。また、ねじの締め忘れや緩みなどの問題が発生すると、プリント基板内の電極をベース側に接地する際に支障をきたすという問題があった。
また、第２従来技術は、ケース本体に蓋体を取り付けるための取付孔および連結孔、回路基板を蓋体に取り付けるための基板取付部および取付孔が必要であるため、プリント基板の実装面積が削減されるという問題や、プリント基板を複数収納する場合にはさらにスタッドなど締結部材が必要であるため、組み立てが複雑で工数がかかるという問題があった。
本発明は上記問題を解決するためになされたものであり、複数のプリント基板を筐体に容易に重ねて取付けることができると共に、取付工数を削減し、プリント基板の筐体への接地を容易に行うことができる電子装置を提供することを目的とする。 However, since the first prior art attaches the printed circuit board to the base with screws, it takes a lot of work to attach a plurality of printed circuit boards like the upper printed circuit board, and there are problems such as forgetting screw tightening and loosening. There was a problem that occurred. In addition, when a problem such as forgetting screw tightening or loosening occurs, there is a problem in that it interferes with grounding the electrode in the printed circuit board to the base side.
In addition, since the second conventional technique requires an attachment hole and a connection hole for attaching the lid to the case body, and a board attachment portion and an attachment hole for attaching the circuit board to the lid, the mounting area of the printed board is small. There is a problem that it is reduced, and when a plurality of printed circuit boards are stored, a fastening member such as a stud is further required, so that there is a problem that assembly is complicated and man-hours are required.
The present invention has been made to solve the above-described problems, and can easily attach a plurality of printed circuit boards to the casing, reduce the number of mounting steps, and easily ground the printed circuit board to the casing. It is an object of the present invention to provide an electronic device that can be performed in the same manner.

上記問題を解決するため、本発明は、次のように構成したのである。
請求項１に記載の発明は、筐体に取付けられると共に、電子部品を実装したプリント基板を備えた電子装置において、前記プリント基板と前記筐体の間に、平板状のベースが設けられており、前記ベースの四隅に、円筒形状からなり、かつ、先端が根元に比べて径の小さい段差部を有してなる金属製のスペーサが圧入されており、プリント基板は、前記ベースの四隅に取付けられた前記スペーサとそれぞれ対向する面に該スペーサを挿入するための取付孔が設けられており、前記プリント基板の筐体との反対側の面には、前記プリント基板の取付孔に挿入された前記スぺーサと嵌合するためのスプリングピンが設けられていることを特徴としている。
また、請求項２の発明は、請求項１に記載の電子装置において、前記プリント基板を前記電子装置に複数設けた場合に、前記複数のプリント基板の間に前記スプリングピンを交互に設けると共に、前記交互に設けた複数のスプリングピンを前記スペーサと嵌合するようにしたことを特徴としている。
また、請求項３に記載の発明は、請求項１または２に記載の電子装置において、前記ベースの両面に電極を設け、前記筐体、前記ベースおよび前記スプリングピンを導電性材料で構成したことを特徴としている。 In order to solve the above problem, the present invention is configured as follows.
According to the first aspect of the present invention, in an electronic device that is attached to a housing and includes a printed circuit board on which electronic components are mounted, a flat base is provided between the printed circuit board and the housing. Metal spacers having a cylindrical shape and having a step with a small diameter compared to the base are press-fitted into the four corners of the base, and the printed circuit board is attached to the four corners of the base. A mounting hole for inserting the spacer is provided on the surface facing each of the spacers, and the surface of the printed board opposite to the housing is inserted into the mounting hole of the printed board. A spring pin for fitting with the spacer is provided.
According to a second aspect of the present invention, in the electronic device according to the first aspect, when a plurality of the printed circuit boards are provided in the electronic device, the spring pins are alternately provided between the plurality of printed circuit boards. The plurality of alternately provided spring pins are fitted with the spacer.
According to a third aspect of the present invention, in the electronic device according to the first or second aspect, electrodes are provided on both surfaces of the base, and the casing, the base, and the spring pin are made of a conductive material. It is characterized by.

