CN219459368U - Electromagnetic interference shielding device - Google Patents
Electromagnetic interference shielding device Download PDFInfo
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- CN219459368U CN219459368U CN202223260331.8U CN202223260331U CN219459368U CN 219459368 U CN219459368 U CN 219459368U CN 202223260331 U CN202223260331 U CN 202223260331U CN 219459368 U CN219459368 U CN 219459368U
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- shielding
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- speed signal
- electromagnetic interference
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
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Abstract
The embodiment of the utility model provides an electromagnetic interference shielding device. The electromagnetic interference shielding device comprises a metal shell and a printed circuit board, wherein the printed circuit board is arranged in the metal shell and comprises at least one substrate and a plurality of high-speed signal wires arranged on the substrate. The shielding wiring is arranged at the edge of one side of the substrate close to the metal shell, is close to the side edge of one side of the metal shell, and is adhered to and electrically connected with the metal shell. The shielding wiring is arranged on the outer side of the high-speed signal wire and is electrically connected with the metal shell, so that the problem of interference such as radiation and the like between the high-speed signal wires is prevented, and the anti-interference capability, the signal transmission effect and the comprehensive performance of devices of the electronic product are effectively improved.
Description
Technical Field
The utility model relates to the technical field of printed circuit boards in the electronic product industry, in particular to an electromagnetic interference shielding device.
Background
With the wide application of electronic products in various fields, people have put higher demands on the performance and the use requirements of each electronic product.
In the prior art, the electronic product can make life more convenient and richer. Meanwhile, along with the higher and higher integration of electronic products, the circuit design in the electronic products is also miniaturized. As for the display panel, the printed circuit board inside the display panel thereof also becomes smaller and lighter. As their size becomes smaller, there is a need to arrange more, denser, and various different signal traces on smaller size printed circuit boards. Because the signal wires are densely distributed, electromagnetic interference is easy to occur between different signal wires, such as various interference problems of conduction interference, radiation interference and the like can occur when an electronic element works, and then the transmission effect is not ideal in the process of transmitting data signals, even the display panel cannot work normally due to interference, and the comprehensive performance of the display panel is reduced.
In summary, in the electronic product prepared in the prior art, there is a problem of mutual interference between different signal lines on the printed circuit board, so that the signal transmission effect cannot be reduced, and the comprehensive performance of the display panel is reduced.
Disclosure of Invention
The embodiment of the utility model provides an electromagnetic interference shielding device which is used for effectively shielding interference in an electronic product and improving the signal transmission effect and the comprehensive performance of devices.
In order to solve the above technical problems, the present utility model provides an electromagnetic interference shielding device, including:
a metal housing;
the printed circuit board is arranged in the metal shell and comprises at least one substrate and a plurality of high-speed signal wires arranged on the substrate;
the shielding wiring is further arranged at the edge of the substrate, which is close to one side of the metal shell, and is close to the side edge of one side of the metal shell, and is adhered to and electrically connected with the metal shell.
According to an embodiment of the present utility model, the side edge of the shielding wire is flush with the side edge of the substrate on the same side, and the side edge of the shielding wire is attached to the inner wall of the metal housing.
According to an embodiment of the present utility model, the shielding trace and the high-speed signal line are disposed in parallel on a surface of the substrate, and the shielding trace and the high-speed signal line are disposed along a first direction.
According to an embodiment of the present utility model, a distance from the shielding trace to the substrate side edge is smaller than a distance from the high-speed signal line to the substrate side edge, and a trace width of the shielding trace is larger than a trace width of the high-speed signal line.
According to an embodiment of the present utility model, a trace width of the shielding trace is twice a trace width of the high-speed signal line.
According to an embodiment of the present utility model, a distance between the high-speed signal line and the substrate side edge is greater than twice a thickness value of the substrate, and a distance between the high-speed signal line and the substrate side edge is less than twenty times the thickness value of the substrate.
According to an embodiment of the present utility model, a trace width of the shielding trace is less than or equal to twice the thickness value of the substrate.
