CN105578743B - Flexible circuit board, circuit board assemblies and mobile terminal - Google Patents
Flexible circuit board, circuit board assemblies and mobile terminal Download PDFInfo
- Publication number
- CN105578743B CN105578743B CN201511026733.3A CN201511026733A CN105578743B CN 105578743 B CN105578743 B CN 105578743B CN 201511026733 A CN201511026733 A CN 201511026733A CN 105578743 B CN105578743 B CN 105578743B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- pad
- length
- flexible circuit
- welding zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000000712 assembly Effects 0.000 title claims description 24
- 238000000429 assembly Methods 0.000 title claims description 24
- 238000003466 welding Methods 0.000 claims abstract description 38
- 230000003247 decreasing effect Effects 0.000 claims description 8
- 230000007423 decrease Effects 0.000 claims description 7
- 230000008859 change Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000295 complement effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The present invention provides a kind of flexible circuit board, including the first surface and second surface being oppositely arranged, the first surface is equipped with the first welding zone, first welding zone includes multiple first pads, the second surface is equipped with the second welding zone, second welding zone includes the second pad, and the multiple first pad is spaced apart from each other setting and length is arranged along vertical the multiple first length of bonding pad direction in staged, and the flexible circuit board is connect by first pad with the third pad on main circuit board.By the way that the length of multiple first pads installed on flexible circuit board, connect with main circuit board is arranged to the method arranged along vertical the multiple first length of bonding pad direction in staged in the present invention, it can be in order to identifying the first pad connecting on flexible circuit board with main circuit board, with the phenomenon for preventing flexible circuit board anti-loaded, reach the technical effect of the yield and welding efficiency that improve welding.
Description
Technical field
The present invention relates to a kind of circuit board technology field more particularly to a kind of flexible circuit boards, the matched master used
The circuit board assemblies and mobile terminal that circuit board is formed.
Background technique
The arriving of digital Age, so that the mankind are growing day by day to the dependence of electronic product.And in order in response to electronics now
Product high speed, high-effect and light and short requirement, flexible circuit board (the Flexible Printed with flexural property
Circuit；FPC), largely apply in various electronic devices, such as: all kinds of escopes, notebook computer, mobile electricity
Words, digital camera, personal digital assistant (PDA), printer and CD-ROM drive etc..
In the prior art, the two sides of some flexible circuit boards is both provided with golden finger pad, what the pad on two sides to be connected
Element is different.When flexible circuit board is welded on main circuit board, need to connect the pad on corresponding pad and main circuit board
It connects, since there is pad on flexible circuit board two sides, is welded on when flexible circuit board is welded on main circuit board and is easy anti-loaded, make
At the semiotic function mistake of entire circuit, normal work cannot achieve.It needs to repeat to weld, so not only allows and take manpower object
Power, while welding repeatedly also be easy to cause the Pad off of FPC Pad off or main circuit board, causes to scrap.
Summary of the invention
The purpose of the present invention is to provide the flexible circuits that one kind quickly can correctly be connect with the pad on main circuit board
Plate.
Another object of the present invention is to provide a kind of circuit board assemblies including above-mentioned flexible circuit board.
Another object of the present invention is to provide a kind of mobile terminals including foregoing circuit board group part.
To achieve the goals above, embodiment of the present invention provides the following technical solutions:
The present invention provides a kind of flexible circuit board, wherein including the first surface and second surface being oppositely arranged, described
One surface is equipped with the first welding zone, and first welding zone includes multiple first pads, and the second surface is equipped with the second welding zone, institute
Stating the second welding zone includes the second pad, and the multiple first pad is spaced apart from each other setting and length is along vertical the multiple first weldering
Disk length direction is arranged in staged, and the flexible circuit board is connected by the third pad on first pad and main circuit board
It connects.
Wherein, the multiple first length of bonding pad becomes along vertical the multiple first length of bonding pad direction in increasing or decreasing
Change.
Wherein, the multiple first length of bonding pad is presented from the centre of first welding zone to the two sides of first welding zone
Increase or successively decrease variation.
Wherein, the flexible circuit board is additionally provided with the first registration holes, the first contraposition hole location and first welding zone
Side, for being aligned with main circuit board.
The present invention also provides a kind of circuit board assemblies, wherein including flexible circuit board described in above-mentioned any one and master
Circuit board, the main circuit board include quantity third pad identical with first number of pads, multiple third pads
Length arrange along vertical third length of bonding pad direction in staged and length variation tendency and the multiple first pad
Length variation tendency is on the contrary, the third pad is used to connect with first pad.
Wherein, the multiple third length of bonding pad is along vertical the multiple third length of bonding pad direction increasing or decreasing.
Wherein, the multiple third length of bonding pad successively decreases or is incremented by from centre to two sides.
Wherein, the multiple third pad is equipped with corresponding with first registration holes on the flexible circuit board
Second registration holes.
Wherein, the main circuit board is FPC or PCB.
The present invention also provides a kind of mobile terminals, including circuit board assemblies described in above-mentioned any one.
The embodiment of the present invention have the following advantages that or the utility model has the advantages that
It is arranged in the present invention by the way that the length for multiple first pads connecting on flexible circuit board, with main circuit board will be installed
At the method for along vertical the multiple first length of bonding pad direction being in staged arrangement, can in order to identify on flexible circuit board with
First pad of main circuit board connection reaches the yield for improving welding and welding is imitated with the phenomenon for preventing flexible circuit board anti-loaded
The technical effect of rate.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is first embodiment of the invention flexible circuit board structure schematic diagram；
Fig. 2 is that have flexible circuit board side view described in Fig. 1；
Fig. 3 is main circuit board structural schematic diagram corresponding with Fig. 1；
Fig. 4 is second embodiment of the invention flexible circuit board structure schematic diagram；
Fig. 5 is main circuit board structural schematic diagram corresponding with Fig. 4.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1 and Fig. 2 are please referred to, flexible circuit board 100 includes first surface 11 and the in one embodiment of the invention
Two surfaces 12, first surface 11 and second surface 12 are oppositely arranged.The first surface 11 is equipped with the first welding zone 110 (in Fig. 1
The region that dotted line surrounds), first welding zone 110 is equipped with multiple first pads 13, and the second surface 12 is equipped with the second weldering
Area (not shown go out), second welding zone include the second pad 14, and second pad 14 is described for connecting with other elements
The setting of multiple intervals of first pad 13, and the length of the multiple first pad 13 is along vertical the multiple first pad, 13 length
It arranges in staged in direction (direction A in Fig. 1).Specifically, as shown in Figure 1, the length of the multiple first pad 13 is along vertical
The multiple first pad, 13 length direction successively decreases from left to right.It will be apparent that in other embodiments, the multiple first
The length of pad 13 can also be incremented by from left to right along vertical the multiple first pad, 13 length direction.In other words, described
The length of multiple first pads 13 is along vertical the multiple first length of bonding pad direction increasing or decreasing.The flexible circuit board
100 are connect by first pad 13 with the third pad 21 on main circuit board 200.
Referring to Fig. 3, corresponding main circuit board 200 includes multiple third pads 21 in one embodiment of the invention,
The quantity of the third pad 21 is identical as the quantity of first pad 13, and the multiple 21 length of third pad is along vertical institute
Multiple third length of bonding pad direction (direction B in Fig. 3) is stated to arrange in staged.Specifically, as shown in figure 3, the multiple third
The length of pad 21 is incremented by from left to right along vertical the multiple 21 length direction of third pad.It will be apparent that when described more
When the length of a first pad 13 can also be incremented by from left to right along vertical the multiple first pad, 13 length direction, accordingly
, the length of the multiple third pad 21 should successively decrease from left to right along vertical the multiple 21 length direction of third pad.It changes
For it, the length variation tendency of the multiple third pad 21 is opposite with the length variation tendency of first pad 13.Or
Person can form complementary when saying first pad 13 with the connection of third pad 21.The main circuit board 200 passes through the third
Pad 21 is connect with the first pad 13 on the flexible circuit board 100.In other words by the flexible circuit board 100 with it is described
Main circuit board 200 is welded together, and just forms the circuit board assemblies of one embodiment of the invention.
In the present embodiment, by multiple first pads 13 that will be connect on flexible circuit board 100, with main circuit board 200
Length be arranged to be in along vertical the multiple first pad, 13 length direction staged arrangement method, can be soft in order to identify
The first pad 13 connecting on property circuit board 100 with main circuit board 200 is reached with preventing flexible circuit board from filling 100 anti-phenomenons
Improve the yield of welding and the technical effect of welding efficiency.
Meanwhile the present invention also provides a kind of circuit board assemblies using above-mentioned flexible circuit board 100.The circuit board assemblies
It further include the main circuit board 200 being used cooperatively with above-mentioned flexible circuit board 100, flexible circuit board 100 and main circuit board 200 are common
Form circuit board assemblies.The length of multiple third pads 21 on main circuit board 200 is along the vertical 21 length side of third pad
To in staged arrangement and length variation tendency be in 13 length variation tendency of the first pad on the contrary, making the flexible circuit board
Longest first pad 13 is connect with third pad 21 shortest on main circuit board 200 on 100, and so on, the first pad 13
Complementation can be formed with third pad 21, effectively reduces the material of third pad 21, reaching reduces circuit board assemblies production cost
Technical effect.
Further, the first registration holes 15 are additionally provided with please continue to refer to Fig. 1, on the flexible circuit board 100, described first
Registration holes 15 are set on the side of first welding zone 110.Referring to Fig. 3, the main circuit board 200 is equipped with and described first
Corresponding second registration holes 22 of registration holes 15.It is aligned by first registration holes 15 with second registration holes 22, it can be with
First pad 13 is aligned with the third pad 21 rapidly, convenient for welding, deviation when preventing from welding.Meanwhile passing through institute
The first registration holes 15 and the alignment of corresponding second registration holes 22 are stated, the first pad 13 and the second pad can also be accurately distinguished
14, avoid flexible circuit board 100 anti-loaded when being welded on main circuit board 200.
Referring to Fig. 4, Fig. 4 is the flexible circuit board 300 of second embodiment of the invention, on the first surface 11
The length of the multiple first pad 33 is in staged along vertical the multiple first pad, 33 length direction (direction A in Fig. 4)
Arrangement.The distinctive points of second embodiment and one embodiment are that the length of the multiple first pad 33 is by described
Successively decrease among one welding zone 110 to two sides.It will be apparent that in other embodiments, the length of the multiple first pad 33
It can be from being incremented by among first welding zone 110 to two sides.In other words, the length of the multiple first pad 33 can be along vertical
Straight the multiple first length of bonding pad direction is incremented by or successively decreases from centre to two sides.The flexible circuit board 300 passes through described
First pad 33 is connect with the third pad 41 on main circuit board 400.
Referring to Fig. 5, corresponding main circuit board 400 includes multiple third pads 41 in second embodiment of the invention,
The quantity of the third pad 41 is identical as the quantity of first pad 33, and the multiple 41 length of third pad is along vertical institute
Multiple 41 length directions of third pad (direction B in Fig. 5) are stated to arrange in staged.Specifically, as shown in figure 5, the multiple
The length of three pads 41 is successively decreased along vertical the multiple 41 length direction of third pad from centre to two sides.It will be apparent that working as
When the length of the multiple first pad 33 is successively decreased along vertical the multiple first pad, 33 length direction from centre to two sides, phase
The length for the multiple third pad 41 answered should be passed along vertical the multiple 41 length direction of third pad from centre to two sides
Increase.In other words, the length variation tendency phase of the length variation tendency of the multiple third pad 41 and first pad 33
Instead.It can be formed when that is, first pad 33 is with the connection of third pad 41 complementary.The main circuit board 400 passes through
The third pad 41 is connect with the first pad 33 on the flexible circuit board 300.In other words by the flexible circuit board
300 are welded together with the main circuit board 400, just form the circuit board assemblies of one embodiment of the invention.
In the present embodiment, by connect on flexible circuit board 300 will be arranged in, with main circuit board 400 multiple first
The length of pad 33 be arranged to be in along vertical the multiple first pad, 33 length direction staged arrangement method, can be in order to
The first pad 33 being connect on identification flexible circuit board 300 with main circuit board 400, to prevent flexible circuit board 300 is anti-loaded from showing
As reaching the technical effect of the yield and welding efficiency that improve welding.
Meanwhile the present invention also provides a kind of circuit board assemblies using above-mentioned flexible circuit board 300.The circuit board assemblies
It further include the main circuit board 400 being used cooperatively with flexible circuit board 300, flexible circuit board 300 and main circuit board 400 are collectively formed
Circuit board assemblies.Vertically 41 length direction of third pad is on the length edge of multiple third pads 41 on main circuit board 400
Staged arrangement and length variation tendency are in 31 length variation tendency of the first pad on the contrary, making first pad 33 and the
Three pads 41 can form complementation when connecting, and effectively reduce the material of third pad, reach the technical effect for reducing production cost.
Further, the first registration holes 15 are additionally provided with please continue to refer to Fig. 3, on the flexible circuit board 300, described first
Registration holes 15 are set on the side of the multiple first pad 33.Referring to Fig. 4, the main circuit board 400 be equipped with it is described
Corresponding second registration holes 42 of first registration holes 35.It is aligned by first registration holes 35 with second registration holes 12,
First pad 33 can be aligned with the third pad 21 rapidly, convenient for welding, deviation when preventing from welding.Meanwhile it is logical
First registration holes 15 and the alignment of corresponding second registration holes 42 are crossed, the first pad and the second weldering can also be accurately distinguished
Disk avoids flexible circuit board 100 anti-loaded when being welded on main circuit board 200.
Further, main circuit board of the present invention can be for flexible circuit board (Flexible Printed
Circuit；FPC) either circuit board (Printed Circuit Board；PCB).
The present invention also provides a kind of mobile terminal using foregoing circuit board group part, the mobile terminal can be mobile phone,
Tablet computer, television set, display, laptop, Digital Frame, navigator etc..
Embodiments described above does not constitute the restriction to the technical solution protection scope.It is any in above-mentioned implementation
Made modifications, equivalent substitutions and improvements etc., should be included in the protection model of the technical solution within the spirit and principle of mode
Within enclosing.
Claims (9)
1. a kind of circuit board assemblies, which is characterized in that including main circuit board and flexible circuit board, wherein the flexible circuit board,
Including the first surface and second surface being oppositely arranged, the first surface is equipped with the first welding zone, and first welding zone includes
Multiple first pads, the second surface are equipped with the second welding zone, and second welding zone includes the second pad, the multiple first weldering
Disk is spaced apart from each other setting and length is arranged along vertical the multiple first length of bonding pad direction in staged, the flexible circuit board
It is connect by first pad with the third pad on main circuit board；
The main circuit board includes quantity third pad identical with first number of pads, the length of multiple third pads
Degree is along vertical third length of bonding pad direction in staged arrangement and length variation tendency and the multiple first length of bonding pad
Variation tendency is on the contrary, the third pad is used to connect with first pad.
2. circuit board assemblies as described in claim 1, which is characterized in that the multiple third length of bonding pad is along vertical described more
A third length of bonding pad direction increasing or decreasing.
3. circuit board assemblies as described in claim 1, which is characterized in that the multiple third length of bonding pad is from centre to two sides
Successively decrease or is incremented by.
4. circuit board assemblies as claimed in claim 2, which is characterized in that
The flexible circuit board is additionally provided with the first registration holes, and the side of the first contraposition hole location and first welding zone is used for
It is aligned with main circuit board, the multiple third pad is equipped with corresponding with first registration holes on the flexible circuit board
The second registration holes.
5. circuit board assemblies as claimed in claim 3, which is characterized in that
The flexible circuit board is additionally provided with the first registration holes, and the side of the first contraposition hole location and first welding zone is used for
It is aligned with main circuit board, the multiple third pad is equipped with corresponding with first registration holes on the flexible circuit board
The second registration holes.
6. circuit board assemblies as described in claim 1, which is characterized in that the main circuit board is FPC or PCB.
7. the circuit board assemblies as described in claim 1 to 6 any one, which is characterized in that the flexible circuit board it is described
Multiple first length of bonding pad change along vertical the multiple first length of bonding pad direction in increasing or decreasing.
8. the circuit board assemblies as described in claim 1 to 6 any one, which is characterized in that the flexible circuit board it is described
Multiple first length of bonding pad change from the centre of first welding zone to the two sides of first welding zone in increasing or decreasing.
