CN219575971U - Electronic equipment - Google Patents

Abstract

The utility model provides electronic equipment, which comprises at least two stacked rigid circuit boards and a flexible connection structure for connecting two adjacent rigid circuit boards, wherein the flexible connection structure comprises a first connection area, a second connection area and a wiring area, the first connection area is provided with a plurality of first connection parts, and the plurality of first connection parts comprise a first single-ended signal connection part and a first differential signal connection part; the second connection area is provided with a plurality of second connection parts, and the plurality of second connection parts comprise a second single-ended signal connection part and a second differential signal connection part; the first single-ended signal connection part and the second single-ended signal connection part are arranged in a mirror image mode relative to the wiring area; the first differential signal connecting part and the second differential signal connecting part are arranged in the same direction relative to the wiring area. The rigid circuit board in the electronic equipment has a simple connection mode, is beneficial to improving the space utilization rate and capacity of the electronic equipment and reducing the cost, can improve the signal-to-ground ratio, inhibit crosstalk and reduce the wiring layer number.

Description

Electronic equipment

Technical Field

The present utility model relates to the field of communications technologies, and in particular, to an electronic device.

Background

Compared with a traditional mechanical Hard Disk (HDD), the Solid State Disk (SSD) has the advantages of quick start, no noise, low power consumption, good reliability and the like. The SSD is a flash memory chip surface-mounted on a single board, and because of the limited horizontal layout area of the hard disk under the standard size, the SSD generally adopts a 2-layer or multi-layer architecture design in the longitudinal direction, so that more memory chips can be stacked in one hard disk to meet the capacity requirement.

Currently, connection is generally achieved between multiple layers of structures of an SSD by adopting a buckle connector or an integrated rigid-flexible board. The scheme of connecting the multilayer boards by adopting the buckle connector needs to leave a larger layout space in the circuit board, occupies the layout position of the memory chip, and reduces the capacity of the hard disk; moreover, the buckle connector needs to consider the demands of the distribution height, the signal quantity and the signal speed of different heights, and needs to develop connectors with different specifications, so that the compatibility is poor and the cost is high. By adopting the scheme of the integrated rigid-flexible board, the flexible board layer and the hard board layer are required to be separately processed and then pressed together, so that the processing process is long, and the quality control cost is high; moreover, the flexible board is arranged on the whole inner layer board, so that the material cost is high; in addition, the integrated rigid-flexible board has higher requirements on the processing capacity of factories, and few processable factories can be processed, so that the cost is high and the cost is not reduced.

Disclosure of Invention

In view of the above, in order to solve at least one of the above drawbacks, an embodiment of the present utility model provides an electronic device, in which a connection manner of a circuit board stacking assembly is simple, which is beneficial to improving space utilization and capacity of the electronic device, and reducing cost of the electronic device.

An embodiment of the present utility model provides an electronic device, including: the flexible connection structure comprises a first rigid circuit board, a second rigid circuit board and a flexible connection structure, wherein the second rigid circuit board and the first rigid circuit board can be arranged in a laminated mode, and the flexible connection structure comprises: the first connecting area is connected to one surface of the first rigid circuit board, a plurality of first connecting parts are arranged on the first connecting area and are used for being electrically connected with the first rigid circuit board, and the plurality of first connecting parts comprise at least one of a first single-ended signal connecting part and a first differential signal connecting part; the second connection area is connected to one surface of the second rigid circuit board, the second connection area is provided with a plurality of second connection parts, the second connection parts are used for being electrically connected with the second rigid circuit board, and the second connection parts comprise at least one of a second single-ended signal connection part and a second differential signal connection part; the routing area is connected with the first connection area and the second connection area, wherein when the plurality of first connection parts comprise the first single-ended signal connection parts and the plurality of second connection parts comprise the second single-ended signal connection parts, the first single-ended signal connection parts and the second single-ended signal connection parts are in mirror image arrangement relative to the routing area; when the plurality of first connecting portions comprise the first differential signal connecting portions, and the plurality of second connecting portions comprise the second differential signal connecting portions, the first differential signal connecting portions and the second differential signal connecting portions are arranged in the same direction relative to the routing area.

