JP5066718B2 - Manufacturing method of flexible printed wiring board - Google Patents

Description

  The present invention relates to a method for manufacturing a flexible printed wiring board.

  In recent years, various flexible printed wiring boards have been used in the field of electronic devices due to demands for smaller and lighter electronic devices. Generally as such a flexible printed wiring board, the flexible printed wiring board provided with the base material used as a base and the conductor formed by the copper foil etc. which were laminated | stacked on the surface of the said base material is used.

  In addition, when this flexible printed wiring board is used in an electronic device such as a liquid crystal panel, generally, the connecting terminal portion formed of a conductor by an anisotropic conductive film or soldering is used as a conductor of the electronic device that is a connected member. It is configured to connect to the pattern. In addition, since the flexible printed wiring board has flexibility, in order to improve the strength of the connection terminal portion when connecting the connection terminal portion to the conductor pattern of the electronic device and prevent bending or bending, for example, And what laminated | stacked and provided the reinforcement board as a reinforcement member on the base material is used.

In addition, depending on the use of the flexible printed wiring board, it is necessary to externally process the flexible printed wiring board. As this processing method, generally, a laminated body in which a reinforcing plate is laminated on a base material is pressed. A method of punching using a mold is employed (for example, see Patent Document 1).
JP 2003-211613 A

  However, when the laminate in which the conductor is laminated on the base material is integrally punched and sheared using the above-described press mold, burrs are generated on the base material and the shearing surface of the conductor. . If it does so, when connecting the connection terminal part of a flexible printed wiring board to the conductor pattern of an electronic device, the problem that the connection became difficult by the burr | flash which generate | occur | produced at the time of a process had arisen. In particular, when the reinforcing plate is laminated on the base material, when the stamping is integrally performed using the above-described press die and the reinforcing plate is sheared, the shear surface of the reinforcing plate Generation | occurrence | production became remarkable and the disadvantage that the connection became difficult by the said burr | flash had arisen. Moreover, in order to avoid such an inconvenience, a removal operation for removing the generated burrs is necessary, which causes a problem that productivity of the flexible printed wiring board is lowered. Furthermore, the generated burrs may scatter and adhere to the conductors, causing a short circuit between the conductors, resulting in a decrease in yield of the flexible printed wiring board.

  Therefore, the present invention has been made in view of the above problems, and when performing a punching process on a laminated body in which a conductor is laminated on a base material, in particular, a laminated body in which a reinforcing plate is laminated, An object of the present invention is to provide a method for producing a flexible printed wiring board capable of effectively suppressing the generation of burrs on a sheared surface, and suppressing the decrease in productivity of the flexible printed wiring board and improving the yield. .

To achieve the above object, the invention according to claim 1, on a substrate, comprising the steps of conductors and reinforcing plate to produce a laminate which is laminated, a part of the shear portion of the laminate base material Forming a slit that penetrates the conductor and the reinforcing plate by punching with a blade mold , and after the slit forming step, the laminated body is integrally punched at the shearing portion, thereby forming the laminated body including the reinforcing plate. It is a manufacturing method of the flexible printed wiring board characterized by including the punching process to shear at least.

According to this configuration, the slit that penetrates the base material, the conductor, and the reinforcing plate formed in the shearing portion can disperse the shearing stress on the shearing surface of the laminate, and thus the laminate including the reinforcing plate It is possible to effectively suppress the generation of burrs on the shear surface of the body. As a result, for example, when connecting a connection terminal portion formed on a conductor to a conductor pattern of an electronic device that is a member to be connected, unlike the above-described conventional technique, the connection is difficult due to burrs generated during processing. Can be avoided. Further, unlike the above-described prior art, the removal work for removing the generated burrs is not necessary, and the productivity of the flexible printed wiring board can be improved. Furthermore, since it is possible to avoid the inconvenience that the generated burrs are scattered and adhere to the conductors to cause a short circuit between the conductors, the yield of the flexible printed wiring board can be improved.

Invention of Claim 2 is a manufacturing method of the flexible printed wiring board of Claim 1 , Comprising: After manufacturing a laminated body before a slit formation process, it further has the process of coat | covering a conductor with solder In the slit forming step, a slit penetrating the base material, the conductor, the reinforcing plate, and the solder is formed, and in the punching step, the solder is sheared together with the laminate including the reinforcing plate .

