CN105307392B - A kind of printed circuit board and electronic equipment - Google Patents
A kind of printed circuit board and electronic equipment Download PDFInfo
- Publication number
- CN105307392B CN105307392B CN201510675131.4A CN201510675131A CN105307392B CN 105307392 B CN105307392 B CN 105307392B CN 201510675131 A CN201510675131 A CN 201510675131A CN 105307392 B CN105307392 B CN 105307392B
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- China
- Prior art keywords
- pad
- golden finger
- circuit board
- printed circuit
- electronic device
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a kind of printed circuit board and electronic equipment, the printed circuit board includes the multiple pads to connect one to one for the golden finger with electronic device；The multiple pad is arranged in order along first direction, and two neighboring pad is stepped in a second direction to be arranged and be not overlapped in said first direction, and the first direction is the orientation of the golden finger, and the second direction is the extending direction of the golden finger.By the above-mentioned means, the present invention can reduce the risk that short circuit or failure welding occurs in welding process between pad, and multiple pads can be carried out at the same time welding, be conducive to improve production efficiency.
Description
Technical field
The present invention relates to circuit board technology fields, more particularly to a kind of printed circuit board and electronic equipment.
Background technology
Currently, many electronic devices are all to form its pin in the form of golden finger, golden finger is generally by multiple conductions
Contact forms, and multiple conductive contact blades, which are located in same horizontal line, to be arranged in order to form header pin.
As shown in Figure 1, Fig. 1 shows weldering corresponding with golden finger 10 in the structure and circuit board 11 of existing golden finger 10
The structure of disk 111.According to the arrangement mode of golden finger 10, accordingly, the pad 111 formed on circuit board 11 be generally also with
10 corresponding entire row pad of golden finger, each pad 111 are arranged side by side, such arrangement mode so that between pad and pad
Spacing is smaller, therefore short circuit or failure welding are easy to happen when being welded golden finger 10 and pad 111, and due to weldering
Disk spacing is smaller, and is to be arranged side by side, therefore need to weld one by one when worker's welding, is unfavorable for production efficiency raising.
Invention content
The invention mainly solves the technical problem of providing a kind of printed circuit board and electronic equipments, can greatly reduce weldering
The risk of short circuit or failure welding occurs in termination process between pad, and multiple pads can be carried out at the same time welding, be conducive to carry
High efficiency.
In order to solve the above technical problems, one aspect of the present invention is：A kind of printed circuit board is provided, including
The multiple pads to connect one to one for the golden finger with electronic device；The multiple pad is arranged in order along first direction,
Two neighboring pad is stepped in a second direction to be arranged and is not overlapped in said first direction, and the first direction is described
The orientation of golden finger, the second direction are the extending direction of the golden finger.
Wherein, the multiple pad is stepped in a second direction is arranged in order, wherein described first between each pad
Direction non-overlapping copies, in the second direction also non-overlapping copies.
Wherein, the length of the golden finger of the electronic device is incremented by successively or successively decreases, and the electronic device passes through the gold
The end of finger is connect with the pad, and the end of the golden finger is provided with through-hole.
Wherein, the electronic device is the FPC in display backlight source, and the printed circuit board is the display backlight source
Mains supply line plate.
Wherein, two neighboring pad partly overlaps in this second direction.
Wherein, the pad is copper foil.
In order to solve the above technical problems, another technical solution used in the present invention is：A kind of electronic equipment is provided, including
Printed circuit board and electronic device, the electronic device include golden finger, and the printed circuit board includes and the electronic device
Multiple pads for connecting one to one of golden finger；The multiple pad is arranged in order along first direction, two neighboring pad edge
Second direction is stepped to be arranged and is not overlapped in said first direction, and the first direction is the arrangement side of the golden finger
To the second direction is the extending direction of the golden finger.
Wherein, the multiple pad is stepped in a second direction is arranged in order, wherein described first between each pad
Direction and the second direction non-overlapping copies.
Wherein, the length of the golden finger of the electronic device is incremented by successively or successively decreases, and the electronic device passes through the gold
The end of finger is connect with the pad, and the end of the golden finger is provided with through-hole.