以上述べたように、請求項１に記載の電子装置によれば、プリント基板の取り付け、取り外しが容易に行うことができ、従来に比べて取付工数を削減することができる。また、筐体の取付部とプリント基板の取付部を集約できるので、プリント基板やそれを内蔵する電子装置を小型にすることが可能である。さらに、プリント基板の他、上位プリント基板は、スプリングピンやスペーサを介して容易に接地することができる。
また、請求項２に記載の電子装置によれば、請求項１の効果に加え複数のプリント基板を筐体に容易に重ねて取付けることができると共に、取付工数を削減し、プリント基板の筐体への接地を容易に行うことができる。
また、請求項３に記載の電子装置によれば、プリント基板の筐体取付部となるベースに設けた電極はスペーサを介して導電性材料からなるスプリングピンに接し、他のプリント基板および筐体へと接地することが可能である。 As described above, according to the electronic device of the first aspect, the printed circuit board can be easily attached and detached, and the number of attachment steps can be reduced as compared with the related art. Moreover, since the attachment part of a housing | casing and the attachment part of a printed circuit board can be integrated, it is possible to make a printed circuit board and an electronic device incorporating the same small. In addition to the printed circuit board, the upper printed circuit board can be easily grounded via a spring pin or a spacer.
Further, according to the electronic device of the second aspect, in addition to the effect of the first aspect, a plurality of printed circuit boards can be easily overlapped and mounted on the casing, and the number of mounting steps can be reduced, and the printed circuit board casing can be reduced. Can be easily grounded.
According to the electronic device according to claim 3, the electrode provided on the base serving as the housing mounting portion of the printed circuit board is in contact with the spring pin made of a conductive material via the spacer, and the other printed circuit board and the housing Can be grounded.

以下、本発明の実施例を図に基づいて具体的に説明する。なお、本発明の構成要素が従来技術と同じものについては説明を省略し、異なる点のみ説明する。   Embodiments of the present invention will be specifically described below with reference to the drawings. In addition, description is abbreviate | omitted about the component of this invention the same as a prior art, and only a different point is demonstrated.

図１は本発明の第１実施例によるプリント基板の取付状態を示す電子装置の分解斜視図である。
図において、１はベース、２はプリント基板、２Ａは取付孔、３はスプリングピン、４はスペーサ、４Ａは段差部、Ｓは筐体である。
本発明の特徴は以下のとおりである。
すなわち、筐体Ｓに取付けられると共に、電子部品Ｅを実装したプリント基板２を備えた電子装置において、プリント基板２と筐体Ｓの間に、平板状のベース１が設けられており、ベース１の四隅に、円筒形状からなり、かつ、先端が根元に比べて径の小さい段差部４Ａを有してなる金属製のスペーサ４が圧入されており、プリント基板２は、ベース１の四隅に取付けられたスペーサ４とそれぞれ対向する面にスペーサ４を挿入するための取付孔２Ａが設けられており、プリント基板２の筐体Ｓとの反対側の面には、プリント基板２の取付孔２Ａの裏側から表側に向かって挿入されたスぺーサ４と嵌合するための金属製のスプリングピン３が設けられている点である。
なお、ベース１の両面には図示しない電極を設けると共に、また、プリント基板２はベース１と同様に四隅にスペーサ４への取付孔２Ａとその孔の周辺に図示しない電極を設けて、筐体Ｓ、ベース１およびスプリングピン３を導電性材料で構成して筐体と接地するようになっている。
次に、プリント基板２の他に上位プリント基板を備えた電子装置を筐体Ｓに取付ける場合について、図２、図３を用いて説明する。図２は第１実施例による上位プリント基板を有する電子装置を筐体に取り付けた場合の分解斜視図、図３は図２の取り付け状態を示す部分側断面図である。
図において、上位プリント基板２５は、一方の面（表面）がねじ２６により押さえられると共に、他方の面（裏面）がスプリングピン３により保持されており、また、プリント基板２は一方の面（表面）がスプリングピン３によって上から押えられると共に、他方の面（裏面）がスプリングピン３の押付力に抗して、取付孔２Ａに圧入されたスペーサ４の段差部４Ａにより保持される、
本発明の第１実施例は上記構成にしたので、プリント基板の他、上位プリント基板を備える電子装置を筐体に取付ける際に、電子装置にスプリングピンおよびスペーサを用いることで、プリント基板の取り付け、取り外しが容易に行うことができ、従来に比べて取付工数を削減することができる。また、筐体への取り付け部とプリント基板の取り付け部が集約できるので、プリント基板やそれを内蔵する電子装置を小型にすることができる。さらに、プリント基板の他、上位プリント基板は、スプリングピンやスペーサを介して容易に接地することができる。 FIG. 1 is an exploded perspective view of an electronic device showing a state where a printed circuit board is attached according to a first embodiment of the present invention.
In the figure, 1 is a base, 2 is a printed circuit board, 2A is a mounting hole, 3 is a spring pin, 4 is a spacer, 4A is a step portion, and S is a housing.
The features of the present invention are as follows.
That is, in an electronic device that is attached to the housing S and includes the printed circuit board 2 on which the electronic component E is mounted, a flat base 1 is provided between the printed circuit board 2 and the housing S. Metal spacers 4 having a cylindrical shape and having a step portion 4A having a smaller diameter than the base are press-fitted into the four corners of the base plate, and the printed circuit board 2 is attached to the four corners of the base 1. Mounting holes 2A for inserting the spacers 4 are provided on the surfaces facing the spacers 4 respectively, and the mounting holes 2A of the printed circuit board 2 are formed on the surface of the printed circuit board 2 opposite to the housing S. The metal spring pin 3 for fitting with the spacer 4 inserted toward the front side from the back side is provided.
It should be noted that electrodes (not shown) are provided on both surfaces of the base 1, and the printed circuit board 2 is provided with mounting holes 2 A to the spacer 4 at the four corners and electrodes (not shown) around the holes as in the base 1. S, the base 1 and the spring pin 3 are made of a conductive material so as to be grounded.
Next, a case where an electronic device provided with a higher-order printed circuit board in addition to the printed circuit board 2 is attached to the housing S will be described with reference to FIGS. FIG. 2 is an exploded perspective view when the electronic device having the upper printed circuit board according to the first embodiment is attached to the housing, and FIG. 3 is a partial sectional side view showing the attached state of FIG.
In the figure, the upper printed circuit board 25 has one surface (front surface) pressed by a screw 26 and the other surface (back surface) held by a spring pin 3, and the printed circuit board 2 has one surface (front surface). ) Is pressed from above by the spring pin 3, and the other surface (back surface) is held by the step portion 4A of the spacer 4 press-fitted into the mounting hole 2A against the pressing force of the spring pin 3.
Since the first embodiment of the present invention has the above-described configuration, when mounting an electronic device having a higher-level printed circuit board in addition to the printed circuit board to the housing, the printed circuit board is attached by using spring pins and spacers in the electronic device. It can be easily removed, and the number of mounting steps can be reduced as compared with the conventional case. Moreover, since the attachment part to a housing | casing and the attachment part of a printed circuit board can be collected, a printed circuit board and the electronic device incorporating it can be reduced in size. In addition to the printed circuit board, the upper printed circuit board can be easily grounded via a spring pin or a spacer.

