CN109327958B - Flexible circuit board, circuit board assembly and mobile terminal - Google Patents
Flexible circuit board, circuit board assembly and mobile terminal Download PDFInfo
- Publication number
- CN109327958B CN109327958B CN201811384739.1A CN201811384739A CN109327958B CN 109327958 B CN109327958 B CN 109327958B CN 201811384739 A CN201811384739 A CN 201811384739A CN 109327958 B CN109327958 B CN 109327958B
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- China
- Prior art keywords
- circuit board
- pads
- bonding pads
- welding
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003466 welding Methods 0.000 claims abstract description 38
- 230000003247 decreasing effect Effects 0.000 claims description 6
- 230000008859 change Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 6
- 238000009434 installation Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000000295 complement effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 241000282414 Homo sapiens Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000009131 signaling function Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention provides a flexible circuit board which comprises a first surface and a second surface which are oppositely arranged, wherein a first welding area is arranged on the first surface and comprises a plurality of first welding pads, a second welding area is arranged on the second surface and comprises a second welding pad, the first welding pads are arranged at intervals, the lengths of the first welding pads are arranged in a step mode along the direction vertical to the length direction of the first welding pads, and the flexible circuit board is connected with a third welding pad on a main circuit board through the first welding pads. According to the invention, the lengths of the plurality of first bonding pads which are arranged on the flexible circuit board and connected with the main circuit board are arranged in a stepped manner along the direction vertical to the length direction of the plurality of first bonding pads, so that the first bonding pads which are arranged on the flexible circuit board and connected with the main circuit board can be conveniently identified, the phenomenon of reverse installation of the flexible circuit board is prevented, and the technical effects of improving the welding yield and the welding efficiency are achieved.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a flexible circuit board, a circuit board assembly formed by a main circuit board matched with the flexible circuit board, and a mobile terminal.
Background
The advent of the digital age has led to an increasing dependence of human beings on electronic products. In order to meet the requirements of high speed, high performance, light weight, short size and small size of the current electronic products, Flexible Printed Circuit (FPC) having a Flexible characteristic has been widely used in various electronic devices, such as: various types of displays, notebook computers, mobile phones, digital cameras, Personal Digital Assistants (PDAs), printers, optical drives, and the like.
In the prior art, gold finger pads are arranged on two sides of some flexible circuit boards, and the pads on the two sides are different in elements to be connected. When the flexible circuit board is welded on the main circuit board, the corresponding bonding pads are required to be connected with the bonding pads on the main circuit board, and due to the fact that the bonding pads are arranged on the two sides of the flexible circuit board, the flexible circuit board is easy to install reversely when being welded on the main circuit board, signal function errors of the whole circuit are caused, and normal work cannot be achieved. Repeated welding is needed, so that manpower and material resources are wasted, the FPC bonding pad is easy to fall off due to repeated welding, or the bonding pad of the main circuit board falls off to cause scrapping.
Disclosure of Invention
The invention aims to provide a flexible circuit board which can be quickly and correctly connected with a bonding pad on a main circuit board.
Another object of the present invention is to provide a circuit board assembly including the above flexible circuit board.
Another object of the present invention is to provide a mobile terminal including the above circuit board assembly.
In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:
the invention provides a flexible circuit board which comprises a first surface and a second surface which are oppositely arranged, wherein a first welding area is arranged on the first surface and comprises a plurality of first welding pads, a second welding area is arranged on the second surface and comprises a second welding pad, the first welding pads are arranged at intervals, the lengths of the first welding pads are arranged in a step mode along the direction vertical to the length direction of the first welding pads, and the flexible circuit board is connected with a third welding pad on a main circuit board through the first welding pads.
The lengths of the first bonding pads are changed in an increasing or decreasing mode along the direction perpendicular to the lengths of the first bonding pads.
The lengths of the first bonding pads are changed from the middle of the first bonding area to the two sides of the first bonding area in an increasing or decreasing mode.
The flexible circuit board is further provided with a first alignment hole, and the first alignment hole is aligned with one side of the first welding area and used for aligning with the main circuit board.
