CN110933848A - FPC (Flexible printed Circuit) cable pasting process - Google Patents

FPC (Flexible printed Circuit) cable pasting process Download PDF

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Publication number
CN110933848A
CN110933848A CN201911214589.4A CN201911214589A CN110933848A CN 110933848 A CN110933848 A CN 110933848A CN 201911214589 A CN201911214589 A CN 201911214589A CN 110933848 A CN110933848 A CN 110933848A
Authority
CN
China
Prior art keywords
fpc
copper foil
flat cable
golden finger
pasting process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201911214589.4A
Other languages
Chinese (zh)
Inventor
罗华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN COMPLEX MICRO INTERCONNECTION Co Ltd
Original Assignee
KUNSHAN COMPLEX MICRO INTERCONNECTION Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNSHAN COMPLEX MICRO INTERCONNECTION Co Ltd filed Critical KUNSHAN COMPLEX MICRO INTERCONNECTION Co Ltd
Priority to CN201911214589.4A priority Critical patent/CN110933848A/en
Publication of CN110933848A publication Critical patent/CN110933848A/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention belongs to the technical field of electronic element manufacturing, and relates to an FPC (flexible printed circuit) flat cable pasting process, which comprises the following steps: and attaching a copper foil with the range larger than the outline of the FPC to the back of the golden finger flat cable area of the FPC without trimming, and punching and forming the FPC golden finger flat cable area attached with the copper foil at one time. According to the invention, the forming process is simplified by replacing the copper foil sheet with the FPC golden finger flat cable supporting material, so that the attaching precision is ensured, and the working efficiency is improved.

Description

FPC (Flexible printed Circuit) cable pasting process
Technical Field
The invention relates to the technical field of electronic element manufacturing, in particular to an FPC (flexible printed circuit) flat cable pasting process.
Background
LCD (short for Liquid Crystal Display) Liquid Crystal Display. In order to make the tablet pc lighter and thinner, a gold finger flat cable FPC (flexible circuit board) with an iron piece welded between the LCD and the main board is generally used to replace the conventional connector. As shown in figure 1, the novel connecting piece is characterized in that a stainless steel sheet 2 for compensating the thickness is attached to the reverse side of the part of the FPC 1 with the gold finger 11 flat cable. Because the FPC itself is soft, it needs to be supported by a stainless steel sheet so that the interfaces can be butted.
Because the stainless steel sheet is hard in texture and the FPC is soft, the stainless steel sheet and the FPC are respectively punched and molded and then attached in the prior art. However, the FPC is easily deformed during the manufacturing process, and then the butt connection conduction is affected, so the alignment tolerance is usually designed during the manufacturing of the corresponding stainless steel sheet, that is, the steel sheet is retracted 0.2mm more than the single edge of the gold finger shape of the FPC. However, this manufacturing method is time-consuming and difficult to control the fitting accuracy. And when welding ironware, use the steel sheet, because of FPC edge thickness only 0.1mm is softer, FPC card is when welding positioning jig, and FPC edge can warp, can cause the welding skew, can't reach the customer requirement.
Therefore, a new process is required to solve the above problems.
Disclosure of Invention
The invention mainly aims to provide an FPC (flexible printed circuit) flat cable pasting process which can finish FPC golden finger pasting in a time-saving and high-precision manner.
The invention realizes the purpose through the following technical scheme: a FPC (flexible printed circuit) cable pasting process comprises the following steps: and attaching a copper foil with the range larger than the outline of the FPC to the back of the golden finger flat cable area of the FPC without trimming, and punching and forming the FPC golden finger flat cable area attached with the copper foil at one time.
Specifically, the thickness of the copper foil is at least 0.13 mm.
In particular, the total thickness of the patch part is 0.24 mm.
By adopting the technical scheme, the technical scheme of the invention has the beneficial effects that:
according to the invention, the forming process is simplified by replacing the copper foil sheet with the FPC golden finger flat cable supporting material, so that the attaching precision is ensured, and the working efficiency is improved.
Drawings
FIG. 1 is a partial cross-sectional view of a gold finger tab area;
fig. 2 is a schematic view of the punching principle.
The figures in the drawings represent:
1-FPC, 11-golden finger, 12-golden finger line arrangement area;
2-stainless steel sheet;
3-a copper foil;
4-die cut area.
Detailed Description
The present invention will be described in further detail with reference to specific examples.
Example (b):
as shown in fig. 1 and 2, the FPC flat cable mounting process of the present invention includes the steps of: attaching the copper foil 3 to the back of the golden finger arranging line area 12 of the FPC 1 without trimming, and punching and forming the FPC golden finger arranging line area 12 attached with the copper foil 3 at one time. The copper foil 3, which is a metal material, also serves to support and compensate for the thickness of the gold finger space 12, but is softer than the stainless steel sheet so that it can be punched together with the FPC 1. Because the copper foil 3 and the FPC 1 are molded together, the copper foil and the FPC 1 do not have the problem of rear positioning, and the punch head is designed according to the appearance of the FPC 1, so that the attaching precision is guaranteed, and the working efficiency is improved.
The thickness of the copper foil 3 is at least 0.13 mm. The copper foil 3 should have a certain thickness to achieve the supporting strength for the FPC.
The total thickness of the patch part was 0.24 mm. During welding, because the copper foil and the FPC are cut to be even, the edge thickness can be 0.24mm, and during welding, the welding positioning jig is clamped, the edge cannot deform, the welding precision of the copper foil and an iron piece is guaranteed, and the requirement of a customer is met.
What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.

