CN103369826A - A bonding pad layout structure of a circuit board used for soldering signal filtering modules - Google Patents

A bonding pad layout structure of a circuit board used for soldering signal filtering modules Download PDF

Info

Publication number
CN103369826A
CN103369826A CN2012100894876A CN201210089487A CN103369826A CN 103369826 A CN103369826 A CN 103369826A CN 2012100894876 A CN2012100894876 A CN 2012100894876A CN 201210089487 A CN201210089487 A CN 201210089487A CN 103369826 A CN103369826 A CN 103369826A
Authority
CN
China
Prior art keywords
wiring board
signal
pad
single line
filtration module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012100894876A
Other languages
Chinese (zh)
Inventor
陈伯榕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DONGGUAN JIANGUAN PLASTICS ELECTRON Co Ltd
Zhongjiang Yongde Electronics Co Ltd
UD Electronic Corp
Original Assignee
DONGGUAN JIANGUAN PLASTICS ELECTRON Co Ltd
Zhongjiang Yongde Electronics Co Ltd
UD Electronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DONGGUAN JIANGUAN PLASTICS ELECTRON Co Ltd, Zhongjiang Yongde Electronics Co Ltd, UD Electronic Corp filed Critical DONGGUAN JIANGUAN PLASTICS ELECTRON Co Ltd
Priority to CN2012100894876A priority Critical patent/CN103369826A/en
Publication of CN103369826A publication Critical patent/CN103369826A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Provided is a bonding pad layout structure of a circuit board used for soldering signal filtering modules. At least one group of bonding pads included by the circuit board are equipped with a plurality of signal single wire narrow bonding pads and a twisted single wire wide bonding pad. The signal filtering module comprises at least two magnetic coils and wires respectively extended from the one sides of the magnetic coils. The wires comprise two signal single wires and two twisted single wires. The two signal single wires can be soldered on an independent signal single wire narrow bonding pad, respectively. The twisted single wires are soldered on a twisted single wire wide bonding pad in order to form an electrical connection. The plurality of signal single wire narrow bonding pads and the twisted single wire wide bonding pad are arranged at intervals in a staggered manner and are arranged in different rows. Multiple groups of bonding pads can be arranged while not changing the limit width of the circuit board. In addition, a problem of increase in soldering short circuit fraction defective caused by short distance between soldering spots is effectively resolved.