Further, the flexible connection structure is a flexible circuit board (FPC) or a flexible cable.

By adopting the flexible connection structure to realize connection of the first rigid circuit board and the second rigid circuit board, compared with the traditional scheme of adopting a buckle connector to connect or the integrated rigid-flexible board scheme, the size of the first connection part and the second connection part on the flexible connection structure can be designed to be smaller and the density can be designed to be higher, so that the occupied board space on the first rigid circuit board and the second rigid circuit board is reduced, and the space utilization rate and the capacity of the electronic equipment are improved; the density of the first connecting part and the second connecting part on the flexible connecting structure is designed to be higher, so that the downward compatibility of the flexible connecting structure can be improved, and more specifications are not required to be designed; the flexible connection structure can be processed independently, the processing difficulty is low, the connection difficulty of the flexible connection structure and the first rigid circuit board and the second rigid circuit board is low, and the material cost is low, so that the cost of the electronic equipment can be remarkably reduced. In addition, the first single-ended signal connection part and the second single-ended signal connection part are arranged in a mirror image mode relative to the wiring area, so that wiring connection is facilitated, and the wiring can be shortest; the first differential signal connecting part and the second differential signal connecting part are arranged in the same direction relative to the wiring area, so that the lengths of the two differential signal wires are consistent, the same time delay is achieved, the purpose of shortening the time delay is achieved, the signal-to-ground ratio can be improved, crosstalk is restrained, and the number of wiring layers of the flexible connection structure can be reduced.

With reference to the first aspect, in some possible embodiments, the first connection portion is electrically connected to the first rigid circuit board by welding, crimping or clamping, and the second connection portion is electrically connected to the second rigid circuit board by welding, crimping or clamping.

The flexible connection structure is connected with the first rigid circuit board and the second rigid circuit board in a connection mode of welding, crimping or clamping, so that the processing difficulty is low, the cost is low, and the cost of the electronic equipment is further reduced.

With reference to the first aspect, in some possible embodiments, the first connection portion and the second connection portion are pads, the first connection portion is electrically connected to the first rigid circuit board through soldering, and the second connection portion is electrically connected to the second rigid circuit board through soldering.

The welding mode is simple and easy to operate, the size of the welding pads and the spacing between the welding pads can be controlled to be smaller, and further the occupied board space of the flexible connection structure is further reduced, so that high-density connection is realized; moreover, compared with other connection modes, the welding cost is lower, and the cost of the electronic equipment is further reduced.

With reference to the first aspect, in some possible embodiments, the plurality of first connection portions and the plurality of second connection portions are all arranged in an array, the first connection area is provided with M columns of the first connection portions, and the second connection area is provided with M columns of the second connection portions, where M is greater than or equal to 2.

The plurality of first connecting parts and the plurality of second connecting parts are arranged in an array manner, the rows occupy the first connecting area and the second connecting area as much as possible, the column number M is more than or equal to 2, the wiring requirement of the maximum flexible board can be met, the occupied board space of the flexible connecting structure is reduced, the space utilization rate of the first rigid circuit board and the second rigid circuit board is improved, and the capacity of the electronic equipment is improved; furthermore, the flexible connection structure with a plurality of specifications is not required to be designed, and the downward compatibility of the same flexible connection structure can be realized.

With reference to the first aspect, in some possible embodiments, when M is greater than or equal to 3, the ground ends in the first plurality of connection portions are located in a middle column of the M columns, and the ground ends in the second plurality of connection portions are located in a middle column of the M columns.

Further, the routing area includes at least three circuit layers, and each circuit layer is connected with a row of first connecting parts and a row of second connecting parts in signal connection, wherein the first connecting parts and the second connecting parts are arranged in a mirror image mode relative to the routing area.

The ground terminal is designed in the middle, and different types of signals are layered and routed, so that the signal-to-ground ratio can be further improved, crosstalk is suppressed, and the number of routing layers is reduced.

With reference to the first aspect, in some possible embodiments, the first rigid circuit board includes a first surface and a second surface that are disposed opposite to each other, the second rigid circuit board includes a third surface and a fourth surface that are disposed opposite to each other, and after the first rigid circuit board and the second rigid circuit board are stacked, the first surface and the third surface are close to each other, and the second surface and the fourth surface are away from each other, where the first connection region is connected to the second surface, and the second connection region is connected to the fourth surface.

Through setting up first connecting region and second connecting region respectively on the surface that first rigid circuit board and second rigid circuit board deviate from each other, can improve the reliability of connection, and then improve signal transmission's stability.

With reference to the first aspect, in some possible embodiments, a plurality of first bending holes are formed in the wiring area near the first connection area, and the plurality of first bending holes form a first bending line; the wiring area is provided with a plurality of second bending holes close to the second connecting area, and the second bending holes form a second bending line.

Through setting up first hole and the second hole of buckling, can reduce the stress of walking the junction of line district and first connecting region and second connecting region, can reduce the problem that stress leads to the connection stability of first connecting portion and second connecting portion to reduce after buckling, and then improves reliability and signal transmission's stability. It is understood that the first bending hole and the second bending hole are disposed in an area where no wiring is provided so as not to affect signal transmission.

With reference to the first aspect, in some possible embodiments, the first connection area is provided with a first fixing hole, the first rigid circuit board is provided with a second fixing hole corresponding to the first fixing hole, and the first fixing hole and the second fixing hole are connected through a first fixing piece; the second connecting area is provided with a third fixing hole, the second rigid circuit board is provided with a fourth fixing hole corresponding to the third fixing hole, and the third fixing hole is connected with the fourth fixing hole through a second fixing piece. Further, the first and second fixing members may be screws.

The first fixing piece and the second fixing piece are mechanically connected in the first connecting area and the second connecting area, so that the reliability of connection between the flexible connection structure and the first rigid circuit board and the reliability of connection between the flexible connection structure and the second rigid circuit board can be improved, and further the stability of signal transmission can be improved.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present utility model.

Fig. 2 and 3 are schematic structural views of two circuit board stack assemblies of fig. 1 having different stack forms.

Fig. 4 is a schematic structural view of the first rigid circuit board and the second rigid circuit board in fig. 1, which are not stacked.

Fig. 5 is a schematic diagram of a signal layout in the flexible connection structure of fig. 4.

Fig. 6 is a schematic diagram of layered traces in the flexible connection structure of fig. 4.

Fig. 7A is a schematic diagram of a signal layout in a flexible connection structure according to another embodiment of the present utility model.

Fig. 7B is a schematic diagram of the signal layout of fig. 7A with the first connection portion and the second connection portion partially removed.

Fig. 8 is a schematic structural view of a flexible connection structure provided with a first bending hole and a second bending hole according to an embodiment of the present utility model.

Fig. 9 is a top view of the flexible connection structure of fig. 8.

Fig. 10 is a schematic structural view of a circuit board stacking assembly according to an embodiment of the present utility model, in which a first fixing member and a second fixing member are disposed.

Description of the main reference signs

First fixing hole 18 of electronic device 100

Second connection region 3 of housing 10

Second connecting portion 31 of circuit board stack assembly 20

The first rigid circuit board 30 second single-ended signal connection portion 32

First surface 301 second differential signal connection 34

Second surface 302 third securing holes 38

Second fixing hole 303 routing area 5

The circuit layer 51 of the second rigid circuit board 40

Third surface 401 first fixing member 7

Fourth surface 402 second securing member 9

Fourth fixing hole 403 first bending hole 2

First bending line 4 of flexible connection structure 50

The first connecting area 1 is provided with a second bending hole 6

Second bending line 8 of first connecting part 11

Length direction a of first single-ended signal connection portion 12

The first differential signal connection part 14 is arranged in the wiring direction b

Ground ends 16,36

Detailed Description

Embodiments of the present utility model will be described below with reference to the accompanying drawings in the embodiments of the present utility model.