According to an embodiment of the present utility model, the printed circuit board further includes:
the first substrate, the first shielding wiring, the second substrate and the second shielding wiring;
the first shielding wire is arranged on the first substrate, the second substrate is arranged on the first shielding wire, the second shielding wire is arranged on the second substrate, the shielding wire is arranged on the surface of one side of the first substrate, which is far away from the second substrate, the shielding wire, the first shielding wire and the second shielding wire are all arranged on one side, which is close to the metal shell, and the side, which is close to one side of the metal shell, of the shielding wire, the first shielding wire and the second shielding wire are electrically connected with the metal shell.
According to an embodiment of the utility model, the semiconductor device further comprises a via hole and a metal connecting piece arranged in the via hole;
the metal shell is electrically connected with the shielding wiring, the first shielding wiring and the second shielding wiring through the metal connecting piece.
According to an embodiment of the present utility model, the material of the shielding trace is any one of metallic copper, metallic iron and alloy.
The embodiment of the utility model has the beneficial effects that: compared with the prior art, the embodiment of the utility model provides an electromagnetic interference shielding device. The electromagnetic interference shielding device comprises a metal shell and a printed circuit board, wherein the printed circuit board is arranged in the metal shell and comprises at least one substrate and a plurality of high-speed signal wires arranged on the substrate. The shielding wiring is arranged at the edge of one side of the substrate close to the metal shell, is close to the side edge of one side of the metal shell, and is adhered to and electrically connected with the metal shell. In the embodiment of the application, the shielding wiring is arranged on the outer side of the high-speed signal wire and is electrically connected with the metal shell, so that the problem of interference such as radiation and the like between the high-speed signal wires is prevented, and the anti-interference capability, the signal transmission effect and the comprehensive performance of devices of the electronic product are effectively improved.
Drawings
In order to more clearly illustrate the embodiments or the technical solutions in the prior art, the following description will briefly introduce the drawings that are required to be used in the embodiments or the description of the prior art, it is obvious that the drawings in the following description are only some embodiments of the application, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an electromagnetic interference shielding device according to an embodiment of the present application;
FIG. 2 is a schematic illustration of shielding provided in an embodiment of the present application;
fig. 3 is a schematic layout diagram of a substrate and signal lines according to an embodiment of the present disclosure;
fig. 4 is a schematic layout diagram of a second substrate and a shielding trace provided in an embodiment of the present application;
FIG. 5 is a schematic structural diagram of another electromagnetic interference shielding device according to an embodiment of the present disclosure;
fig. 6 is a schematic diagram of simulation effects of an electromagnetic interference shielding device and a shielding device in the prior art provided in an embodiment of the present application.
Detailed Description
The following disclosure provides various embodiments or examples of implementing various features of the utility model in conjunction with the accompanying drawings in the examples of the utility model. In order to simplify the present disclosure, components and arrangements of specific examples are described below. In addition, the examples of the various specific processes and materials provided herein are those of ordinary skill in the art and will recognize other process applications. All other embodiments obtained by those skilled in the art without making any inventive effort are within the scope of the present utility model.
In the description of the present utility model, it is to be understood that terms such as those skilled in the art will understand that all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs unless defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the prior art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
Along with the development of electronic devices such as electronic products, people put forward higher requirements on the use performance and quality of the electronic products.
The components in the electronic product are highly integrated on the same circuit board, such as a plurality of signal wires are integrated on the same flexible circuit board, so that the size of the electronic product device is reduced, and the device is thinned. However, due to high integration, mutual interference is easy to occur between different signal wires and components, and the signal transmission effect is not ideal, which is not beneficial to further improving the comprehensive performance of electronic products.
The embodiment of the application provides an electromagnetic interference shielding device to effectively improve the anti-interference capability of devices such as electronic products, improve the signal transmission effect and ensure the comprehensive performance of the devices.
As shown in fig. 1, fig. 1 is a schematic structural diagram of an electromagnetic interference shielding device according to an embodiment of the present application. The electromagnetic shielding device includes a metal case 121 and a printed circuit board 120 disposed inside the metal case 121.
Referring to fig. 1 in detail, when the printed circuit board 120 is disposed, the printed circuit board 120 is formed by stacking a plurality of different film layers. The printed circuit board includes at least one substrate 103 and a plurality of different signal lines disposed on the substrate 103.
