CN110785000B - Heat dissipation method for flexible circuit board - Google Patents
Heat dissipation method for flexible circuit board Download PDFInfo
- Publication number
- CN110785000B CN110785000B CN201911044329.7A CN201911044329A CN110785000B CN 110785000 B CN110785000 B CN 110785000B CN 201911044329 A CN201911044329 A CN 201911044329A CN 110785000 B CN110785000 B CN 110785000B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- circuit area
- area
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
Abstract
The invention discloses a method for radiating a flexible circuit board, which comprises the following steps: step 1, when a solder resist is coated, coating the solder resist on a circuit area of the flexible circuit board, and not coating the solder resist on a non-circuit area of the flexible circuit board, so that a solid copper foil on the non-circuit area of the flexible circuit board is exposed; step 2, punching a groove along the copper foil after packaging the semiconductor element; and 3, bending the non-circuit area to enable the input end non-circuit area to be adhered to the upper surface of the semiconductor element. The method does not need to add other heat dissipation equipment, utilizes the solid copper foil on the flexible circuit board substrate to be connected with the semiconductor element to provide a heat dissipation channel, and has convenient implementation and good heat dissipation effect.
Description
Technical Field
The invention relates to the technical field of flexible circuit boards, in particular to a heat dissipation method of a flexible circuit board.
Background
In the production of flexible circuit boards, a roll-to-roll production method is adopted, in which a line pattern is formed on a roll of COF base material composed of a metal layer (generally, a solid copper foil) and an insulating film layer by coating, exposure, development, etc., then electroplating, printing a solder resist, etc., is performed on a specific region of the line pattern, a protective layer is provided, then a semiconductor electronic component is mounted at a device hole, and finally, a single COF product is punched out from a COF roll tape and linked to other circuit boards for producing electronic products.
Since the semiconductor element mounted on the flexible printed circuit board generates heat during operation, the operation speed of the semiconductor element is reduced, and the reliability is lowered, so that how to dissipate heat from the semiconductor element is a problem to be solved. In the prior art, a method for dissipating heat of a semiconductor device on a flexible printed circuit board is mainly to provide a metal plate on the back of the flexible printed circuit board and connect the metal plate with the semiconductor device, so that heat on the semiconductor device can be conducted to the metal plate, and heat dissipation can be achieved by means of the metal plate. The disadvantage of this method is that the metal plate is connected to the semiconductor element, usually by an insulating substrate and an encapsulating resin, which have poor heat conduction effects, and therefore the heat of the semiconductor element cannot be efficiently transferred to the metal plate, thereby affecting the heat dissipation efficiency.
Disclosure of Invention
The invention aims to provide a method for radiating heat of a flexible circuit board, which aims to solve the problem of poor heat radiation of a semiconductor element on the flexible circuit board.
In order to achieve the above object, a method for dissipating heat of a flexible printed circuit board according to the present invention includes a circuit area and a non-circuit area, where the non-circuit area includes an input end non-circuit area and an output end side non-circuit area, and the method includes the following steps:
step 1, when a solder resist is coated, coating the solder resist on a circuit area of the flexible circuit board, and not coating the solder resist on a non-circuit area of the flexible circuit board, so that a solid copper foil on the non-circuit area of the flexible circuit board is exposed;
step 2, punching a groove along the copper foil on the non-circuit area after packaging the semiconductor element;
and 3, bending the non-circuit area to enable the input end non-circuit area to be adhered to the upper surface of the semiconductor element.
Furthermore, the non-circuit area on the side edge of the output end is in lap joint with the heat dissipation channel of the liquid crystal panel.
Further, the shape of the non-line area is a door shape or a triangle.
Further, the insulating film on the back surface of the non-wiring region is removed by etching.
Further, the insulating film is a polyimide-based resin or an epoxy resin or a liquid crystal polymer.