According to this configuration, the shearing surface of the solder can be dispersed on the shearing surface of the solder by the slits penetrating the base material, the conductor, the reinforcing plate, and the solder formed in the shearing portion. It is possible to effectively suppress the occurrence of sagging. As a result, for example, when connecting a connection terminal portion formed on a conductor to a conductor pattern of an electronic device that is a member to be connected via solder, the solder is scattered on the shear surface of the solder due to solder sag. Can be effectively suppressed, and the connection between the connection terminal portion and the conductor pattern of the electronic device is facilitated.

The invention of claim 3 is a method of manufacturing a flexible printed wiring board according to claim 1 or claim 2, slit, and having a width of 0.3 to 5.0 mm. According to this configuration, it is possible to improve the effect of dispersing the shear stress when the laminate is integrally punched to shear the reinforcing plate or the reinforcing plate and the solder.

Invention of Claim 4 is a manufacturing method of the flexible printed wiring board as described in any one of Claim 1 thru | or 3 , Comprising: A slit is a substantially intermediate | middle of a shearing part in the surface direction of a laminated body. It forms in a position, It is characterized by the above-mentioned.

According to this configuration, since the shear stress can be evenly distributed on the shearing surface of the reinforcing plate, the generation of burrs on the shearing surface can be more effectively suppressed. Further, when the solder is provided, the shear stress can be evenly distributed on the shear surface of the solder, so that the occurrence of sagging on the shear surface can be further effectively suppressed.
Invention of Claim 5 is a manufacturing method of the flexible printed wiring board as described in any one of Claim 1 thru | or 4, Comprising: By providing the insulating layer which covers a conductor before a punching process, The method further includes the step of providing the laminated body with a connection terminal portion where a conductor is exposed without forming an insulating layer, and in the punching step, the connection terminal portion is used as a shearing portion, and the laminate is integrally punched at the connection terminal portion. Features.

According to the present invention, it is possible to effectively suppress the generation of burrs on the shearing surface of the laminate including the reinforcing plate by the slit formed in the shearing part. For example, the connection terminal part formed in the conductor When connecting to a conductor pattern of an electronic device as a connected member, it is possible to avoid the inconvenience that the connection becomes difficult. Moreover, productivity of a flexible printed wiring board can be improved. Furthermore, the yield of flexible printed wiring boards can be improved.

  Hereinafter, a preferred embodiment of the present invention will be described. FIG. 1 is a cross-sectional view illustrating a schematic configuration of a flexible printed wiring board according to an embodiment of the present invention. As shown in FIG. 1, this flexible printed wiring board 1 is a so-called single-sided board in which a conductor 4 is provided on one side of an insulating base 2 formed of a flexible resin film with an adhesive layer 3 interposed therebetween. Then, a cover lay film 7 as an insulating layer is provided on one side so as to cover the conductor 4. Here, the “insulating layer” means a material for protecting the conductor 4 and includes a cover lay film 7 and a cover coat described later. As shown in FIG. 1, the cover lay film 7 is composed of an adhesive layer 9 laminated on the conductor 4 and a resin film 10 laminated thereon so as to cover the conductor 4.

  Further, as shown in FIG. 1, the flexible printed wiring board 1 has an insulating layer for electrically connecting a conductor 4 to a conductor pattern (not shown) of an electronic device which is a connected member such as a liquid crystal panel. A connection terminal portion 8 that is exposed to the outside without forming a certain coverlay film 7 is provided.

  As shown in FIG. 1, the flexible printed wiring board 1 is provided with a reinforcing plate 13 on one side of the base material 2 with an adhesive layer 12 interposed therebetween. The reinforcing plate 13 is for improving the strength of the flexible printed wiring board 1 having flexibility. As the reinforcing plate 13, one having excellent mechanical strength is used, and for example, glass epoxy resin, polyester resin, polyimide resin, and metals such as aluminum and stainless steel are preferably used.