In this embodiment, the printed circuit board 120 may include a first substrate 101, a first shielding trace 111, a second substrate 102, a second shielding trace 112, a substrate 103, a shielding trace 113, and a high-speed signal line. In the following embodiments, the printed circuit board 120 is formed by the different film layers and traces, and optionally, other number of substrates may be provided, which will not be described herein.
Specifically, the high-speed signal line is described by taking the first high-speed signal line 131 and the second high-speed signal line 132 as examples. Meanwhile, the first shielding trace 111 is disposed on the first substrate 101, the second substrate 102 is disposed on the first shielding trace 111, the second shielding trace 112 is disposed on the second substrate 102, and the substrate 103 is disposed on the second shielding trace 112.
Further, the first high-speed signal line 131 and the second high-speed signal line 132 are disposed on the substrate 103, and the shielding trace 113 is disposed on the substrate 103. In this embodiment, the first high-speed signal line 131, the second high-speed signal line 132 and the shielding trace 113 are disposed on the surface of the substrate 103, and when the electronic product is working normally, the corresponding signals can be transmitted through the first high-speed signal line 131 and the second high-speed signal line 132. The first high-speed signal line 131 and the second high-speed signal line 132 may be differential signal lines.
In this embodiment, the first high-speed signal line 131 and the second high-speed signal line 132 are disposed in parallel, and are disposed in parallel with the shielding trace 113 at the same time, and the trace width of the shielding trace 113 is greater than the trace widths of the first high-speed signal line 131 and the second high-speed signal line 132. Meanwhile, the first high-speed signal line 131, the second high-speed signal line 132 and the shielding trace 113 are all disposed along a first direction, and the first direction may be a width direction or a length direction of the printed circuit board.
Further, the shielding trace 113 is disposed at an edge of the substrate 103 near the metal housing 121. Specifically, if the shielding trace 113 is disposed at the right edge of the substrate 103, and the side edge of the shielding trace 113 is disposed flush with the side edge of the substrate 103, or the side edge of the shielding trace 113 exceeds the side edge of the substrate 103. In this embodiment, the side edge of the shielding trace 113 near the side of the metal housing 121 is attached to the inner sidewall of the metal housing 121 and electrically connected thereto.
As shown in fig. 2, fig. 2 is a schematic diagram of shielding provided in an embodiment of the present application. When the printed circuit board is operating normally, the reciprocating charge in the high speed signal lines generates corresponding electromagnetic fields in the printed circuit board 120 section, which are related to time and space distance. For example, assume that the point charge Q is shifted by an amount s=asin2pi ft in the X-axis direction. The magnitude of the electromagnetic field can be changed by changing the magnitude of R according to coulomb law e=kq/R2, with the motion of the interval [ -a, a ] exactly at the origin of coordinates when t=0. In this embodiment of the present application, since the shielding trace 113 is disposed at the edge, the shielding trace 113 may cut off R, so that R becomes infinite, and the higher the speed signal line thereof, the smaller the electromagnetic radiation from the outside. Thereby achieving the effects of anti-interference and radiation shielding.
Further, referring to fig. 1 in detail, when the high-speed signal line 13 is provided, the distance between the high-speed signal line 13 and the metal housing 121 is set to H. Meanwhile, the thickness of its corresponding substrate 103 is set to D. In order to improve the shielding effect, in the embodiment of the present application, the distance between the high-speed signal wire 13 and the metal housing 121 is greater than the distance between the shielding wire 113 and the metal housing 121. I.e. the shield trace 113 is arranged on the side close to the metal housing.
Meanwhile, the trace width of the shielding trace 113 is larger than the trace width of the high-speed signal trace 13, for example, the trace width of the shielding trace 113 is larger than the trace widths of the first and second high-speed signal traces 132. Optionally, the trace width of the shielding trace 113 is twice the trace width of the second high-speed signal trace 132.
Further, in the embodiment of the present application, the distance H between the second high-speed signal line 132 and the edge of the substrate 103 is greater than twice the thickness D of the substrate, and the distance H between the second high-speed signal line 132 and the edge of the substrate 103 is less than twenty times the thickness D of the substrate 103. Meanwhile, the track width of the shielding track 113 is less than or equal to twice the thickness D value of the substrate 103. Thereby ensuring the shielding effect of the shielding wiring 113 on each high-speed signal line. In the embodiment of the application, 70% of the electric field can be limited in the ground plane, so that the external radiation interference of the plate edge is reduced, and the comprehensive performance of the plate edge is improved.
In this embodiment, when the first substrate 101 and the corresponding signal lines are disposed, each signal line on the surface of the first substrate 101 far from the second substrate 102 may have the same wiring structure as the wiring structure on the upper surface of the substrate 103. And will not be described in detail here.
Meanwhile, when each substrate between the first substrate 101 and the substrate 103 and the corresponding shielding trace are disposed, one side edges of the first shielding trace 111, the second shielding trace 112 and the shielding trace 113 may be disposed flush with each other, and simultaneously attached to and electrically connected with the inner side wall of the metal housing 121, so that each shielding trace is conducted with the metal housing and the shielding effect thereof is enlarged.
In this embodiment of the present application, each shielding trace may be made of a metal material, such as any one of copper foil, copper, iron, and alloy, and each of the shielding traces is made of GND ground.
Further, the first shielding trace 111, the second shielding trace 112 and the shielding trace 113 may be set to have different widths, for example, the width of the first shielding trace 111 is the same as the width of the second shielding trace 112, and is larger than the upper shielding trace 113. The widths of the first shielding trace 111 and the second shielding trace 112 may be set according to the requirements of different products, which will not be described herein.
As shown in fig. 3 and fig. 4, fig. 3 is a schematic layout diagram of a substrate and signal lines according to an embodiment of the present application. Fig. 4 is a schematic layout diagram of a second substrate and a shielding trace provided in an embodiment of the present application. The first high-speed signal lines 131, the second high-speed signal lines 132, and the shielding traces 113 are disposed on the surface of the substrate 103. Similarly, the second shielding trace 112 is tiled on the second substrate 102, and the side surfaces 151 corresponding to the side edges of the second shielding trace and the shielding trace 113 are attached to the inner side edge of the metal housing and electrically connected, so as to effectively improve the shielding effect of the electromagnetic shielding device.
In this embodiment, the shielding trace may be further configured as a grid trace, meanwhile, the first substrate 101 may be configured as a semi-cured board (PP 2 board) of the printed circuit board, the second substrate 102 may be configured as a core board (core board) of the printed circuit board, and the substrate 103 may be configured as the other half cured board (PP 1 board) of the printed circuit board.
Further, as shown in fig. 5, fig. 5 is a schematic structural diagram of another electromagnetic interference shielding device provided in an embodiment of the present application. In combination with the structure in fig. 1. In this embodiment, the emi shielding apparatus further includes a via 888 and a metal connector 333 disposed within the via 888. In the embodiment of the present application, the metal connector 333 is exemplified by a screw, and the via hole is exemplified by a screw hole.
The metal connection member 333 penetrates through the above layers and the corresponding shielding wires, and meanwhile, the metal connection member 333 is electrically connected with the shielding wires 113, the first shielding wires 111 and the second shielding wires 112, and the upper portion of the metal connection member 333 can be connected with the metal housing 121, so as to further increase the electrical connection effect between different shielding wires and the metal housing 121 and ensure the shielding and anti-interference effects on electromagnetic fields.
Further, as shown in fig. 6, fig. 6 is a schematic diagram illustrating simulation effects of the electromagnetic interference shielding device provided in the embodiment of the present application and the shielding device in the prior art. Wherein, a is a device in the prior art, and b is a device provided in the embodiment of the present application. It is clear that the radiation of the corresponding far field electric and magnetic fields in the b plot is significantly smaller than the radiation values in the a plot. Therefore, by arranging the electromagnetic interference shielding device provided by the embodiment of the application, the electromagnetic radiation is effectively reduced, and the shielding effect of the electromagnetic interference shielding device on various interferences is effectively improved. Thereby improving the signal transmission effect of different electronic products and the stability of devices.
