CN106255318A - Printed circuit board (PCB) and Wave crest Welding method thereof - Google Patents
Printed circuit board (PCB) and Wave crest Welding method thereof Download PDFInfo
- Publication number
- CN106255318A CN106255318A CN201610724487.7A CN201610724487A CN106255318A CN 106255318 A CN106255318 A CN 106255318A CN 201610724487 A CN201610724487 A CN 201610724487A CN 106255318 A CN106255318 A CN 106255318A
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- pcb
- circuit board
- pin pad
- perforate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
Abstract
The present invention is applicable to printed-board technology field, it is provided that a kind of printed circuit board (PCB) includes: substrate, and described substrate is provided with at least two welding hole, and each welding hole interval is arranged；Pin pad, is correspondingly arranged with each described welding hole, and each pin pad ring sets and is formed at each described welding hole periphery；Wherein, described substrate being additionally provided with perforate, perforate is described in adjacent two between pin pad；When described substrate carries out wave-soldering process, unnecessary scolding tin flows in described perforate.This printed circuit board (PCB) is by arranging at least two welding hole on the substrate, and at the periphery formation pin pad of described welding hole, the electronic devices and components to be welded for wave-soldering are prepared；Described perforate is being set between pin pad described in adjacent two, during so that described substrate carries out wave-soldering process, unnecessary scolding tin is opened to described perforate, to change the continuity that described in adjacent two, between pin pad, scolding tin flows, pull open the adhesion distance of described scolding tin, thus phenomenon has been welded by the company of avoiding the occurrence of.
Description
Technical field
The invention belongs to printed-board technology field, particularly relate to a kind of printed circuit board (PCB) and this printed circuit board (PCB)
Wave crest Welding method.
Background technology
Electronic devices and components even weld when producing and are always insoluble problem, the most in recent years electronics unit device in industry
Part is to miniaturization, and spacing is more and more less, and even weldering problem is the most prominent.
At present, in the production of printed circuit board (PCB), use wave-soldering to carry out welding and be widely used.Wave-soldering is one
Kind by pump function, the liquid solder surface melted is made to form the solder wave of given shape, the dress connection of components and parts when plug-in mounting
When assembly is at a certain angle by solder wave, form the Technology of solder joint in pin-land.And, wave-soldering is that employing is right
Welding zone is heated by stream heat transfer theory.
When using wave-soldering, liquid tin has certain fluidity and adhesive, when between the electronic devices and components pin welded
When closeer, still it is easier even weldering phenomenon.For example, for small and lightening electronic equipment, absolutely
The lead pin pitch of major part electronic devices and components is both less than 1 millimeter, and so, electronic devices and components pin closeer during wave-soldering is because of scolding tin
Adhesive and cannot pull open, the just company's of generation weldering.
Summary of the invention
It is an object of the invention to provide a kind of printed circuit board (PCB), it is intended to solve printed circuit board (PCB) in prior art and carry out ripple
The technical problem of even weldering is there is during peak weldering.
The present invention is achieved in that a kind of printed circuit board (PCB), including:
Substrate, described substrate is provided with at least two welding hole, and each described welding hole interval is arranged；
Pin pad, is correspondingly arranged with each described welding hole, and each described pin pad ring sets and is formed at each described welding
Hole peripheral；
Wherein, described substrate being additionally provided with perforate, described perforate is described in adjacent two between pin pad；Described substrate
When carrying out wave-soldering process, unnecessary scolding tin flows in described perforate.
Further, described aperture widths is less than the spacing between pin pad described in adjacent two.
Further, described aperture widths is than the little 0.2mm of spacing between pin pad described in adjacent two.
Further, the length of described perforate is not less than the length of described pin pad.
Further, the length of described perforate is than the big 0.4mm of length of described pin pad.
Further, each described pin pad and described perforate are linearly arranged along described substrate moving direction.
Further, the cross sectional shape of described perforate is circular, oval, track type or polygon.
