CN109121294A - Board structure of circuit and electronic equipment - Google Patents
Board structure of circuit and electronic equipment Download PDFInfo
- Publication number
- CN109121294A CN109121294A CN201811156325.3A CN201811156325A CN109121294A CN 109121294 A CN109121294 A CN 109121294A CN 201811156325 A CN201811156325 A CN 201811156325A CN 109121294 A CN109121294 A CN 109121294A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- circuit
- board
- groove
- plate face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The present invention discloses a kind of board structure of circuit, it includes the second circuit board on first circuit board and the plate face being arranged on the first circuit board, at least one of the first circuit board and the second circuit board have groove, and the first circuit board and the second circuit board are welded and fixed and form the accommodation space for accommodating electronic component in the groove.Invention additionally discloses a kind of electronic equipment.Above scheme, which can solve current board structure of circuit, has that welding difficulty is larger.
Description
Technical field
The present invention relates to a kind of board structure of circuit and electronic equipments.
Background technique
With the promotion of development and the user demand of electronic equipment, more and more electricity are integrated in current electronic equipment
Sub- component, so that the function of electronic equipment is more and more.In view of the portability of electronic equipment, the complete machine of electronic equipment
Size is generally smaller, and therefore, the electronic component integrated level in electronic equipment is higher and higher, makes full use of the shell of electronic equipment
Internal space seems particularly necessary.
Most of electronic component in electronic equipment is laid on the circuit board of electronic equipment, therefore, current electronics
Device integration is higher and higher, and it is higher and higher to be embodied in its circuit board integration degree.It is limited to the package size of electronic equipment,
The area of circuit board can not be done greatly, in order to which more electronic components are arranged on circuit boards, usually by circuit board be arranged to
Few double-layer structure, to form three-dimensional board structure of circuit.In such cases, the board structure of circuit in electronic equipment is to stack
Structure, this advantageously reduces the area occupied of circuit board, while can increase the space that electronic component is laid on circuit board again.
Referring to FIG. 1, Fig. 1 is a kind of schematic diagram of typical board structure of circuit.In structure shown in FIG. 1, the first circuit
Plate 101 is supported on tertiary circuit plate 103 by second circuit board 102, and second circuit board 102 plays the role of support, can
So that forming accommodation space 104 between first circuit board 101 and second circuit board 102.In specific design process, the first electricity
Electronic component 105 can be installed towards the plate face of accommodation space 104 on road plate 101 and second circuit board 102.
Second circuit board 102 plays the role of being electrically connected first circuit board 101 and tertiary circuit plate 103, second circuit board
The plate face of 102 two sides is designed with bump, first circuit board 101 and the position opposite with bump of tertiary circuit plate 103
It is respectively provided with corresponding pad.Welding procedure between circuit board is higher to the flatness requirement of circuit board, second circuit board 102
Flatness is poor to will affect welding quality.Since the plate face of the two sides of second circuit board 102 is required to weld, produced in welding process
Raw heat will lead to 102 local heating of second circuit board and deformation occurs, when the side of second circuit board 102, which is welded, completes,
The flatness for often already leading to the plate face of 102 other side of second circuit board is adversely affected, and then will affect the second line
The welding of the plate face of the other side of road plate 102, it is seen then that current board structure of circuit has that welding difficulty is larger.
Summary of the invention
The present invention discloses a kind of board structure of circuit, is asked with solving current board structure of circuit there are welding difficulty is biggish
Topic.
To solve the above-mentioned problems, the present invention adopts the following technical solutions:
Board structure of circuit, including the second circuit on first circuit board and the plate face being arranged on the first circuit board
Plate, at least one of the first circuit board and the second circuit board have groove, the first circuit board and described second
Welding circuit board is fixed and docks the accommodation space to be formed for installing electronic component in the groove.
Electronic equipment, including shell and setting, in the intracorporal board structure of circuit of the shell, the board structure of circuit is above
The board structure of circuit.