The invention has the beneficial effects that: the invention sets the non-circuit areas at the two sides of the flexible circuit board as the heat dissipation channels of the semiconductor element, the input end non-circuit area is directly adhered on the surface of the semiconductor element through the thermosetting adhesive with high heat conductivity, the heat generated by the semiconductor element during working can be directly transferred to the input end non-circuit area, the heat dissipation efficiency is high, and the problems that the working speed of the semiconductor element is slowed down and the reliability is reduced due to overhigh temperature can be effectively avoided.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of a groove B cut at the edge of the circuit area of the flexible circuit board;
FIG. 3 is a schematic view of the non-circuit area G of the input terminal being bent and then being adhered to the surface of the semiconductor element F;
fig. 4 is a schematic diagram of the connection of the output terminal non-circuit region H with other flexible wiring boards I;
FIG. 5 is a schematic view of the flexible circuit board after bending and connection with other equipment;
in the figure, an A-non-circuit region, a B-groove, a C-circuit region, a D-input terminal, an E-output terminal, an F-semiconductor element, a G-input terminal non-circuit region, an H-output terminal side non-circuit region, an I-liquid crystal panel heat dissipation channel, a J-other flexible circuit board, and a K-liquid crystal panel.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1 to 5, a method for dissipating heat of a flexible printed circuit, the flexible printed circuit including a circuit area C and a non-circuit area a, the non-circuit area a including an input non-circuit area G and an output side non-circuit area H, includes the following steps:
step 1, when a solder resist is coated, coating the solder resist on a circuit area C of the flexible circuit board, and not coating the solder resist on a non-circuit area A of the flexible circuit board, so that a solid copper foil on the non-circuit area A of the flexible circuit board is exposed;
2, punching a groove B along the copper foil on the non-circuit area A after packaging the semiconductor element F;
step 3 bends the non-wiring region a to make the input terminal non-wiring region G adhere to the upper surface of the semiconductor element F.
The invention sets the non-circuit area A at two sides of the flexible circuit board as the heat dissipation channel of the semiconductor element F, the input end non-circuit area G is directly adhered on the surface of the semiconductor element F through the thermosetting adhesive with high heat conductivity, the heat generated by the semiconductor element F during working can be directly transferred to the input end non-circuit area G, the heat dissipation efficiency is high, and the problems that the working speed is slowed down and the reliability is reduced due to overhigh temperature of the semiconductor element F can be effectively avoided. The shape of the non-line area A is a door shape or a triangle. As shown in fig. 4, the non-circuit area H on the side of the output end is overlapped with the heat dissipation channel I of the liquid crystal panel, so that heat can be better dissipated, the output end D is connected with other flexible circuit boards J, and the input end E is connected with the liquid crystal panel K. The insulating film on the surface of the non-circuit area is removed by etching, so that heat dissipation can be performed on the front surface and the back surface of the non-circuit area A of the flexible circuit board, wherein the insulating film is made of polyimide resin or epoxy resin or liquid crystal polymer.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited thereto, and various changes which can be made within the knowledge of those skilled in the art without departing from the gist of the present invention are within the scope of the claims of the present invention.
Claims (5)
1. A method of dissipating heat from a flexible wiring board, the flexible wiring board including a wiring region (C) and a non-wiring region (a), the non-wiring region (a) including an input-side non-wiring region (G) and an output-side non-wiring region (H), the method comprising the steps of:
step 1, when a solder resist is coated, coating the solder resist on a circuit area (C) of the flexible circuit board, and not coating the solder resist on a non-circuit area (A) of the flexible circuit board, so that a solid copper foil on the non-circuit area (A) of the flexible circuit board is exposed;
2, punching a groove (B) along the copper foil on the non-circuit area (A) after packaging the semiconductor element (F);
step 3 bends the non-wiring area (A) to make the input end non-wiring area (G) adhere to the upper surface of the semiconductor element (F).
2. The method for dissipating heat of the flexible circuit board according to claim 1, wherein: and the non-circuit area (H) at the side edge of the output end is in lap joint with the heat dissipation channel (I) of the liquid crystal panel.