  As a resin film which comprises the base material 2, what consists of a resin material excellent in the softness | flexibility is used. As the resin film, for example, any resin film that is versatile for flexible printed wiring boards, such as a polyester film, can be used. In addition, in particular, it is preferable to have high heat resistance and mechanical strength in addition to flexibility. Examples of such resin films include polyamide resin films, polyimide resins such as polyimide and polyamideimide, and the like. Films, heat-resistant polyester films, polyethylene naphthalates and the like are preferably used. In addition, as thickness of the base material 2, 10 micrometers-150 micrometers are preferable. If the thickness is less than 10 μm, sufficient mechanical strength may not be obtained, and if it is greater than 150 μm, the flexibility of the flexible printed wiring board 1 may be reduced. Moreover, as resin which comprises the resin film 10, the thing similar to the resin material which comprises the above-mentioned base material 2 can be used conveniently.

  As the adhesive constituting the adhesive layers 3, 9, and 12, those having excellent flexibility and heat resistance are preferable. Examples of such an adhesive include nylon, epoxy resin, butyral resin, and acrylic resin. And various resin adhesives. Further, ceramic fillers and rubber fillers can be dispersed in these adhesive resins.

  Moreover, copper foil is used suitably as metal foil which comprises the conductor 4 which has a predetermined conductor pattern. Moreover, the conductor 4 which has a predetermined conductor pattern is formed by etching and processing this metal foil by a conventional method.

  Next, an example of the manufacturing method of the flexible printed wiring board in embodiment of this invention is demonstrated. As a manufacturing process of the flexible printed wiring board 1, first, as shown in FIG. 2A, a laminated body in which the conductor 4 is laminated on the surface of the base material 2 via the adhesive layer 3 is produced. More specifically, an adhesive layer 3 is laminated on one side of the base material 2 formed of a flexible resin film, and then a metal foil such as a copper foil laminated via the adhesive layer 3 is used. Then, exposure and etching are performed by a conventional method to form a conductor 4 having a predetermined conductor pattern and having a connection terminal portion 8 formed thereon.

  Next, as shown in FIG. 2B, the resin film 10 with the adhesive layer 9 is laminated except for the connection terminal portion 8 formed by the conductor 4, and the coverlay film 7 is bonded. Thus, the cover lay film 7 is laminated on the surface of the conductor 4.

  Next, as shown in FIG. 2C, the rigidity of the flexible printed wiring board 1 is increased via an adhesive layer 12 on the surface of the substrate 2 opposite to the surface on which the conductor 4 is provided. The laminated body 1a in which the conductor 4 on which the connection terminal portion 8 is formed and the reinforcing plate 13 are laminated on the base material 2 is produced.

  And the flexible printed wiring board 1 shown in FIG. 1 is obtained by punching the laminate 1a along the outer shape (that is, the outer periphery 18a of the shearing portion 18 shown in FIG. 2D) using a press die. Manufactured.

  Here, in this embodiment, when the laminated body 1a including the reinforcing plate 13 is integrally punched in the shearing portion 18, first, the slit 30 is formed in the above-described shearing portion 18, and then the press mold is used. It is characterized in that the reinforcing plate 13 is sheared by integrally punching the laminated body 1a at the shearing portion 18.

  With such a configuration, when the laminated body 1a provided with the reinforcing plate 13 is integrally punched and sheared using a press die, the slits 30 shear the reinforcing plate 13 shown in FIG. It is possible to disperse the shear stress on the surface 13a (that is, a part of the outer periphery 18a of the shearing portion 18). Therefore, the generation of burrs on the shearing surface 13a of the reinforcing plate 13 can be effectively suppressed. As a result, when connecting the connection terminal portion 8 of the flexible printed wiring board 1 to the conductor pattern of the electronic device, unlike the above-described conventional technology, it is possible to avoid the inconvenience that the connection is difficult due to burrs generated during processing. it can. Further, unlike the above-described conventional technique, the removal work for removing the generated burrs is not necessary. Furthermore, it is possible to avoid the disadvantage that the generated burrs are scattered and adhere to the conductor 4 to cause a short circuit between the conductors 4.

  In addition, the slit 30 can be formed by punching with the blade type | mold provided in the press metal mold | die, for example. Further, from the viewpoint of improving the effect of dispersing the shearing stress described above when shearing by punching, the slit 30 is configured to have a predetermined width W as shown in FIG. Is preferred. In addition, the value of this width W is not specifically limited, For example, the said width W can be set to 0.3-5.0 mm.

  Further, from the viewpoint of evenly distributing the shear stress on the shearing surface 13a of the reinforcing plate 13 and more effectively suppressing the generation of burrs on the shearing surface 13a, as shown in FIG. In the surface direction of the laminated body 1a (that is, the direction perpendicular to the thickness direction X of the laminated body 1a shown in FIGS. It is preferable that the intermediate position Z be formed.

