CN104093268A - PCB structure capable of preventing tin connection of adjacent pads - Google Patents
PCB structure capable of preventing tin connection of adjacent pads Download PDFInfo
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- CN104093268A CN104093268A CN201410256046.XA CN201410256046A CN104093268A CN 104093268 A CN104093268 A CN 104093268A CN 201410256046 A CN201410256046 A CN 201410256046A CN 104093268 A CN104093268 A CN 104093268A
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Abstract
The invention discloses a PCB structure capable of preventing tin connection of adjacent pads, for solving the problem of tin connection easily generated during welding of pads in a PCB. The PCB structure comprises a PCB main body and the N pads which are arranged on the PCB main body and are provided with welding holes. All the pads are sequentially arranged to form a pad group, the pad arrangement direction is parallel to the furnace direction of a PCB, N is a natural number greater than one, the pads are runway-shaped, the adjacent two pads are arranged in such a way that the runway-shaped straight edges are opposite, and the PCB main body area between the adjacent pads is provided with a silkscreen white oil layer whose length is not smaller than the length of the pads; and tin dragging pads connected with the pads at edges are disposed at the two ends of the pad group on the reverse surface of the PCB main body. The design is ingenious, the problem of tin connection between the tail portions of the pads and between the adjacent pads can be effectively solved, the labor cost is saved, and the production efficiency is also substantially improved.
Description
Technical field
The present invention relates to a kind of pcb board structure, what be specifically related to is a kind ofly to prevent that adjacent pad from connecting the pcb board structure of tin.
Background technology
Connect tin while referring to welding component, two and multiple solder joint are linked together by scolder, thereby cause product function and bad order, therefore, in the time carrying out components and parts welding, should avoid occurring connecting tin phenomenon as far as possible.
At present, plug-in components being welded in the process on pcb board, crossing stove direction due to pcb board is tin falling direction, thereby on pcb board, conventional pad design can join together the tin in the middle of two pads.As shown in Figure 1, conventional pad design, its pad is circle, thereby spacing between adjacent pad is less, the close pin element that even tin phenomenon very difficult avoiding, particularly leg spacing is less than 2.0mm, in the time crossing wave-soldering or Reflow Soldering, more easily occurs that copper sheet connects tin phenomenon.
Above-mentioned company after the appearance of tin phenomenon, the direct result causing is to need the manual detin of staff, and this has not only had a strong impact on the efficiency of producing, and has wasted cost of labor.
Summary of the invention
The object of the present invention is to provide a kind ofly to prevent that adjacent pad from connecting the pcb board structure of tin, mainly solve the problem that tin easily appears connecting in pad in existing pcb board in the time of welding.
To achieve these goals, the technical solution used in the present invention is as follows:
A kind ofly prevent that adjacent pad from connecting the pcb board structure of tin, comprise pcb board main body, and be arranged in this pcb board main body and be provided with welding hole, after penetrating welding hole for plug-in components leg, plug-in components is welded to the pad in pcb board main body, described pad is N, all pads are arranged in turn and are formed pad group, it is parallel that direction and the pcb board that pad is arranged crossed stove direction, N is greater than 1 natural number, described pad is racetrack, between adjacent two pads, arrange in the relative mode of the straight flange of racetrack, and the pcb board body region between adjacent pad is provided with the silk-screen white oil layer that length is not less than length of bonding pad, the reverse side of described pcb board main body and the two ends that are positioned at pad group be equipped be connected with the pad at edge drag soldering dish.
Further, for improving isolation effect, the company's of stopping tin phenomenon completely, described silk-screen white oil layer is arranged on the obverse and reverse of pcb board main body.
Again further, described in drag being shaped as of soldering dish square, and length is not less than length of bonding pad.
Compared with prior art, the present invention has following beneficial effect:
(1) the present invention is reasonable in design, with low cost, convenient welding.
(2) outer pad original circle is changed to racetrack by the present invention, so design, on the one hand, in the situation that not changing welding hole size and pad setting position, can dwindle pad width (horizontal direction), effectively increase the distance between adjacent pad, thereby reduce the possibility that connects tin; On the other hand, the run-track shaped length of bonding pad (vertical direction) that can make increases, because length of bonding pad role in welding spot reliability is more even more important than pad width, welding spot reliability depends primarily on length instead of width, therefore, the increase of length of bonding pad of the present invention also makes its solder joint more reliable, has optimized the weldability of pcb board.In addition, it is comprehensive that pad reduced width, length increase, and also makes its total area not large than original area in fact, thereby do not have the phenomenon of waste copper sheet.
(3) the present invention is racetrack by pad design, because the pcb board region between adjacent pad increases, thereby also increase space for arranging of silk-screen white oil layer, it can be finely arranged on this region, and all there is setting positive and negative, thereby can be well to intercepting between adjacent pad, the further company's of preventing tin, the present invention is all linked with one another in detail, and bring useful chain reaction, its design is very exquisite, and overall compactness is very strong, can effectively solve plug-in components and cross wave crest soldering/refluxing soldering company's tin problem afterwards.