The terminology used in the following examples is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in the specification of the utility model and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include, for example, "one or more" such forms of expression, unless the context clearly indicates to the contrary.

Reference in the specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the utility model. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," and the like in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.

The electronic equipment provided by the embodiment of the utility model comprises, but is not limited to, mobile or fixed terminals such as a solid state disk, a mobile phone, a tablet personal computer, a notebook computer and the like.

Referring to fig. 1, in the embodiment of the present utility model, an electronic device 100 is illustrated as a solid state disk, where the electronic device 100 includes a housing 10 and a circuit board stacking assembly 20 accommodated in the housing 10, the circuit board stacking assembly 20 includes a first rigid circuit board 30 and a second rigid circuit board 40 that can be stacked, and the first rigid circuit board 30 and the second rigid circuit board 40 are electrically connected through a flexible connection structure 50, so as to further realize signal transmission. It will be appreciated that the first rigid circuit board 30 and the second rigid circuit board 40 may be printed circuit boards (Printed Circuit Board, PCBs), and the number of the first rigid circuit board 30 and the second rigid circuit board 40 may be at least one, or may be plural, and when a plurality of first rigid circuit boards 30 and a plurality of second rigid circuit boards 40 are stacked, adjacent first rigid circuit boards 30 and second rigid circuit boards 40 are electrically connected through one flexible connection structure 50. It will be appreciated that, since the flexible connection structure 50 has flexibility and can be bent, for example, a flexible circuit board (Flexible Printed Circuit, FPC) or a flexible cable, etc., the combination of the first rigid circuit board 20 and the second rigid circuit board 40 connected by the flexible connection structure 50 can be stacked in various ways according to the structural requirement of the actual electronic device 100 and the internal space layout of the housing 10, and as shown in fig. 2, the plurality of first rigid circuit boards 30 and the plurality of second rigid circuit boards 40 can be stacked alternately in the vertical direction to form a multilayer stacked structure with a thicker thickness but a narrower width; as shown in fig. 3, a certain number of the first rigid circuit boards 20 and the second rigid circuit boards 40 may be connected in the horizontal direction by the flexible connection structure 50 to form a single-layer combination, and then the single-layer combination is stacked in the vertical direction, so as to realize the transverse and longitudinal stacking of the first rigid circuit boards 20 and the second rigid circuit boards 40, and further form a multi-layer stacked structure with a thinner thickness and a wider width. As the solid state disk, the first rigid circuit board 30 and the second rigid circuit board 40 are provided with the memory chips, and through the structural design of the circuit board stacking assembly 20, stacking of more memory chips can be realized, so that the internal space utilization rate of the shell 10 and the capacity of the solid state disk are effectively improved.

Referring to fig. 4, and referring to fig. 1 in combination, the flexible connection structure 50 includes a first connection area 1, a second connection area 3, and a routing area 5 connecting the first connection area 1 and the second connection area 3. The first connection area 1 is configured to be electrically connected to the first rigid circuit board 30, and the second connection area 3 is configured to be electrically connected to the second rigid circuit board 40, so as to electrically connect the two first rigid circuit boards 30 and the second rigid circuit board 40.