Present invention also offers a kind of Wave crest Welding method of printed circuit board (PCB), comprise the following steps:
Thering is provided printed circuit board (PCB), described printed circuit board (PCB) is above-mentioned printed circuit board (PCB)；
Thering is provided stannum face crest, described printed circuit board (PCB) moves towards described stannum face crest, and described stannum face crest is to described printing
Each described pin pad on circuit board carries out wave-soldering process.
Relative to prior art, the present invention has the technical effect that this printed circuit board (PCB) is by arranging at least on the substrate
Two welding holes, and form described pin pad at the periphery of described welding hole, the electronic devices and components to be welded for wave-soldering do
Prepare；Described perforate is being set between pin pad described in adjacent two, during so that described substrate carries out wave-soldering process, unnecessary scolding tin
It is opened to described perforate, to change the continuity that described in adjacent two, between pin pad, scolding tin flows, has pulled open described weldering
The adhesion distance of stannum, thus the company's of avoiding the occurrence of weldering phenomenon.
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme of the embodiment of the present invention, below will be to the embodiment of the present invention or prior art
In description, the required accompanying drawing used is briefly described, it should be apparent that, drawings described below is only the present invention's
Some embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to according to this
A little accompanying drawings obtain other accompanying drawing.
Fig. 1 is pin pad and the structural representation of perforate on a kind of printed circuit board (PCB) that the embodiment of the present invention provides；
Fig. 2 is pin pad and the structural representation of perforate on the another kind of printed circuit board (PCB) that the embodiment of the present invention provides；
Fig. 3 is pin pad and the structural representation of perforate on another printed circuit board (PCB) that the embodiment of the present invention provides.
Description of reference numerals:
| 10 | Substrate | 40 | Perforate |
| 20 | Welding hole | 50 | Stannum face crest |
| 30 | Pin pad |
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings, the most from start to finish
Same or similar label represents same or similar element or has the element of same or like function.Below with reference to attached
The embodiment that figure describes is exemplary, it is intended to is used for explaining the present invention, and is not considered as limiting the invention.
In describing the invention, it is to be understood that term " length ", " width ", " on ", D score, "front", "rear",
The orientation of the instruction such as "left", "right", " vertically ", " level ", " top ", " end " " interior ", " outward " or position relationship are for based on accompanying drawing institute
The orientation shown or position relationship, be for only for ease of and describe the present invention and simplify description rather than instruction or the dress of hint indication
Put or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that limit to the present invention
System.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or
Implicitly include one or more this feature.In describing the invention, " multiple " are meant that two or more,
Unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, term " install ", " being connected ", " connection ", " fixing " etc.
Term should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect, or integral；Can be that machinery connects
Connect, it is also possible to be electrical connection；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, in can being two elements
The connection in portion or the interaction relationship of two elements.For the ordinary skill in the art, can be according to concrete feelings
Condition understands above-mentioned term concrete meaning in the present invention.
In order to make the purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, right
The present invention is further elaborated.
Refer to Fig. 1 to Fig. 3, the printed circuit board (PCB) that the embodiment of the present invention provides includes:
Substrate 10, described substrate 10 is provided with at least two welding hole 20, and each described welding hole 20 interval is arranged；
Pin pad 30, is correspondingly arranged with each described welding hole 20, and each described pin pad 30 ring sets and is formed at each institute
State welding hole 20 periphery；
Wherein, described substrate 10 being additionally provided with perforate 40, described perforate 40 is described in adjacent two between pin pad 30；
When described substrate 10 carries out wave-soldering process, unnecessary scolding tin flows in described perforate 40.
The printed circuit board (PCB) that the embodiment of the present invention provides passes through to arrange at least two welding hole 20 on described substrate 10, and
Periphery at described welding hole 20 forms described pin pad 30, and the electronic devices and components to be welded for wave-soldering are prepared；In phase
Described perforate 40 is set between pin pad 30 described in adjacent two, during so that described substrate 10 carries out wave-soldering process, unnecessary scolding tin quilt
Pull open to described perforate 40, to change the continuity that described in adjacent two, between pin pad 30, scolding tin flows, pulled open described
The adhesion distance of scolding tin, thus the company's of avoiding the occurrence of weldering phenomenon.