The invention also provides a circuit board assembly, which comprises the flexible circuit board and the main circuit board, wherein the main circuit board comprises third bonding pads, the number of the third bonding pads is the same as that of the first bonding pads, the lengths of the third bonding pads are arranged in a stepped mode along the direction perpendicular to the length direction of the third bonding pads, the length change trend of the third bonding pads is opposite to that of the first bonding pads, and the third bonding pads are used for being connected with the first bonding pads.
Wherein the lengths of the third bonding pads are increased or decreased along a direction perpendicular to the lengths of the third bonding pads.
Wherein, the lengths of the third bonding pads are decreased or increased from the middle to two sides.
And second alignment holes corresponding to the first alignment holes on the flexible circuit board are arranged on the third bonding pads.
Wherein, the main circuit board is FPC or PCB.
The invention also provides a mobile terminal comprising the circuit board assembly.
The embodiment of the invention has the following advantages or beneficial effects:
according to the invention, the lengths of the plurality of first bonding pads which are arranged on the flexible circuit board and connected with the main circuit board are arranged in a stepped manner along the direction vertical to the length direction of the plurality of first bonding pads, so that the first bonding pads which are arranged on the flexible circuit board and connected with the main circuit board can be conveniently identified, the phenomenon of reverse installation of the flexible circuit board is prevented, and the technical effects of improving the welding yield and the welding efficiency are achieved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a first embodiment of a flexible circuit board structure of the present invention;
FIG. 2 is a side view of the flexible circuit board of FIG. 1;
FIG. 3 is a schematic diagram of a main circuit board corresponding to FIG. 1;
FIG. 4 is a schematic diagram of a second embodiment of a flexible circuit board structure of the present invention;
fig. 5 is a schematic diagram of a main circuit board structure corresponding to fig. 4.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and 2, a flexible circuit board 100 according to a first embodiment of the present invention includes a first surface 11 and a second surface 12, where the first surface 11 and the second surface 12 are disposed opposite to each other. Be equipped with first bonding pad 110 on first surface 11 (the region that the dotted line encloses in fig. 1), first bonding pad 110 is equipped with a plurality of first pads 13, be equipped with second bonding pad (not shown in the figure) on second surface 12, the second bonding pad includes second pad 14, second pad 14 is used for being connected with other components, a plurality of first pads 13 interval sets up, just the length of a plurality of first pads 13 is along perpendicular a plurality of first pads 13 length direction (the A direction in fig. 1) is cascaded and arranges. Specifically, as shown in fig. 1, the lengths of the first pads 13 decrease from left to right along a direction perpendicular to the lengths of the first pads 13. Obviously, in other embodiments, the lengths of the plurality of first pads 13 may also increase from left to right along a direction perpendicular to the lengths of the plurality of first pads 13. In other words, the lengths of the plurality of first pads 13 are increased or decreased in a direction perpendicular to the lengths of the plurality of first pads. The flexible circuit board 100 is connected to the third land 21 on the main circuit board 200 through the first land 13.
Referring to fig. 3, the main circuit board 200 according to the first embodiment of the present invention includes a plurality of third pads 21, the number of the third pads 21 is the same as the number of the first pads 13, and the lengths of the third pads 21 are arranged in a step shape along a direction (B direction in fig. 3) perpendicular to the lengths of the third pads. Specifically, as shown in fig. 3, the lengths of the third pads 21 increase from left to right in a direction perpendicular to the lengths of the third pads 21. Obviously, while the lengths of the plurality of first pads 13 may also increase from left to right in a direction perpendicular to the lengths of the plurality of first pads 13, correspondingly, the lengths of the plurality of third pads 21 should decrease from left to right in a direction perpendicular to the lengths of the plurality of third pads 21. In other words, the length variation tendency of the plurality of third pads 21 is opposite to the length variation tendency of the first pads 13. Or the first pad 13 and the third pad 21 may be complementary when connected. The main circuit board 200 is connected to the first land 13 on the flexible circuit board 100 through the third land 21. In other words, the flexible circuit board 100 and the main circuit board 200 are soldered together to form the circuit board assembly of the first embodiment of the present invention.
In this embodiment, by setting the lengths of the plurality of first pads 13 on the flexible circuit board 100 and connected to the main circuit board 200 to be arranged in a stepped manner along a direction perpendicular to the length direction of the plurality of first pads 13, the first pads 13 on the flexible circuit board 100 and connected to the main circuit board 200 can be identified conveniently, so as to prevent the flexible circuit board 100 from being mounted reversely, and achieve the technical effects of improving the yield of welding and the welding efficiency.