(4) the present invention is also provided with that length is not less than length of bonding pad and for being shaped as the square soldering dish that drags, soldering dish is dragged in the setting of pcb board main body reverse side, one leg that can not affect plug-in components is welded on pcb board, two can play the effect of traction melting welding, thereby in the time that plug-in components is crossed crest, avoid well pad group tail end that tin occurs to connect.
(5) through overtesting, we find that the phenomenon of tin did not almost appear connecting in the present invention in the process of practical application, therefore, the present invention is by changing bond pad shapes, and in conjunction with silk-screen white oil layer and the mode of dragging soldering dish, solve the problem that tin easily occurs to connect between adjacent pad when plug-in components is crossed wave-soldering or Reflow Soldering, not only technique is simple for it, and welding quality is guaranteed, and significantly save cost of labor, and the efficiency that significantly raising is produced, therefore, compared to existing technology, the present invention has outstanding substantive distinguishing features and significant progressive, produce beyond thought effect.
Brief description of the drawings
Fig. 1 is the structural representation of pad in existing pcb board.
Fig. 2 is structural representation of the present invention.
Wherein, the parts name that Reference numeral is corresponding is called:
1-PCB plate main body, 2-pad, 3-welding hole, 4-silk-screen white oil layer, 5-drags soldering dish.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described, and embodiments of the present invention include but not limited to the following example.
Embodiment
As shown in Figure 2, the present invention includes pcb board main body 1, pad 2 and silk-screen white oil layer 4.Described pad 2 is arranged in pcb board main body 1, and in pad 2, be provided with the welding hole 3 penetrating for plug-in components leg, pad 2 is welded to plug-in components in pcb board main body after the leg of plug-in components penetrates welding hole 3, pad 2 is provided with multiple, and all pads are arranged in turn and formed pad group, it is parallel that the direction that pad is arranged and pcb board are crossed stove direction.Each pad is all racetrack, and arranges in the relative mode of the straight flange of racetrack between adjacent two pads, so can effectively increase the spacing of adjacent pad, the company's of preventing tin.
Further, owing to arranging in the relative mode of the straight flange of racetrack between adjacent two pads, thereby pcb board region between adjacent pad is effectively increased, silk-screen white oil layer 4 is arranged on this region, its length is not less than the length of pad, if the design of conventional bond pad shapes cannot be arranged on silk-screen white oil layer between adjacent pad, the present invention has solved this problem well, and utilizes silk-screen white oil layer further to prevent that tin from appearring connecting in adjacent pad.As preferably, in the present embodiment, silk-screen white oil layer 4 is all set on pcb board main body positive and negative.
In addition, on the reverse side of described pcb board the main body 1 and two ends that are positioned at pad group be equipped be connected with the pad at edge drag soldering dish 5, and it is square to drag the shape of soldering dish 5 to be preferably, length is not less than length of bonding pad.So design can effectively increase the copper sheet area of crossing wave-soldering or Reflow Soldering aspect of reverse side, while ensureing tin, can will drag the pin detin after soldering dish clean.
Although structure of the present invention is simple, due to small volume, thereby its design and practice being not easy, only have size, shape and the position of accurate assurance pad, and after silk-screen white oil layer is accurately set, could effectively prevent that adjacent pad from occurring connecting tin, the design in its details is very tight.Therefore, the present invention is based on the design philosophy of a forming surface, significantly optimize the performance of pcb board structure, for the welding procedure of plug-in components has been brought obvious benefit, particularly for close pin element, the present invention can make it farthest be solved in the problem aspect pcb board welding procedure, and therefore, technological progress of the present invention is fairly obvious.
Above-described embodiment is only preferably one of implementation of the present invention; should be in order to not limit the scope of the invention; all any change and polishings of having no essential meaning of having done under design concept of the present invention and spirit; or be equal to the technical scheme of displacement; its technical problem solving is consistent with the present invention in fact, also should be in protection scope of the present invention.
Claims (3)
1. one kind can prevent that adjacent pad from connecting the pcb board structure of tin, comprise pcb board main body (1), and be arranged on this pcb board main body (1) and go up and be provided with welding hole (3), after penetrating welding hole for plug-in components leg, plug-in components is welded to the pad (2) in pcb board main body, described pad is N, all pads are arranged in turn and are formed pad group, it is parallel that direction and the pcb board that pad is arranged crossed stove direction, N is greater than 1 natural number, it is characterized in that: described pad (2) is racetrack, between adjacent two pads, arrange in the relative mode of the straight flange of racetrack, and the pcb board body region between adjacent pad is provided with the silk-screen white oil layer (4) that length is not less than length of bonding pad, the reverse side of described pcb board main body (1) and the two ends that are positioned at pad group be equipped be connected with the pad at edge drag soldering dish (5).