In this embodiment, by arranging described perforate 40 described in adjacent two between pin pad 30, it is to avoid adjacent
Even weldering problem occurs, compared to occurring when being not provided with perforate 40 that even weldering rate is the feelings of about 75% described in two between pin pad 30
Condition, by after described perforate 40 is set so that within even weldering rate is reduced to 1%, substantially increasing welding yield, improve printing
The quality of circuit board.
In this embodiment, described welding hole 20 is the through hole running through relative two surfaces of described substrate 10.
It should be noted that before carrying out wave-soldering, when not being inserted with the pin of electronic devices and components in described welding hole 20,
The hole wall of described welding hole 20 does not carry out metalized, in order to avoid occurring that when wave-soldering scolding tin is directly adhered to described hole wall
In, and cause plug-hole, it is beneficial to follow-up soldering；Before carrying out wave-soldering, in described welding hole 20, it is inserted with electronics unit device
During the pin of part, the hole wall of described welding hole 20 must carry out metalized, so that being welded by described pin during wave-soldering
It is connected in described welding hole 20, it is ensured that described electronic devices and components and the conducting of circuit in described substrate 10.
When through stannum face crest 50, described substrate 10 1 surface is towards described stannum face crest 50, and another surface deviates from institute
State the scolding tin in stannum face crest 50 and described stannum face crest 50 upwards climb through described welding hole 20 and be adhered to the weldering of described pin
On dish 30, after cooling, form solder joint, and unnecessary scolding tin is drawn to by described perforate 40.
In this embodiment, each described pin pad 30 is made of copper, it would however also be possible to employ other conduct electricity and may be used for
The material of welding is made, and is not limited to this.
In this embodiment, described substrate 10 can be multilayer wiring board 10 or single-layer wire base board 10, and at it
Two relative surfaces are provided with solder mask, i.e. green oil.
In this embodiment, described substrate 10, under the drive of conveying mechanism, moves relative to described stannum face crest 50, as
Direction of arrow A shown in Fig. 1 to Fig. 3, to realize welding.Described welding hole 20 moves along the direction of advance of described substrate 10,
In described substrate 10 moving process, described perforate 40 is positioned at the rear of described stannum face crest 50, and described scolding tin is from described welding hole
The inwall of 20 flows towards the outer rim of described pin pad 30, is i.e. drawn by unnecessary scolding tin along described perforate 40, is avoided each described
Even weldering problem occurs between pin pad 30.
Refer to Fig. 1, further, described perforate 40 width W1 is less than the spacing between pin pad 30 described in adjacent two
W0.It is to be appreciated that the outward flange of the edge of described perforate 40 and described pin pad 30 has gap, have at described substrate 10
In the case of having translational speed, the unnecessary scolding tin after Wave crest Welding flow in described perforate 40 from described pin pad 30,
Pull open the adhesion distance of unnecessary scolding tin between pin pad 30 described in adjacent two, change unnecessary scolding tin to pin next described
The continuity of pad 30 flowing, thus the company's of avoiding the occurrence of weldering.
In this embodiment, the distance of pin pad 30 described in described perforate 40 Edge Distance adjacent two is identical.
Refer to Fig. 1, it is preferable that described perforate 40 width W1 is less than spacing W0 between pin pad 30 described in adjacent two
0.2mm.Being appreciated that W0-W1=0.2mm, i.e. when difference therebetween is 0.2mm, occur that even weldering rate is minimum, effect is
Good.If spacing W0 between described perforate 40 width W1 and pin pad 30 described in adjacent two is poor less than 0.2mm, i.e. W0-W1
＜ 0.2mm, then be not enough to pull open the adhesion distance of described unnecessary scolding tin, it is also possible to causes even welding；If described A/F W1
Poor with spacing W0 between pin pad 30 described in adjacent two more than 0.2mm, i.e. W0-W1 ＞ 0.2mm, the most unnecessary scolding tin easily glues
It is connected in described substrate 10 surface, and it is possible to cause connecting the problem welded.
Refer to Fig. 1, further, length L1 of described perforate 40 is not less than length L0 of described pin pad 30.Can
To understand ground, length L1 of described perforate 40 at least will be equal to length L0 of described pin pad 30, to ensure unnecessary scolding tin not
It is adhered on substrate 10, further, since during carrying out wave-soldering, described substrate 10 is constantly in mobile status, unnecessary weldering
Stannum easily occurs whipping in moving process, is not limited solely to along described substrate 10 moving direction flowing, also can expand to both sides
Diffusing is moved, to this end, by length L0 that length L1 of described perforate 40 is set greater than described pin pad 30, then and can be by
Unnecessary scolding tin all sucks, and avoids unnecessary scolding tin to residue in described substrate 10 surface, or is adhered to pin weldering described in adjacent two
Occur between dish 30 even welding.
Refer to Fig. 1, further, length L1 of described perforate 40 is than the big 0.4mm of length L0 of described pin pad 30.
It is appreciated that L1-L0=0.4mm, i.e. when difference therebetween is 0.4mm, occurs that even weldering rate is minimum, best results.As
The most described perforate 40 length L1 is less than 0.4mm, i.e. L1-L0 ＜ 0.4mm with the length L0 difference of described pin pad 30, then be not enough to
Pull open unnecessary scolding tin, it is also possible to cause even welding；If between described A/F W1 with pin pad 30 described in adjacent two
Away from W0 difference more than 0.4mm, i.e. L1-L0 ＞ 0.4mm, the most described perforate 40 is long and causes waste.
Preferably, described perforate 40 is along the centrage of described substrate 10 moving direction, with described pin pad 30 along described
The centerline collineation of substrate 10 moving direction, when whipping occurs in unnecessary scolding tin, the rear side at described pin pad 30 has enough
Perforate 40 space unnecessary scolding tin is pulled open, it is to avoid even weldering occurs.
Refer to Fig. 1 to Fig. 3, further, each described pin pad 30 and described perforate 40 are moved along described substrate 10
Linearly arrange in direction.It is to be appreciated that by each described pin pad 30 and described perforate 40 are linearly arranged, so that
When carrying out wave-soldering, the unnecessary scolding tin flowed out from each described pin pad 30 can be pulled open by perforate 40, it is to avoid even weldering occurs.
It should be noted that the centrage of indication in the various embodiments described above, refer to described pin pad 30 and described perforate
40 centrages being had in the shape on described substrate 10 surface rather than refer to the centrage along substrate 10 thickness direction.
Refer to Fig. 1 to Fig. 3, further, the cross sectional shape of described perforate 40 be circular, oval, track type or
Polygon.Described polygon can be square, pentagon, hexagon etc., is not limited to this.
Refer to Fig. 1 to Fig. 3, the Wave crest Welding method of the printed circuit board (PCB) that the embodiment of the present invention provides includes following step
Rapid:
Thering is provided printed circuit board (PCB), described printed circuit board (PCB) is above-mentioned printed circuit board (PCB)；
Thering is provided stannum face crest 50, described printed circuit board (PCB) moves towards described stannum face crest 50, and described stannum face crest 50 is to institute
The each described pin pad 30 stated on printed circuit board (PCB) carries out wave-soldering process.
The Wave crest Welding method of the printed circuit board (PCB) that the embodiment of the present invention provides, owing to using the various embodiments described above to provide
Printed circuit board (PCB), when carrying out Wave crest Welding, unnecessary scolding tin is drawn from described drawing soldering dish 40, it is to avoid even weldering.And should
Printed circuit board (PCB) in embodiment has identical structure with the printed circuit board (PCB) in the various embodiments described above, role also phase
With, do not repeat.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all essences in the present invention
Any amendment, equivalent and the improvement etc. made within god and principle, should be included within the scope of the present invention.
Claims (8)
1. a printed circuit board (PCB), it is characterised in that including:
Substrate, described substrate is provided with at least two welding hole, and each described welding hole interval is arranged；
Pin pad, is correspondingly arranged with each described welding hole, and each described pin pad ring sets and is formed at each described welding hole week
Edge；
Wherein, described substrate being additionally provided with perforate, described perforate is described in adjacent two between pin pad；Described substrate is carried out
When wave-soldering processes, unnecessary scolding tin flows in described perforate.