In this embodiment of the application, through set up a shielding in the side department of printed circuit board and walk the line, and the side that should shield to walk the line corresponds is laminated and electric connection with this metal casing to lead to with the metal casing through this shielding and walk the line, and then reach electromagnetic shield's effect. In the embodiment of the application, the problems of interference among different signal wires in the middle circuit board with smaller size and external electromagnetic interference can be effectively solved, and the stability and the comprehensive performance of device signal transmission are improved.
In summary, the foregoing describes an electromagnetic interference shielding device provided by the embodiments of the present utility model in detail, and specific examples are applied to illustrate the principles and embodiments of the present utility model, and the description of the foregoing embodiments is only for helping to understand the technical solution and core ideas of the present utility model; although the present utility model has been described with reference to the preferred embodiments, it should be understood that the utility model is not limited to the particular embodiments described, but can be modified and altered by persons skilled in the art without departing from the spirit and scope of the utility model.
Claims (10)
1. An electromagnetic interference shielding device, comprising:
a metal housing;
the printed circuit board is arranged in the metal shell and comprises at least one substrate and a plurality of high-speed signal wires arranged on the substrate;
the shielding wiring is further arranged at the edge of the substrate, which is close to one side of the metal shell, and is close to the side edge of one side of the metal shell, and is adhered to and electrically connected with the metal shell.
2. The electromagnetic interference shielding device according to claim 1, wherein a side edge of the shielding wire is flush with a side edge of the substrate on the same side, and the side edge of the shielding wire is attached to an inner wall of the metal housing.
3. The electromagnetic interference shielding device according to claim 1, wherein the shielding trace and the high-speed signal line are disposed in parallel on a side surface of the substrate, and the shielding trace and the high-speed signal line are both disposed along a first direction.
4. The electromagnetic interference shielding device according to claim 3, wherein a distance from the shielding trace to the substrate side edge is smaller than a distance from the high-speed signal line to the substrate side edge, and a trace width of the shielding trace is larger than a trace width of the high-speed signal line.
5. The electromagnetic interference shielding device of claim 4, wherein the shielded trace has a trace width twice the trace width of the high-speed signal line.
6. The electromagnetic interference shielding device according to claim 1, wherein a distance between the high-speed signal line and the substrate-side edge is greater than twice a thickness value of the substrate, and a distance between the high-speed signal line and the substrate-side edge is less than twenty times the thickness value of the substrate.
7. The electromagnetic interference shielding device of claim 6, wherein a trace width of the shielding trace is less than or equal to twice the thickness value of the substrate.
8. The electromagnetic interference shielding device of claim 1, wherein the printed circuit board further comprises:
the first substrate, the first shielding wiring, the second substrate and the second shielding wiring;
the first shielding wire is arranged on the first substrate, the second substrate is arranged on the first shielding wire, the second shielding wire is arranged on the second substrate, the shielding wire is arranged on the surface of one side of the first substrate, which is far away from the second substrate, the shielding wire, the first shielding wire and the second shielding wire are all arranged on one side, which is close to the metal shell, and the side, which is close to one side of the metal shell, of the shielding wire, the first shielding wire and the second shielding wire are electrically connected with the metal shell.
9. The electromagnetic interference shielding device of claim 8, further comprising a via and a metal connector disposed within the via;
the metal shell is electrically connected with the shielding wiring, the first shielding wiring and the second shielding wiring through the metal connecting piece.
10. The electromagnetic interference shielding device according to claim 1, wherein the material of the shielding trace is any one of a metal copper foil, a metal iron, and an alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223260331.8U CN219459368U (en) | 2022-12-05 | 2022-12-05 | Electromagnetic interference shielding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223260331.8U CN219459368U (en) | 2022-12-05 | 2022-12-05 | Electromagnetic interference shielding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219459368U true CN219459368U (en) | 2023-08-01 |
Family
ID=87416855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223260331.8U Active CN219459368U (en) | 2022-12-05 | 2022-12-05 | Electromagnetic interference shielding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219459368U (en) |
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2022
- 2022-12-05 CN CN202223260331.8U patent/CN219459368U/en active Active
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