CN105307392A - Printed circuit board and electronic equipment - Google Patents
Printed circuit board and electronic equipment Download PDFInfo
- Publication number
- CN105307392A CN105307392A CN201510675131.4A CN201510675131A CN105307392A CN 105307392 A CN105307392 A CN 105307392A CN 201510675131 A CN201510675131 A CN 201510675131A CN 105307392 A CN105307392 A CN 105307392A
- Authority
- CN
- China
- Prior art keywords
- golden finger
- circuit board
- pad
- printed circuit
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
Abstract
The invention discloses a printed circuit board and electronic equipment. The printed circuit board comprises a plurality of bonding pads which are used for being connected with golden fingers of an electronic device in a one-to-one correspondence mode, wherein the plurality of bonding pads are sequentially arranged along a first direction, two adjacent bonding pads are arranged in a stepped mode along a second direction and are not overlapped in the first direction, the first direction is an arrangement direction of the golden fingers, and the second direction is an extension direction of the golden fingers. Through the mode disclosed by the invention, the risk of short circuit or poor welding occurred among the bonding pads in the welding process can be reduced. In addition, the plurality of bonding pads can be welded simultaneously, thereby being conducive to improving the production efficiency.
Description
Technical field
The present invention relates to circuit board technology field, particularly relate to a kind of printed circuit board (PCB) and electronic equipment.
Background technology
At present, many electronic devices are all adopt the form of golden finger to form its pin, and golden finger is generally made up of multiple conductive contact blade, and multiple conductive contact blade is positioned on same level line and is arranged in order formation header pin.
As shown in Figure 1, Fig. 1 shows the structure of pad 111 corresponding with golden finger 10 on the structure of existing golden finger 10 and circuit board 11.According to the arrangement mode of golden finger 10, accordingly, the pad 111 that circuit board 11 is formed also is a whole row pad corresponding with golden finger 10 usually, and each pad 111 is arranged side by side, this kind of arrangement mode, make the spacing between pad and pad less, therefore be easily short-circuited or failure welding when golden finger 10 is welded with pad 111, and due to solder pad space length less, and be arranged side by side, therefore need when workman welds to weld one by one, be unfavorable for that production efficiency improves.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of printed circuit board (PCB) and electronic equipment, can greatly reduce to be short-circuited between pad in welding process or the risk of failure welding, and multiple pad can weld simultaneously, is conducive to enhancing productivity.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of printed circuit board (PCB), comprises the multiple pads for connecting one to one with the golden finger of electronic device; Described multiple pad is arranged in order along first direction, adjacent two pads are not overlapping in said first direction along the stepped arrangement of second direction, described first direction is the orientation of described golden finger, and described second direction is the bearing of trend of described golden finger.
Wherein, described multiple pad is arranged in order along second direction is stepped, wherein between each pad at described first direction non-overlapping copies, in described second direction also non-overlapping copies.
Wherein, the length increasing or decreasing successively of the golden finger of described electronic device, described electronic device is connected with described pad by the end of described golden finger, and the end of described golden finger is provided with through hole.
Wherein, described electronic device is the FPC in display backlight source, and described printed circuit board (PCB) is the mains supply line plate in described display backlight source.
Wherein, adjacent two pads partly overlap in this second direction.
Wherein, described pad is Copper Foil.
For solving the problems of the technologies described above, another technical solution used in the present invention is: provide a kind of electronic equipment, comprise printed circuit board (PCB) and electronic device, described electronic device comprises golden finger, and described printed circuit board (PCB) comprises the multiple pads connected one to one with the golden finger of described electronic device; Described multiple pad is arranged in order along first direction, adjacent two pads are not overlapping in said first direction along the stepped arrangement of second direction, described first direction is the orientation of described golden finger, and described second direction is the bearing of trend of described golden finger.
Wherein, described multiple pad is arranged in order along second direction is stepped, wherein between each pad at described first direction and described second direction non-overlapping copies.
Wherein, the length increasing or decreasing successively of the golden finger of described electronic device, described electronic device is connected with described pad by the end of described golden finger, and the end of described golden finger is provided with through hole.
Wherein, described electronic device is the FPC in display backlight source, and described printed circuit board (PCB) is the mains supply line plate in described display backlight source.