Referring to fig. 5, referring to fig. 1 and fig. 4 in combination, the first connection area 1 includes a plurality of first connection portions 11, the plurality of first connection portions 11 may include, but is not limited to, at least one of a first single-ended signal connection portion 12 and a first differential signal connection portion 14, and the number of the first single-ended signal connection portion 12 and the first differential signal connection portion 14 may be set according to actual requirements. The second connection area 3 includes a plurality of second connection parts 31, and the plurality of second connection parts 31 may include, but is not limited to, at least one of the second single-ended signal connection parts 32 and the second differential signal connection parts 34, and the number of the second single-ended signal connection parts 32 and the second differential signal connection parts 34 may be set according to actual needs. As shown in fig. 5, dx refers to a single-ended signal, where the first single-ended signal connection portion 12 and the second single-ended signal connection portion 32 are arranged in a mirror image with respect to the routing area 5, so as to facilitate routing connection, and achieve shortest routing. The first differential signal connection portion 14 and the second differential signal connection portion 34 are arranged in the same direction with respect to the routing area 5 (the term "same direction arrangement" in this case means that the first connection area 1 is translated along the surface of the routing area 5 to overlap with the second connection area 3, and the corresponding first differential signal connection portion 14 and the second differential signal connection portion 34 can completely overlap with each other), so that the lengths of the two differential signal lines are ensured to be consistent, and the same delay is achieved, so as to achieve the purpose of shortening the delay. By the single-ended signal mirror arrangement, the signal-to-ground ratio can be improved, crosstalk can be suppressed, and the number of wiring layers of the flexible connection structure 50 can be reduced.

In some embodiments, the flexible connection structure 50 and the first rigid circuit board 30 and the second rigid circuit board 40 may be electrically connected by a connection manner such as welding, crimping or clamping, and specifically, the first connection portion 11 and the second connection portion 31 are electrically connected at corresponding positions of the first rigid circuit board 30 and the second rigid circuit board 40 by a connection manner such as welding, crimping or clamping, respectively. The connection mode of welding, crimping or clamping is low in processing difficulty and low in cost, and is beneficial to reducing the cost of the electronic equipment 100. In some embodiments, the first connection portion 11 and the second connection portion 31 are solder pads, the first connection portion 11 is electrically connected to the first rigid circuit board by soldering, and the second connection portion 31 is electrically connected to the second rigid circuit board by soldering. The welding mode is simple and easy to operate, and the size of the welding pads and the spacing between the welding pads can be controlled to be smaller, so that the density of the welding pads is improved, high-density wiring is realized, and further the occupation space of the flexible connection structure 50 is further reduced; moreover, compared with other connection modes (such as crimping or clamping) in the foregoing embodiment, the solder paste has lower cost, the welding process is more mature, and the process cost is lower, which is beneficial to further reducing the comprehensive cost of the electronic device 100.

Referring to fig. 5 again, the first connection portions 11 and the second connection portions 31 are arranged in an array, the first connection area 1 is provided with M rows of the first connection portions 11, and the second connection area 3 is provided with M columns of the second connection portions 31, wherein M is greater than or equal to 2. The first connection portion 11 and the second connection portion 31 of the flexible connection structure 50 are arranged in an array, according to the number of wiring lines of the board, the number of rows can occupy the first connection area 1 and the second connection area 3 as much as possible, the number of columns M is greater than or equal to 2, for example, 4-column high-density Pinmap arrangement can be achieved, the wiring requirement of the maximum flexible board can be met, the board occupation space of the flexible connection structure 50 is reduced, and the space utilization rate of the first rigid circuit board 30 and the second rigid circuit board 40 is improved. In addition, after the flexible connection structure 50 realizes the maximum board passing wiring, the flexible connection structure can be downward compatible, the flexible connection structure can be selected according to signals which are actually required to be connected, has stronger universality, does not need to design flexible connection structures with excessive specifications, and further reduces the cost of the electronic equipment 100.