According to the present embodiment described above, the following effects can be obtained.
(1) In the manufacturing method of the flexible printed wiring board 1 including the reinforcing plate 13 of the present invention, the step of forming the slit 30 in the shearing portion 18 of the laminate 1a and the punching of the laminate 1a integrally at the shearing portion 18 Thus, the punching process for shearing the reinforcing plate 13 is provided. Accordingly, since the shear stress can be dispersed on the shearing surface 13a of the reinforcing plate 13 by the slit 30, the generation of burrs on the shearing surface 13a of the reinforcing plate 13 can be effectively suppressed. As a result, when connecting the connection terminal portion 8 to the conductor pattern of the electronic device, unlike the above-described conventional technique, it is possible to avoid the inconvenience that the connection is difficult due to burrs generated during processing. Further, unlike the above-described prior art, the removal work for removing the generated burrs is not necessary, and the productivity of the flexible printed wiring board can be improved. Furthermore, since the generated burrs are scattered and adhered to the conductors 4 and a short circuit between the conductors 4 can be avoided, the yield of the flexible printed wiring board 1 can be improved.

  (2) The slit 30 has a predetermined width W. Therefore, when the laminated body 1a provided with the reinforcing plate 13 is integrally punched and sheared, the effect of dispersing the shear stress can be improved.

  (3) In addition, the slit 30 is formed at a substantially intermediate position Z of the shearing portion 18 in the surface direction Y of the laminate 1a. Accordingly, since the shear stress can be evenly distributed on the shear surface 13a of the reinforcing plate 13, the generation of burrs on the shear surface 13a can be further effectively suppressed.

  In addition, this invention is not limited to the said embodiment, A various design change is possible based on the meaning of this invention, and they are not excluded from the scope of the present invention.

  For example, as shown in FIG. 4, the surface of the connection terminal portion 8 may be covered with a plating layer 11 in order to increase connection reliability. The plating layer 11 is preferably a lead-free plating layer in consideration of the environment, and from the viewpoint of preventing a decrease in connection reliability between the connection terminal portion 8 and the conductor pattern of the electronic device. As the plating layer 11 containing no lead, a gold plating layer can be used.

  The plating process on the surface of the conductor 4 is performed by an electroless plating method or an electrolytic plating method. When providing a gold plating layer, first, nickel as a diffusion preventing layer is applied to the exposed surface of the conductor 4. After forming the plating layer, a method of forming a gold plating layer on the surface of the nickel plating layer is employed. Moreover, when using this flexible printed wiring board 1 for electronic devices, such as a liquid crystal panel, it becomes the structure which connects the connection terminal part 8 to the conductor pattern part of an electronic device by anisotropically conductive film or soldering. Yes.

  -Moreover, it is good also as a structure which provides solder on the surface (namely, surface of the connecting terminal part 8) of the conductor 4, and coat | covers the surface of the connecting terminal part 8 with solder. In this case, after manufacturing the laminated body 1a which laminated | stacked the conductor 4 and the reinforcement board 13 in which the connection terminal part 8 was formed demonstrated in above-mentioned FIG.2 (c) on the base material 2, FIG. ), The surface of the connection terminal portion 8 is covered with the solder 20 by pouring the solder 20 from above the cover lay film 7. And as shown in FIG.5 (b), it is flexible by punching the laminated body 1a along the outer periphery 18a of the shearing part 18 using a press die similarly to the above-mentioned FIG.2 (d). The printed wiring board 1 is manufactured. When the solder 20 is provided, similarly to the above-described embodiment, in the step of integrally punching the laminate 1a including the reinforcing plate 13 and the solder 20 in the shearing portion 18, first, the above-described shearing portion is provided. The slit 30 is formed in 18, and then the laminate 1 a is integrally punched at the shearing portion 18 by using a press die, and the reinforcing plate 13 and the solder 20 are sheared, whereby the flexible print shown in FIG. The wiring board 1 is manufactured.