Description

The wiring board pad layout structure of signal filtration module welding
Technical field
The invention provides a kind of wiring board pad layout structure of signal filtration module welding, especially refer to that the narrow pad of plural signal single line on the wiring board and the wide pad of tap single line are for being dislocation and being spaced and being positioned at the difference innings mode of arranging, more groups solder joint can be set, the problem that the fraction defective of short circuit increased when effectively solution caused welding because of each weld spacing from approaching simultaneously under the wiring board finite width.
Background technology
Press, the now fast development of computer science and technology, and desktop computer or notebook computer general be present in each corner in the society, its Computer development trend also, speed strong towards calculation function reaches soon the little direction of volume and strides forward.Because during network communications technology is also rapidly flourish, and with people's life, study, work and lie fallow and bring another different brand-new boundary in the past into, make people more fervent and inseparable with the relation between the network.
Moreover, along with computer or notebook computer development trend, the connector that makes computer-internal also with significantly dwindle, but connector is in the computer downsizing, namely need consider the signal interference problem that its galvanomagnetic effect produces, and the reason that generally can affect the noise jamming of connector can be divided into two major parts haply, one is from the Electromagnetic Interference around the connector, its two interference that produces for connector inside, and because general RJ45 connector is used in digital communication mostly, just there is manufacturer to be provided with filtration module in network connector inside and solves above-mentioned disappearance, the external network signal that network connector can be received carries out the action of filtering, and the actual useful signal of reservation, in order to network signal is transferred to the external control circuit interface, after being converted into again string type transfer of data signal, just can in data handling system, carrying out signal and process.
Please consult simultaneously Fig. 9 and shown in Figure 10, be respectively vertical view and filtration module and the vertical view of wiring board after welding of known lines plate, find out by knowing among the figure, wherein the employed filtration module B of this network signal is generally by magnetic coil B1 and is consisted of, if this magnetic coil B1 will be welded on the wiring board A, namely need enough wiring board A width just to be enough to hold lower all solder joint A1, yet, the wire diameter of the general used copper cash B2 of magnetic coil B1 is 0.06-0.1mm, because the solder joint A1 solder side length on the wiring board A is about 0.8-3.0mm, and this width is about 0.4-1.2mm, so that need at least between two solder joint A1 solders side apart from the short-circuit conditions that could effectively avoid more than the 0.2mm causing because distance is too little when welding, so, general common wiring board A solder joint A1 layout type mostly comes layout in whole row's linear array mode, but this kind layout type requires wiring board A width must be large enough to hold the sum total of all solder joint A1 solders side, when if wiring board A width is restricted, its layout type namely can't be carried out.
In order effectively to solve the problem in the above-mentioned wiring board A width restriction, just there is the dealer to adopt the dislocation mode to come layout, please in conjunction with consulting Figure 11 and shown in Figure 12, be respectively vertical view and another known filtration module and the vertical view of wiring board after welding of another known lines plate, find out by knowing among the figure, it is more approaching that wherein this dislocation layout type can make the distance between each adjacent welds A1 solder side of wiring board A, approximately can effectively save the width demand more than 40%, in addition, the dealer who knows this field all knows, the one-sided copper cash B2 of each group magnetic coil B1 includes two single lines and one group of twisted wire usually, but twisted wire is the situation that two single line modes weld to avoid failure welding by scattering again often, wherein twisted wire is called tap, this tap connects for short circuit in design, if yet when adopting dislocation mode layout to reduce requiring of wiring board A width, just can be because of also having a copper cash B2 in each the solder joint A1 spacing on the wiring board A, cause the fraction defective of short circuit is increased, and coming than the linear array layout type must be high, then remains to be engaged in this journey dealer and redesigns effectively and solved.
Summary of the invention
Problem and disappearance when the present patent application people welds in view of known filtration module, be to collect related data via in many ways assessment and consideration, and utilize for many years research and development experience of engaging in the industry constantly to study and revise, begin to design the wiring board pad layout structure invention birth of this kind signal filtration module welding.
The object of the present invention is to provide a kind of wiring board pad layout structure of signal filtration module welding, to overcome the defective that exists in the known technology.
For achieving the above object, the wiring board pad layout structure of signal filtration module welding provided by the invention, include wiring board and signal filtration module, wherein has at least one assembly welding point on this wiring board, and on the signal filtration module, has a wire that extend respectively at least two group magnetic coils and magnetic coil one side place, and wire is to be welded in solder joint corresponding on the wiring board to form electric connection, wherein:
Each assembly welding point place on this wiring board all is formed with and is the narrow pad of plural signal single line and the wide pad of tap single line that dislocation was spaced and was positioned at different rows, and in the signal filtration module each the group magnetic coil wire all have two signal single lines and two tap single lines, and two signal single lines are for being welded in respectively separately on the narrow pad of independent signal single line, and two tap single lines then are welded in to form on the wide pad of same tap single line and are electrically connected.