In some embodiments, when M is greater than or equal to 3, the ground 16 in the first connection 11 is located in the middle of the M columns and the ground 36 in the second connection 31 is located in the middle of the M columns. In addition, different signal wires may be disposed on different circuit layers according to the routing requirement, and the routing area 5 may include at least three circuit layers 51, where each circuit layer 51 is in signal connection with a row of the first connection portions 11 and a row of the second connection portions 31 that are arranged in mirror image with respect to the routing area 5. For example, as shown in fig. 6, when the flexible connection structure 50 is required to simultaneously route a high-speed signal and a low-speed signal, the first circuit layer 51 may route the high-speed signal, the third circuit layer 51 may route the low-speed signal, and the middle circuit layer 51 may route the ground. The ground terminal is designed in the middle, and different types of signals are layered and routed, so that the signal-to-ground ratio can be further improved, crosstalk is suppressed, and the routing layer number of the flexible connection structure 50 is reduced.

Referring to fig. 7A and fig. 7B together with fig. 1, a part of the first connection portion 11 and a part of the second connection portion 31 in the manufactured flexible connection structure 50 can be removed, that is, if the number of signals is large in the actual connection process, the low-speed signals can be properly sacrificed by a bit of signal-to-ground ratio, and some of the first connection portion 11 and the second connection portion 31 can be selectively removed according to the requirement of the number of signals to be led out on the first rigid circuit board 30 and the second rigid circuit board 40, so that the originally shielded signal lines can be connected through channels, which is convenient for the flexible connection structure 50 to achieve the optimal signal routing requirement when being compatible with different application scenarios, so as to promote the routing channels of the flexible connection structure 50 and reduce the routing layer number. For example, in an array of more than 2 columns, the first connection 11 and the second connection 31 of the column near the routing area 5 may be removed, which facilitates the connection of signal lines of the middle column with channels. In some embodiments, as shown in the signal layout diagram of fig. 7A, only 7 signals of the 9 signals D2-D10 in the flexible connection structure 50 can be routed. By partially removing portions of the first connection portion 11 and the second connection portion 31, as shown in fig. 7B, the first connection portion 11 and the second connection portion 31 at the D5 position can be removed, so that the routing requirements of 8 signals can be satisfied. The flexible connection structure 50 is convenient for the downward compatibility of the flexible connection structure 50 with the largest board routing by partially removing the first connection part 11 and the second connection part 31, so as to promote the routing channel of the flexible connection structure 50 and reduce the routing layer number.

Referring again to fig. 1, the first rigid circuit board 30 includes a first surface 301 and a second surface 302 that are disposed opposite to each other, the second rigid circuit board 40 includes a third surface 401 and a fourth surface 402 that are disposed opposite to each other, when the first rigid circuit board 30 and the second rigid circuit board 40 are stacked, the first surface 301 and the third surface 401 are disposed close to each other, and the second surface 302 and the fourth surface 402 are disposed away from each other, wherein the first connection area 1 is connected to the second surface 302, and the second connection area 3 is connected to the fourth surface 402. By disposing the first connection region 1 and the second connection region 3 of the flexible connection structure 50 on the surfaces of the first rigid circuit board 30 and the second rigid circuit board 40 facing away from each other, respectively, the reliability of connection can be improved, and the stability of signal transmission of the circuit board stacked assembly 20 can be further improved.

Referring to fig. 8 and 9, in some embodiments, the trace area 5 is provided with a plurality of first bending holes 2 near the first connection area 1, and the plurality of first bending holes 2 are located on the same line, so as to form a first bending line 4; the wiring area 5 is provided with a plurality of second bending holes 6 near the second connection area 3, and the second bending holes 6 are located on the same line, so as to form a second bending line 8. Through setting up first hole 2 and the second hole 6 of buckling, can reduce the stress of walking the junction of line district 5 and first connecting region 1 and second connecting region 3, first hole 2 and the second hole 6 of buckling can release the stress of buckling the district, like this, first rigid circuit board 30 and second rigid circuit board 40 can not disengage because of the buckling of flexible connection structure 50 in the back of range upon range of, first connecting portion 11 and second connecting portion 31 to can reduce the problem that the stress leads to the connection stability of first connecting portion 11 and second connecting portion 31 to reduce after buckling, and then improve reliability and signal transmission's stability. It will be appreciated that the first bending holes 2 and the second bending holes 6 are disposed in the area where the routing area 5 is not routed, so as not to affect the signal transmission of the routing area 5. In some embodiments, the shape of the first bending holes 2 and the second bending holes 6 may be circular, triangular, rectangular, or the like. In this embodiment, the first bending hole 2 and the second bending hole 6 are circular holes, and the aperture is not easy to be too large, so that the routing of the routing area 5 is not affected. When the first bending line 4 and the second bending line 8 are provided, the width L1 of the trace area 5 may be equal to or slightly greater than the thickness L2 of the first rigid circuit board 30 and the second rigid circuit board 40 after being laminated, which is advantageous for shortening the length of the trace in the trace area 5.

