CN211378345U - High-precision single-sided circuit board - Google Patents
High-precision single-sided circuit board Download PDFInfo
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- CN211378345U CN211378345U CN201921736301.5U CN201921736301U CN211378345U CN 211378345 U CN211378345 U CN 211378345U CN 201921736301 U CN201921736301 U CN 201921736301U CN 211378345 U CN211378345 U CN 211378345U
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- circuit board
- main part
- heat
- line board
- conducting layer
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Abstract
The utility model discloses a high-accuracy single face circuit board, including line board main part, main control IC, metal forming, circuit board mounting hole, louvre and heat-conducting layer, the line board main part is formed by a plurality of small-size line board combinations, is equipped with main control IC in the middle of the line board main part, and main control IC all is equipped with the circuit board mounting hole all around, and circuit board mounting hole one side is equipped with the louvre, and line board main part surface is equipped with the metal forming, and line board main part inboard is equipped with the heat-conducting layer, and line board main. The utility model discloses a metal forming reaches electromagnetic shield's function, because metal forming has low surface oxygen characteristic, mainly is applied to electromagnetic shield and antistatic, arranges the metal forming in the circuit board surface, combines metal substrate, has good conductivity, has set up louvre and heat-conducting layer on the circuit board, the heat dissipation that is convenient for can be timely to the safe in utilization of protection circuit board.
Description
Technical Field
The utility model relates to a circuit board technical field particularly, relates to a high-accuracy single face circuit board.
Background
At present, the development trend of miniaturization and high speed of electronic products is pushing the electronic circuit board industry to enter a new development period, in the manufacturing process of the circuit board, usually, a copper foil pressed on a base material forms a conductive circuit through multiple steps of pressing, exposing, developing, etching and the like, and then a circuit board is formed, the appearance of the flexible circuit board plays a revolutionary promotion role in the industry, but the flexible circuit board is also a conductive circuit which is formed by adopting a flexible insulating base material through the manufacturing steps, although the circuit board has many advantages which cannot be achieved by a rigid circuit board, such as bending, winding, folding and the like, can be randomly arranged according to space layout requirements, has very strong freedom degree, and is very suitable for the development of the electronic products towards high density, miniaturization and high reliability, and the flexible circuit board is used in the aerospace, The method is widely applied to the fields of military, mobile electronic equipment and the like. However, the production process of the preparation method needs to be treated by a chemical corrosion solvent, so that environmental pollution and operation danger are easily caused, and the production link is complicated, equipment is complex and expensive, and the cost of raw materials is high, so that the product cost is directly increased, and the market competitive advantage is reduced. Therefore, there is a need for a method for manufacturing a circuit board, which can reduce the pollution and danger caused by the prior art and reduce the manufacturing cost of the circuit board, and has a circuit board with high heat dissipation performance to improve the industrial competitive advantage.
An effective solution to the problems in the related art has not been proposed yet.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high-accuracy single face circuit board to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high-accuracy single face circuit board, includes line board main part, master control IC, metal forming, circuit board mounting hole, louvre and heat-conducting layer, line board main part is formed by the combination of a plurality of small-size line boards, be equipped with in the middle of the line board main part master control IC, master control IC all is equipped with all around the circuit board mounting hole, circuit board mounting hole one side is equipped with the louvre, line board main part surface is equipped with the metal forming, line board main part inboard is equipped with the heat-conducting layer, line board main part distributes all around has the pipe position hole.
Furthermore, the master control IC is connected with the wire board main body in a welding mode, and the distance between welding pins is smaller than 0.2 mm.
Furthermore, the thickness of the heat conducting layer is 0.5mm, and brominated epoxy resin is selected as the material of the heat conducting layer.
Further, the inboard of line board main part is equipped with the recess, the diameter of pipe position hole is 2.0 mm.
Further, the metal foil is made of an aluminum material.
Compared with the prior art, the utility model discloses following beneficial effect has:
(1) the utility model relates to a high-accuracy single face circuit board reaches electromagnetic shield's function through the metal forming, because the metal forming has low surface oxygen characteristic, can adhere to with various different substrates, like metal, insulating material etc. possess the temperature application range of broad. The metal foil is mainly applied to electromagnetic shielding and static resistance, the metal foil is arranged on the surface of the circuit board, the metal base material is combined, excellent conductivity is achieved, heat dissipation holes and heat conduction layers are formed in the circuit board, heat dissipation can be conducted timely, and the circuit board is protected to be safe to use.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a high-precision single-sided circuit board according to an embodiment of the present invention.
