JP2006148011A - Fitting structure for electric element to substrate - Google Patents

Fitting structure for electric element to substrate Download PDF

Info

Publication number
JP2006148011A
JP2006148011A JP2004339070A JP2004339070A JP2006148011A JP 2006148011 A JP2006148011 A JP 2006148011A JP 2004339070 A JP2004339070 A JP 2004339070A JP 2004339070 A JP2004339070 A JP 2004339070A JP 2006148011 A JP2006148011 A JP 2006148011A
Authority
JP
Japan
Prior art keywords
substrate
receiving member
electric element
metal fitting
electrolytic capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP2004339070A
Other languages
Japanese (ja)
Inventor
Takashi Niwa
孝 丹羽
Takashi Kitade
貴士 北出
Ryuichi Fujisaki
龍一 藤崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP2004339070A priority Critical patent/JP2006148011A/en
Publication of JP2006148011A publication Critical patent/JP2006148011A/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/06Mountings specially adapted for mounting on a printed-circuit support
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10015Non-printed capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To enable size reduction in a direction perpendicular to a surface of a substrate by making it possible to fit an electric element in such a posture that the length direction of the electric element is along the surface of the substrate. <P>SOLUTION: A reception member 30 is provided with a storage space 31 capable of storing an aluminum electrolysis capacitor 20 in a lying posture and a pressure member 40 is attachable to and detachable from its opening portion. The reception member 30 is fixed while fitted to the substrate 10 with screw members N. A support portion 38 which projects toward the substrate 10 is provided on a bottom surface of the reception member 30. A space S of specified height is secured by the support portion 38 between the reception member 30 and substrate 10 and another electric element D can be mounted in the space S. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、基板に対する電気素子の取付構造に関する。   The present invention relates to an electric element mounting structure for a substrate.

従来、ECUのケース内に基板を収容し、その基板に対して多数の電気素子を取り付けたものの一例として下記特許文献1に記載されたものが知られている。このものは、図17に示すように、ECUのロアケース1内に基板2が収容され、この基板2上にリレー3やコンデンサ4などの電気素子が多数実装されるとともに、上方からアッパケース5が被せ付けられるようになっている。
特開2004−119485公報
Conventionally, what was described in the following patent document 1 is known as an example in which a substrate is accommodated in a case of an ECU and a large number of electric elements are attached to the substrate. As shown in FIG. 17, a substrate 2 is housed in a lower case 1 of an ECU, and a large number of electrical elements such as relays 3 and capacitors 4 are mounted on the substrate 2, and an upper case 5 is mounted from above. It is designed to be covered.
JP 2004-119485 A

上記したものでは、大型の電気素子であるコンデンサ4が基板2に対して立てた姿勢で取り付けられているため、全体が嵩高になっていた。
かといって仮にコンデンサ4を寝かせた姿勢で基板2に取り付けたとしても、その分基板2の表面積を大きくとることになるため、他の電気素子の実装面積を確保するために基板2を面方向について大型化せざるを得ず、対策に苦慮していた。
本発明は上記のような事情に基づいて完成されたものであって、小型化を図ることを目的とする。
In the above, since the capacitor 4 which is a large electric element is attached in a standing posture with respect to the substrate 2, the whole is bulky.
However, even if the capacitor 4 is attached to the substrate 2 in a lying position, the surface area of the substrate 2 is increased accordingly, so that the substrate 2 is oriented in the plane direction in order to secure a mounting area for other electric elements. I was forced to increase the size, and I was struggling with measures.
The present invention has been completed based on the above circumstances, and aims to reduce the size.

上記の目的を達成するための手段として、請求項1の発明は、柱状をなす電気素子の基板に対する取付構造であって、前記電気素子がその長さ方向を前記基板の面に沿わせた姿勢で基板に対して取り付けられるとともに、前記基板との間に所定の空間を保った状態で前記電気素子を支持可能な支持部が設けられている構成としたところに特徴を有する。   As a means for achieving the above object, the invention of claim 1 is a mounting structure of a columnar electric element to a substrate, wherein the electric element has a length direction along the surface of the substrate. And a support portion capable of supporting the electric element in a state where a predetermined space is maintained between the substrate and the substrate.

請求項2の発明は、請求項1に記載のものにおいて、前記基板とは反対側から前記電気素子を押さえ付けることが可能な押さえ部材が設けられているところに特徴を有する。   The invention of claim 2 is characterized in that, in the invention of claim 1, a pressing member capable of pressing the electric element from the side opposite to the substrate is provided.

請求項3の発明は、請求項1または請求項2に記載のものにおいて、前記基板側に配されて前記電気素子を受け入れ可能とされ、且つ前記支持部が一体的に設けられた受け部材と、この受け部材を基板に対して固定可能な固定手段とを備えているところに特徴を有する。   According to a third aspect of the present invention, there is provided the receiving member according to the first or second aspect, wherein the receiving member is arranged on the substrate side so as to be able to receive the electric element, and the support portion is integrally provided. The receiving member is characterized by having fixing means that can fix the receiving member to the substrate.

請求項4の発明は、請求項3に記載のものにおいて、前記受け部材に対して前記押さえ部材が着脱可能とされており、これら押さえ部材及び受け部材には、両者を装着状態に保持可能なロック手段が設けられているところに特徴を有する。   According to a fourth aspect of the present invention, the pressing member can be attached to and detached from the receiving member according to the third aspect, and both of the pressing member and the receiving member can be held in a mounted state. It is characterized in that a locking means is provided.

請求項5の発明は、請求項4に記載のものにおいて、前記受け部材及び前記押さえ部材における前記電気素子との対向面は、電気素子の外形に沿った形状に形成されているところに特徴を有する。   The invention of claim 5 is characterized in that, in the invention of claim 4, the opposing surfaces of the receiving member and the pressing member to the electric element are formed in a shape along the outer shape of the electric element. Have.

請求項6の発明は、請求項3ないし請求項5のいずれかに記載のものにおいて、前記固定手段は、前記基板に設けられた孔部に対して圧入可能な圧入部を有する金具により構成され、この金具が前記受け部材に装着されるようになっているところに特徴を有する。   According to a sixth aspect of the present invention, in the method according to any one of the third to fifth aspects, the fixing means includes a fitting having a press-fit portion that can be press-fitted into a hole provided in the substrate. This metal fitting is characterized in that it is mounted on the receiving member.

請求項7の発明は、請求項6に記載のものにおいて、前記金具は、前記電気素子の接続端子に接続可能な素子側接続部を有するとともに、前記圧入部が前記基板の導電路に対して接続可能とされているところに特徴を有する。   According to a seventh aspect of the present invention, in the apparatus according to the sixth aspect, the metal fitting has an element side connection portion connectable to a connection terminal of the electric element, and the press-fitting portion is connected to the conductive path of the substrate. It is characterized in that it can be connected.

<請求項1の発明>
電気素子がその長さ方向を基板の面に沿わせた姿勢で取り付けられるので、基板の面と直交する方向について小型化することができる。その上、電気素子と基板との間に所定の空間を確保した状態で支持部にて電気素子を支持するようにしたから、その空間に例えば他の電気素子を実装するなどして、基板の表面積を有効に利用することができる。これにより、基板の面方向についても小型化を図ることができる。
<Invention of Claim 1>
Since the electric element is attached in such a posture that its length direction is aligned with the surface of the substrate, it can be miniaturized in a direction orthogonal to the surface of the substrate. In addition, since the electric element is supported by the support portion in a state where a predetermined space is secured between the electric element and the substrate, for example, by mounting another electric element in the space, The surface area can be used effectively. Thereby, size reduction can be achieved also about the surface direction of a board | substrate.