The invention has the beneficial effects as follows: the situation being different from prior art, in printed circuit board (PCB) of the present invention, comprise the multiple pads for connecting one to one with the golden finger of electronic device, be arranged in order along the orientation of golden finger by making multiple pad, adjacent two pads are not overlapping in the orientation of golden finger in the stepped arrangement of the bearing of trend of golden finger, the relative spacing between adjacent two pads in the orientation of golden finger can be increased thus, be conducive to reducing the short circuit between pad or failure welding, and because adjacent pad is not overlapping in the orientation of golden finger, therefore can along the orientation of golden finger at least two pads brush scolding tin simultaneously when welding, thus do not need to weld one by one, be conducive to enhancing productivity.
Accompanying drawing explanation
Fig. 1 is a kind of golden finger of prior art and the structural representation of the board pads for being connected golden finger;
Fig. 2 is in electronic equipment one execution mode of the present invention, the structural representation of electronic device and printed circuit board (PCB);
Fig. 3 is the structural representation of the electronic equipment shown in Fig. 2 after electronic device is connected with printed circuit board (PCB);
Fig. 4 is in another execution mode of electronic equipment of the present invention, the structural representation of electronic device and printed circuit board (PCB);
Fig. 5 is in the another execution mode of electronic equipment of the present invention, the structural representation of electronic device and printed circuit board (PCB).
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail
Consult Fig. 2, Fig. 2 shows in electronic equipment one execution mode of the present invention, the electronic device of electronic equipment and the structural representation of printed circuit board (PCB), wherein, a figure in Fig. 2 is the structural representation of the golden finger of electronic device, and the b figure in Fig. 2 is the structural representation of printed circuit board (PCB).In one execution mode of electronic equipment of the present invention, electronic equipment comprises printed circuit board (PCB) 20 and electronic device 30.Wherein, electronic equipment is for liquid crystal display.Printed circuit board (PCB) 20 is the mains supply line plate of the backlight of liquid crystal display, and electronic device 30 is the FPC of backlight of LCD, in order to drive backlight.Electronic device 30 comprises golden finger 301, and the golden finger 301 of electronic device 30 is the lead-in wire of the FPC of backlight of LCD, for being connected with printed circuit board (PCB) 20, to realize powering to backlight.
Certainly, in other embodiments, electronic equipment also can be other electronic equipments such as computer, mobile phone, and electronic device and printed circuit board (PCB) are then the device in respective electronic equipment.
Continue to consult Fig. 2, in present embodiment, printed circuit board (PCB) 20 comprises the multiple pads 201 for connecting one to one with the golden finger 301 of electronic device 30.Wherein, pad 201 is Copper Foil.Certainly, other conductive material also can be used to be formed.
Based on the view shown in Fig. 2, multiple pad 201 is arranged in order along first direction AB, and adjacent two pads 201 are not overlapping on first direction AB along the stepped arrangement of second direction CD.Wherein, first direction AB is the orientation of golden finger 301, and second direction CD is the bearing of trend of golden finger 30.The arrangement position of multiple pad 201 at first direction AB and the arrangement position one_to_one corresponding of multiple golden finger 301.
Further, in present embodiment, multiple pad 201 is arranged in order along second direction CD is stepped, not overlapping at first direction AB between each pad, also not overlapping at second direction CD.Accordingly, the length of each golden finger 301 is unequal, as shown in the figure, the length of each golden finger 301 is successively decreased successively along first direction AB, or increase progressively successively along the opposite direction of first direction AB, to make the position of the length of golden finger 301 and pad 201 match, be convenient to golden finger 301 and weld with corresponding pad 201.In addition, the end of golden finger 301 is provided with through hole, and this through hole, for leaking tin hole, flows on pad 201 from golden finger 301 to make scolding tin.
Consult Fig. 3, Fig. 3 is by the schematic diagram after the golden finger shown in Fig. 2 is together with the pad solder of printed circuit board (PCB).Electronic device 30 is welded with pad 201 by the end of golden finger 301.
By making, multiple pad 201 is stepped to be arranged in order and not overlapping in the orientation of golden finger 301, can easily weld.
Particularly, in welding process, be first placed on pad 201 by golden finger 301, each golden finger 301 is positioned on the pad 201 of its correspondence, and pins golden finger 301 and contact with pad 201 to keep golden finger 301.Then cutter head soldering appliance is stained with scolding tin, wherein, larger cutter head soldering appliance can be selected to weld, namely cutter head soldering appliance speckle with the width of the part of scolding tin can be identical in the width summation of second direction CD with multiple pad 201.Because multiple pad 201 is not overlapping on first direction AB, cutter head soldering appliance once can be streaked the golden finger 301 on multiple pad 201 when therefore using cutter head soldering appliance to weld along first direction AB, namely based on the view shown in Fig. 3, from left to right disposablely can streak, scolding tin can be sticked on multiple golden finger 301 and (also namely between pad 201) between golden finger 301 can be avoided to be short-circuited.The scolding tin sticked on golden finger 301 flows on pad 201 by the through hole 302 on golden finger 301, more firm to make golden finger 301 and pad 201 weld.Therefore, by the printed circuit board (PCB) 20 of present embodiment, disposable welding action can complete the welding between multiple pad 201 with corresponding golden finger 301, greatly enhance productivity, and welding operation is simple and convenient.
In addition, due to the stepped arrangement of multiple pads 201, the relative spacing between pad 201 increases, easier contraposition during welding, can also reduce the risk of welding process open circuit and short circuit simultaneously, is conducive to improving welding yield.
In above-mentioned execution mode, each pad 201 is all not overlapping on first direction AB and second direction CD, and in other execution modes of electronic equipment of the present invention, each pad is not overlapping at first direction, and adjacent two pads can partly overlap in a second direction, namely the size of pad can expand along first direction, be conducive to thus increasing pad size, and then the size of through hole on golden finger also can be done larger thereupon, be conducive to scolding tin and flow through through hole, thus golden finger and pad good welds can be made, avoid loose contact.
Consult Fig. 4, in another execution mode of electronic equipment of the present invention, the multiple pads 201 on printed circuit board (PCB) 20 can also be V-shaped arrangement or inverted V-shaped arrangement.The arrangement position of multiple pad 201 at first direction AB and the arrangement position one_to_one corresponding of multiple golden finger 301, adjacent two pads 201 are not in the stepped arrangement of second direction, and overlapping in a first direction.In addition, multiple pad 201 take intermediate contact pads as boundary, both sides pad respectively along the stepped arrangement of different directions, and both sides pad with intermediate contact pads place center line for symmetry axis is symmetrical.Accordingly, multiple golden finger 301 also V-shaped arrangement or inverted V-shaped arrangement.
By the arrangement mode of the pad of present embodiment, the relative spacing between adjacent pad can be made to increase, be conducive to reducing the risk of failure welding in welding process or easily short circuit, open circuit.And, by making the arrangement of multiple pad V-shaped or inverted V-shaped, when welding because adjacent two pads are not overlapping at first direction, therefore can at least weld two pads simultaneously and two pads can not be caused easily to be short-circuited, can welding efficiency be improved thus.
Certainly, in other execution modes of electronic equipment of the present invention, the multiple pads 201 on printed circuit board (PCB) 20 can also be other arrangement modes, as the height Heterogeneous Permutation of adjacent pad 201, as shown in Figure 5.By this kind of arrangement mode, the relative spacing of adjacent pad also can be made to increase.
The present invention also provides an execution mode of printed circuit board (PCB), and wherein the structure of printed circuit board (PCB) is identical with the printed circuit board (PCB) described in using method and the respective embodiments described above.
The foregoing is only embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (10)
1. a printed circuit board (PCB), is characterized in that, comprises the multiple pads for connecting one to one with the golden finger of electronic device;
Described multiple pad is arranged in order along first direction, adjacent two pads are not overlapping in said first direction along the stepped arrangement of second direction, described first direction is the orientation of described golden finger, and described second direction is the bearing of trend of described golden finger.
2. printed circuit board (PCB) according to claim 1, is characterized in that, described multiple pad is arranged in order along second direction is stepped, wherein between each pad at described first direction non-overlapping copies, in described second direction also non-overlapping copies.
3. printed circuit board (PCB) according to claim 2, is characterized in that, the length increasing or decreasing successively of the golden finger of described electronic device, and described electronic device is connected with described pad by the end of described golden finger, and the end of described golden finger is provided with through hole.
4. printed circuit board (PCB) according to claim 3, is characterized in that, described electronic device is the FPC in display backlight source, and described printed circuit board (PCB) is the mains supply line plate in described display backlight source.