Wherein, the electronic device is the FPC in display backlight source, and the printed circuit board is the display backlight source
Mains supply line plate.
The beneficial effects of the invention are as follows：The case where being different from the prior art in printed circuit board of the invention, including is used for
The multiple pads to connect one to one with the golden finger of electronic device, by make multiple pads along golden finger orientation successively
Arrangement, two neighboring pad golden finger extending direction it is stepped arrangement and be not overlapped in the orientation of golden finger,
It is possible thereby to increase the relative spacing in the orientation of golden finger between two neighboring pad, be conducive to reduce between pad
Short circuit or failure welding, and since adjacent pad is not overlapped in the orientation of golden finger, when welding
It can be conducive to improve without welding one by one along at least two pad of orientation pair while brush scolding tin of golden finger
Production efficiency.
Description of the drawings
Fig. 1 is the structural schematic diagram of a kind of golden finger of the prior art and the board pads for connecting golden finger；
Fig. 2 is the structural schematic diagram of electronic device and printed circuit board in one embodiment of electronic equipment of the present invention；
Fig. 3 is structural schematic diagram of the electronic equipment shown in Fig. 2 after electronic device is connected with printed circuit board；
Fig. 4 is the structural schematic diagram of electronic device and printed circuit board in another embodiment of electronic equipment of the present invention；
Fig. 5 is the structural schematic diagram of electronic device and printed circuit board in the another embodiment of electronic equipment of the present invention.
Specific implementation mode
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail
Referring to Fig.2, Fig. 2 shows in one embodiment of electronic equipment of the present invention, the electronic device of electronic equipment and printing
The structural schematic diagram of circuit board, wherein a figures in Fig. 2 are the structural schematic diagram of the golden finger of electronic device, and the b figures in Fig. 2 are
The structural schematic diagram of printed circuit board.In one embodiment of electronic equipment of the present invention, electronic equipment includes printed circuit board 20
With electronic device 30.Wherein, electronic equipment is by taking liquid crystal display as an example.Printed circuit board 20 is the backlight of liquid crystal display
Mains supply line plate, electronic device 30 is the FPC of backlight of LCD, to drive backlight.Electronic device 30 includes
Golden finger 301, the golden finger 301 of electronic device 30 are the lead of the FPC of backlight of LCD, are used for and printed circuit
Plate 20 connects, and is powered to backlight with realizing.
Certainly, in other embodiments, electronic equipment can also be other electronic equipments such as computer, mobile phone, electronics
Device and printed circuit board are then the device in corresponding electronic equipment.
With continued reference to Fig. 2, in present embodiment, printed circuit board 20 includes for the golden finger 301 with electronic device 30
The multiple pads 201 to connect one to one.Wherein, pad 201 is copper foil.It is of course also possible to be formed using other conductive materials.
Based on view shown in Fig. 2, multiple pads 201 are arranged in order along first direction AB, two neighboring pad 201
CD is stepped in a second direction arranges and is not overlapped on AB in a first direction.Wherein, first direction AB is the row of golden finger 301
Column direction, second direction CD are the extending direction of golden finger 30.The arrangement position of AB and multiple in a first direction of multiple pads 201
The arrangement position of golden finger 301 corresponds.
Further, in present embodiment, CD is stepped in a second direction is arranged in order for multiple pads 201, each weldering
AB is not overlapped in a first direction between disk, is not also overlapped in second direction CD.Accordingly, the length of each golden finger 301 not phase
Deng, as shown, the length of each golden finger 301 is successively decreased successively along first direction AB, or along first direction AB negative direction according to
It is secondary incremental, so that the position of the length of golden finger 301 and pad 201 matches, it is convenient for golden finger 301 and corresponding pad
201 welding.In addition, the end of golden finger 301 is provided with through-hole, which is leakage tin hole, so that scolding tin is from golden finger 301
It flows on pad 201.
It is the schematic diagram by golden finger shown in Fig. 2 after together with the pad solder of printed circuit board refering to Fig. 3, Fig. 3.
Electronic device 30 is welded by the end of golden finger 301 with pad 201.
It, can be very by making multiple pads 201 are stepped to be arranged in order and be not overlapped in the orientation of golden finger 301
Facilitate welding.