The wiring board pad layout structure of described signal filtration module welding, wherein, the narrow pad of plural signal single line at each assembly welding point place of this wiring board all is positioned at same row, and the wide pad of tap single line then is positioned at another row.
The wiring board pad layout structure of described signal filtration module welding, wherein, two narrow pads of signal single line at each assembly welding point place of this wiring board are for being positioned at tap single line wide pad two side places or the same side place.
The wiring board pad layout structure of described signal filtration module welding, wherein, two narrow pads of signal single line at least two assembly weldings point place on this wiring board and the wide pad of tap single line are for being an opposite mirror array spread configuration sequentially up and down.
The wiring board pad layout structure of described signal filtration module welding, wherein, the wide pad of tap single line at each assembly welding point place of this wiring board can be the narrow pad of two adjacent single lines and utilizes wiring or form electric connection in the mode of solder shorts.
At least one assembly welding point place that the invention reside in institute's tool on the wiring board all is formed with and is the narrow pad of plural signal single line and the wide pad of tap single line that dislocation was spaced and was positioned at different rows, can be with the extended wire of signal filtration module at least two group magnetic coils for being welded in respectively independently with two signal single lines on the narrow pad of signal single line, two tap single lines then are welded in to form on the wide pad of same tap single line and are electrically connected, more groups solder joint can be set not changing under the wiring board finite width, effectively solve simultaneously the problem of the fraction defective increase of short circuit when causing its welding from approaching because of each weld spacing.
The narrow pad of plural signal single line that the invention reside in each assembly welding point place of wiring board all is positioned at same row, the wide pad of tap single line then is positioned at another row's layout type, each assembly welding of can making appropriate arrangements is put whole layout configurations, and the wire that makes the signal filtration module is stretching when being welded on the wiring board corresponding solder joint place, its signal single line can not be in contact with one another with the wide pad of tap single line, guarantees by this quality and the yield that weld.
The invention reside in two narrow pads of signal single line at each assembly welding point place of wiring board for being positioned at tap single line wide pad two side places or the same side place, and making two narrow pads of signal single line at least two assembly weldings point place and the wide pad of tap single line also can be an opposite mirror array spread configuration sequentially up and down, this kind layout type can make the required width of wiring board more narrow.
Each organizes the wire that magnetic coil two side places are extended with respectively two signal single lines of tool and two tap single lines to the invention reside in the signal filtration module, and be welded in respectively on two wiring boards corresponding solder joint, and the wide pad of tap single line at each assembly welding point place of wiring board can be the narrow pad of two adjacent single lines and utilizes wiring or form electric connection in the solder shorts mode.
Description of drawings
Fig. 1 is stereo appearance figure of the present invention.
Fig. 2 is the vertical view of wiring board of the present invention.
Fig. 3 is signal filtration module of the present invention and the vertical view of wiring board after welding.
Fig. 4 is the vertical view of the present invention's the first preferred embodiment wiring board.
Fig. 5 is the vertical view of the present invention's the second preferred embodiment wiring board.
Fig. 6 is the present invention's the second preferred embodiment signal filtration module and the vertical view of wiring board after welding.
Fig. 7 is the present invention's the 3rd preferred embodiment signal filtration module and the vertical view of wiring board after welding.
Fig. 8 is the vertical view of the present invention's the 4th preferred embodiment wiring board.
Fig. 9 is the vertical view of known lines plate.
Figure 10 is known filtration module and the vertical view of wiring board after welding.
Figure 11 is the vertical view of another known lines plate.
Figure 12 is another known filtration module and the vertical view of wiring board after welding.
Main element symbol description in the accompanying drawing:
1 wiring board, 11 solder joints, the narrow pad of 111 signal single lines, the wide pad of 112 tap single lines, the narrow pad of 1121 single lines;
2 signal filtration modules, 21 magnetic coils, 22 wires, 221 signal single lines, 222 tap single lines;
3 scolders;
The A wiring board, the A1 solder joint;
The B filtration module, B1 magnetic coil, B2 copper cash.
Embodiment
For and being configured with further understanding to the technology used in the present invention means, elaborate with preferred embodiment by reference to the accompanying drawings, in order to understanding fully.
See also Fig. 1, Fig. 2, shown in Figure 3, be respectively stereo appearance figure of the present invention, the vertical view of wiring board and signal filtration module and the wiring board vertical view after welding, find out by knowing among the figure, the present invention is for including at least one wiring board 1 and signal filtration module 2, wherein on these wiring board 1 one side surfaces for having at least one assembly welding point 11, and put 11 places in each assembly welding and all be formed with and be the narrow pad 111 of plural signal single line and the wide pads 112 of tap single line that dislocation was spaced and was positioned at different rows, and on the signal filtration module 2 for including at least two group magnetic coils 21, and two tap single lines 222 that the wire 22 that extend respectively in each group magnetic coil 21 1 side place all has two signal single lines 221 and twisted wire group, and the wire 22 that makes magnetic coil 21 is corresponding to solder joint 11 welds on the wiring board 1, two signal single lines 221 can be utilized respectively scolder 3 to be welded in separately independently on the narrow pad 111 of signal single line, two tap single lines 222 then are welded in to give on the wide pad 112 of same tap single line forming after the solid welding and are electrically connected.