  With this configuration, the slit 30 enables the shear stress to be dispersed on the shearing surface 20a of the solder 20, so that the occurrence of sagging on the shearing surface 20a of the solder 20 can be effectively suppressed. Become. As a result, in addition to the above-described effect (1), when the connection terminal portion 8 is electrically connected to the conductor pattern of the electronic device that is the connected member via the solder 20, the shear surface 20a of the solder 20 In addition, it is possible to effectively suppress the scattering of the solder 20 due to the sagging of the solder 20 and to obtain an effect that the connection between the connection terminal portion 8 and the conductor pattern of the electronic device is facilitated.

  In the case where the solder 20 is provided, a slit 30 having a predetermined width W may be formed. With such a configuration, in addition to the above-described effect (2), when the laminate 1a in which the reinforcing plate 13 and the solder 20 are laminated is integrally punched and sheared, the effect of dispersing the shear stress is obtained. Can be improved. Moreover, it is good also as a structure which forms the slit 30 in the substantially middle position Z of the shearing part 18 in the surface direction Y of the laminated body 1a similarly to the case of the above-mentioned embodiment. With such a configuration, in addition to the above-described effect (3), the shear stress can be evenly distributed on the shearing surface 20a of the solder 20, so that the occurrence of sagging on the shearing surface 20a is more effective. It is possible to obtain an effect that it is possible to suppress it.

  Moreover, it is good also as a structure which surface-treats with respect to the said connecting terminal part 8 from a viewpoint of improving the solderability of the connecting terminal part 8. FIG. For example, the solder 20 may be provided after the plating layer 11 is formed on the connection terminal portion 8.

  -Moreover, it is good also as a structure by which the conductor 4 is directly formed on the base material 2 without the adhesive bond layer 3 interposed. As the method, for example, a method of laminating and bonding a hot melt type resin film, which is the base material of the base material 2, to one side of the metal foil, which is the base material of the conductor 4, under high temperature and high pressure (lamination method) Alternatively, a coating solution containing a resin precursor (monomer, oligomer, prepolymer, etc.) is applied, dried and solidified, and then subjected to a curing reaction as necessary to form the substrate 2 (casting method) Alternatively, for example, a plating method in which a conductive layer is formed on one surface of the substrate 2 by using electroless plating, vacuum deposition, sputtering, or the like, and then the conductor 4 is formed by electrolytic plating may be used.

  In the above embodiment, the cover lay film 7 is used as the insulating layer. However, instead of the cover lay film 7, a cover coat may be used. As this cover coat, for example, a cover resin mainly composed of a polyimide resin formed with a polyimide-based photosensitive cover coat ink is used. In addition, as the polyimide-based photosensitive cover coat ink, for example, a polyimide resin (36 to 37% by weight) as a main component, ethyl benzoate (23 to 24% by weight), triethylene glycol dimethyl ether (35 to 36% by weight). %) And magnesium hydroxide (3.5 to 4% by weight) can be used. Moreover, as a kind of polyimide resin used, an aromatic polyimide polymer etc. are mentioned, for example.

  In the above embodiment, the flexible printed wiring board 1 has been described by taking as an example a so-called single-sided board in which the conductor 4 is provided on one side of the insulating base material 2, but is formed of a flexible resin film. A configuration in which the present invention is applied to a so-called double-sided board in which two layers of conductors are provided on each of both surfaces of the insulating base material, and two layers of insulating layers are provided on both sides to cover the conductors. It is also good.

  In the above embodiment, the laminated body 1a in which the conductor 4 and the reinforcing plate 13 are laminated on the base material 2 has been described. However, in the present invention, only the conductor 4 is laminated on the base material 2. Needless to say, the present invention can also be applied to laminated bodies. In this case, the laminated body which laminated | stacked the conductor 4 on the base material 2 demonstrated through above-mentioned FIG. 2 (a), (b) through the adhesive bond layer 3 is produced, and a coverlay is carried out on the surface of the conductor 4. After laminating the film 7, a flexible printed wiring board is manufactured by punching the laminate along the outer periphery 18 a of the shearing portion 18 using a press die in the same manner as in FIG. The Also in this case, as in the case of the above-described embodiment, in the step of integrally punching the laminated body in which the conductor 4 is laminated on the base material 2 in the shearing part 18, first, the above-described shearing part 18 is formed. The flexible printed wiring board is manufactured by forming the slit 30 and then punching the laminated body integrally at the shearing portion 18 by using a press die to shear the laminated body.