Specifically, in the welding process, first golden finger 301 is placed on pad 201, each golden finger 301 is located at it
On corresponding pad 201, and golden finger 301 is pinned to keep golden finger 301 and pad 201 to contact.Then by cutter head Welder
Tool is stained with scolding tin, wherein larger cutter head soldering appliance can be selected to be welded, i.e., cutter head soldering appliance speckles with the portion of scolding tin
The width divided can be identical in the width summation of second direction CD as multiple pads 201.In a first direction due to multiple pads 201
Cutter head soldering appliance can once be streaked along first direction AB when not being overlapped on AB, therefore being welded using cutter head soldering appliance more
Golden finger 301 on a pad 201 from left to right can be streaked disposably that is, based on view shown in Fig. 3, you can will
Scolding tin is stained on multiple golden fingers 301 and short circuit can occur to avoid (namely between pad 201) between golden finger 301.It is stained with
Scolding tin on golden finger 301 is flowed by the through-hole 302 on golden finger 301 on pad 201, so that golden finger 301 and weldering
The welding of disk 201 is more firm.Therefore, by the printed circuit board of present embodiment 20, disposable welding action can be completed multiple
Welding between pad 201 and corresponding golden finger 301 greatly improves production efficiency, and welds simple to operate.
Further, since the 201 stepped arrangement of multiple pads, the relative spacing between pad 201 increases, and when welding more holds
Easy fitted, while the risk of welding process circuit break and short circuit can also be reduced, be conducive to improve welding yield.
In the above embodiment, each pad 201 is not overlapped on AB and second direction CD in a first direction, and in the present invention
In the other embodiment of electronic equipment, each pad is not overlapped in a first direction, and two neighboring pad can be in second direction
On partly overlap, i.e., the size of pad can expand along first direction, thus be conducive to increase pad size, and then on golden finger
The size of through-hole can also be made larger therewith, be conducive to scolding tin and flow through through-hole, so as to so that golden finger and pad are good
Welding, avoids contact with bad.
Refering to Fig. 4, in another embodiment of electronic equipment of the present invention, multiple pads 201 on printed circuit board 20
It can also be V-shaped arrangement or inverted V-shaped arrangement.Multiple pads 201 arrangement position of AB and multiple golden fingers 301 in a first direction
Arrangement position correspond, two neighboring pad 201 do not weigh in a first direction in the stepped arrangement of second direction
It is folded.In addition, multiple pads 201 are using intermediate contact pads as boundary, both sides pad is respectively along the stepped arrangement of different directions, and both sides
Pad is symmetrical as symmetry axis using center line where intermediate contact pads.Accordingly, multiple golden fingers 301 also V-shaped arrangement or V
Shape arranges.
By the arrangement mode of the pad of present embodiment, the relative spacing between adjacent pad can be made to increase, favorably
In reducing failure welding in welding process or be easy the risk of short circuit, open circuit.Also, by keeping multiple pads V-shaped or inverted V-shaped
Arrangement can at least be carried out at the same time two pads in welding since two neighboring pad is not overlapped in a first direction
Welding is without causing two pads to be easy to happen short circuit, it is possible thereby to improve welding efficiency.
Certainly, in the other embodiment of electronic equipment of the present invention, multiple pads 201 on printed circuit board 20 may be used also
To be other arrangement modes, such as the height Heterogeneous Permutation of adjacent pad 201, as shown in Figure 5.By such arrangement mode,
The relative spacing of adjacent pad can be made to increase.
The present invention also provides an embodiment of printed circuit board, wherein the structure with application method of printed circuit board with it is upper
The printed circuit board stated described in each embodiment is identical.
Mode the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this
Equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field is included within the scope of the present invention.
Claims (8)
1. a kind of printed circuit board, which is characterized in that include connect one to one for the golden finger with electronic device it is multiple
Pad；
The multiple pad is arranged in order along first direction, and two neighboring pad is stepped in a second direction to be arranged and described
It is not overlapped on first direction, the first direction is the orientation of the golden finger, and the second direction is the golden finger
Extending direction；
The electronic device is the FPC in display backlight source, and the printed circuit board is the main power supply in the display backlight source
Wiring board；
In the welding process, cutter head soldering appliance is stained with scolding tin, and the cutter head soldering appliance speckles with the width of the part of scolding tin
Degree is identical in the width summation of the second direction as the multiple pad.