Referring to fig. 10, in other embodiments, in order to enhance the connection reliability of the first connection portion 11 and the second connection portion 31, a first fixing hole 18 may be further provided in the first connection area 1, and a second fixing hole 303 may be provided in the first rigid circuit board 30 corresponding to the first fixing hole 18, where the first fixing hole 18 and the second fixing hole 303 are connected by the first fixing member 7. The second connection area 3 is provided with a third fixing hole 38, the second rigid circuit board 40 is provided with a fourth fixing hole 403 corresponding to the third fixing hole 38, and the third fixing hole 38 and the fourth fixing hole 403 are connected through the second fixing piece 9. Further, the first fixing member 7 and the second fixing member 9 may be screws. The first connecting area 1 and the second connecting area 3 are respectively mechanically connected with the first rigid circuit board 30 and the second rigid circuit board 40 through the first fixing piece 7 and the second fixing piece 9, so that the reliability of connection can be improved, and the stability of signal transmission is further improved. In some embodiments, the number of the first fixing holes 18 may be two, referring to fig. 4, and the number of the second fixing holes 38 may be two, which are respectively disposed at two ends of the first connection area 1 along the length direction a (i.e., the direction perpendicular to the signal routing direction b), and the connection reliability is higher.

According to the embodiment of the utility model, the first rigid circuit board 30 and the second rigid circuit board 40 are connected by adopting the flexible connection structure 50, so that compared with the traditional scheme of connecting by adopting a buckle connector or the integrated rigid-flexible board scheme, the first connection part 11 and the second connection part 31 on the flexible connection structure 50 can be designed to be smaller in size and higher in density, and the occupied board space on the first rigid circuit board 30 and the second rigid circuit board 40 is reduced, so that the space utilization rate and the capacity of the electronic equipment 100 are improved; and by designing the density of the first connection portion 11 and the second connection portion 31 on the flexible connection structure 50 to be higher, the downward compatibility of the flexible connection structure 50 can be improved without designing more specifications. The flexible connection structure 50 can be independently processed and decoupled from the processing of the first rigid circuit board 30 and the second rigid circuit board 40, so that the processing difficulty is low, and the connection difficulty between the flexible connection structure 50 and the first rigid circuit board 30 and the connection difficulty between the flexible connection structure 50 and the second rigid circuit board 40 are low, so that the material cost of the flexible connection structure 50 is low, and the comprehensive cost of the electronic device 100 can be remarkably reduced. In addition, the first single-ended signal connection part 12 and the second single-ended signal connection part 32 are arranged in a mirror image mode relative to the wiring area 5, so that wiring connection is facilitated, and wiring can be shortest; the first differential signal connection part 14 and the second differential signal connection part 34 are arranged in the same direction relative to the wiring area 5, so that the lengths of the two differential signal lines are consistent, and the same time delay is realized, and the purpose of shortening the time delay is achieved; in addition, the ground terminals 16 (36) are arranged centrally, so that the signal-to-ground ratio can be improved, crosstalk can be suppressed, and the number of wiring layers of the flexible connection structure 50 can be reduced.