3. The method for dissipating heat of the flexible circuit board according to claim 1, wherein: the shape of the non-circuit area (A) is in a door shape or a triangle shape.
4. The method for dissipating heat of the flexible circuit board according to claim 1, wherein: and removing the insulating film on the back of the non-circuit area (A) by means of etching.
5. The method for dissipating heat of the flexible circuit board according to claim 4, wherein: the insulating film is made of polyimide resin or epoxy resin or liquid crystal polymer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911044329.7A CN110785000B (en) | 2019-10-30 | 2019-10-30 | Heat dissipation method for flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911044329.7A CN110785000B (en) | 2019-10-30 | 2019-10-30 | Heat dissipation method for flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110785000A CN110785000A (en) | 2020-02-11 |
| CN110785000B true CN110785000B (en) | 2022-02-22 |
Family
ID=69387679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911044329.7A Active CN110785000B (en) | 2019-10-30 | 2019-10-30 | Heat dissipation method for flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110785000B (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4697118B2 (en) * | 2006-10-23 | 2011-06-08 | 株式会社デンソー | Electronic equipment |
| JP2014103134A (en) * | 2011-03-10 | 2014-06-05 | Panasonic Corp | Heat radiation structure |
| WO2011137756A2 (en) * | 2011-05-06 | 2011-11-10 | 华为终端有限公司 | Composite material and electron device |
| TWI475297B (en) * | 2012-02-10 | 2015-03-01 | Au Optronics Corp | Backlight module and thermal design thereof |
| JPWO2019188973A1 (en) * | 2018-03-30 | 2021-04-01 | Jnc株式会社 | Compositions, heat dissipation members, electronic devices, and methods for manufacturing compositions |
-
2019
- 2019-10-30 CN CN201911044329.7A patent/CN110785000B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN110785000A (en) | 2020-02-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100704919B1 (en) | Coreless substrate and manufacturing method thereof | |
| KR20100024381A (en) | Semiconductor device and its manufacturing method, and display and its manufacturing method | |
| US20060008970A1 (en) | Optimized plating process for multilayer printed circuit boards having edge connectors | |
| TWI506748B (en) | Package substrate, method for manufacturing same, and package structure | |
| JP2010239022A (en) | Flexible printed wiring board and semiconductor device employing the same | |
| TW201405745A (en) | Package substrate, package structure and method for manufacturing package structure | |
| JP2015223044A (en) | Circuit structure and electric connection box | |
| KR20080077588A (en) | Wiring board for chip on film, preparing method thereof and semiconductor device | |
| JP2001053108A (en) | Semiconductor device, manufacture thereof, and liquid crystal module, and mounting method therefor | |
| US10356909B1 (en) | Embedded circuit board and method of making same | |
| JP2009135340A (en) | Source driver, manufacturing method of source driver, and liquid crystal module | |
| CN110785000B (en) | Heat dissipation method for flexible circuit board | |
| KR101369300B1 (en) | Cof package having improved heat dissipation | |
| TW201813458A (en) | Hollow flexible circuit board and method for manufacturing same | |
| JP2000340617A (en) | Tab tape carrier and its manufacture | |
| JP2007019078A (en) | Printed circuit board, flexible printed circuit board, and manufacturing method thereof | |
| JP4260098B2 (en) | Printed circuit board for plasma display and manufacturing method thereof | |
| JP3726891B2 (en) | Mounting structure of film carrier tape for mounting electronic components and manufacturing method of film carrier tape for mounting electronic components | |
| JP5299206B2 (en) | Circuit board manufacturing method | |
| JP2015012078A (en) | Method for manufacturing flexible printed wiring board and flexible printed wiring board | |
| CN211378345U (en) | High-precision single-sided circuit board | |
| JP2005276981A (en) | Method of manufacturing module with built-in circuit component | |
| JP5861258B2 (en) | Lead frame wiring body, module, and manufacturing method thereof | |
| JP5066718B2 (en) | Manufacturing method of flexible printed wiring board | |
| JP2007306314A (en) | Waveguide connecting structure, and its manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |