CN219534895U - Cable connector and cable assembly - Google Patents

Abstract

The utility model discloses a cable connector and a cable assembly. The cable connector includes: the circuit board and at least one carrier board; the circuit board is provided with a circuit board wiring, the carrier plate is arranged on one side of the circuit board, and the carrier plate and the circuit board form at least one step; the step includes a first surface and a second surface disposed opposite to each other, and pad portions are provided on the first surface and the second surface, the pad portions being for connecting signal lines. According to the technical scheme, the bonding pads are distributed in a layered arrangement mode, so that the distribution density of the bonding pads in the cable joint is reduced, the welding difficulty of the signal wires is reduced, and the signal interference among the signal wires is reduced.

Description

Cable connector and cable assembly

Technical Field

The embodiment of the utility model relates to the technical field of connector assemblies, in particular to a cable joint and a cable assembly.

Background

With the continuous development and updating iteration of new generation information technologies such as big data and cloud computing, the application data volume presents an exponential growth trend. When mass data is transmitted, the communication speed and the bandwidth of the data transmission connector are required to meet higher requirements.

Currently, there are two modes of electric transmission and optical transmission in the high-speed transmission field. The signal transmission mode of the optical transmission mainly adopts an optical device and an optical fiber to realize signal transmission. However, the optical device has the disadvantages of high design difficulty, complex assembly process and high cost. The signal transmission mode of electric transmission adopts the cable as transmission medium, because the cable has stable performance and low cost's characteristics, especially be fit for short distance wiring, consequently, wide application in SATA storage device, RADI system scene, core router and data center interconnection scene such as high-speed ethernet. The electric transmission signal transmission mode is applied to a cable assembly (Direct Attach Cable, DAC), and the cable assembly is applied to a signal wire to realize data transmission with external equipment.

To meet the demand for higher rate signal transmission, the signal lines provided in the cable assembly have also been multiplied. However, existing cable assemblies are typically arranged with a single row of signal wires. For the signal wires which are multiplied, the arrangement of the welding points of the signal wires is too dense, so that the signal interference among different signal wires is increased, and the welding difficulty of the signal wires is high.

Disclosure of Invention

The utility model provides a cable connector and a cable assembly, which are used for reducing the arrangement density of signal wire welding points and reducing the welding difficulty under the condition that signal wires are multiplied.

According to an aspect of the present utility model, there is provided a cable joint comprising:

a circuit board including a circuit;

the carrier plate is arranged on one side of the circuit board, and the carrier plate and the circuit board form at least one step;

the step includes a first surface and a second surface disposed opposite to each other, and pad portions for connecting signal lines are disposed on the first surface and the second surface.

Optionally, the pad part includes at least two pad groups, and the first surface is provided with at least one of the pad groups; the second surface is provided with at least one of the sets of pads.

Optionally, the number of the pad groups located on the first surface is greater than the number of the pad groups located on the second surface.

Optionally, the bonding pad group includes a plurality of bonding pads, the plurality of bonding pads are arranged in a direction parallel to the step edge in an extending manner, and the number of bonding pads included in at least two adjacent bonding pad groups on the first surface is different.

Optionally, the carrier plate includes: the first carrier plate and the second carrier plate;

the first carrier plate and the second carrier plate are arranged on two sides of the circuit board; the length of the circuit board is longer than that of the carrier board;

the first carrier plate and the circuit board form a first step, and the first surface and the second surface of the first step are provided with the bonding pad part;

the second carrier plate and the circuit board form a second step, and the first surface and the second surface of the second step are provided with the pad part.

Optionally, the first surface of the first step coincides with the surface of the first carrier plate on one side far away from the circuit board; the second surface of the first step coincides with the surface of one side of the circuit board adjacent to the first carrier plate;

the first surface of the second step coincides with the surface of the side, away from the circuit board, of the second carrier plate; the second surface of the second step coincides with the surface of the circuit board adjacent to one side of the second carrier plate.

Optionally, the pad includes: the signal pad and the grounding pad are arranged between the grounding pads; the width of the grounding pad is half of the width of the signal pad;

alternatively, the pad includes: a signal pad and a ground pad, two adjacent pads sharing one ground pad; the width of the grounding pad is equal to the width of the signal pad.

Optionally, at least one of the carrier boards is provided with an electronic device, a plurality of connection terminals and a carrier board wiring, and the connection terminals are electrically connected with the electronic device through the carrier board wiring.

Optionally, the carrier board trace is electrically connected with the circuit board trace, the pad portion of the first surface is electrically connected with the electronic device through the carrier board trace, and the pad portion of the second surface is electrically connected with the electronic device through the carrier board trace and the circuit board trace.

According to another aspect of the present utility model, there is provided a cable assembly comprising: a cable and a cable connector according to the first aspect, the cable comprising a plurality of signal wires.

The cable connector provided by the technical scheme of the embodiment of the utility model comprises a circuit board and at least one carrier plate, wherein the carrier plate is arranged on one side of the circuit board, and at least one step is formed between the carrier plate and the circuit board at one end. The step includes having the first surface and the second surface of certain difference in height, all is provided with the pad portion on the side near step edge on first surface and second surface, can realize the cable joint and cable between the electricity through the pad portion. Compared with the condition that only a single row of bonding pads are arranged on the surface of the circuit board in the prior art, the technical scheme of the embodiment of the utility model can increase the bonding pad parts on the second surface of the step by forming the step structure at one end of the carrier plate and one end of the circuit board, and the number of bonding pads contained in each bonding pad part is reduced in a layering multi-row mode. Therefore, the arrangement density of the bonding pads can be reduced, so that the welding difficulty of the signal wires is reduced, and the signal interference is reduced.

It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the utility model or to delineate the scope of the utility model. Other features of the present utility model will become apparent from the description that follows.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic longitudinal sectional view of a cable connector according to an embodiment of the present utility model;

fig. 2 is a schematic top view of a cable connector according to an embodiment of the present utility model;

FIG. 3 is a schematic top view of still another cable connector according to an embodiment of the present utility model;

FIG. 4 is a schematic top view of yet another cable connector provided in accordance with an embodiment of the present utility model;

FIG. 5 is a schematic top view of yet another cable connector provided in accordance with an embodiment of the present utility model;

fig. 6 is a schematic top view of a pad according to an embodiment of the present utility model;

FIG. 7 is a schematic top view of yet another bond pad provided in accordance with an embodiment of the present utility model;

fig. 8 is a schematic longitudinal sectional view of still another cable connector according to an embodiment of the present utility model;

FIG. 9 is a schematic top view of yet another cable connector provided in accordance with an embodiment of the present utility model;

fig. 10 is a schematic structural view of a cable connector according to an embodiment of the present utility model;

FIG. 11 is a schematic view of a cable connector according to an embodiment of the present utility model;

fig. 12 is a schematic view of a cable assembly according to an embodiment of the present utility model.

Detailed Description

In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the utility model described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

The technical scheme of the embodiment of the utility model provides a cable connector. Fig. 1 is a schematic longitudinal sectional structure of a cable connector according to an embodiment of the present utility model, and fig. 2 is a schematic top view of the cable connector according to an embodiment of the present utility model. As shown in fig. 1, the cable joint includes: a circuit board 10 and at least one carrier board 20; the circuit board 10 is provided with a circuit board wiring, the carrier plate 20 is arranged on one side of the circuit board 10, and the carrier plate 20 and the circuit board 10 form at least one step 30; the step 30 includes a first surface 31 and a second surface 32 disposed opposite to each other, and a pad portion 33 is provided on the first surface 31 and the second surface 32, the pad portion 33 being for connecting the signal line 11.

Illustratively, the circuit board 10 may be a conventional printed circuit board having circuit board traces disposed thereon. At least one carrier 20 is disposed on a surface of a side surface of the circuit board 10, and the carrier 20 may be a substrate-like PCB (SLP), on which carrier traces are disposed and electrically connected with the circuit board traces. The carrier-like board is a special printed circuit board, and has smaller line width and space compared with the common printed circuit board, thereby improving the circuit density.

The carrier plate 20 and the circuit board 10 together form at least one step 30 at one end, and as an example, the cable joint includes the circuit board 10 and one carrier plate 20, fig. 1 and 2 show a case where one carrier plate 20 and the circuit board 10 together form one step 30. The step 30 comprises a first surface 31 and a second surface 32 having a height difference, the first surface 31 and the second surface 32 being parallel to a horizontal plane. The pad portions 33 are arranged on the first surface 31 and the second surface 32 at positions near the edge of the step 30, and the pad portions 33 can electrically connect the signal wires 11 with the cable connector, thereby performing signal transmission. Through setting up to the step structure that has the difference in height at the one end that circuit board 10 and carrier plate 20 and cable are connected, not only can set up pad portion 33 at the surface of step 30 the highest layer, i.e. first surface 31, can also add pad portion 33 at the surface of step 30 lower floor, i.e. second surface 32 to the total number of pad in pad portion 33 that reduces the surface setting of step 30 the highest layer, thereby avoid the pad to arrange too densely, reduce the welding degree of difficulty of signal line, reduce signal interference.

The cable connector provided by the technical scheme of the embodiment comprises a circuit board and at least one carrier plate, wherein the carrier plate is arranged on one side of the circuit board, and at least one step is formed between the carrier plate and the circuit board at one end. The step includes having the first surface and the second surface of certain difference in height, all is provided with the pad portion on the side near step edge on first surface and second surface, can realize the cable joint and cable between the electricity through the pad portion. Compared with the prior art, the technical scheme of the embodiment has the advantages that the bonding pads are arranged on the surface of the circuit board in a single row, the step structure is formed at one end of the carrier board and one end of the circuit board, the bonding pads can be additionally arranged on the second surface of the step, and the number of bonding pads contained in each bonding pad is reduced in a layered multi-row mode. Therefore, the arrangement density of the bonding pads can be reduced, so that the welding difficulty of the signal wires is reduced, and the signal interference is reduced.

Alternatively, with continued reference to fig. 2, based on the above-described embodiment, the pad section 33 includes at least two pad groups 331, and the first surface 31 is provided with at least one pad group 331; the second surface 32 is provided with at least one pad group 331.

Specifically, the pad part 33 may include at least two pad groups 331 respectively disposed on the first surface 31 and the second surface 32 having a height difference on the step 30. Compared with the prior art, the circuit board 10 and one end of the carrier board 20 provided in this embodiment form a step structure, and the arrangement position of one layer of bonding pads can be expanded, that is, at least two bonding pad groups 331 can be arranged on the surface of the step 30 in a layered manner. Under the condition that the total number of the bonding pads is fixed, a certain number of bonding pads are arranged on the first surface 31 and the second surface 32 in a layering mode, and the number of bonding pads arranged on each layer can be reduced, so that the bonding pad arrangement density is reduced, and the bonding difficulty of signal wires is reduced.

Illustratively, when the pad part 33 includes two pad groups 331, one pad group 331 may be disposed at the first surface 31, and one pad group 331 may be disposed at the second surface 32 as well. By arranging the pad groups 331 in layers, the thickness of the signal line extending portion is the same as that of the signal line arranged in a single layer on the surface of the circuit board in the prior art. Therefore, the technical scheme provided by the embodiment can reduce the arrangement density of the bonding pads under the condition of not increasing the overlapping thickness of the signal lines. Fig. 3 is a schematic top view of still another cable connector according to an embodiment of the utility model. The number of the pad groups 331 located on the first surface 31 is greater than the number of the pad groups 331 located on the second surface 32. When the pad section 33 includes a plurality of pad groups 331, since the available area of the first surface 31 is large, the pad groups 331 can be preferentially arranged on the first surface 31, i.e., the pad groups 331 provided on the first surface 31 are more than the pad groups 331 provided on the second surface 32. For example: two bonding pad groups 331 can be arranged on the first surface 31, and one bonding pad group 331 is arranged on the second surface 32, so that the arrangement density of bonding pads can be effectively reduced, the signal wire welding is easier, and the signal interference between the signal wires is reduced. Illustratively, if the area of the second surface 32 of the step 30 is large enough, two pad groups 331 may be arranged on the second surface 32, and both pad groups 331 may be parallel to the edge of the step 30. When the first surface 31 and the second surface 32 are arranged with two pad groups 331, the pitch between two adjacent pads 3311 in the same pad group 331 can be further reduced, and signal interference can be reduced.

Optionally, fig. 4 is a schematic top view of another cable connector according to an embodiment of the utility model. On the basis of the above embodiments, as shown in fig. 4, the pad group 331 includes a plurality of pads 3311, the plurality of pads 3311 are arranged to extend in a direction parallel to the edge of the step 30, and at least two adjacent pad groups 331 located on the first surface 31 include different numbers of pads 3311.

Specifically, a plurality of pads 3311 may be included in one pad group 331 in unequal numbers, and the plurality of pads 3311 are sequentially arranged in a row in a direction parallel to edges of the first surface 31 and the second surface 32 to form one pad group 331. When the first surface 31 and the second surface 32 each include one pad group 331, the number of pads 3311 included in the two pad groups 331 is equal. When the first surface 31 is provided with two pad groups 331, as shown in fig. 4, the pads 3311 in the two pad groups 331 are each arranged in a row parallel to the direction of the edge of the step 30. To avoid overlapping of the signal lines on the first surface 31 soldered to the pads in the adjacent two pad groups 331 in the thickness direction of the circuit board 10 and the carrier board 20, the pads 3311 in the adjacent two pad groups 331 provided on the first surface 31 are arranged in a staggered manner so that the signal lines soldered to the respective pads 3311 in the adjacent two pad groups 331 are located in the same layer by increasing the thickness of the cable joint. Therefore, the adjacent two pad groups 331 provided on the first surface 31 include different numbers of pads 3311. Illustratively, the number of pads 3311 included in the pad group 331 disposed on the first surface 31 near the edge of the step 30 may be greater than the number of pads 3311 included in the pad group 331 far from the edge of the step 30, and the specific number of pads 3311 included in each pad group 331 may be prepared by self-design according to the widths of the circuit board 10 and the carrier board 20 and the arrangement requirement of the total number of actual signal lines, which is not limited herein.

Optionally, fig. 5 is a schematic top view of another cable connector provided in an embodiment of the present utility model, fig. 6 is a schematic top view of a pad provided in an embodiment of the present utility model, and fig. 7 is a schematic top view of another pad provided in an embodiment of the present utility model. On the basis of the above embodiments, referring to fig. 5 to 7, the pad 3311 includes: a signal pad 3312 and a ground pad 3313, the signal pad 3312 being disposed between the ground pads 3313; the width of the ground pad 3313 is half the width of the signal pad 3312; alternatively, the pad 3311 includes: a signal pad 3312 and a ground pad 3313, adjacent two pads 3311 sharing one ground pad 3313; the width of the ground pad 3313 is equal to the width of the signal pad 3312.

Specifically, each signal line 11 in the cable includes two data signal lines 111 and two ground signal lines 112, wherein the two ground signal lines 112 are disposed on both sides of the two data signal lines 111, respectively. Since the signal line 11 is connected to the cable joint by soldering with the pads, each pad 3311 in the pad group 331 includes a signal pad 3312 and a ground pad 3313. Among these, the pad 3311 generally includes two signal pads 3312, a signal transmission pad and a signal reception pad, respectively. The signal transmitting pad and the signal receiving pad are respectively soldered with two data signal lines 111 in the signal line 11 to realize transmission and reception of signals on the same signal line 11. The ground pad 3313 is used to connect each signal line 11 to ground, and prevents electrostatic interference with signals transmitted on the signal lines 11.

The ground pads 3313 may be arranged in various ways, for example, one of the ground pads 3311 may include two ground pads 3313, and two signal pads 3312 are arranged at intervals in the center of the pad 3311, and two ground pads 3313 are arranged at intervals outside the two sides of the signal pad 3312, as shown in fig. 6. There is also a certain interval between adjacent two ground pads 3313 in adjacent two pads 3311, but the interval between adjacent two ground pads 3313 is smaller than the interval between pads within the same pad 3311. In addition, since each ground pad 3313 is only required to be connected to one ground signal line 112, the width of one ground pad 3313 may be half the width of one signal pad 3312, thereby reducing the area occupied by each pad 3311, and in the case where the widths of the circuit board 10 and the carrier 20 are constant, the number of pads 3311 that can be arranged in one pad group 331 may be increased accordingly.

For example, another arrangement of the ground pads 3313 may be seen in fig. 7, where one ground pad 3313 is shared between two adjacent pads 3311, that is, one ground pad 3313 may form two pads 3311 with two signal pads 3312 on the left and right sides, respectively, to be soldered with two signal lines 11. In one pad group 331, there is an equal spacing between each signal pad 3312 and/or ground pad 3313. In addition, since each ground pad 3313 needs to be connected to the ground signal line 112 of the adjacent two signal lines 11, the width of the ground pad 3313 is the same as the width of the signal pad 3312 to ensure that each signal line 11 in the cable has good grounding performance. Note that, since the outermost ground pad 3313 among the pads 3311 provided at both ends of the pad group 331 is electrically connected to only one ground signal line 112, the width of the ground pad 3313 provided at both ends of the pad group is half the width of the remaining ground pad 3313.

The above embodiments explain the distribution of the bonding pads of the cable connector including the circuit board and one carrier board, in order to meet the requirement of higher signal transmission speed, the cable connector may include the circuit board and two carrier boards, so as to ensure that the arrangement positions of the bonding pads are expanded and the arrangement density of the bonding pads is reduced under the condition that the number of the bonding pads is increased. The following embodiments will explain the structure of a cable joint including a circuit board and two carrier boards.