Moreover, 21 groups of numbers of the magnetic coil of above-mentioned signal filtration module 2 for can be on demand or the difference of design changed, when being 10/100MBps such as the transmission speed of LAN architecture network signal, the 2 better enforcements of signal filtration module can be made of two groups of magnetic coils 21 and wire 22, and the network signal transmission speed is when being 1GBps, 2 of signal filtration modules are made of four groups of magnetic coils 21 and wire 22, and each group magnetic coil 21 2 side place is extended with all respectively wire 22 and is welded in solder joint 11 welds formation electric connection corresponding on the wiring board 1, but when practical application, then be not to be as limitation with this, so when being mainly in this manual wire 22 for each group magnetic coil 21 1 side place and being welded on the wiring board 1, the layout type of at least one group solder joint 11 is described on the wiring board 1.
It is to be formed with to be the narrow pad 111 of plural signal single line and the wide pad 112 of tap single line that dislocation was spaced and was positioned at different rows that at least one assembly welding on the wiring board 1 of the present invention is put the better specific embodiment in 11 places, and make when wire 22 on each group magnetic coil 21 of signal filtration module 2 is stretching to be welded in solder joint 11 weld corresponding on the wiring board 1, its signal single line 221 can not be in contact with one another with the wide pad 112 of tap single line, the narrow pad 111 of plural signal single line that each assembly welding of this kind is put 11 places all is positioned at same row, the wide pad 112 of tap single line then is positioned at another innings mode of arranging, more groups solder joint 11 do not changing under wiring board 1 finite width as can be set, and each assembly welding of can making appropriate arrangements is put the configuration of 11 integral layouts, solve simultaneously effectively the problem of the fraction defective increase of short circuit when approaching institute and cause its welding because of each solder joint 11 distance, reach thus and guarantee the quality of welding and the purpose of yield.
Please arrange in pairs or groups and consult Fig. 4, Fig. 5, shown in Figure 6, be respectively the vertical view of the present invention's the first preferred embodiment wiring board, the vertical view of the second preferred embodiment wiring board and filtration module and the wiring board vertical view after welding, find out by knowing among the figure, wherein this wiring board 1 each assembly welding narrow pad 111 of plural signal single line of putting 11 places all is positioned at same row, the wide pad 112 of tap single line then is positioned at another row, and make two narrow pads 111 of signal single line be positioned at the wide pad of tap single line 112 2 side places, or two narrow pads 111 of signal single line are positioned at place, the wide pad of tap single line 112 the same sides, in addition, at least two assembly weldings on the wiring board 1 are put the narrow pad 111 of two signal single lines at 11 places and the wide pad 112 of tap single line also can be an opposite mirror array spread configuration sequentially up and down, this kind layout type can make the required width of wiring board 1 more narrow, and the circuit board applicable to signal transmission, variability on adapter or the connector and selectivity are high, have more the competitiveness of product.
Please continue to consult Fig. 7, shown in Figure 8, be respectively the present invention's the 3rd preferred embodiment signal filtration module and wiring board in the welding after vertical view and the vertical view of the 4th preferred embodiment wiring board, find out by knowing among the figure, wherein these signal filtration module 2 each group magnetic coil 21 2 side places are extended with all respectively the wire 22 of two signal single lines 221 of tool and two tap single lines 222, and make wire 22 be welded in respectively solder joint 11 welds formation electric connection corresponding on two wiring boards 1, and the wide pad 112 of tap single line that wiring board 1 each assembly welding is put 11 places can be narrow pad 1121 centre of two adjacent single lines and utilizes wiring or form electric connection in the mode of solder shorts, such as the simple and easy modification and the equivalent structure that use specification of the present invention and accompanying drawing content to do change, and all should in like manner be contained in the claim scope of the present invention.
See also again Fig. 2, shown in Figure 3, the present invention is formed with and is the narrow pad 111 of plural signal single line and the wide pads 112 of tap single line that dislocation was spaced and was positioned at different rows for put 11 places at least one assembly welding of institute's tool on the wiring board 1, can be with the extended wires 22 of signal filtration module 2 at least two group magnetic coils 21 for being welded in respectively with two signal single lines 221 independently on the narrow pad 111 of signal single line, two tap single lines 222 then are welded in to form on the wide pad 112 of same tap single line and are electrically connected, more groups solder joint 11 do not changing under wiring board 1 finite width as can be set, and each assembly welding of can making appropriate arrangements is put 11 integral layouts configurations, effectively solves simultaneously the problem of the fraction defective increase of short circuit when approaching institute and cause welding because of each solder joint 11 distance.
Above-mentioned detailed description is for a kind of better possible embodiments explanation of the present invention, only this embodiment limits claim of the present invention, all other do not break away from the equalization finished under the disclosed skill spirit to be changed and modifies change, all should be contained in the claim scope that the present invention contains.