Reference numerals:
1. a wire plate body; 2. a groove; 3. a master control IC; 4. a metal foil; 5. a circuit board mounting hole; 6. heat dissipation holes; 7. a heat conductive layer; 8. and (4) pipe position holes.
Detailed Description
The following, with reference to the drawings and the detailed description, further description of the present invention is made:
please refer to fig. 1, according to the embodiment of the present invention, a high-precision single-sided circuit board includes a circuit board main body 1, a main control IC3, a metal foil 4, a circuit board mounting hole 5, a heat dissipation hole 6 and a heat conduction layer 7, wherein the circuit board main body 1 is formed by combining a plurality of small circuit boards, the main control IC3 is arranged in the middle of the circuit board main body 1, the main control IC3 is provided with the circuit board mounting hole 5 all around, the heat dissipation hole 6 is arranged on one side of the circuit board mounting hole 5, the metal foil 4 is arranged on the surface of the circuit board main body 1, the heat conduction layer 7 is arranged on the inner side of the circuit board main body 1, and pipe holes.
Through the above technical scheme of the utility model, master control IC3 adopts the welded mode to be connected with line board main part 1, and the welding position interval is less than below 0.2mm, the thickness of heat-conducting layer 7 is 0.5mm, brominated epoxy is chooseed for use to heat-conducting layer 7 material, 1 inboard of line board main part is equipped with recess 2, the diameter in pipe position hole 8 is 2.0mm, metal forming 4 adopts the aluminum material.
When specifically using, the utility model relates to a high accuracy single face circuit board reaches electromagnetic shield's function through metal forming 4, because metal forming 4 has low surface oxygen characteristic, can adhere to with various different substrates, like metal, insulating material etc. possess the temperature application range of broad. The metal foil heat dissipation device is mainly applied to electromagnetic shielding and static electricity resistance, the metal foil 4 is arranged on the surface of a circuit board, a metal base material is combined, excellent conductivity is achieved, the heat dissipation holes 6 and the heat conduction layer 7 are formed in the circuit board, heat dissipation can be conducted timely, and the circuit board is protected to be safe to use.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. The utility model provides a high-accuracy single face circuit board, its characterized in that, includes line board main part (1), master control IC (3), foil (4), circuit board mounting hole (5), louvre (6) and heat-conducting layer (7), line board main part (1) is formed by a plurality of small-size line board combinations, be equipped with in the middle of line board main part (1) master control IC (3), master control IC (3) all are equipped with all around circuit board mounting hole (5), circuit board mounting hole (5) one side is equipped with louvre (6), line board main part (1) surface is equipped with foil (4), line board main part (1) inboard is equipped with heat-conducting layer (7), line board main part (1) distributes all around has pipe position hole (8).
2. A high-precision single-sided circuit board according to claim 1, wherein the main control IC (3) is connected with the circuit board main body (1) by soldering, and the pitch of the soldering pins is less than 0.2 mm.
3. A high-precision single-sided circuit board according to claim 1, wherein the thickness of the heat conducting layer (7) is 0.5mm, and the material of the heat conducting layer (7) is brominated epoxy resin.
4. A high-precision single-sided wiring board according to claim 1, wherein the wiring board body (1) is provided with a recess (2) inside, and the diameter of the pipe position hole (8) is 2.0 mm.
5. A high-precision single-sided circuit board according to claim 1, wherein the metal foil (4) is made of aluminum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921736301.5U CN211378345U (en) | 2019-10-16 | 2019-10-16 | High-precision single-sided circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921736301.5U CN211378345U (en) | 2019-10-16 | 2019-10-16 | High-precision single-sided circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211378345U true CN211378345U (en) | 2020-08-28 |
Family
ID=72154662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921736301.5U Active CN211378345U (en) | 2019-10-16 | 2019-10-16 | High-precision single-sided circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211378345U (en) |
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2019
- 2019-10-16 CN CN201921736301.5U patent/CN211378345U/en active Active
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