Optionally, fig. 8 is a schematic longitudinal sectional view of still another cable connector according to an embodiment of the present utility model. On the basis of the above embodiments, referring to fig. 2 and 8, the carrier plate 20 includes: a first carrier plate 21 and a second carrier plate 22; the first carrier plate 21 and the second carrier plate 22 are arranged on two sides of the circuit board 10; the length of the circuit board 10 is greater than the length of the carrier board 20; the first carrier 21 and the circuit board 10 form a first step 301, and the first surface and the second surface of the first step 301 are provided with pad portions 33; the second carrier 22 and the circuit board 10 form a second step 302, and the first and second surfaces of the second step 302 are provided with pad portions 33.

Specifically, the first carrier 21 and the second carrier 22 are disposed on two side surfaces of the circuit board 10 by high-temperature pressing, and are integrated with the circuit board 10. The lengths of the first carrier plate 21 and the second carrier plate 22 are smaller than the length of the circuit board 10, and the lengths of the first carrier plate 21 and the second carrier plate 22 may be equal or unequal, which is not limited in any way.

The first carrier 21 forms a first step 301 having a height difference between one side surface of the circuit board 10 and one end of the circuit board 10 by a length difference, and the second carrier 22 disposed on the other side surface of the circuit board 10 forms a second step 302 having a height difference between one end of the circuit board 10. Illustratively, the first surface of the first step 301 coincides with the surface of the first carrier plate 21 on the side away from the circuit board 10; the second surface of the first step 301 coincides with the surface of the circuit board 10 on the side adjacent to the first carrier plate 21; the first surface of the second step 302 coincides with the surface of the second carrier 22 on the side away from the circuit board 10; the second surface of the second step 302 coincides with the surface of the circuit board 10 on the side adjacent to the second carrier plate 22.

Thus, the first surface of the first step 301 is higher than the second surface, and the first surface of the second step 302 is higher than the second surface. By arranging the pad portions 33 on the surfaces of the first step 301 and the second step 302 formed on both sides of the circuit board 10, respectively, the arrangement positions of the pads can be increased, the soldering density of the signal lines can be reduced, and the signal interference can be reduced.

Optionally, fig. 9 is a schematic top view of another cable connector according to an embodiment of the utility model. On the basis of the above embodiments, as shown in fig. 9, at least one carrier 20 is provided with an electronic device 40, a plurality of connection terminals 23 and carrier traces; the connection terminals 23 are electrically connected to the electronic device 40 through the board wiring.

In particular, the electronic devices 40 disposed in the cable joint may include active devices and passive devices. Illustratively, the active device may include a controller chip, a signal processing chip, and the like; passive devices may include resistive, capacitive, inductive, and the like. Each electronic device 40 in the cable connector is configured to process the received signal, and output the processed signal to the other end, so as to realize signal transmission. At one end far away from the step structure, a plurality of connection terminals 23, namely golden fingers, are arranged on the surface of the carrier plate 20 near the edge. Each connection terminal 23 is correspondingly arranged according to the arrangement mode of the connection terminals in the interfaces of the corresponding electronic equipment, so that one end of the cable connector, provided with the connection terminal 23, is used for being spliced with the electronic equipment for signal transmission, and the communication between the cable and the electronic equipment is realized. The carrier traces provided on the carrier 20 are not shown in fig. 9, and the carrier traces are used to electrically connect the connection terminals 23 with the electronic device 40.

Alternatively, with continued reference to fig. 9, the carrier trace is electrically connected to the circuit board trace, the pad portion 33 of the first surface 31 is electrically connected to the electronic device 40 via the carrier trace, and the pad portion 33 of the second surface 32 is electrically connected to the electronic device 40 via the carrier trace and the circuit board trace.

Illustratively, the electronic device is electrically connected to the electronic device 40 soldered to the carrier 20 through the connection terminal 23, the signal line soldered to the pad 3311 provided on the first surface 31 of the step 30 is electrically connected to the electronic device 40 through the carrier trace, and the signal line 11 soldered to the pad 3311 provided on the second surface 32 of the step 30 is electrically connected to the electronic device 40 soldered to the carrier 20 through the circuit board trace and the carrier trace. Based on the above connection relationship, the electronic device and the cable can realize signal transmission through the electronic device 40.