5. printed circuit board (PCB) according to claim 1, is characterized in that, adjacent two pads partly overlap in this second direction.
6. printed circuit board (PCB) according to claim 1, is characterized in that, described pad is Copper Foil.
7. an electronic equipment, is characterized in that, comprises printed circuit board (PCB) and electronic device, and described electronic device comprises golden finger, and described printed circuit board (PCB) comprises the multiple pads connected one to one with the golden finger of described electronic device;
Described multiple pad is arranged in order along first direction, adjacent two pads are not overlapping in said first direction along the stepped arrangement of second direction, described first direction is the orientation of described golden finger, and described second direction is the bearing of trend of described golden finger.
8. electronic equipment according to claim 7, is characterized in that, described multiple pad is arranged in order along second direction is stepped, wherein between each pad at described first direction and described second direction non-overlapping copies.
9. electronic equipment according to claim 8, is characterized in that, the length increasing or decreasing successively of the golden finger of described electronic device, and described electronic device is connected with described pad by the end of described golden finger, and the end of described golden finger is provided with through hole.
10. electronic equipment according to claim 9, is characterized in that, described electronic device is the FPC in display backlight source, and described printed circuit board (PCB) is the mains supply line plate in described display backlight source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510675131.4A CN105307392B (en) | 2015-10-16 | 2015-10-16 | A kind of printed circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510675131.4A CN105307392B (en) | 2015-10-16 | 2015-10-16 | A kind of printed circuit board and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105307392A true CN105307392A (en) | 2016-02-03 |
| CN105307392B CN105307392B (en) | 2018-10-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510675131.4A Active CN105307392B (en) | 2015-10-16 | 2015-10-16 | A kind of printed circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105307392B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109275260A (en) * | 2018-10-09 | 2019-01-25 | 郑州云海信息技术有限公司 | A kind of high-speed and high-density pcb board and preparation method thereof |
| CN109994042A (en) * | 2019-04-11 | 2019-07-09 | 武汉华星光电技术有限公司 | Driving chip and display panel |
| CN110007215A (en) * | 2019-04-30 | 2019-07-12 | 厦门市铂联科技股份有限公司 | A kind of open circuit short circuit electric measuring method of FPC |
| CN109994042B (en) * | 2019-04-11 | 2024-05-03 | 武汉华星光电技术有限公司 | Driving chip and display panel |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4843191A (en) * | 1987-11-27 | 1989-06-27 | American Telephone And Telegraph Company, At&T Bell Laboratories | Interconnection technique using dielectric layers |
| CN102540510A (en) * | 2011-10-12 | 2012-07-04 | 深圳市华星光电技术有限公司 | Liquid crystal display module and liquid crystal display panel |
| CN202713785U (en) * | 2012-07-25 | 2013-01-30 | 台龙电子（昆山）有限公司 | Gold finger for flexible circuit board |
-
2015
- 2015-10-16 CN CN201510675131.4A patent/CN105307392B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4843191A (en) * | 1987-11-27 | 1989-06-27 | American Telephone And Telegraph Company, At&T Bell Laboratories | Interconnection technique using dielectric layers |
| CN102540510A (en) * | 2011-10-12 | 2012-07-04 | 深圳市华星光电技术有限公司 | Liquid crystal display module and liquid crystal display panel |
| CN202713785U (en) * | 2012-07-25 | 2013-01-30 | 台龙电子（昆山）有限公司 | Gold finger for flexible circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109275260A (en) * | 2018-10-09 | 2019-01-25 | 郑州云海信息技术有限公司 | A kind of high-speed and high-density pcb board and preparation method thereof |
| CN109275260B (en) * | 2018-10-09 | 2021-06-29 | 郑州云海信息技术有限公司 | High-speed high-density PCB and preparation method thereof |
| CN109994042A (en) * | 2019-04-11 | 2019-07-09 | 武汉华星光电技术有限公司 | Driving chip and display panel |
| CN109994042B (en) * | 2019-04-11 | 2024-05-03 | 武汉华星光电技术有限公司 | Driving chip and display panel |
| CN110007215A (en) * | 2019-04-30 | 2019-07-12 | 厦门市铂联科技股份有限公司 | A kind of open circuit short circuit electric measuring method of FPC |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105307392B (en) | 2018-10-19 |
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