Meanwhile, the present invention also provides a circuit board assembly using the flexible circuit board 100. The circuit board assembly further comprises a main circuit board 200 used in cooperation with the flexible circuit board 100, and the flexible circuit board 100 and the main circuit board 200 together form the circuit board assembly. The lengths of the third bonding pads 21 on the main circuit board 200 are arranged in a stepped manner along the direction perpendicular to the length direction of the third bonding pads 21, and the length change trend is opposite to the length change trend of the first bonding pads 13, so that the longest first bonding pad 13 on the flexible circuit board 100 is connected with the shortest third bonding pad 21 on the main circuit board 200, and by analogy, the first bonding pad 13 and the third bonding pad 21 can form complementation, the materials of the third bonding pad 21 are effectively reduced, and the technical effect of reducing the production cost of circuit board components is achieved.
Further, referring to fig. 1, the flexible circuit board 100 is further provided with a first alignment hole 15, and the first alignment hole 15 is disposed on one side of the first bonding pad 110. Referring to fig. 3, the main circuit board 200 is provided with a second alignment hole 22 corresponding to the first alignment hole 15. By aligning the first aligning hole 15 and the second aligning hole 22, the first pad 13 and the third pad 21 can be quickly aligned, which facilitates soldering and prevents misalignment during soldering. Meanwhile, the first alignment holes 15 and the corresponding second alignment holes 22 are aligned, so that the first pads 13 and the second pads 14 can be accurately distinguished, and the flexible circuit board 100 is prevented from being inversely mounted when being welded to the main circuit board 200.
Referring to fig. 4, fig. 4 is a flexible circuit board 300 according to a second embodiment of the present invention, lengths of the first pads 33 on the first surface 11 are arranged in a stepped manner along a direction (a direction in fig. 4) perpendicular to a length direction of the first pads 33. The second embodiment is different from the first embodiment in that the lengths of the plurality of first pads 33 decrease from the middle of the first lands 110 to both sides. Obviously, in other embodiments, the lengths of the plurality of first pads 33 may also increase from the middle of the first lands 110 to both sides. In other words, the lengths of the first pads 33 may increase or decrease from the middle to both sides in a direction perpendicular to the lengths of the first pads. The flexible circuit board 300 is connected to the third land 41 of the main circuit board 400 through the first land 33.
Referring to fig. 5, the main circuit board 400 according to the second embodiment of the present invention includes a plurality of third pads 41, the number of the third pads 41 is the same as the number of the first pads 33, and the lengths of the third pads 41 are arranged in a step shape along a direction (direction B in fig. 5) perpendicular to the lengths of the third pads 41. Specifically, as shown in fig. 5, the lengths of the third pads 41 decrease from the middle to both sides along a direction perpendicular to the lengths of the third pads 41. It is obvious that, when the lengths of the plurality of first pads 33 decrease from the middle to both sides in the direction perpendicular to the length direction of the plurality of first pads 33, the lengths of the corresponding plurality of third pads 41 should increase from the middle to both sides in the direction perpendicular to the length direction of the plurality of third pads 41. In other words, the length variation tendency of the plurality of third pads 41 is opposite to the length variation tendency of the first pads 33. That is, the first pad 33 and the third pad 41 may be connected to be complementary to each other. The main circuit board 400 is connected to the first land 33 on the flexible circuit board 300 through the third land 41. In other words, the flexible circuit board 300 and the main circuit board 400 are soldered together to form the circuit board assembly of the first embodiment of the present invention.
In this embodiment, by setting the lengths of the plurality of first pads 33 disposed on the flexible circuit board 300 and connected to the main circuit board 400 to be arranged in a stepwise manner along a direction perpendicular to the length direction of the plurality of first pads 33, the first pads 33 connected to the main circuit board 400 on the flexible circuit board 300 can be identified conveniently, so as to prevent the flexible circuit board 300 from being mounted reversely, and achieve the technical effects of improving the yield of welding and the welding efficiency.
Meanwhile, the present invention also provides a circuit board assembly using the flexible circuit board 300. The circuit board assembly further comprises a main circuit board 400 for use with the flexible circuit board 300, the flexible circuit board 300 and the main circuit board 400 together forming the circuit board assembly. The lengths of the third bonding pads 41 on the main circuit board 400 are perpendicular to the length direction of the third bonding pads 41, and the length variation trend is opposite to the length variation trend of the first bonding pads 31, so that the first bonding pads 33 and the third bonding pads 41 can be complementary when being connected, the material of the third bonding pads is effectively reduced, and the technical effect of reducing the production cost is achieved.
Further, referring to fig. 3, the flexible circuit board 300 is further provided with a first alignment hole 15, and the first alignment hole 15 is disposed on one side of the first pads 33. Referring to fig. 4, the main circuit board 400 is provided with a second alignment hole 42 corresponding to the first alignment hole 35. By aligning the first aligning hole 35 with the second aligning hole 12, the first pad 33 can be quickly aligned with the third pad 21, which facilitates soldering and prevents misalignment during soldering. Meanwhile, the first aligning holes 15 are aligned with the corresponding second aligning holes 42, so that the first bonding pads and the second bonding pads can be accurately distinguished, and the flexible circuit board 100 is prevented from being inversely mounted when being welded to the main circuit board 200.
Furthermore, the main Circuit Board of the invention can be a Flexible Printed Circuit (FPC) or a Printed Circuit Board (PCB).
The invention also provides a mobile terminal adopting the circuit board assembly, and the mobile terminal can be a mobile phone, a tablet personal computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
The above-described embodiments do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the above-described embodiments should be included in the protection scope of the technical solution.
Claims (11)
1. A flexible circuit board is characterized by comprising a first surface and a second surface which are oppositely arranged, wherein a first welding area is arranged on the first surface and comprises a plurality of first welding pads, a second welding area is arranged on the second surface and comprises a second welding pad, the first welding pads are arranged at intervals, the lengths of the first welding pads are arranged in a step mode along the direction vertical to the length direction of the first welding pads, and the flexible circuit board is connected with a third welding pad on a main circuit board through the first welding pads; the flexible circuit board can be applied to a circuit board assembly comprising a main circuit board, wherein the main circuit board comprises a plurality of third bonding pads, the number of the third bonding pads is the same as that of the first bonding pads, the third bonding pads are vertical in length, the third bonding pads are arranged in a stepped mode in the length direction, the length change trend of the third bonding pads is opposite to that of the first bonding pads, the third bonding pads are used for being connected with the first bonding pads, the circuit board assembly can be applied to a mobile terminal, and the mobile terminal is a mobile phone, a tablet personal computer, a television, a display, a notebook computer, a digital photo frame or a navigator.
2. The flexible circuit board of claim 1, wherein the lengths of the first pads are varied in an increasing or decreasing manner along a direction perpendicular to the lengths of the first pads.
3. The flexible circuit board of claim 1, wherein the lengths of the first pads vary incrementally or decrementally from the middle of the first land to either side of the first land.
4. The flexible circuit board according to any one of claims 1 to 3, wherein the flexible circuit board is further provided with a first alignment hole located at a side of the first land for alignment with the main circuit board.
5. A circuit board assembly is characterized by comprising a main circuit board and the flexible circuit board as claimed in any one of claims 1 to 4, wherein the main circuit board comprises third bonding pads the number of which is the same as that of the first bonding pads, the lengths of the third bonding pads are arranged in a stepped mode along the direction perpendicular to the length direction of the third bonding pads, the length change trend of the third bonding pads is opposite to that of the first bonding pads, the circuit board assembly can be applied to a mobile terminal, and the mobile terminal is a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame or a navigator.
6. The circuit board assembly of claim 5, wherein the third pad lengths increase or decrease in a direction perpendicular to the third pad lengths.
7. The circuit board assembly of claim 5, wherein the third pads decrease or increase in length from the middle to the sides.
8. The circuit board assembly of claim 6 or 7, wherein the third pads have second alignment holes corresponding to the first alignment holes on the flexible circuit board.
9. A circuit board assembly according to any one of claims 5 to 7, wherein the main circuit board is an FPC.
10. The circuit board assembly of claim 8,
the main circuit board is FPC.