図４は本発明の第２実施例による複数のプリント基板を取り付けた電子装置の分解斜視図、図５は図４の取付状態を示す部分断面図である。
図において、第２実施例が第１実施例と異なる点は、電子装置Ｄにプリント基板２を複数設けた場合に、複数のプリント基板２の間にスプリングピン３を交互に設けると共に、スプリングピン３を取付孔２Ａを介して挿入されるスペーサ４に嵌合することにより、複数のプリント基板を保持する構成とした点である。
図において、上位プリント基板２５は、一方の面（表面）がねじ２６により押さえられると共に、他方の面（裏面）がスプリングピン３により保持される。上位プリント基板２５に対向して設けたプリント基板２は一方の面（表面）がスプリングピン３によって上から押えられると共に、他方の面（裏面）が他のスリングピン３により保持される。また、ベース側に設けたプリント基板２は一方の面（表面）が該他のスプリングピン３によって上から押えられると共に、他方の面（裏面）がスプリングピン３の押付力に抗してスペーサ４の段差部４Ａにより保持される。
本発明の第２実施例は上記構成にしたので、第１実施例と同様に複数のプリント基板を筐体に容易に重ねて取付けることができると共に、取付工数を削減し、プリント基板の筐体への接地を容易に行うことができる。 FIG. 4 is an exploded perspective view of an electronic device having a plurality of printed circuit boards attached thereto according to the second embodiment of the present invention, and FIG. 5 is a partial cross-sectional view showing the attached state of FIG.
In the figure, the second embodiment differs from the first embodiment in that when a plurality of printed circuit boards 2 are provided in the electronic device D, spring pins 3 are alternately provided between the plurality of printed circuit boards 2 and the spring pins. 3 is fitted to a spacer 4 inserted through the mounting hole 2A, thereby holding a plurality of printed boards.
In the figure, the upper printed circuit board 25 has one surface (front surface) held by a screw 26 and the other surface (back surface) held by a spring pin 3. One surface (front surface) of the printed circuit board 2 provided facing the upper printed circuit board 25 is pressed from above by the spring pin 3, and the other surface (back surface) is held by the other sling pin 3. The printed circuit board 2 provided on the base side has one surface (front surface) pressed from above by the other spring pin 3, and the other surface (back surface) resists the pressing force of the spring pin 3. Is held by the step portion 4A.
Since the second embodiment of the present invention is configured as described above, a plurality of printed circuit boards can be easily overlapped and mounted on the housing in the same manner as the first embodiment, and the number of mounting steps can be reduced, and the printed circuit board housing can be reduced. Can be easily grounded.

本発明の第１実施例によるプリント基板の取付状態を示す電子装置の分解斜視図The exploded perspective view of the electronic device which shows the attachment state of the printed circuit board by 1st Example of this invention 第１実施例による上位プリント基板を有する電子装置を筐体に取り付けた場合の分解斜視図The disassembled perspective view at the time of attaching the electronic device which has a high-order printed circuit board by 1st Example to a housing | casing 図２の取り付け状態を示す部分側断面図Partial side sectional view showing the mounting state of FIG. 本発明の第２実施例による複数のプリント基板を取り付けた電子装置の分解斜視図FIG. 6 is an exploded perspective view of an electronic device having a plurality of printed circuit boards attached thereto according to a second embodiment of the present invention. 図４の取付状態を示す部分断面図Partial sectional view showing the mounting state of FIG. 第１従来技術によるプリント基板の取付状態を示す電子装置の分解斜視図The disassembled perspective view of the electronic device which shows the attachment state of the printed circuit board by 1st prior art 第１従来技術による上位プリント基板を有する電子装置を筐体に取り付けた場合の分解斜視図The exploded perspective view at the time of attaching the electronic device which has a high-order printed circuit board by the 1st prior art to a case 第２従来技術を示す電子装置の分解斜視図、An exploded perspective view of an electronic device showing the second prior art, 図８の取付状態を示す側断面図Side sectional view showing the mounting state of FIG.

符号の説明Explanation of symbols

１ ベース
２ プリント基板
２Ａ 取付孔
３ スプリングピン
４ スペーサ
４Ａ 段差部
２５ 上位プリント基板
２６ ねじ
Ｄ 電子装置
Ｅ 電子部品
Ｓ 筐体
1 Base 2 Printed Circuit Board 2A Mounting Hole 3 Spring Pin 4 Spacer 4A Stepped Part
25 High-order printed circuit board 26 Screw D Electronic device E Electronic component S Case

Claims (3)