It should be noted that the above is only a specific embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present utility model, and the changes or substitutions are covered by the scope of the present utility model; the embodiments of the present utility model and features in the embodiments may be combined with each other without conflict. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.

Claims (10)

1. An electronic device, comprising:

a first rigid circuit board;

a second rigid circuit board that is stackable with the first rigid circuit board; and

a flexible connection structure, the flexible connection structure comprising:

the first connecting area is connected to one surface of the first rigid circuit board and is provided with a plurality of first connecting parts which are used for being electrically connected with the first rigid circuit board, and the plurality of first connecting parts comprise at least one of a first single-ended signal connecting part and a first differential signal connecting part;

the second connecting area is connected to one surface of the second rigid circuit board, and is provided with a plurality of second connecting parts which are used for being electrically connected with the second rigid circuit board, and the plurality of second connecting parts comprise at least one of a second single-ended signal connecting part and a second differential signal connecting part; and

a wiring area connected with the first connection area and the second connection area,

when the plurality of first connection parts comprise the first single-ended signal connection parts and the plurality of second connection parts comprise the second single-ended signal connection parts, the first single-ended signal connection parts and the second single-ended signal connection parts are arranged in a mirror image mode relative to the wiring area; when the plurality of first connecting portions comprise the first differential signal connecting portions, and the plurality of second connecting portions comprise the second differential signal connecting portions, the first differential signal connecting portions and the second differential signal connecting portions are arranged in the same direction relative to the routing area.

2. The electronic device of claim 1, wherein the first connection portion is electrically connected to the first rigid circuit board by welding, crimping, or clamping, and the second connection portion is electrically connected to the second rigid circuit board by welding, crimping, or clamping.

3. The electronic device of claim 2, wherein the first connection portion and the second connection portion are pads, the first connection portion is electrically connected to the first rigid circuit board by soldering, and the second connection portion is electrically connected to the second rigid circuit board by soldering.

4. The electronic device of claim 1, wherein the plurality of first connection portions and the plurality of second connection portions are arranged in an array, the first connection region is provided with M columns of the first connection portions, and the second connection region is provided with M columns of the second connection portions, wherein M is greater than or equal to 2.

5. The electronic device of claim 4, wherein when M is greater than or equal to 3, the ground terminals of the first plurality of connection portions are located in a middle column of the M columns, and the ground terminals of the second plurality of connection portions are located in a middle column of the M columns.

6. The electronic device of claim 5, wherein the routing area includes at least three circuit layers, each of the circuit layers being respectively in signal connection with a row of the first connection portions and a row of the second connection portions arranged in mirror image with respect to the routing area.

7. The electronic device of claim 1, wherein the first rigid circuit board comprises a first surface and a second surface disposed opposite each other, the second rigid circuit board comprises a third surface and a fourth surface disposed opposite each other, the first surface and the third surface are adjacent to each other and the second surface and the fourth surface are opposite each other after the first rigid circuit board and the second rigid circuit board are laminated, wherein the first connection region is connected to the second surface and the second connection region is connected to the fourth surface.

8. The electronic device of claim 1, wherein the flexible connection structure is a flexible circuit board (FPC) or a flexible cable.

9. The electronic device of claim 1, wherein the routing area is provided with a plurality of first bending holes near the first connection area, and the plurality of first bending holes form a first bending line;

the wiring area is provided with a plurality of second bending holes close to the second connecting area, and the second bending holes form a second bending line.

10. The electronic device of claim 1, wherein the first connection region is provided with a first fixing hole, the first rigid circuit board is provided with a second fixing hole corresponding to the first fixing hole, and the first fixing hole and the second fixing hole are connected through a first fixing member;

the second connecting area is provided with a third fixing hole, the second rigid circuit board is provided with a fourth fixing hole corresponding to the third fixing hole, and the third fixing hole is connected with the fourth fixing hole through a second fixing piece.