11. A mobile terminal, characterized by comprising the circuit board assembly of any one of claims 5 to 10, or comprising the flexible circuit board of any one of claims 1 to 4, wherein the mobile terminal is a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, or a navigator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811384739.1A CN109327958B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board, circuit board assembly and mobile terminal |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511026733.3A CN105578743B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board, circuit board assemblies and mobile terminal |
| CN201811384739.1A CN109327958B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board, circuit board assembly and mobile terminal |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511026733.3A Division CN105578743B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board, circuit board assemblies and mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109327958A CN109327958A (en) | 2019-02-12 |
| CN109327958B true CN109327958B (en) | 2021-03-12 |
Family
ID=55888248
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811384739.1A Expired - Fee Related CN109327958B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board, circuit board assembly and mobile terminal |
| CN201511026733.3A Expired - Fee Related CN105578743B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board, circuit board assemblies and mobile terminal |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511026733.3A Expired - Fee Related CN105578743B (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board, circuit board assemblies and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN109327958B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109327958B (en) * | 2015-12-29 | 2021-03-12 | Oppo广东移动通信有限公司 | Flexible circuit board, circuit board assembly and mobile terminal |
| CN105911767A (en) * | 2016-06-16 | 2016-08-31 | 武汉华星光电技术有限公司 | LCD display module, master control circuit board thereof and backlight bar welding disc |
| CN108306351B (en) * | 2017-11-28 | 2022-05-31 | 海信视像科技股份有限公司 | Charging device and electronic mobile terminal |
| CN108012455B (en) * | 2017-12-29 | 2019-07-19 | Oppo广东移动通信有限公司 | Reflow soldering apparatus for electronic equipment |
| CN108258464B (en) * | 2018-01-12 | 2020-02-14 | 武汉光迅科技股份有限公司 | Soft band power supply device and power supply method for high-speed device |
| CN114679656A (en) * | 2019-01-05 | 2022-06-28 | 深圳市韶音科技有限公司 | Battery pack and bone conduction speaker |
| CN110933837B (en) * | 2019-11-28 | 2021-05-14 | 武汉天马微电子有限公司 | Flexible circuit board, manufacturing method thereof and display module comprising flexible circuit board |
| CN111965521B (en) * | 2020-08-11 | 2022-08-05 | 广东利扬芯片测试股份有限公司 | Anti-reverse-insertion structure of test board for radio frequency chip and radio frequency chip testing device |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0402055A3 (en) * | 1989-06-09 | 1991-09-18 | International Business Machines Corporation | Method and apparatus for a rapid interconnection to a computer bus |
| US6452114B1 (en) * | 1999-09-17 | 2002-09-17 | Hubbell Incorporated | Plug-in circuit board with reduced insertion force |
| AU2001237651A1 (en) * | 2000-02-11 | 2001-08-20 | Tyco Electronics Belgium Ec N.V. | Printed circuit board and connector assembly |
| JP2004023076A (en) * | 2002-06-20 | 2004-01-22 | Mitsubishi Electric Corp | Wiring board device |
| US20040245620A1 (en) * | 2003-06-03 | 2004-12-09 | Jackson Hsieh | Memory card capable of indicating an inserting direction |
| JP2005183496A (en) * | 2003-12-17 | 2005-07-07 | Canon Inc | Method and structure for connecting flexible printed board |
| CN101868123B (en) * | 2010-07-02 | 2011-12-28 | 深圳和而泰智能控制股份有限公司 | Printed circuit board and design method thereof |
| CN202206653U (en) * | 2011-09-22 | 2012-04-25 | 温州银河电子有限公司 | Golden finger structure of flexible printed circuit board |
| CN202697021U (en) * | 2012-04-25 | 2013-01-23 | 中兴通讯股份有限公司 | Goldfinger printed circuit board |
| CN109327958B (en) * | 2015-12-29 | 2021-03-12 | Oppo广东移动通信有限公司 | Flexible circuit board, circuit board assembly and mobile terminal |
-
2015
- 2015-12-29 CN CN201811384739.1A patent/CN109327958B/en not_active Expired - Fee Related
- 2015-12-29 CN CN201511026733.3A patent/CN105578743B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN105578743A (en) | 2016-05-11 |
| CN105578743B (en) | 2018-12-11 |
| CN109327958A (en) | 2019-02-12 |
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| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20210312 |