Claims (5)

1. the wiring board pad layout structure of signal filtration module welding, include wiring board and signal filtration module, wherein has at least one assembly welding point on this wiring board, and on the signal filtration module, has a wire that extend respectively at least two group magnetic coils and magnetic coil one side place, and wire is to be welded in solder joint corresponding on the wiring board to form electric connection, it is characterized in that:
Each assembly welding point place on this wiring board all is formed with and is the narrow pad of plural signal single line and the wide pad of tap single line that dislocation was spaced and was positioned at different rows, and in the signal filtration module each the group magnetic coil wire all have two signal single lines and two tap single lines, and two signal single lines are for being welded in respectively separately on the narrow pad of independent signal single line, and two tap single lines then are welded in to form on the wide pad of same tap single line and are electrically connected.
2. the wiring board pad layout structure of signal filtration module welding as claimed in claim 1, wherein, the narrow pad of plural signal single line at each assembly welding point place of this wiring board all is positioned at same row, and the wide pad of tap single line then is positioned at another row.
3. the wiring board pad layout structure of signal filtration module welding as claimed in claim 1, wherein, two narrow pads of signal single line at each assembly welding point place of this wiring board are located for being positioned at tap single line wide pad two side places or the same side.
4. the wiring board pad layout structure of signal filtration module welding as claimed in claim 1, wherein, two narrow pads of signal single line at least two assembly weldings point place on this wiring board and the wide pad of tap single line are for being an opposite mirror array spread configuration sequentially up and down.
5. the wiring board pad layout structure of signal filtration module welding as claimed in claim 1, wherein, the wide pad of tap single line at each assembly welding point place of this wiring board can be the narrow pad of two adjacent single lines and utilizes wiring or form electric connection in the mode of solder shorts.
CN2012100894876A 2012-03-30 2012-03-30 A bonding pad layout structure of a circuit board used for soldering signal filtering modules Pending CN103369826A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012100894876A CN103369826A (en) 2012-03-30 2012-03-30 A bonding pad layout structure of a circuit board used for soldering signal filtering modules

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012100894876A CN103369826A (en) 2012-03-30 2012-03-30 A bonding pad layout structure of a circuit board used for soldering signal filtering modules

Publications (1)

Publication Number Publication Date
CN103369826A true CN103369826A (en) 2013-10-23

Family

ID=49370051

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012100894876A Pending CN103369826A (en) 2012-03-30 2012-03-30 A bonding pad layout structure of a circuit board used for soldering signal filtering modules

Country Status (1)