筐体に取付けられると共に、電子部品を実装したプリント基板を備えた電子装置において、
前記プリント基板と前記筐体の間に、平板状のベースが設けられており、
前記ベースの四隅に、円筒形状からなり、かつ、先端が根元に比べて径の小さい段差部を有してなる金属製のスペーサが圧入されており、
プリント基板は、前記ベースの四隅に取付けられた前記スペーサとそれぞれ対向する面に該スペーサを挿入するための取付孔が設けられており、
前記プリント基板の筐体との反対側の面には、前記プリント基板の取付孔に挿入された前記スぺーサと嵌合するためのスプリングピンが設けられていることを特徴とする電子装置。 In an electronic device provided with a printed circuit board mounted with an electronic component and mounted on a housing,
A flat base is provided between the printed circuit board and the housing,
At the four corners of the base, metal spacers having a cylindrical shape and having a step portion with a small diameter compared to the base are press-fitted,
The printed circuit board is provided with mounting holes for inserting the spacers on surfaces facing the spacers mounted at the four corners of the base,
An electronic device, wherein a spring pin for fitting with the spacer inserted into the mounting hole of the printed board is provided on a surface of the printed board opposite to the housing. 前記プリント基板を前記電子装置に複数設けた場合に、前記複数のプリント基板の間に前記スプリングピンを交互に設けると共に、前記交互に設けた複数のスプリングピンを前記スペーサと嵌合したことを特徴とする請求項１記載の電子装置。   When a plurality of the printed boards are provided in the electronic device, the spring pins are alternately provided between the plurality of printed boards, and the plurality of alternately provided spring pins are fitted with the spacers. The electronic device according to claim 1. 前記ベースの両面に電極を設け、前記筐体、前記ベースおよび前記スプリングピンを導電性材料で構成したことを特徴とする請求項１または２に記載の電子装置。   The electronic device according to claim 1, wherein electrodes are provided on both surfaces of the base, and the casing, the base, and the spring pin are made of a conductive material.
JP2003406811A 2003-12-05 2003-12-05 Electronic apparatus Pending JP2005167112A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007166760A (en) * 2005-12-13 2007-06-28 Yaskawa Electric Corp Molded motor
JP2013235030A (en) * 2012-05-02 2013-11-21 Olympus Imaging Corp Electric substrate connecting structure of portable apparatus
JP2017021378A (en) * 2016-10-05 2017-01-26 オリンパス株式会社 Electrical board connection structure
CN109121294A (en) * 2018-09-29 2019-01-01 维沃移动通信有限公司 Board structure of circuit and electronic equipment
WO2021141423A1 (en) * 2020-01-08 2021-07-15 주식회사 엘지에너지솔루션 Battery pack, electronic device and vehicle

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007166760A (en) * 2005-12-13 2007-06-28 Yaskawa Electric Corp Molded motor
JP2013235030A (en) * 2012-05-02 2013-11-21 Olympus Imaging Corp Electric substrate connecting structure of portable apparatus
JP2017021378A (en) * 2016-10-05 2017-01-26 オリンパス株式会社 Electrical board connection structure
CN109121294A (en) * 2018-09-29 2019-01-01 维沃移动通信有限公司 Board structure of circuit and electronic equipment
WO2020063643A1 (en) * 2018-09-29 2020-04-02 维沃移动通信有限公司 Circuit board structure and electronic device
CN109121294B (en) * 2018-09-29 2020-09-18 维沃移动通信有限公司 Circuit board structure and electronic equipment
WO2021141423A1 (en) * 2020-01-08 2021-07-15 주식회사 엘지에너지솔루션 Battery pack, electronic device and vehicle
CN114424395A (en) * 2020-01-08 2022-04-29 株式会社Lg新能源 Battery pack, electronic device, and vehicle
JP2022544974A (en) * 2020-01-08 2022-10-24 エルジー エナジー ソリューション リミテッド Battery packs, electronic devices and automobiles
EP4020661A4 (en) * 2020-01-08 2023-06-07 Lg Energy Solution, Ltd. Battery pack, electronic device and vehicle
JP7367182B2 (en) 2020-01-08 2023-10-23 エルジー エナジー ソリューション リミテッド Battery packs, electronic devices and automobiles

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