2. according to claim 1ly a kind ofly prevent that adjacent pad from connecting the pcb board structure of tin, is characterized in that: described silk-screen white oil layer (4) is arranged on the obverse and reverse of pcb board main body (1).
3. according to claim 2ly a kind ofly prevent that adjacent pad from connecting the pcb board structure of tin, is characterized in that: described in drag being shaped as of soldering dish (5) square, and length is not less than length of bonding pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410256046.XA CN104093268A (en) | 2014-06-11 | 2014-06-11 | PCB structure capable of preventing tin connection of adjacent pads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410256046.XA CN104093268A (en) | 2014-06-11 | 2014-06-11 | PCB structure capable of preventing tin connection of adjacent pads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104093268A true CN104093268A (en) | 2014-10-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410256046.XA Pending CN104093268A (en) | 2014-06-11 | 2014-06-11 | PCB structure capable of preventing tin connection of adjacent pads |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105208775A (en) * | 2015-08-07 | 2015-12-30 | 深圳崇达多层线路板有限公司 | PCB design method for preventing BGA from solder bridge |
| CN106255318A (en) * | 2016-08-25 | 2016-12-21 | 广东欧珀移动通信有限公司 | Printed circuit board (PCB) and Wave crest Welding method thereof |
| CN107690226A (en) * | 2016-08-05 | 2018-02-13 | 东莞莫仕连接器有限公司 | Circuit board with tin tailing solder pad |
| CN107787126A (en) * | 2016-08-25 | 2018-03-09 | 迈普通信技术股份有限公司 | A kind of wave soldering tool and its design method |
| CN109068502A (en) * | 2018-10-31 | 2018-12-21 | 中新科技集团股份有限公司 | A kind of PCB |
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| CN201150149Y (en) * | 2007-10-19 | 2008-11-12 | 深圳和而泰智能控制股份有限公司 | Tin-thieving soldering disk |
| DE202011002439U1 (en) * | 2011-02-07 | 2011-05-12 | Tq-Systems Gmbh | Mechatronic positive 3D PCB extension |
| CN201878424U (en) * | 2010-11-15 | 2011-06-22 | 华为终端有限公司 | Printed circuit board for wave soldering of electronic product |
| CN103079341A (en) * | 2012-12-24 | 2013-05-01 | 广东欧珀移动通信有限公司 | Structure preventing short circuit caused by soldering of PCB (Printed Circuit Board) board and PCB board with structure |
| CN204031581U (en) * | 2014-06-11 | 2014-12-17 | 深圳市磊科实业有限公司 | A kind ofly prevent that adjacent pad from connecting the pcb board structure of tin |
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2014
- 2014-06-11 CN CN201410256046.XA patent/CN104093268A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201150149Y (en) * | 2007-10-19 | 2008-11-12 | 深圳和而泰智能控制股份有限公司 | Tin-thieving soldering disk |
| CN201878424U (en) * | 2010-11-15 | 2011-06-22 | 华为终端有限公司 | Printed circuit board for wave soldering of electronic product |
| DE202011002439U1 (en) * | 2011-02-07 | 2011-05-12 | Tq-Systems Gmbh | Mechatronic positive 3D PCB extension |
| CN103079341A (en) * | 2012-12-24 | 2013-05-01 | 广东欧珀移动通信有限公司 | Structure preventing short circuit caused by soldering of PCB (Printed Circuit Board) board and PCB board with structure |
| CN204031581U (en) * | 2014-06-11 | 2014-12-17 | 深圳市磊科实业有限公司 | A kind ofly prevent that adjacent pad from connecting the pcb board structure of tin |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105208775A (en) * | 2015-08-07 | 2015-12-30 | 深圳崇达多层线路板有限公司 | PCB design method for preventing BGA from solder bridge |
| CN105208775B (en) * | 2015-08-07 | 2018-03-06 | 深圳崇达多层线路板有限公司 | A kind of PCB design method for preventing BGA welding from connecting tin |
| CN107690226A (en) * | 2016-08-05 | 2018-02-13 | 东莞莫仕连接器有限公司 | Circuit board with tin tailing solder pad |
| CN106255318A (en) * | 2016-08-25 | 2016-12-21 | 广东欧珀移动通信有限公司 | Printed circuit board (PCB) and Wave crest Welding method thereof |
| CN107787126A (en) * | 2016-08-25 | 2018-03-09 | 迈普通信技术股份有限公司 | A kind of wave soldering tool and its design method |
| CN107787126B (en) * | 2016-08-25 | 2019-12-10 | 迈普通信技术股份有限公司 | wave soldering jig and design method thereof |
| CN109068502A (en) * | 2018-10-31 | 2018-12-21 | 中新科技集团股份有限公司 | A kind of PCB |
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Application publication date: 20141008 |
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| RJ01 | Rejection of invention patent application after publication |