Country Link
CN (1) CN103369826A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106061110A (en) * 2016-06-28 2016-10-26 广东欧珀移动通信有限公司 PCB and mobile terminal having the same
CN106304628A (en) * 2015-05-26 2017-01-04 上海和辉光电有限公司 Flexible circuit board
CN106658940A (en) * 2016-10-31 2017-05-10 努比亚技术有限公司 Ball grid array printed circuit board
WO2019196569A1 (en) * 2018-04-09 2019-10-17 北京比特大陆科技有限公司 Circuit substrate, chip, series circuit, circuit board, and electronic apparatus
CN111989165A (en) * 2018-04-16 2020-11-24 阿特拉斯柯普科工业技术(德国)有限公司 Metering valve

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080246501A1 (en) * 2005-03-01 2008-10-09 Williams Scott R Probe Card With Stacked Substrate
CN101779525A (en) * 2007-08-10 2010-07-14 夏普株式会社 Wiring board and liquid crystal display device
WO2011056967A2 (en) * 2009-11-06 2011-05-12 Molex Incorporated Multi-layer circuit member with reference circuit
TWM408909U (en) * 2010-12-07 2011-08-01 Chi Mei Comm Systems Inc Circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080246501A1 (en) * 2005-03-01 2008-10-09 Williams Scott R Probe Card With Stacked Substrate
CN101779525A (en) * 2007-08-10 2010-07-14 夏普株式会社 Wiring board and liquid crystal display device
WO2011056967A2 (en) * 2009-11-06 2011-05-12 Molex Incorporated Multi-layer circuit member with reference circuit
TWM408909U (en) * 2010-12-07 2011-08-01 Chi Mei Comm Systems Inc Circuit board

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106304628A (en) * 2015-05-26 2017-01-04 上海和辉光电有限公司 Flexible circuit board
CN106061110A (en) * 2016-06-28 2016-10-26 广东欧珀移动通信有限公司 PCB and mobile terminal having the same
CN106658940A (en) * 2016-10-31 2017-05-10 努比亚技术有限公司 Ball grid array printed circuit board
WO2019196569A1 (en) * 2018-04-09 2019-10-17 北京比特大陆科技有限公司 Circuit substrate, chip, series circuit, circuit board, and electronic apparatus
US11758654B2 (en) 2018-04-09 2023-09-12 Bitmain Development Pte. Ltd. Circuit substrate, chip, series circuit, circuit board and electronic device
CN111989165A (en) * 2018-04-16 2020-11-24 阿特拉斯柯普科工业技术(德国)有限公司 Metering valve
CN111989165B (en) * 2018-04-16 2023-01-13 阿特拉斯柯普科工业技术(德国)有限公司 Metering valve

Similar Documents

Publication Publication Date Title
CN102480070B (en) Wire and cable connector and manufacture method thereof and method for transmitting signals
CN103369826A (en) A bonding pad layout structure of a circuit board used for soldering signal filtering modules
CN102315534B (en) Electric connector
TWI601346B (en) Electrical connector and conductive terminal assembly thereof
CN206961822U (en) The encapsulating structure and printed circuit board (PCB) of chip
TW201409848A (en) Flexible circuit cable insertion structure
US8147274B2 (en) Connector
CN203289736U (en) PCB structure
CN105826285B (en) Chip and electronic equipment
CN103311207A (en) Stacked package structure
CN105307392A (en) Printed circuit board and electronic equipment
CN102523682A (en) Circuit board assembly and electronic apparatus
US20050054241A1 (en) Multi-jack adapter
CN105376962A (en) Method for improving circuit board structure
CN202159791U (en) Double-layer multi-port type communication connector
CN206163868U (en) Full signal switching device of USB
CN203801142U (en) Printed circuit board, system end of medical ultrasonic probe, medical ultrasonic probe, and B ultrasonic machine
TW201325358A (en) Circuit board soldering plate layout structure for soldering signal filter module
CN101901998B (en) Electric connector
TWM599071U (en) Single-row welding wire structure
CN203895387U (en) Circuit breaker busbar
CN205212125U (en) PCB board and electric connector
CN219534895U (en) Cable connector and cable assembly
CN102570121A (en) Socket for automobile sound system
CN210432044U (en) Different annular pad flexible line way board

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20131023