  With such a configuration, as in the case of the above-described embodiment, the slit 30 formed in the shearing portion 18 enables the shear stress to be dispersed on the shearing surface of the laminate. It is possible to effectively suppress the occurrence of burrs on the surface. As a result, similar to the above-described effect (1), when connecting the connection terminal portion 8 to a conductor pattern of an electronic device that is a connected member, unlike the conventional technique, it is difficult to connect due to burrs generated during processing. The inconvenience of becoming can be avoided. Moreover, since the removal operation | work for removing the produced | generated burr | flash becomes unnecessary, productivity of a flexible printed wiring board can be improved. Furthermore, since it is possible to avoid the inconvenience that the generated burrs are scattered and adhere to the conductors to cause a short circuit between the conductors 4, the yield of the flexible printed wiring board can be improved.

  In this case as well, the slit 30 having a predetermined width W may be formed. With such a configuration, similarly to the above-described effect (2), when the laminated body in which the conductor 4 is laminated on the base material 2 is integrally punched and sheared, the shear stress is dispersed. It becomes possible to improve. Moreover, it is good also as a structure which forms the slit 30 in the substantially middle position Z of the shearing part 18 in the surface direction Y of a laminated body similarly to the case of the above-mentioned embodiment. With such a configuration, similarly to the above-described effect (3), the shear stress can be evenly distributed on the shear surface of the laminate in which the conductor 4 is laminated on the substrate 2. It is possible to more effectively suppress the generation of burrs. Similarly to the case of FIGS. 5 and 6 described above, the surface of the conductor 4 (that is, the surface of the connection terminal portion 8) may be provided with solder, and the surface of the connection terminal portion 8 may be covered with the solder. good.

  As a utilization example of this invention, the manufacturing method of a flexible printed wiring board provided with a reinforcement member is mentioned.

It is sectional drawing which shows schematic structure of the flexible printed wiring board in embodiment of this invention. (A)-(d) is sectional drawing for demonstrating the manufacturing process of the flexible printed wiring board based on this invention. FIG. 3 is a partially enlarged view of FIG. 2. It is sectional drawing which shows the modification of the flexible printed wiring board in embodiment of this invention. (A)-(b) is sectional drawing for demonstrating the modification of the manufacturing process of the flexible printed wiring board based on this invention. It is sectional drawing which shows the modification of the flexible printed wiring board in embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Flexible printed wiring board, 1a ... Laminated body, 2 ... Base material, 4 ... Conductor, 7 ... Coverlay film, 8 ... Connection terminal part, 13 ... Reinforcement board, 13a ... Shear surface of a reinforcement board, 18 ... Shear part 18a ... outer periphery of the shearing part, 20 ... solder, 20a ... shearing surface of the solder, 30 ... slit, W ... width of the slit, Y ... surface direction of the laminated body, Z ... intermediate position of the shearing part in the surface direction of the laminated body

Claims (5)

Producing a laminate in which a conductor and a reinforcing plate are laminated on a substrate;
A slit forming step of forming a slit penetrating the base material, the conductor and the reinforcing plate in a part of the shearing portion of the laminate by punching with a blade mold ;
After the slit forming step, a punching step of shearing the laminate including the reinforcing plate by integrally punching the laminate at the shearing portion;
A method for producing a flexible printed wiring board, comprising: Before the slit forming step, after preparing the laminate, further comprising a step of covering the conductor with solder,
In the slit forming step, as the slit, a slit that penetrates the base material, the conductor, the reinforcing plate, and the solder is formed,
In the punching step, the solder is sheared together with the laminate including the reinforcing plate.
The manufacturing method of the flexible printed wiring board of Claim 1 characterized by the above-mentioned. The said slit has a width | variety of 0.3-5.0 mm, The manufacturing method of the flexible printed wiring board of Claim 1 or Claim 2 characterized by the above-mentioned. The method for manufacturing a flexible printed wiring board according to any one of claims 1 to 3, wherein the slit is formed at a substantially intermediate position of the shearing portion in the surface direction of the laminate.   Before the punching step, by providing an insulating layer that covers the conductor, further comprising the step of providing a connection terminal portion in which the conductor is exposed without forming the insulating layer in the laminate,
  In the punching step, the connection terminal portion is the shearing portion, and the laminate is integrally punched at the connection terminal portion.
  The manufacturing method of the flexible printed wiring board as described in any one of Claims 1 thru | or 4 characterized by the above-mentioned.

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