2. printed circuit board according to claim 1, which is characterized in that the multiple pad is stepped in a second direction
It is arranged in order, wherein in the first direction non-overlapping copies between each pad, in the second direction also non-overlapping copies.
3. printed circuit board according to claim 2, which is characterized in that the length of the golden finger of the electronic device is successively
Increasing or decreasing, the electronic device are connect by the end of the golden finger with the pad, and the end of the golden finger is set
It is equipped with through-hole.
4. printed circuit board according to claim 1, which is characterized in that two neighboring pad portion in this second direction
Divide overlapping.
5. printed circuit board according to claim 1, which is characterized in that the pad is copper foil.
6. a kind of electronic equipment, which is characterized in that including printed circuit board and electronic device, the electronic device includes golden hand
Refer to, the printed circuit board includes the multiple pads to connect one to one with the golden finger of the electronic device；
The multiple pad is arranged in order along first direction, and two neighboring pad is stepped in a second direction to be arranged and described
It is not overlapped on first direction, the first direction is the orientation of the golden finger, and the second direction is the golden finger
Extending direction；
The electronic device is the FPC in display backlight source, and the printed circuit board is the main power supply in the display backlight source
Wiring board；
In the welding process, cutter head soldering appliance is stained with scolding tin, and the cutter head soldering appliance speckles with the width of the part of scolding tin
Degree is identical in the width summation of the second direction as the multiple pad.
7. electronic equipment according to claim 6, which is characterized in that the multiple pad in a second direction it is stepped according to
Secondary arrangement, wherein in the first direction and the second direction non-overlapping copies between each pad.
8. electronic equipment according to claim 7, which is characterized in that the length of the golden finger of the electronic device is passed successively
Increase or successively decrease, the electronic device is connect by the end of the golden finger with the pad, the end setting of the golden finger
There is through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510675131.4A CN105307392B (en) | 2015-10-16 | 2015-10-16 | A kind of printed circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510675131.4A CN105307392B (en) | 2015-10-16 | 2015-10-16 | A kind of printed circuit board and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105307392A CN105307392A (en) | 2016-02-03 |
| CN105307392B true CN105307392B (en) | 2018-10-19 |
Family
ID=55203989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510675131.4A Active CN105307392B (en) | 2015-10-16 | 2015-10-16 | A kind of printed circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105307392B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109275260B (en) * | 2018-10-09 | 2021-06-29 | 郑州云海信息技术有限公司 | High-speed high-density PCB and preparation method thereof |
| CN109994042B (en) * | 2019-04-11 | 2024-05-03 | 武汉华星光电技术有限公司 | Driving chip and display panel |
| CN110007215B (en) * | 2019-04-30 | 2021-05-28 | 厦门市铂联科技股份有限公司 | Open-circuit short-circuit electrical testing method for FPC |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4843191A (en) * | 1987-11-27 | 1989-06-27 | American Telephone And Telegraph Company, At&T Bell Laboratories | Interconnection technique using dielectric layers |
| CN102540510A (en) * | 2011-10-12 | 2012-07-04 | 深圳市华星光电技术有限公司 | Liquid crystal display module and liquid crystal display panel |
| CN202713785U (en) * | 2012-07-25 | 2013-01-30 | 台龙电子（昆山）有限公司 | Gold finger for flexible circuit board |
-
2015
- 2015-10-16 CN CN201510675131.4A patent/CN105307392B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4843191A (en) * | 1987-11-27 | 1989-06-27 | American Telephone And Telegraph Company, At&T Bell Laboratories | Interconnection technique using dielectric layers |
| CN102540510A (en) * | 2011-10-12 | 2012-07-04 | 深圳市华星光电技术有限公司 | Liquid crystal display module and liquid crystal display panel |
| CN202713785U (en) * | 2012-07-25 | 2013-01-30 | 台龙电子（昆山）有限公司 | Gold finger for flexible circuit board |
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| Publication number | Publication date |
|---|---|
| CN105307392A (en) | 2016-02-03 |
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