9. a kind of mobile terminal, which is characterized in that including circuit board assemblies described in claim 1-8 any one.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511026733.3A CN105578743B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board, circuit board assemblies and mobile terminal |
| CN201811384739.1A CN109327958B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board, circuit board assembly and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511026733.3A CN105578743B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board, circuit board assemblies and mobile terminal |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811384739.1A Division CN109327958B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board, circuit board assembly and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105578743A CN105578743A (en) | 2016-05-11 |
| CN105578743B true CN105578743B (en) | 2018-12-11 |
Family
ID=55888248
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811384739.1A Expired - Fee Related CN109327958B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board, circuit board assembly and mobile terminal |
| CN201511026733.3A Expired - Fee Related CN105578743B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board, circuit board assemblies and mobile terminal |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811384739.1A Expired - Fee Related CN109327958B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board, circuit board assembly and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN109327958B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109327958B (en) * | 2015-12-29 | 2021-03-12 | Oppo广东移动通信有限公司 | Flexible circuit board, circuit board assembly and mobile terminal |
| CN105911767A (en) * | 2016-06-16 | 2016-08-31 | 武汉华星光电技术有限公司 | LCD display module, master control circuit board thereof and backlight bar welding disc |
| CN108306351B (en) * | 2017-11-28 | 2022-05-31 | 海信视像科技股份有限公司 | Charging device and electronic mobile terminal |
| CN108012455B (en) * | 2017-12-29 | 2019-07-19 | Oppo广东移动通信有限公司 | Reflow soldering apparatus for electronic equipment |
| CN108258464B (en) * | 2018-01-12 | 2020-02-14 | 武汉光迅科技股份有限公司 | Soft band power supply device and power supply method for high-speed device |
| CN114679656A (en) * | 2019-01-05 | 2022-06-28 | 深圳市韶音科技有限公司 | Battery pack and bone conduction speaker |
| CN110933837B (en) * | 2019-11-28 | 2021-05-14 | 武汉天马微电子有限公司 | Flexible circuit board, manufacturing method thereof and display module comprising flexible circuit board |
| CN111965521B (en) * | 2020-08-11 | 2022-08-05 | 广东利扬芯片测试股份有限公司 | Anti-reverse-insertion structure of test board for radio frequency chip and radio frequency chip testing device |
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| EP0402055A2 (en) * | 1989-06-09 | 1990-12-12 | International Business Machines Corporation | Method and apparatus for a rapid interconnection to a computer bus |
| US6452114B1 (en) * | 1999-09-17 | 2002-09-17 | Hubbell Incorporated | Plug-in circuit board with reduced insertion force |
| CN1229005C (en) * | 2002-06-20 | 2005-11-23 | 三菱电机株式会社 | Distributing base board device |
| CN101868123A (en) * | 2010-07-02 | 2010-10-20 | 深圳和而泰智能控制股份有限公司 | Printed circuit board and design method thereof |
| CN202697021U (en) * | 2012-04-25 | 2013-01-23 | 中兴通讯股份有限公司 | Goldfinger printed circuit board |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2001237651A1 (en) * | 2000-02-11 | 2001-08-20 | Tyco Electronics Belgium Ec N.V. | Printed circuit board and connector assembly |
| US20040245620A1 (en) * | 2003-06-03 | 2004-12-09 | Jackson Hsieh | Memory card capable of indicating an inserting direction |
| JP2005183496A (en) * | 2003-12-17 | 2005-07-07 | Canon Inc | Method and structure for connecting flexible printed board |
| CN202206653U (en) * | 2011-09-22 | 2012-04-25 | 温州银河电子有限公司 | Golden finger structure of flexible printed circuit board |
| CN109327958B (en) * | 2015-12-29 | 2021-03-12 | Oppo广东移动通信有限公司 | Flexible circuit board, circuit board assembly and mobile terminal |
-
2015
- 2015-12-29 CN CN201811384739.1A patent/CN109327958B/en not_active Expired - Fee Related
- 2015-12-29 CN CN201511026733.3A patent/CN105578743B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0402055A2 (en) * | 1989-06-09 | 1990-12-12 | International Business Machines Corporation | Method and apparatus for a rapid interconnection to a computer bus |
| US6452114B1 (en) * | 1999-09-17 | 2002-09-17 | Hubbell Incorporated | Plug-in circuit board with reduced insertion force |
| CN1229005C (en) * | 2002-06-20 | 2005-11-23 | 三菱电机株式会社 | Distributing base board device |
| CN101868123A (en) * | 2010-07-02 | 2010-10-20 | 深圳和而泰智能控制股份有限公司 | Printed circuit board and design method thereof |
| CN202697021U (en) * | 2012-04-25 | 2013-01-23 | 中兴通讯股份有限公司 | Goldfinger printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105578743A (en) | 2016-05-11 |
| CN109327958A (en) | 2019-02-12 |
| CN109327958B (en) | 2021-03-12 |
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| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181211 |
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