<請求項2の発明>
振動などにより電気素子ががたつくのを抑制することができる。
<請求項3の発明>
受け部材に電気素子を収容した状態で基板に対して取り付けることができるので、作業性に優れる。
<Invention of Claim 2>
Shaking of the electric element due to vibration or the like can be suppressed.
<Invention of Claim 3>
Since it can attach with respect to a board | substrate in the state which accommodated the electrical element in the receiving member, it is excellent in workability | operativity.

<請求項4の発明>
押さえ部材及び電気素子を受け部材に対してアッセンブリした状態でまとめて基板に対して取り付けることができ、一層作業性に優れる。
<請求項5の発明>
電気素子のがたつきを極力抑制することができる。
<Invention of Claim 4>
The pressing member and the electric element can be collectively attached to the substrate in a state assembled to the receiving member, and the workability is further improved.
<Invention of Claim 5>
Shaking of the electric element can be suppressed as much as possible.

<請求項6の発明>
受け部材に装着した金具の圧入部を基板の孔部に対して圧入することで、受け部材を基板に対して固定することができる。これにより、基板に対する受け部材の固定作業が容易なものとなる。
<請求項7の発明>
基板に対して受け部材を固定する機能と、基板に対して電気素子を電気的に接続する機能とを金具に兼用させることができる。
<Invention of Claim 6>
The receiving member can be fixed to the substrate by press-fitting the press-fitting portion of the metal fitting attached to the receiving member into the hole of the substrate. Thereby, the fixing operation of the receiving member with respect to the substrate becomes easy.
<Invention of Claim 7>
The function of fixing the receiving member to the substrate and the function of electrically connecting the electric element to the substrate can be used as the metal fitting.

<実施形態1>
本発明の実施形態1を図1ないし図8によって説明する。この実施形態1では、図示しないECUのケース内に収容される基板10に対してアルミ電解コンデンサ20を取り付ける構造を例示する。この取付構造は、図1に示すように、大まかにはアルミ電解コンデンサ20を受け入れ可能な受け部材30と、受け部材30に対して着脱可能な押さえ部材40と、受け部材30を基板10に対して固定可能なねじ部材Nとから構成される。なお以下では、上下方向及び左右方向の記載について図1や図7を基準とする。
<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. In this Embodiment 1, the structure which attaches the aluminum electrolytic capacitor 20 with respect to the board | substrate 10 accommodated in the case of ECU which is not shown in figure is illustrated. As shown in FIG. 1, the mounting structure roughly includes a receiving member 30 that can receive the aluminum electrolytic capacitor 20, a pressing member 40 that can be attached to and detached from the receiving member 30, and the receiving member 30 to the substrate 10. And a screw member N that can be fixed. In the following, description of the vertical direction and the horizontal direction is based on FIGS. 1 and 7.

アルミ電解コンデンサ20は、一方向に細長い円柱状をなす本体部21と、本体部21における図示左側の端面(一方の端面)から突出する一対の接続端子22とから構成されている。アルミ電解コンデンサ20は、本体部21を寝かせた姿勢、つまり長さ方向(軸線方向)を基板10の面方向に沿わせた(ほぼ平行な)姿勢で受け部材30内に収容されるようになっている。両接続端子22は、本体部21の端面からその長さ方向に沿って所定寸法突出してから下方へ向けて屈曲されている。言い換えると、接続端子22は、基板10の面に沿って水平な水平部分22aと、基板10の面に対し垂直な垂直部分22bとを連結した構成で、側方から見て略L字型をなしている。このうち垂直部分22bの先端部は、基板10に設けられた孔部11に対して挿入されるとともに、半田付けされることで基板10の導電路(図示せず)に対して電気的に接続可能とされる。   The aluminum electrolytic capacitor 20 is composed of a main body portion 21 having a columnar shape elongated in one direction, and a pair of connection terminals 22 protruding from the left end surface (one end surface) of the main body portion 21 in the figure. The aluminum electrolytic capacitor 20 is accommodated in the receiving member 30 in a posture in which the main body portion 21 is laid down, that is, in a posture in which the length direction (axial direction) is along the surface direction of the substrate 10 (substantially parallel). ing. Both connection terminals 22 are bent downward from the end face of the main body portion 21 by projecting a predetermined dimension along the length direction thereof. In other words, the connection terminal 22 has a configuration in which a horizontal portion 22a that is horizontal along the surface of the substrate 10 and a vertical portion 22b that is perpendicular to the surface of the substrate 10 are connected to each other, and is substantially L-shaped when viewed from the side. There is no. Of these, the tip of the vertical portion 22b is inserted into the hole 11 provided in the substrate 10 and is electrically connected to a conductive path (not shown) of the substrate 10 by soldering. It is possible.

受け部材30は、合成樹脂製とされ、上面側が開口する矩形の略箱型に形成されており、その内部には、アルミ電解コンデンサ20を収容可能な収容空間31が確保されている。収容空間31の底面31a(アルミ電解コンデンサ20との対向面)は、図4に示すように、アルミ電解コンデンサ20の本体部21の外面に沿って略円弧状に形成されている。また受け部材30の周壁のうち両長辺部分の長さ方向略中央位置には、上方へ開口する切り欠き32が形成されている。   The receiving member 30 is made of a synthetic resin and is formed in a substantially rectangular box shape whose upper surface is open, and an accommodation space 31 in which the aluminum electrolytic capacitor 20 can be accommodated is secured. As shown in FIG. 4, the bottom surface 31 a of the housing space 31 (the surface facing the aluminum electrolytic capacitor 20) is formed in a substantially arc shape along the outer surface of the main body portion 21 of the aluminum electrolytic capacitor 20. Further, a notch 32 that opens upward is formed at a substantially central position in the length direction of both long side portions of the peripheral wall of the receiving member 30.

受け部材30の周壁の両長辺部分の外側面における切り欠き32を挟んだ左右には、図1及び図7に示すように、押さえ部材40のロック片41が係止可能な被ロック部33が一対ずつ設けられている。被ロック部33は、受け部材30の外面から側方へ突出する形態とされ、その上面はロック片41の乗り上げ動作を案内すべくテーパ状に形成されている。各被ロック部33の左右には、ロック片41に摺接することで押さえ部材40の取り付け動作をガイド可能なロックガイド部34が一対ずつ設けられている。対をなす両ロックガイド部34の上端部は、ロック片41に対する受け入れ間口が広くなるようテーパ状に形成されている。   As shown in FIGS. 1 and 7, on the left and right sides of the cutouts 32 on the outer side surfaces of the long side portions of the peripheral wall of the receiving member 30, the locked portion 33 to which the lock piece 41 of the pressing member 40 can be locked. Are provided in pairs. The locked portion 33 is configured to protrude laterally from the outer surface of the receiving member 30, and its upper surface is formed in a tapered shape so as to guide the riding operation of the lock piece 41. A pair of lock guide portions 34 that can guide the mounting operation of the pressing member 40 by slidingly contacting the lock pieces 41 are provided on the left and right sides of the respective locked portions 33. The upper end portions of the pair of lock guide portions 34 are formed in a tapered shape so that the receiving opening for the lock piece 41 is widened.

受け部材30の周壁のうち図示左側の短辺部分には、図1に示すように、アルミ電解コンデンサ20の両接続端子22のうち水平部分22aを挿通可能な端子挿通溝35が一対、上方へ開口して設けられている。受け部材30の周壁のうち上記端子挿通溝35が設けられた短辺部分の下端部には、両接続端子22のうち垂直部分22bを支持可能な端子支持部36が設けられている。端子支持部36には、接続端子22を挟み込む端子支持溝36aが一対、図示左側方へ開口して設けられている。また端子支持部36の長さ寸法は、受け部材30の短辺よりも短く設定されている。   As shown in FIG. 1, a pair of terminal insertion grooves 35 into which the horizontal portion 22a of both the connection terminals 22 of the aluminum electrolytic capacitor 20 can be inserted are formed on the short side portion on the left side of the peripheral wall of the receiving member 30 as shown in FIG. An opening is provided. A terminal support portion 36 capable of supporting the vertical portion 22b of both connection terminals 22 is provided at the lower end portion of the short side portion of the peripheral wall of the receiving member 30 where the terminal insertion groove 35 is provided. The terminal support portion 36 is provided with a pair of terminal support grooves 36a that sandwich the connection terminal 22 and open to the left side in the drawing. The length dimension of the terminal support portion 36 is set shorter than the short side of the receiving member 30.

受け部材30の底面(基板10との対向面)には、図4及び図7に示すように、基板10に対して受け部材30を固定するためのねじ部材Nを取付可能なねじ取付部37が設けられている。ねじ取付部37は、受け部材30の底面における長手方向両端位置付近に一対配置されている。各ねじ取付部37には、基板10に設けられたねじ挿通孔12に通したねじ部材Nが螺合可能なねじ孔37aが螺刻形成されている。   As shown in FIGS. 4 and 7, a screw mounting portion 37 to which a screw member N for fixing the receiving member 30 to the substrate 10 can be attached to the bottom surface (the surface facing the substrate 10) of the receiving member 30. Is provided. A pair of screw attachment portions 37 are arranged in the vicinity of both end positions in the longitudinal direction on the bottom surface of the receiving member 30. Each screw mounting portion 37 is formed with a screw hole 37a into which the screw member N passed through the screw insertion hole 12 provided in the substrate 10 can be screwed.

押さえ部材40は、図1及び図7に示すように、受け部材30における上面の開口部分を閉塞可能な大きさを有する略平板状をなしている。押さえ部材40における長辺側の両側縁には、受け部材30側の被ロック部33に対応した位置にロック片41が一対ずつ設けられている。ロック片41は、下方へ延びる片持ち状に形成され、根元部分を支点として外側へ開くようにして弾性変形可能とされる。ロック片41には、中央に被ロック部33が進入可能とされる溝部42が上方へ開口して形成されており、残された先端部41aが被ロック部33に対して係止可能とされる。   As shown in FIGS. 1 and 7, the pressing member 40 has a substantially flat plate shape having a size capable of closing the opening portion of the upper surface of the receiving member 30. A pair of lock pieces 41 are provided on both long side edges of the pressing member 40 at positions corresponding to the locked portions 33 on the receiving member 30 side. The lock piece 41 is formed in a cantilever shape extending downward, and can be elastically deformed so as to open outward with the root portion as a fulcrum. The lock piece 41 is formed with a groove portion 42 that allows the locked portion 33 to enter the center of the lock piece 41 so as to open upward. The remaining tip portion 41 a can be locked to the locked portion 33. The

押さえ部材40の下面(アルミ電解コンデンサ20との対向面)には、図4に示すように、アルミ電解コンデンサ20を押さえ付け可能な押さえ部43が設けられている。押さえ部43は、押さえ部材40短辺方向に沿って延びる突条により構成され、その内面43a、つまりアルミ電解コンデンサ20との対向面は、本体部21の外面に沿って略円弧状に形成されている。この押さえ部43の内面43aは、組み付け状態において受け部材30の収容空間31の底面31aと共に1つの円を形成できるようになっており、その円の径寸法は、本体部21の外径寸法とほぼ一致する設定となっている(図5参照)。   As shown in FIG. 4, a pressing portion 43 capable of pressing the aluminum electrolytic capacitor 20 is provided on the lower surface of the pressing member 40 (the surface facing the aluminum electrolytic capacitor 20). The pressing portion 43 is constituted by a ridge extending along the short side direction of the pressing member 40, and the inner surface 43 a thereof, that is, the surface facing the aluminum electrolytic capacitor 20 is formed in a substantially arc shape along the outer surface of the main body portion 21. ing. The inner surface 43a of the pressing portion 43 can form a circle together with the bottom surface 31a of the receiving space 31 of the receiving member 30 in the assembled state, and the diameter of the circle is the same as the outer diameter of the main body 21. The settings are almost the same (see FIG. 5).

さて、受け部材30の底面(基板10との対向面)には、図1,図4及び図7に示すように、下方(基板10側)へ突出する支持部38が設けられている。支持部38は、受け部材30における長辺方向の両端位置に一対設けられている。両支持部38は、受け部材30の短辺方向に沿って延びる突条により構成されており、それぞれねじ取付部37に連結されている。両支持部38の長さ寸法は、端子支持部36とほぼ同じに設定されており、図示左側の支持部38については端子支持部36にも連結されている。   As shown in FIGS. 1, 4 and 7, a support portion 38 that protrudes downward (on the substrate 10 side) is provided on the bottom surface (the surface facing the substrate 10) of the receiving member 30. A pair of support portions 38 are provided at both end positions of the receiving member 30 in the long side direction. Both support portions 38 are constituted by ridges extending along the short side direction of the receiving member 30, and are respectively connected to the screw attachment portions 37. The length dimension of both the support parts 38 is set to be substantially the same as that of the terminal support part 36, and the support part 38 on the left side of the figure is also connected to the terminal support part 36.

両支持部38は、受け部材30を基板10に取り付けると、その下面が基板10の上面に当接されるとともに、受け部材30の底面を基板10の上面から所定高さ分持ち上げた(浮かせた)位置に支持できるようになっている(図6及び図8参照)。従って、取付状態で基板10と受け部材30との間には、支持部38の高さ分の空間Sが確保されるようになっている。支持部38の高さ寸法、つまり基板10と受け部材30との間の空間Sは、他の電気素子Dを基板10の上面に実装したり、配線(図示せず)を設けることが可能となる大きさに設定されている。なお他の電気素子Dの実装作業や配線作業については、詳しくは次述するように受け部材30を基板10に対して取り付ける作業に先立って行うようにする。   When the receiving member 30 is attached to the substrate 10, the lower support portions 38 are brought into contact with the upper surface of the substrate 10, and the bottom surface of the receiving member 30 is lifted (floated) from the upper surface of the substrate 10 by a predetermined height. ) Position (see FIGS. 6 and 8). Therefore, a space S corresponding to the height of the support portion 38 is secured between the substrate 10 and the receiving member 30 in the attached state. In the height dimension of the support portion 38, that is, the space S between the substrate 10 and the receiving member 30, it is possible to mount another electric element D on the upper surface of the substrate 10 or to provide wiring (not shown). Is set to a size. The mounting work and wiring work of other electric elements D are performed prior to the work of attaching the receiving member 30 to the substrate 10 as will be described in detail below.

本実施形態は以上のような構造であり、続いてその組み付け作業について説明する。まず、図1及び図4に示すように、アルミ電解コンデンサ20を寝かせた姿勢として、受け部材30の収容空間31内に上方から収容する。この過程では両接続端子22の垂直部分22bが端子支持部36の両端子支持溝36a内に通されるとともに、水平部分22aが両端子挿通溝35内に通されることで、アルミ電解コンデンサ20の軸線周りの取付姿勢が定められる。   The present embodiment has the above structure, and the assembly work will be described next. First, as shown in FIGS. 1 and 4, the aluminum electrolytic capacitor 20 is housed from above in the housing space 31 of the receiving member 30 in a posture in which the aluminum electrolytic capacitor 20 is laid down. In this process, the vertical portions 22b of both connection terminals 22 are passed through the both terminal support grooves 36a of the terminal support portion 36, and the horizontal portions 22a are passed through the both terminal insertion grooves 35. The mounting posture around the axis is determined.

その後、受け部材30の開口部分に対して上方から押さえ部材40を組み付ける作業を行う。この過程では、各ロック片41が対をなすロックガイド部34間に進入することで、受け部材30に対する押さえ部材40の左右方向への位置決めがなされる。そして、ロック片41は、被ロック部33に乗り上げて一旦外側に開くよう弾性変形した後、被ロック部33を乗り越えると復元し、図2及び図7に示すように、溝部42内に被ロック部33が進入するとともに先端部41aの上面に被ロック部33の下面が係止する。この取り付け状態では、図5に示すように、アルミ電解コンデンサ20の本体部21の外周面には、ほぼ全周にわたって収容空間31の底面31aと押さえ部材40の押さえ部43の内面43aとが当接している。つまり、アルミ電解コンデンサ20は、受け部材30と押さえ部材40との間でほぼ隙間なく挟まれた状態で保持されているので、本体部21の径方向についてがたつくのが防止されるようになっている。   Thereafter, the pressing member 40 is assembled to the opening portion of the receiving member 30 from above. In this process, when the lock pieces 41 enter between the pair of lock guide portions 34, the pressing member 40 is positioned in the left-right direction with respect to the receiving member 30. Then, the lock piece 41 rides on the locked portion 33 and is elastically deformed so as to open outward once, and then recovers when it gets over the locked portion 33. As shown in FIGS. 2 and 7, the lock piece 41 is locked in the groove portion 42. As the portion 33 enters, the lower surface of the locked portion 33 engages with the upper surface of the distal end portion 41a. In this attached state, as shown in FIG. 5, the outer peripheral surface of the main body portion 21 of the aluminum electrolytic capacitor 20 is contacted with the bottom surface 31a of the housing space 31 and the inner surface 43a of the pressing portion 43 of the pressing member 40 over almost the entire circumference. Touching. That is, since the aluminum electrolytic capacitor 20 is held in a state of being sandwiched between the receiving member 30 and the pressing member 40 with almost no gap, it is possible to prevent the body portion 21 from shaking in the radial direction. Yes.

上記のようにしてアルミ電解コンデンサ20及び押さえ部材40を受け部材30に対してアッセンブリする作業を行う一方で、基板10における受け部材30(アルミ電解コンデンサ20)の装着予定位置に他の電気素子Dを実装したり、配線を設ける作業をしておく。そして、アルミ電解コンデンサ20及び押さえ部材40を組み付けたアッセンブリ状態の受け部材30を基板10に対して取り付ける作業を行う。基板10の両孔部11に対して両接続端子22の垂直部分22bの先端部を位置合わせしつつ挿入するとともに、基板10の両ねじ挿通孔12に対して両ねじ取付部37のねじ孔37aを位置合わせする。その後、基板10の裏側から両ねじ部材Nをそれぞれねじ挿通孔12内に通して締め付けることで、ねじ取付部37のねじ孔37aに対して螺合させる。これにより、図3,図6及び図8に示すように、受け部材30がアルミ電解コンデンサ20及び押さえ部材40と共に基板10に対して取付状態に固定される。また両接続端子22の垂直部分22bを半田付けして基板10の導電路に対して電気的に接続する。   While performing the operation of assembling the receiving member 30 with the aluminum electrolytic capacitor 20 and the holding member 40 as described above, another electric element D is placed at the position where the receiving member 30 (the aluminum electrolytic capacitor 20) is to be mounted on the substrate 10. Work to install and wiring. Then, an operation of attaching the assembled receiving member 30 assembled with the aluminum electrolytic capacitor 20 and the pressing member 40 to the substrate 10 is performed. While inserting the front-end | tip part of the perpendicular | vertical part 22b of both the connection terminals 22 with respect to both the hole parts 11 of the board | substrate 10, it inserts into the both screw insertion holes 12 of the board | substrate 10, and the screw hole 37a of the both screw attachment part 37 is inserted. Align. Thereafter, both screw members N are passed through the screw insertion holes 12 from the back side of the substrate 10 and tightened to be screwed into the screw holes 37 a of the screw attachment portion 37. Thereby, as shown in FIGS. 3, 6, and 8, the receiving member 30 is fixed to the substrate 10 together with the aluminum electrolytic capacitor 20 and the pressing member 40. Also, the vertical portions 22b of both connection terminals 22 are soldered to be electrically connected to the conductive path of the substrate 10.

この取り付け時には、受け部材30の両支持部38の下面が基板10の上面に当接されることで、受け部材30が基板10との間に空間Sを確保した状態で支持される。これにより、受け部材30と基板10との間の空間S内に、事前に基板10に設けられた他の電気素子Dや配線が収容されることになる。言い換えると、アルミ電解コンデンサ20と他の電気素子D及び配線とは、高さ方向(基板10の面方向と直交する方向)についてずれているものの、基板10の面方向について重なる位置に配される。   At the time of attachment, the lower surface of both support portions 38 of the receiving member 30 is in contact with the upper surface of the substrate 10, so that the receiving member 30 is supported in a state where a space S is secured between the receiving member 30 and the substrate 10. As a result, other electrical elements D and wirings provided in advance on the substrate 10 are accommodated in the space S between the receiving member 30 and the substrate 10. In other words, the aluminum electrolytic capacitor 20 and the other electric elements D and wirings are arranged at positions overlapping in the surface direction of the substrate 10 although they are displaced in the height direction (direction orthogonal to the surface direction of the substrate 10). .

なお組み付け手順について、例えば先に基板10における受け部材30の装着予定位置に他の電気素子Dなどを実装し、その後受け部材30を基板10に取り付けるようにし、その受け部材30に対してアルミ電解コンデンサ20、押さえ部材40の順で組み付けるようにしてもよく、またその他にも組み付け手順は適宜に変更可能である。   As for the assembling procedure, for example, another electrical element D or the like is first mounted on the mounting position of the receiving member 30 on the substrate 10, and then the receiving member 30 is attached to the substrate 10. The capacitor 20 and the pressing member 40 may be assembled in this order, and the assembly procedure can be changed as appropriate.

以上説明したように本実施形態によれば、アルミ電解コンデンサ20がその長さ方向を水平方向、つまり基板10の面に沿わせた姿勢で取り付けられるので、高さ方向、つまり基板10の面と直交する方向について全体を小型化を図ることができる。その上、アルミ電解コンデンサ20を収容した受け部材30と基板10との間に所定の空間Sを確保した状態で支持部38にて支持するようにしたから、その空間Sに他の電気素子Dを実装したり、配線を設けることができるなど、基板10の表面積を有効に利用することができる。これにより、基板10の面方向についても小型化を図ることができる。   As described above, according to the present embodiment, since the aluminum electrolytic capacitor 20 is attached in a posture in which the length direction thereof is in the horizontal direction, that is, along the surface of the substrate 10, the height direction, that is, the surface of the substrate 10 is The overall size can be reduced in the orthogonal direction. In addition, since a predetermined space S is secured between the receiving member 30 containing the aluminum electrolytic capacitor 20 and the substrate 10, it is supported by the support portion 38. The surface area of the substrate 10 can be used effectively, such as mounting a wiring or providing wiring. Thereby, size reduction can be achieved also about the surface direction of the board | substrate 10. FIG.

また、アルミ電解コンデンサ20を基板10とは反対側から押さえ部材40により押さえ付けるようにしたから、振動などによりアルミ電解コンデンサ20が基板10に対して接離する方向にがたつくのを抑制することができる。   Further, since the aluminum electrolytic capacitor 20 is pressed by the pressing member 40 from the side opposite to the substrate 10, it is possible to prevent the aluminum electrolytic capacitor 20 from rattling in the direction in which the aluminum electrolytic capacitor 20 contacts and separates from the substrate 10 due to vibration or the like. it can.

また、支持部38を一体的に設けた受け部材30内にアルミ電解コンデンサ20を収容し、その受け部材30をねじ部材Nにより基板10に対して固定するようにしたから、作業性に優れる。しかも、ロック片41及び被ロック部33により受け部材30に押さえ部材40を装着状態に保持することができるから、押さえ部材40及びアルミ電解コンデンサ20を受け部材30に対してアッセンブリした状態でまとめて基板10に対して取り付けることができ、一層作業性に優れる。   Moreover, since the aluminum electrolytic capacitor 20 is accommodated in the receiving member 30 integrally provided with the support portion 38 and the receiving member 30 is fixed to the substrate 10 by the screw member N, the workability is excellent. In addition, since the holding member 40 can be held in the receiving member 30 by the lock piece 41 and the locked portion 33, the holding member 40 and the aluminum electrolytic capacitor 20 are assembled in a state assembled to the receiving member 30. It can be attached to the substrate 10 and is further excellent in workability.

また、受け部材30及び押さえ部材40の内周面がアルミ電解コンデンサ20の外周面に沿って円弧状に形成されているから、アルミ電解コンデンサ20のがたつきを極力抑制することができる。   In addition, since the inner peripheral surfaces of the receiving member 30 and the pressing member 40 are formed in an arc shape along the outer peripheral surface of the aluminum electrolytic capacitor 20, rattling of the aluminum electrolytic capacitor 20 can be suppressed as much as possible.

<実施形態2>
本発明の実施形態2を図9ないし図16によって説明する。この実施形態2では、基板10に対して受け部材30を固定するにあたり金具60を使用したものを示す。なおこの実施形態2では、上記した実施形態1と同様の構造、作用及び効果について重複する説明は省略する。
<Embodiment 2>
A second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, a metal fitting 60 is used to fix the receiving member 30 to the substrate 10. In the second embodiment, redundant description of the same structure, operation, and effects as those in the first embodiment will be omitted.

受け部材30の周壁における両短辺部分には、図9に示すように、金具60を取り付け可能な金具取付部50がそれぞれ設けられている(以下、図9及び図15に示す左右の金具取付部50及び金具60について区別する場合は、左側のものについて添え字Aを、右側のものについて添え字Bを付し、区別せず総称する場合は添え字を付さないものとする)。両金具取付部50の共通構造について説明すると、金具取付部50は、受け部材30の周壁の短辺部分から側方へ突出する形態とされるとともに、各金具60を個別に圧入保持可能な金具取付溝51が上下に貫通して設けられている。   As shown in FIG. 9, metal mounting portions 50 to which the metal fitting 60 can be attached are provided on both short sides of the peripheral wall of the receiving member 30 (hereinafter, the left and right metal fittings shown in FIGS. 9 and 15). When distinguishing between the part 50 and the metal fitting 60, the subscript A is attached to the left one, and the subscript B is attached to the right one. The common structure of the two metal fittings 50 will be described. The metal fittings 50 are formed so as to protrude laterally from the short side portion of the peripheral wall of the receiving member 30, and the metal fittings 60 can be press-fitted and held individually. A mounting groove 51 is provided penetrating vertically.

金具取付部50の相違構造について説明すると、右側の金具取付部50Bには、4つの金具取付溝51Bが並設されている。右側の金具取付部50Bの外周縁には、受け部材30の周壁に連続する壁52が取り囲むようにして設けられている。左側の金具取付部50Aには、右側の金具取付溝51Bよりも幅広な2つの金具取付溝51Aが並設されている。また左側の金具取付部50Aは、隣接する左側の支持部38に対して連結されている。   Explaining the different structure of the metal fitting mounting portion 50, four metal fitting mounting grooves 51B are arranged in parallel on the metal fitting mounting portion 50B on the right side. A wall 52 continuous with the peripheral wall of the receiving member 30 is provided around the outer peripheral edge of the right metal fitting 50B. Two metal fitting grooves 51A wider than the right metal fitting groove 51B are arranged in parallel on the left metal fitting portion 50A. Further, the left metal mounting part 50A is connected to the adjacent left support part 38.

次に、各金具取付部50に対応した金具60の共通構造について説明する。金具60は、金属板をプレス加工することで所定の形状に成形されており、上側には、金具取付溝51内に圧入可能とされる受け部材側圧入部61が、下側には、基板10の孔部13内に圧入可能とされる基板側圧入部62がそれぞれ設けられている。受け部材側圧入部61は、金具取付溝51の溝幅よりも幅広に形成されるとともに、その下端位置にはさらに幅広となる張出部63が設けられている。この張出部63は、圧入時に金具取付溝51の側縁に突き当たることで金具60の圧入深さを規制可能とされる。基板側圧入部62は、基板10の孔部13の径寸法よりも大きな外幅寸法を有しており、その上端位置にはさらに大きな外幅の張出部64が設けられている。この張出部64は、圧入時に孔部13の周縁に突き当たることで金具60の圧入深さを規制可能とされる。   Next, the common structure of the metal fitting 60 corresponding to each metal fitting attaching part 50 is demonstrated. The metal fitting 60 is formed into a predetermined shape by pressing a metal plate. A receiving member side press-fit portion 61 that can be press-fitted into the metal fitting mounting groove 51 is formed on the upper side, and the substrate 10 is formed on the lower side. Substrate-side press-fit portions 62 that can be press-fitted into the holes 13 are respectively provided. The receiving member side press-fit portion 61 is formed wider than the groove width of the metal fitting mounting groove 51, and an overhang portion 63 that is wider is provided at the lower end position thereof. The overhanging portion 63 is capable of regulating the press-fitting depth of the metal fitting 60 by abutting against the side edge of the metal fitting mounting groove 51 during press-fitting. The board-side press-fit portion 62 has an outer width dimension larger than the diameter dimension of the hole portion 13 of the substrate 10, and an overhanging portion 64 having a larger outer width is provided at the upper end position. The overhanging portion 64 is capable of regulating the press-fitting depth of the metal fitting 60 by abutting against the periphery of the hole 13 during press-fitting.

金具60の相違構造について説明すると、右側の金具60Bは、金具取付溝51Bに対応して左側の金具60Aよりも受け部材側圧入部61Bの幅が小さく形成されている。左側の金具60Aにおける受け部材側圧入部61Aの上側には、アルミ電解コンデンサ20の接続端子22が接続可能とされるコンデンサ側接続部65が設けられている。アルミ電解コンデンサ20の接続端子22は、図示左側へ突出する水平部分のみを有する構造とされる。コンデンサ側接続部65は、上方へ開口するスリット65aを設けることで二股状に形成され、その間に接続端子22を挟持可能とされる。コンデンサ側接続部65は、金具60Aが金具取付部50Aに取り付けられた状態で金具取付部50Aから上方へ突出するようになっている。左側の金具60Aにおける基板側圧入部62Aは、基板10の孔部13内に圧入されると、孔部13の周面に設けられて導電路に接続された接点部(図示せず)に対して電気的に接続可能とされる。   The difference structure of the metal fitting 60 will be described. The right metal fitting 60B is formed so that the width of the receiving member side press-fit portion 61B is smaller than the left metal fitting 60A corresponding to the metal fitting mounting groove 51B. A capacitor side connection portion 65 to which the connection terminal 22 of the aluminum electrolytic capacitor 20 can be connected is provided above the receiving member side press-fit portion 61A in the left metal fitting 60A. The connection terminal 22 of the aluminum electrolytic capacitor 20 has a structure having only a horizontal portion protruding to the left in the figure. The capacitor side connection portion 65 is formed in a forked shape by providing a slit 65a that opens upward, and the connection terminal 22 can be sandwiched therebetween. The capacitor side connecting portion 65 protrudes upward from the metal fitting mounting portion 50A in a state where the metal fitting 60A is attached to the metal fitting mounting portion 50A. When the board-side press-fit portion 62A of the left metal fitting 60A is press-fitted into the hole 13 of the board 10, it is provided on the peripheral surface of the hole 13 and is connected to a contact portion (not shown) connected to the conductive path. It can be electrically connected.

本実施形態は以上のような構造であり、続いてその作用を説明する。図9に示す状態から、まず受け部材30の両金具取付部50に対して各金具60を取り付ける作業を行う。各金具60の受け部材側圧入部61を各金具取付溝51内に下方から圧入する。これにより、図10に示すように、各金具60が受け部材30に対して取付状態で圧入保持される。各金具60の圧入深さは、張出部63が各金具取付溝51の側縁に突き当たることで所定量に規制される。   This embodiment has the structure as described above, and the operation thereof will be described subsequently. From the state shown in FIG. 9, first, an operation of attaching the metal fittings 60 to the metal fitting attaching portions 50 of the receiving member 30 is performed. The receiving member side press-fitting portion 61 of each metal fitting 60 is press-fitted into each metal fitting mounting groove 51 from below. As a result, as shown in FIG. 10, each metal fitting 60 is press-fitted and held with respect to the receiving member 30. The press-fitting depth of each metal fitting 60 is regulated to a predetermined amount by the protruding portion 63 abutting against the side edge of each metal fitting mounting groove 51.

続いて、受け部材30に対してアルミ電解コンデンサ20、押さえ部材40の順で組み付け作業を行う。アルミ電解コンデンサ20を収容空間31内に収容する際には、両接続端子22を両端子挿通溝35内に通すことで、アルミ電解コンデンサ20の軸線周りの取付姿勢が定められる。この取り付けに伴い、両接続端子22が対応する両金具60Aのコンデンサ側接続部65のスリット65a内に通されて挟持されるので、この接続部分を半田付けして固定する(図13)。押さえ部材40を組み付けると、図11及び図15に示すように、各ロック片41が各被ロック部33に対して係止することで、押さえ部材40がアルミ電解コンデンサ20を押さえ付けた状態で受け部材30に対して保持される。これらの作業を行う一方で、基板10における受け部材30の装着予定位置に他の電気素子Dを実装したり、配線を設ける作業を行っておく。   Subsequently, the aluminum electrolytic capacitor 20 and the pressing member 40 are assembled to the receiving member 30 in this order. When the aluminum electrolytic capacitor 20 is accommodated in the accommodating space 31, the attachment posture around the axis of the aluminum electrolytic capacitor 20 is determined by passing both the connection terminals 22 through the both terminal insertion grooves 35. Along with this attachment, both the connection terminals 22 are passed through the slits 65a of the capacitor side connection portions 65 of the corresponding metal fittings 60A, so that these connection portions are fixed by soldering (FIG. 13). When the pressing member 40 is assembled, as shown in FIGS. 11 and 15, each locking piece 41 is engaged with each locked portion 33, so that the pressing member 40 presses the aluminum electrolytic capacitor 20. It is held with respect to the receiving member 30. While performing these operations, other electrical elements D are mounted on the planned mounting position of the receiving member 30 on the substrate 10 or wiring is provided.

次に、各金具60、アルミ電解コンデンサ20及び押さえ部材40を組み付けた受け部材30を、基板10に対して取り付ける作業を行う。各金具60の基板側圧入部62を対応する各孔部13に整合させつつ受け部材30を基板10に向けて押し込むと、図12,図14及び図16に示すように、各基板側圧入部62が各孔部13内に圧入される。このとき、アルミ電解コンデンサ20の接続端子22に接続された両金具60Aの基板側圧入部62Aは、両孔部13の周面に配された接点部に対して接触され、これによりアルミ電解コンデンサ20が基板10の導電路に対して導通接続される。また受け部材30の押し込み深さ及び各金具60の圧入深さは、支持部38が基板10に当接される、若しくは各基板側圧入部62の張出部64が各孔部13の周縁に突き当たることで、所定量に規制される。これにより、受け部材30と基板10との間には、所定高さ分の空間Sが確保され、ここに他の電気素子Dや配線が収容される。以上のように、各金具60の基板側圧入部62が基板10の各孔部13内に圧入保持されることで、受け部材30(アルミ電解コンデンサ20)が基板10に対して取付状態に固定される。   Next, an operation of attaching the receiving member 30 assembled with each metal fitting 60, the aluminum electrolytic capacitor 20 and the pressing member 40 to the substrate 10 is performed. When the receiving member 30 is pushed toward the substrate 10 while aligning the substrate-side press-fit portions 62 of the respective metal fittings 60 with the corresponding holes 13, the substrate-side press-fit portions 62 are formed as shown in FIGS. It is press-fitted into each hole 13. At this time, the board-side press-fit portions 62A of the metal fittings 60A connected to the connection terminals 22 of the aluminum electrolytic capacitor 20 are brought into contact with the contact portions disposed on the peripheral surfaces of the both hole portions 13, thereby the aluminum electrolytic capacitor 20 Is electrically connected to the conductive path of the substrate 10. The pressing depth of the receiving member 30 and the press-fitting depth of each metal fitting 60 are such that the support portion 38 is brought into contact with the substrate 10 or the protruding portion 64 of each substrate-side press-fitting portion 62 abuts the peripheral edge of each hole portion 13. Thus, the amount is regulated to a predetermined amount. As a result, a space S of a predetermined height is secured between the receiving member 30 and the substrate 10, and other electrical elements D and wirings are accommodated therein. As described above, the receiving member 30 (aluminum electrolytic capacitor 20) is fixed to the substrate 10 in an attached state by the press-fitting and holding of the board-side press-fit portions 62 of the metal fittings 60 in the holes 13 of the substrate 10. The

以上説明したように本実施形態によれば、受け部材30に取り付けた各金具60の基板側圧入部62を基板10の各孔部13に圧入することで、受け部材30を基板10に対して固定することができるから、受け部材30をねじ止めして固定するものと比較して、固定作業が容易なものとなり、作業性に優れる。   As described above, according to this embodiment, the receiving member 30 is fixed to the substrate 10 by press-fitting the board-side press-fit portions 62 of the metal fittings 60 attached to the receiving member 30 into the holes 13 of the substrate 10. Therefore, as compared with the case where the receiving member 30 is fixed by screwing, the fixing operation is easy and the workability is excellent.

しかも、左側の金具60Aは、アルミ電解コンデンサ20の接続端子22に接続可能なコンデンサ側接続部65を有するとともに、基板側圧入部62Aが基板10の導電路に対して接続可能とされているから、基板10に対して受け部材30を固定する機能と、基板10に対してアルミ電解コンデンサ20を電気的に接続する機能とを金具60Aに兼用させることができる。これにより、構成の簡素化を図ることが可能となる。   In addition, the left metal fitting 60A has a capacitor side connection portion 65 that can be connected to the connection terminal 22 of the aluminum electrolytic capacitor 20, and the substrate side press-fit portion 62A can be connected to the conductive path of the substrate 10. The function of fixing the receiving member 30 to the substrate 10 and the function of electrically connecting the aluminum electrolytic capacitor 20 to the substrate 10 can be shared by the metal fitting 60A. This makes it possible to simplify the configuration.

<他の実施形態>
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれ、さらに、下記以外にも要旨を逸脱しない範囲内で種々変更して実施することができる。
(1)基板に対して受け部材を固定する固定手段として、例えば受け部材の底面に下方へ突出する弾性片を設け、その弾性片の先端にフック部を設けるようにし、基板に設けた孔部に対して弾性片を挿入してフック部を孔部の周縁裏面側に係止させるようにしてもよい。またその他にも例えば、受け部材を基板に対して接着剤を用いて固定するようにしてもよい。
<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention, and further, within the scope not departing from the gist of the invention other than the following. Various modifications can be made.
(1) As a fixing means for fixing the receiving member to the substrate, for example, an elastic piece protruding downward is provided on the bottom surface of the receiving member, and a hook portion is provided at the tip of the elastic piece, and a hole provided in the substrate On the other hand, an elastic piece may be inserted so that the hook portion is locked to the peripheral back surface side of the hole portion. In addition, for example, the receiving member may be fixed to the substrate using an adhesive.

(2)上記した実施形態2の変形例として、金具が受け部材や基板に対して圧入により保持されるのではなく、例えば半田付けにより保持されるようにしても構わない。
(3)上記した各実施形態では、支持部が受け部材に一体に設けられた場合を示したが、支持部が受け部材とは別体で設けられるものも本発明に含まれる。その場合、支持部がアルミ電解コンデンサを直接に支持する構造とすれば、受け部材を省略することも可能である。その場合は、アルミ電解コンデンサを支持部に対して接着剤により固定すればよい。また押さえ部材に関しては、基板または支持部に対して取り付けるようにし、両者にロック手段を設けるようにすればよい。
(2) As a modification of the above-described second embodiment, the metal fitting may not be held by press fitting to the receiving member or the substrate, but may be held by soldering, for example.
(3) In each of the above-described embodiments, the case where the support portion is provided integrally with the receiving member has been described. However, the present invention includes a case where the support portion is provided separately from the receiving member. In that case, if the support portion has a structure that directly supports the aluminum electrolytic capacitor, the receiving member can be omitted. In that case, what is necessary is just to fix an aluminum electrolytic capacitor with an adhesive agent with respect to a support part. In addition, the pressing member may be attached to the substrate or the support portion, and a locking means may be provided on both.

(4)上記した各実施形態では、支持部が受け部材側に一体に設けられた場合を示したが、基板側に一体に設けるようにしてもよい。
(5)上記した各実施形態では、押さえ部材の内面から部分的に突出する押さえ部がアルミ電解コンデンサを押さえ付けるものを示したが、押さえ部材の内面の全域が張り出してアルミ電解コンデンサを押さえ付けるようにしたものも本発明に含まれる。また押さえ部材を省略することも可能である。
(4) In each of the above-described embodiments, the case where the support portion is integrally provided on the receiving member side is shown, but the support portion may be integrally provided on the substrate side.
(5) In each of the above-described embodiments, the pressing portion that partially protrudes from the inner surface of the pressing member presses the aluminum electrolytic capacitor. However, the entire inner surface of the pressing member projects to press the aluminum electrolytic capacitor. What was done is also included in the present invention. It is also possible to omit the pressing member.

(6)上記した各実施形態では、アルミ電解コンデンサを例示したが、他の種類のコンデンサでもよく、また他の種類の電気素子(例えばリレー)についても本発明は適用可能である。また本体部の形状は、円柱状のものに限らず、例えば角柱状のものでもよい。
(7)上記した実施形態では、ECUに収容する基板に電気素子を取り付けるものを例示したが、他の種類の電気接続箱内に収容する基板に電気素子を取り付けるものにも本発明は適用可能である。
(6) In each of the above-described embodiments, the aluminum electrolytic capacitor has been exemplified. However, other types of capacitors may be used, and the present invention can be applied to other types of electric elements (for example, relays). The shape of the main body is not limited to a cylindrical shape, and may be a prismatic shape, for example.
(7) In the above-described embodiment, the example in which the electric element is attached to the board accommodated in the ECU is illustrated, but the present invention can also be applied to the case in which the electric element is attached to the board accommodated in another type of electrical junction box It is.

本発明の実施形態1に係る基板に対するアルミ電解コンデンサの取付構造の分解斜視図The exploded perspective view of the attachment structure of the aluminum electrolytic capacitor to the substrate concerning Embodiment 1 of the present invention アルミ電解コンデンサ及び押さえ部材を受け部材に取り付けた状態を示す斜視図The perspective view which shows the state which attached the aluminum electrolytic capacitor and the pressing member to the receiving member 受け部材を基板に取り付けた状態を示す斜視図The perspective view which shows the state which attached the receiving member to the board | substrate 基板に対するアルミ電解コンデンサの取付構造の分解横断面図Exploded cross-sectional view of mounting structure of aluminum electrolytic capacitor on board アルミ電解コンデンサ及び押さえ部材を受け部材に取り付けた状態を示す横断面図Cross-sectional view showing a state in which the aluminum electrolytic capacitor and the holding member are attached to the receiving member 受け部材を基板に取り付けた状態を示す横断面図Cross-sectional view showing a state where the receiving member is attached to the substrate アルミ電解コンデンサ及び押さえ部材を受け部材に取り付けた状態を示す側面図Side view showing a state in which the aluminum electrolytic capacitor and the holding member are attached to the receiving member 受け部材を基板に取り付けた状態を示す側面図Side view showing a state where the receiving member is attached to the substrate 本発明の実施形態2に係る基板に対するアルミ電解コンデンサの取付構造の分解斜視図The exploded perspective view of the attachment structure of the aluminum electrolytic capacitor to the substrate concerning Embodiment 2 of the present invention 各金具を受け部材に取り付けた状態を示す斜視図The perspective view which shows the state which attached each metal fitting to the receiving member アルミ電解コンデンサ及び押さえ部材を受け部材に取り付けた状態を示す斜視図The perspective view which shows the state which attached the aluminum electrolytic capacitor and the pressing member to the receiving member 受け部材を基板に取り付けた状態を示す斜視図The perspective view which shows the state which attached the receiving member to the board | substrate 各金具、アルミ電解コンデンサ及び押さえ部材を受け部材に取り付けた状態を示す正面図Front view showing a state in which each metal fitting, aluminum electrolytic capacitor and holding member are attached to the receiving member 受け部材を基板に取り付けた状態を示す正面図Front view showing a state in which the receiving member is attached to the substrate 各金具、アルミ電解コンデンサ及び押さえ部材を受け部材に取り付けた状態を示す側面図Side view showing a state in which each metal fitting, aluminum electrolytic capacitor and holding member are attached to the receiving member 受け部材を基板に取り付けた状態を示す側面図Side view showing a state where the receiving member is attached to the substrate 従来例の斜視図Perspective view of conventional example

符号の説明Explanation of symbols

10…基板
13…孔部
20…アルミ電解コンデンサ(電気素子)
22…接続端子
30…受け部材
31a…底面(対向面)
33…被ロック部(ロック手段)
38…支持部
40…押さえ部材
41…ロック片(ロック手段)
43…内面(対向面)
60…金具(固定手段)
62…圧入部
65…コンデンサ側接続部(素子側接続部)
D…他の電気素子
N…ねじ部材(固定手段)
S…空間
DESCRIPTION OF SYMBOLS 10 ... Board | substrate 13 ... Hole 20 ... Aluminum electrolytic capacitor (electric element)
22 ... Connection terminal 30 ... Receiving member 31a ... Bottom surface (opposite surface)
33 ... Locked part (locking means)
38 ... support part 40 ... pressing member 41 ... lock piece (locking means)
43 ... Inner surface (opposite surface)
60 ... Fitting (fixing means)
62 ... Press-fit part 65 ... Capacitor side connection part (element side connection part)
D: Other electric element N ... Screw member (fixing means)
S ... space

Claims (7)

柱状をなす電気素子の基板に対する取付構造であって、
前記電気素子がその長さ方向を前記基板の面に沿わせた姿勢で基板に対して取り付けられるとともに、前記基板との間に所定の空間を保った状態で前記電気素子を支持可能な支持部が設けられていることを特徴とする基板に対する電気素子の取付構造。
A mounting structure for a substrate of an electric element having a columnar shape,
The electrical element is attached to the substrate in a posture in which the length direction of the electrical element is along the surface of the substrate, and a support portion capable of supporting the electrical element while maintaining a predetermined space between the electrical element and the substrate. A structure for mounting an electric element to a substrate, characterized in that is provided.
前記基板とは反対側から前記電気素子を押さえ付けることが可能な押さえ部材が設けられていることを特徴とする請求項1記載の基板に対する電気素子の取付構造。 2. The electric element mounting structure for a board according to claim 1, further comprising a pressing member capable of pressing the electric element from the side opposite to the board. 前記基板側に配されて前記電気素子を受け入れ可能とされ、且つ前記支持部が一体的に設けられた受け部材と、この受け部材を基板に対して固定可能な固定手段とを備えていることを特徴とする請求項1または請求項2記載の基板に対する電気素子の取付構造。 A receiving member that is arranged on the substrate side and is capable of receiving the electric element and that is integrally provided with the support portion; and a fixing means that can fix the receiving member to the substrate. The structure for attaching an electric element to a substrate according to claim 1 or 2, characterized by the above-mentioned. 前記受け部材に対して前記押さえ部材が着脱可能とされており、これら押さえ部材及び受け部材には、両者を装着状態に保持可能なロック手段が設けられていることを特徴とする請求項3記載の基板に対する電気素子の取付構造。 4. The pressing member is detachably attached to the receiving member, and the pressing member and the receiving member are provided with locking means capable of holding both in a mounted state. Mounting structure of electrical element to the substrate. 前記受け部材及び前記押さえ部材における前記電気素子との対向面は、電気素子の外形に沿った形状に形成されていることを特徴とする請求項4記載の基板に対する電気素子の取付構造。 The structure for mounting an electric element on a substrate according to claim 4, wherein the opposing surface of the receiving member and the pressing member facing the electric element is formed in a shape along the outer shape of the electric element. 前記固定手段は、前記基板に設けられた孔部に対して圧入可能な圧入部を有する金具により構成され、この金具が前記受け部材に装着されるようになっていることを特徴とする請求項3ないし請求項5のいずれかに記載の基板に対する電気素子の取付構造。 The said fixing means is comprised by the metal fitting which has a press-fit part press-fit with respect to the hole provided in the said board | substrate, and this metal fitting is mounted | worn with the said receiving member, It is characterized by the above-mentioned. A structure for attaching an electric element to a substrate according to any one of claims 3 to 5. 前記金具は、前記電気素子の接続端子に接続可能な素子側接続部を有するとともに、前記圧入部が前記基板の導電路に対して接続可能とされていることを特徴とする請求項6記載の基板に対する電気素子の取付構造。 The metal fitting has an element-side connection portion connectable to a connection terminal of the electric element, and the press-fitting portion is connectable to a conductive path of the substrate. Mounting structure of electrical elements to the board.
JP2004339070A 2004-11-24 2004-11-24 Fitting structure for electric element to substrate Abandoned JP2006148011A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004339070A JP2006148011A (en) 2004-11-24 2004-11-24 Fitting structure for electric element to substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004339070A JP2006148011A (en) 2004-11-24 2004-11-24 Fitting structure for electric element to substrate

Publications (1)

Publication Number Publication Date
JP2006148011A true JP2006148011A (en) 2006-06-08

Family

ID=36627318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004339070A Abandoned JP2006148011A (en) 2004-11-24 2004-11-24 Fitting structure for electric element to substrate

Country Status (1)

Country Link
JP (1) JP2006148011A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010541240A (en) * 2007-09-26 2010-12-24 モレックス インコーポレイテド Electrical component mounting assembly
JP2011249713A (en) * 2010-05-31 2011-12-08 Mitsubishi Electric Corp Electronic component and semiconductor device with electronic component
EP3240375A1 (en) * 2016-04-25 2017-11-01 Schaeffler Technologies GmbH & Co. KG Electronic module with a holder element comprising an optimized design for improved the surface utilisation of the printed circuit board
JP2019004167A (en) * 2018-08-22 2019-01-10 パナソニックIpマネジメント株式会社 Power storage unit

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010541240A (en) * 2007-09-26 2010-12-24 モレックス インコーポレイテド Electrical component mounting assembly
JP2011249713A (en) * 2010-05-31 2011-12-08 Mitsubishi Electric Corp Electronic component and semiconductor device with electronic component
EP3240375A1 (en) * 2016-04-25 2017-11-01 Schaeffler Technologies GmbH & Co. KG Electronic module with a holder element comprising an optimized design for improved the surface utilisation of the printed circuit board
JP2019004167A (en) * 2018-08-22 2019-01-10 パナソニックIpマネジメント株式会社 Power storage unit

Similar Documents

Publication Publication Date Title
US7147481B2 (en) Shielded electrical connector with anti-mismatching means
US7112071B2 (en) Structure for attaching a terminal to a circuit board
JP5339531B2 (en) Electrolytic capacitor board mounting connector and electronic circuit equipment
US10424857B2 (en) Connector device with connector and assembly method
KR100800216B1 (en) Connector
KR100816619B1 (en) Board mounted terminal construction
JPH08330032A (en) Connector for circuit board
JP2013229437A (en) Fixing structure of substrate
JP4115974B2 (en) Zero insertion force electrical connector
US11489296B2 (en) Power supply
JP2003123875A (en) Circuit board connection device
JP2007066614A (en) Connector for substrate
JP2006148011A (en) Fitting structure for electric element to substrate
JP2008270234A (en) Substrate fixing structure, substrate fixing spacer and substrate unit
JP2010123589A (en) Terminal structure of electronic component
JP2012124332A (en) Circuit structure and electric connection box
JP2005203698A (en) Case structure of electric instrument
JP3242590B2 (en) Board mounted electrical connector
JP2008016547A (en) Substrate fixing structure
JPH11339903A (en) Substrate mount connector
JP4403951B2 (en) Electronics
US20090075521A1 (en) Stacked electrical connector structure
JP2008270082A (en) Ic socket and mounting method of ic using ic socket
JPH1174046A (en) Asymmetrical connector and its mounting method
JP2000224738A (en) Electric connection box

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20061025

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070305

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090827

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090901

A762 Written abandonment of application

Free format text: JAPANESE INTERMEDIATE CODE: A762

Effective date: 20091006