Fig. 10 is a schematic structural view of a cable connector according to an embodiment of the present utility model, and fig. 11 is a schematic structural view of another cable connector according to an embodiment of the present utility model. Referring to fig. 10 and 11, fig. 10 shows a structure of an inside of a housing of the cable connector, and fig. 11 shows a structure of the cable connector mounted with the housing. The housing 50 encloses the welded structure of the cable connector to protect the connection structure inside the cable connector from the external environment. It should be noted that the strip-shaped groove provided on the surface of the housing 50 is used for dissipating heat inside the cable connector, so as to prevent the cable connector from being damaged due to overheating inside during the signal transmission process.

The embodiment of the utility model also provides a cable assembly. Fig. 12 is a schematic diagram of a cable assembly according to an embodiment of the present utility model. As shown in fig. 12, the cable assembly includes a cable connector 100 and a cable 101, the cable 101 including a plurality of signal lines.

Specifically, the cable 101 is connected between two cable joints 100 with the same structure, two ends of the cable 101 are respectively connected with a step structure formed by a circuit board and a carrier board in the cable joint 100, and the other ends of the cable joints 100 are respectively electrically connected with corresponding electronic equipment, so that signal transmission of the two electronic equipment through the cable 101 is realized.

Since the circuit board and the carrier form a step structure having a height difference, pad portions may be provided on both the first surface and the second surface of the step structure. For a cable with a certain signal transmission speed, all signal wires included in the cable can be welded with the bonding pad parts arranged on the first surface and the second surface, and the arrangement density of the bonding pads is reduced through layered arrangement, so that the welding difficulty of the signal wires and the signal interference between the signal wires are reduced, and the signal wire arrangement requirement in a cable assembly for transmitting signals at a high speed is met.

The above embodiments do not limit the scope of the present utility model. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included in the scope of the present utility model.

Claims (10)

1. A cable fitting, comprising:

the circuit board is provided with a circuit board wiring;

the carrier plate is arranged on one side of the circuit board, and the carrier plate and the circuit board form at least one step;

the step includes a first surface and a second surface disposed opposite to each other, and pad portions for connecting signal lines are disposed on the first surface and the second surface.

2. The cable fitting according to claim 1, wherein said pad portion comprises at least two sets of pads, said first surface being provided with at least one of said sets of pads; the second surface is provided with at least one of the sets of pads.

3. The cable fitting of claim 2, wherein the number of sets of pads on the first surface is greater than the number of sets of pads on the second surface.

4. The cable fitting according to claim 2, wherein said set of pads comprises a plurality of pads arranged extending in a direction parallel to said step edge, said at least two adjacent sets of pads on said first surface comprising different numbers of said pads.

5. The cable fitting according to claim 1, wherein the carrier plate comprises: the first carrier plate and the second carrier plate;

the first carrier plate and the second carrier plate are arranged on two sides of the circuit board; the length of the circuit board is longer than that of the carrier board;

the first carrier plate and the circuit board form a first step, and the first surface and the second surface of the first step are provided with the bonding pad part;

the second carrier plate and the circuit board form a second step, and the first surface and the second surface of the second step are provided with the pad part.

6. The cable fitting according to claim 5, wherein a first surface of the first step coincides with a surface of the first carrier plate on a side away from the circuit board; the second surface of the first step coincides with the surface of one side of the circuit board adjacent to the first carrier plate;

the first surface of the second step coincides with the surface of the side, away from the circuit board, of the second carrier plate; the second surface of the second step coincides with the surface of the circuit board adjacent to one side of the second carrier plate.

7. The cable fitting of claim 4, wherein the bonding pad comprises: the signal pad and the grounding pad are arranged between the grounding pads; the width of the grounding pad is half of the width of the signal pad;

alternatively, the pad includes: a signal pad and a ground pad, two adjacent pads sharing one ground pad; the width of the grounding pad is equal to the width of the signal pad.

8. The cable connector of claim 1, wherein at least one of the carrier plates has an electronic device, a plurality of connection terminals and carrier plate traces thereon, the connection terminals being electrically connected to the electronic device by the carrier plate traces.

9. The cable fitting according to claim 8, wherein said carrier trace is electrically connected to said circuit board trace, said pad portion of said first surface is electrically connected to said electronic device through said carrier trace, and said pad portion of said second surface is electrically connected to said electronic device through said carrier trace and said circuit board trace.

10. A cable assembly comprising a cable and a cable connector according to any one of claims 1-9, the cable comprising a plurality of signal wires.