2. printed circuit board (PCB) as claimed in claim 1, it is characterised in that described aperture widths is less than pin weldering described in adjacent two
Spacing between dish.
3. printed circuit board (PCB) as claimed in claim 2, it is characterised in that described aperture widths is than pin pad described in adjacent two
Between the little 0.2mm of spacing.
4. printed circuit board (PCB) as claimed in claim 1, it is characterised in that the length of described perforate is not less than described pin pad
Length.
5. printed circuit board (PCB) as claimed in claim 4, it is characterised in that long than described pin pad of the length of described perforate
Spend big 0.4mm.
6. the printed circuit board (PCB) as described in claim 1 to 5 any one, it is characterised in that each described pin pad and described
Perforate is linearly arranged along described substrate moving direction.
7. the printed circuit board (PCB) as described in claim 1 to 5 any one, it is characterised in that the cross sectional shape of described perforate is
Circle, oval, track type or polygon.
8. the Wave crest Welding method of a printed circuit board (PCB), it is characterised in that comprise the following steps:
Thering is provided printed circuit board (PCB), described printed circuit board (PCB) is such as the printed circuit board (PCB) of claim 1 to 7 any one；
Thering is provided stannum face crest, described printed circuit board (PCB) moves towards described stannum face crest, and described stannum face crest is to described printed circuit
Each described pin pad on plate carries out wave-soldering process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610724487.7A CN106255318A (en) | 2016-08-25 | 2016-08-25 | Printed circuit board (PCB) and Wave crest Welding method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610724487.7A CN106255318A (en) | 2016-08-25 | 2016-08-25 | Printed circuit board (PCB) and Wave crest Welding method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106255318A true CN106255318A (en) | 2016-12-21 |
Family
ID=57596214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610724487.7A Pending CN106255318A (en) | 2016-08-25 | 2016-08-25 | Printed circuit board (PCB) and Wave crest Welding method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN106255318A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107148146A (en) * | 2017-05-05 | 2017-09-08 | 青岛海信宽带多媒体技术有限公司 | A kind of manufacture method of optical module and optical module |
| CN111545856A (en) * | 2020-05-15 | 2020-08-18 | 宁波奥克斯电气股份有限公司 | Method for preventing wave soldering from being connected and welded, printing screen and electric control board |
| CN113163589A (en) * | 2020-01-22 | 2021-07-23 | 华为技术有限公司 | Circuit device and method for manufacturing the same |
| CN113766765A (en) * | 2021-08-18 | 2021-12-07 | 惠州雷曼光电科技有限公司 | Circuit board and soldering assembly |
| CN115623660A (en) * | 2021-07-20 | 2023-01-17 | 荣耀终端有限公司 | Circuit board and electronic equipment |
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| CN1627882A (en) * | 2003-12-11 | 2005-06-15 | 三菱电机株式会社 | Printed circuit board for mounting a quad flat package IC, method of soldering a quad flat package IC, and air conditioning apparatus with such a printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107148146A (en) * | 2017-05-05 | 2017-09-08 | 青岛海信宽带多媒体技术有限公司 | A kind of manufacture method of optical module and optical module |
| CN113163589A (en) * | 2020-01-22 | 2021-07-23 | 华为技术有限公司 | Circuit device and method for manufacturing the same |
| CN111545856A (en) * | 2020-05-15 | 2020-08-18 | 宁波奥克斯电气股份有限公司 | Method for preventing wave soldering from being connected and welded, printing screen and electric control board |
| CN111545856B (en) * | 2020-05-15 | 2022-03-22 | 宁波奥克斯电气股份有限公司 | Method for preventing wave soldering from being connected and welded, printing screen and electric control board |
| CN115623660A (en) * | 2021-07-20 | 2023-01-17 | 荣耀终端有限公司 | Circuit board and electronic equipment |
| CN115623660B (en) * | 2021-07-20 | 2024-04-05 | 荣耀终端有限公司 | Circuit board and electronic equipment |
| CN113766765A (en) * | 2021-08-18 | 2021-12-07 | 惠州雷曼光电科技有限公司 | Circuit board and soldering assembly |
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Application publication date: 20161221 |