The technical solution adopted by the present invention can reach it is following the utility model has the advantages that
In board structure of circuit disclosed by the invention, it can be adjusted by the structure to first circuit board and second circuit board
It is whole, so that at least one has groove in the two, forms first circuit board and second circuit board in groove and hold
Space is received, so that the first circuit board and second circuit board stereochemical structure that is formed lays more electronic components.Phase
For forming accommodation space by welding by three pieces of circuit boards in background technique, board structure of circuit disclosed in the present embodiment
Accommodation space can be formed with less circuit board, therefore only needed during welding assembly by first circuit board and second
Welding circuit board together, and then can reduce welding difficulty.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present invention, constitutes a part of the invention, this hair
Bright illustrative embodiments and their description are used to explain the present invention, and are not constituted improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is a kind of structural schematic diagram of typical board structure of circuit in the prior art；
Fig. 2 is the structural schematic diagram of the first board structure of circuit disclosed by the embodiments of the present invention；
Fig. 3 is the structural schematic diagram of second circuit board in Fig. 2；
Fig. 4 is the structural schematic diagram of second of board structure of circuit disclosed by the embodiments of the present invention；
Fig. 5 is the structural schematic diagram of second circuit board in Fig. 4；
Fig. 6 is the structural schematic diagram of the third board structure of circuit disclosed by the embodiments of the present invention；
Fig. 7 is the structural schematic diagram of the 4th kind of board structure of circuit disclosed by the embodiments of the present invention；
Fig. 8 is the structural schematic diagram of the 5th kind of board structure of circuit disclosed by the embodiments of the present invention.
Description of symbols:
101- first circuit board, 102- second circuit board, 103- tertiary circuit plate, 104- accommodation space, 105- electronics member
Device；
110- first circuit board, 120- second circuit board, 121- groove, 130- accommodation space, 140- second circuit board,
141- groove, 142- opening, 150- accommodation space, 110 '-first circuit boards, 120 '-second circuit boards；
210- first circuit board, 211- groove, 220- second circuit board, 230- accommodation space；
310- first circuit board, the first groove of 311-, 320- second circuit board, the second groove of 321-, 330- accommodation space；
410- installation foundation, 411- support portion, the space 412-, 420- screw.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with the specific embodiment of the invention and
Technical solution of the present invention is clearly and completely described in corresponding attached drawing.Obviously, described embodiment is only the present invention one
Section Example, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall within the protection scope of the present invention.
Below in conjunction with attached drawing, technical solution disclosed in each embodiment that the present invention will be described in detail.
The embodiment of the present invention discloses a kind of board structure of circuit, and disclosed board structure of circuit includes first circuit board and second
Circuit board, second circuit board are arranged in the plate face of first circuit board and are welded and fixed with first circuit board.
In the present embodiment, at least one of first circuit board and second circuit board have groove, first circuit board and second
Circuit board is fixedly linked and forms accommodation space in groove, can accommodate electronics member device in such cases, in accommodation space
Part.Electronic component can be installed in the plate face of first circuit board and second circuit board composition accommodation space.Such structure energy
It enough realizes distribution of the electronic component on solid space, and then higher integrated level can be reached.
In board structure of circuit disclosed by the embodiments of the present invention, the structure to first circuit board and second circuit board can be passed through
Be adjusted so that in the two at least one have groove, after then first circuit board being docked with second circuit board
Groove forms accommodation space, so that the first circuit board and second circuit board stereochemical structure that is formed lays more electricity
Sub- component.For passing through three pieces of circuit boards in background technique and forming accommodation space by welding, the present embodiment is disclosed
Board structure of circuit less circuit board can be used to form accommodation space, therefore only need during welding assembly by first
Circuit board and second circuit board weld together, and then can reduce welding difficulty.
In addition, welding difficulty reduces since whole circuit board structure is by first circuit board and second circuit board welding completion,
When repairing subsequent board structure of circuit, it is also easier to implement detachable maintaining to board structure of circuit.
Understanding to above scheme for convenience is introduced several on basis as described above presently in connection with attached drawing
More specific board structure of circuit.
Referring to FIG. 2, in the first board structure of circuit disclosed by the embodiments of the present invention, second circuit board 120 towards first
Fluted 121 are opened up in the plate face of circuit board 110, the plate face of first circuit board 110 towards second circuit board 120 is plane.The
It is fixedly linked between one circuit board 110 and second circuit board 120 by welding (soldering) realization, first circuit board 110 is towards the
The plate face and groove 121 of two circuit boards 120 form accommodation space 130.Plate of the first circuit board 110 towards second circuit board 120
The electronic component A laid on face is located in accommodation space 130.
Board structure of circuit shown in Fig. 2 only opens up groove 121, as shown in figure 3, then making on second circuit board 120
First circuit board 110 docks to form accommodation space 130 with second circuit board 120, without carrying out in structure to first circuit board 110
Adjustment, operate simpler, conveniently.
Referring to FIG. 2, board structure of circuit disclosed by the embodiments of the present invention can also include installation foundation 410, installation foundation
410 may be considered the mounting bracket of board structure of circuit, facilitate the installation of board structure of circuit.Installation foundation 410 has support portion
411, first circuit board 110 is overlapped on support portion 411, and first circuit board 110 is fixedly linked with support portion 411.Support portion 411
Whole circuit board structure is propped, so that whole circuit board structure forms hanging structure, it is final convenient positioned at outside
The setting of electronic component is carried out in each plate face.
Specifically, first circuit board 110 can be between second circuit board 120 and installation foundation 410, first circuit board
110 are provided with electronic component B1 in the plate face of second circuit board 120, electronic component B1 be located at installation foundation 410 and
In space 412 between first circuit board 110.
In order to facilitate the installation of, in preferred scheme, the both ends of first circuit board 110 are overlapped on two support portions 411 respectively
It above and with support portion 411 is fixedly linked, second circuit board 120 is located between two support portions 411.Specifically, first circuit board
110 can be fixedly connected by screw 420 with support portion 411.Certainly, first circuit board 110 can also be used with support portion 411
Other way is fixedly linked, such as first circuit board 110 can be adhesively fixed with support portion 411 and be connected.
In the present embodiment, second circuit board 120 may include at least two pieces of sub-circuit boards, and at least two pieces of sub-circuit boards are folded
It sets, two pieces of adjacent sub-circuit boards are fixedly linked.In general, two pieces of adjacent sub-circuit boards are bonded by glue, avoid using weldering
It connects.At least two pieces of sub-circuit boards are realized by electric wire and are electrically connected.
In the present embodiment, electronic component can be installed in the plate face of the two sides of first circuit board, the two of second circuit board
Electronic component can also be fitted in the plate face of side.In such cases, first circuit board and the opposite plate of second circuit board
The electronic component being arranged on face can be set in accommodation space.
Referring to FIG. 4, specifically, be respectively arranged in the plate face of the two sides of first circuit board 110 electronic component A1 and
Electronic component B1 is respectively arranged with electronic component C1 and electronic component D1 in the plate face of the two sides of second circuit board 140,
That is, second circuit board 140 is provided with electronic component D1, the groove of second circuit board 140 away from the plate face of first circuit board 110
141 bottom surface is provided with electronic component C1.Electronic component A1 and electronic component C1 are arranged at accommodation space 150
In.In above structure, the thickness of second circuit board 140 can be increased, so that the depth of groove 141 can be bigger, finally
It can make the accommodation space to be formed 150 while accommodate electronic component A1 and electronic component C1.It will be apparent that electricity shown in Fig. 4
More electronic components can be arranged in the hardened structure in road, can be further improved integrated level.
As shown in figure 4, the bottom surface of groove 141 is laid with electronic component C1, printed on the bottom surface of groove 141 for convenience
Brush tin cream, in preferred scheme, referring to FIG. 5, at least one end of groove 141 is provided with opening 142, opening 142 in groove 141
Space connection, during operation, operator or process equipment can be extend into groove 141 from opening 142, in turn
In the bottom surface print solder paste of groove 141.The groove 141 of above structure does not influence on the basis of the formation of accommodation space 150, moreover it is possible to side
Just the operation of print solder paste.
Referring to FIG. 6, Fig. 6 shows the structural schematic diagram of the third board structure of circuit disclosed by the embodiments of the present invention.Fig. 6
Shown in board structure of circuit, first circuit board 210 is towards can open up fluted 211, in the plate face of second circuit board 220
The plate face of two circuit boards 220 towards first circuit board 210 can be plane.Between first circuit board 210 and second circuit board 220
It is fixedly linked by welding (soldering) realization, second circuit board 220 is towards between the plate face and groove 211 of first circuit board 210
Form accommodation space 230.The electronic component A2 being arranged in groove 211 is located in accommodation space 230.
In board structure of circuit shown in fig. 6, groove 211 is only opened up on first circuit board 210, then makes the first circuit
Plate 210 docks to form accommodation space 230 with second circuit board 220, without carrying out the adjustment in structure to second circuit board 220,
It operates simpler, conveniently.In Fig. 6, there is no setting electronics towards in the plate face of first circuit board 210 for second circuit board 220
Component, in actual operating process, second circuit board 220 is towards equally can be set electricity in the plate face of first circuit board 210
Sub- component.
Equally, print solder paste, at least one end of groove 211 are provided with opening on the bottom surface of groove 211 for convenience, operate
Personnel or process equipment can be extend into groove 211 by opening, and then in the bottom surface print solder paste of groove 211, Jin Erwei
The setting of subsequent electronic component provides condition.
Referring to FIG. 7, the structural schematic diagram of the 4th kind of board structure of circuit disclosed by the embodiments of the present invention, knot shown in Fig. 7
In structure, fluted, 311 He of respectively the first groove is opened up in first circuit board 310 and the opposite plate face of second circuit board 320
Second groove 321, after first circuit board 310 and second circuit board 320 are welded and fixed, the notch of the first groove 311 and second recessed
The notch of slot 321 docks to form accommodation space 330, and the notch edges of the notch edges of the first groove 311 and the second groove 321 are welded
It connects and is fixedly linked, and then realize being fixedly linked for first circuit board 310 and second circuit board 320.
In board structure of circuit shown in Fig. 7, groove is opened up on first circuit board 310 and second circuit board 320, then
Accommodation space 330 is formed by two grooves (i.e. the first groove 311 and the second groove 321), such mode can make full use of
The space of the thickness direction of one circuit board 310 and second circuit board 320 is hollowed out, and short transverse (i.e. first is relatively easy to form
The thickness direction of circuit board 310 or the thickness direction of second circuit board 320) bigger space, and then accommodation space 330 can be made
The biggish electronic component of height can be accommodated.
As described above, first circuit board 110 is overlapped on support portion 411, and then is realized and connected with the fixed of support portion 411
It connects.It is of course also possible to be, second circuit board 120 ' is overlapped on support portion 411, and second circuit board 120 ' and support portion 411 are solid
Fixed to be connected, in such cases, first circuit board 110 ' is then installed based on second circuit board 120 ', as shown in Figure 8.
Based on board structure of circuit disclosed by the embodiments of the present invention, the embodiment of the present invention discloses a kind of electronic equipment, disclosed
Electronic equipment include shell and setting in the intracorporal board structure of circuit of shell, which is that above-described circuit is hardened
Structure.
Electronic equipment disclosed by the embodiments of the present invention can be tablet computer, smart phone, game machine, e-book reading
The equipment such as device, wearable device (such as smartwatch), the embodiment of the present invention do not limit the specific type of electronic equipment.
Emphasis describes the difference between each embodiment, difference between each embodiment in foregoing embodiments of the present invention
As long as optimization feature non-contradiction, can combine to form more preferably embodiment, it is contemplated that style of writing is succinct, then no longer superfluous at this
It states.
The above description is only an embodiment of the present invention, is not intended to restrict the invention.For those skilled in the art
For, the invention may be variously modified and varied.All any modifications made within the spirit and principles of the present invention are equal
Replacement, improvement etc., should be included within scope of the presently claimed invention.
Claims (10)
1. board structure of circuit, which is characterized in that including on first circuit board and the plate face being arranged on the first circuit board
Second circuit board, at least one of the first circuit board and the second circuit board have groove, the first circuit board with
The second circuit board is welded and fixed and forms the accommodation space for installing electronic component in the groove.
2. board structure of circuit according to claim 1, which is characterized in that the second circuit board is towards first circuit
The groove is offered in the plate face of plate, the plate face of the first circuit board towards the second circuit board is plane.
3. board structure of circuit according to claim 2, which is characterized in that the second circuit board includes at least two blocks son electricity
Road plate, at least two pieces of sub-circuit boards are stacked, and two pieces of adjacent sub-circuit boards are fixedly linked.
4. board structure of circuit according to claim 2, which is characterized in that the second circuit board deviates from first circuit
The bottom surface of the plate face of plate and the groove is provided with electronic component.
5. board structure of circuit according to claim 4, which is characterized in that the groove at least one end is provided with opening.
6. board structure of circuit according to claim 1, which is characterized in that the first circuit board is towards the second circuit
The groove is offered in the plate face of plate, the plate face of the second circuit board towards the first circuit board is plane.
7. board structure of circuit according to claim 1, which is characterized in that the first circuit board and the second circuit board
Offer the groove, and respectively the first groove and the second groove in opposite plate face, the notch of first groove with
The notch of second groove docks to form the accommodation space, the notch edges of first groove and second groove
Notch edges are welded and fixed connected.
8. board structure of circuit according to claim 1, which is characterized in that it further include installation foundation, the installation foundation tool
There is support portion, the first circuit board or the second circuit board are overlapped on the support portion and fix with the support portion
It is connected, for the first circuit board between the second circuit board and the installation foundation, the first circuit board deviates from institute
The electronic component in the plate face of second circuit board is stated in the space between the first circuit board and the installation foundation.
9. board structure of circuit according to claim 8, which is characterized in that the both ends of the first circuit board are overlapped on respectively
It is fixedly linked on two support portions and with the support portion, the second circuit board is located between two support portions.
10. electronic equipment, which is characterized in that including shell and be arranged in the intracorporal board structure of circuit of the shell, the circuit board
Structure is board structure of circuit of any of claims 1-9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811156325.3A CN109121294B (en) | 2018-09-29 | 2018-09-29 | Circuit board structure and electronic equipment |
| PCT/CN2019/107751 WO2020063643A1 (en) | 2018-09-29 | 2019-09-25 | Circuit board structure and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811156325.3A CN109121294B (en) | 2018-09-29 | 2018-09-29 | Circuit board structure and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109121294A true CN109121294A (en) | 2019-01-01 |
| CN109121294B CN109121294B (en) | 2020-09-18 |
Family
ID=64857590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811156325.3A Active CN109121294B (en) | 2018-09-29 | 2018-09-29 | Circuit board structure and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109121294B (en) |
| WO (1) | WO2020063643A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110165443A (en) * | 2019-05-24 | 2019-08-23 | 维沃移动通信有限公司 | A kind of circuit board stacked structure, installation method and terminal |
| CN110621122A (en) * | 2019-09-03 | 2019-12-27 | Oppo（重庆）智能科技有限公司 | Manufacturing method of multilayer circuit board, multilayer circuit board and electronic equipment |
| CN110958771A (en) * | 2019-12-10 | 2020-04-03 | 维沃移动通信有限公司 | Integrated circuit board and electronic equipment |
| CN113645759A (en) * | 2021-08-09 | 2021-11-12 | 维沃移动通信有限公司 | Circuit board assembly, electronic equipment and processing method of circuit board assembly |
| CN113727514A (en) * | 2021-08-26 | 2021-11-30 | 维沃移动通信有限公司 | Circuit board assembly and electronic device |
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| CN204377298U (en) * | 2015-02-03 | 2015-06-03 | 广东美的暖通设备有限公司 | For household electrical appliance circuit board mounting structure and there are its household electrical appliance |
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| US20010005313A1 (en) * | 1999-12-22 | 2001-06-28 | Shigetsugu Muramatsu | Unit interconnection substrate, interconnection substrate, mount structure of electronic parts, electronic device, method for mounting electronic parts, and method for manufacturing electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110165443A (en) * | 2019-05-24 | 2019-08-23 | 维沃移动通信有限公司 | A kind of circuit board stacked structure, installation method and terminal |
| WO2020238424A1 (en) * | 2019-05-24 | 2020-12-03 | 维沃移动通信有限公司 | Circuit board stacking structure, mounting method and terminal |
| CN110165443B (en) * | 2019-05-24 | 2021-10-22 | 维沃移动通信有限公司 | Circuit board stacking structure, mounting method and terminal |
| CN110621122A (en) * | 2019-09-03 | 2019-12-27 | Oppo（重庆）智能科技有限公司 | Manufacturing method of multilayer circuit board, multilayer circuit board and electronic equipment |
| CN110958771A (en) * | 2019-12-10 | 2020-04-03 | 维沃移动通信有限公司 | Integrated circuit board and electronic equipment |
| CN113645759A (en) * | 2021-08-09 | 2021-11-12 | 维沃移动通信有限公司 | Circuit board assembly, electronic equipment and processing method of circuit board assembly |
| CN113727514A (en) * | 2021-08-26 | 2021-11-30 | 维沃移动通信有限公司 | Circuit board assembly and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020063643A1 (en) | 2020-04-02 |
| CN109121294B (en) | 2020-09-18 |
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