Claims (3)

1. A FPC winding displacement paster technology is characterized by comprising the following steps: and attaching a copper foil with the range larger than the outline of the FPC to the back of the golden finger flat cable area of the FPC without trimming, and punching and forming the FPC golden finger flat cable area attached with the copper foil at one time.
2. The FPC ribbon cable pasting process of claim 1, wherein: the thickness of the copper foil is at least 0.13 mm.
3. The FPC ribbon cable pasting process of claim 2, wherein: the total thickness of the patch part was 0.24 mm.
CN201911214589.4A 2019-12-02 2019-12-02 FPC (Flexible printed Circuit) cable pasting process Withdrawn CN110933848A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911214589.4A CN110933848A (en) 2019-12-02 2019-12-02 FPC (Flexible printed Circuit) cable pasting process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911214589.4A CN110933848A (en) 2019-12-02 2019-12-02 FPC (Flexible printed Circuit) cable pasting process

Publications (1)

Publication Number Publication Date
CN110933848A true CN110933848A (en) 2020-03-27

Family

ID=69847198

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911214589.4A Withdrawn CN110933848A (en) 2019-12-02 2019-12-02 FPC (Flexible printed Circuit) cable pasting process

Country Status (1)

Country Link
CN (1) CN110933848A (en)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH046892A (en) * 1990-04-24 1992-01-10 Toray Ind Inc Flexible printed wiring board
JPH08204309A (en) * 1995-01-26 1996-08-09 Sumitomo Electric Ind Ltd Manufacture of flexible printed wiring board
JPH0997955A (en) * 1995-09-29 1997-04-08 Sumitomo Electric Ind Ltd Printed-wiring board suitable for component mounting
JP2004014894A (en) * 2002-06-10 2004-01-15 Shinko Electric Ind Co Ltd Circuit board for semiconductor component, and manufacturing method thereof
JP2004266105A (en) * 2003-03-03 2004-09-24 Sumitomo Bakelite Co Ltd Flexible printed wiring board with reinforcing board
JP2006269948A (en) * 2005-03-25 2006-10-05 Teikoku Tsushin Kogyo Co Ltd Insulating plate with peeling sheet and manufacturing method thereof
CN101175375A (en) * 2006-10-31 2008-05-07 比亚迪股份有限公司 Production method of flexible circuit board
CN201066955Y (en) * 2007-06-26 2008-05-28 比亚迪股份有限公司 A flexible printed line board
JP2009147224A (en) * 2007-12-17 2009-07-02 Sumitomo Electric Printed Circuit Inc Method of manufacturing flexible printed-wiring board
JP2010010277A (en) * 2008-06-25 2010-01-14 Nippon Mektron Ltd Flexible circuit board and method of manufacturing the same
CN106507586A (en) * 2016-09-26 2017-03-15 珠海市联决电子有限公司 A kind of processing method of FPC battery protecting plates
CN108040421A (en) * 2017-12-29 2018-05-15 广东欧珀移动通信有限公司 A kind of flexible PCB and preparation method thereof, electronic equipment

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH046892A (en) * 1990-04-24 1992-01-10 Toray Ind Inc Flexible printed wiring board
JPH08204309A (en) * 1995-01-26 1996-08-09 Sumitomo Electric Ind Ltd Manufacture of flexible printed wiring board
JPH0997955A (en) * 1995-09-29 1997-04-08 Sumitomo Electric Ind Ltd Printed-wiring board suitable for component mounting
JP2004014894A (en) * 2002-06-10 2004-01-15 Shinko Electric Ind Co Ltd Circuit board for semiconductor component, and manufacturing method thereof
JP2004266105A (en) * 2003-03-03 2004-09-24 Sumitomo Bakelite Co Ltd Flexible printed wiring board with reinforcing board
JP2006269948A (en) * 2005-03-25 2006-10-05 Teikoku Tsushin Kogyo Co Ltd Insulating plate with peeling sheet and manufacturing method thereof
CN101175375A (en) * 2006-10-31 2008-05-07 比亚迪股份有限公司 Production method of flexible circuit board
CN201066955Y (en) * 2007-06-26 2008-05-28 比亚迪股份有限公司 A flexible printed line board
JP2009147224A (en) * 2007-12-17 2009-07-02 Sumitomo Electric Printed Circuit Inc Method of manufacturing flexible printed-wiring board
JP2010010277A (en) * 2008-06-25 2010-01-14 Nippon Mektron Ltd Flexible circuit board and method of manufacturing the same
CN106507586A (en) * 2016-09-26 2017-03-15 珠海市联决电子有限公司 A kind of processing method of FPC battery protecting plates
CN108040421A (en) * 2017-12-29 2018-05-15 广东欧珀移动通信有限公司 A kind of flexible PCB and preparation method thereof, electronic equipment

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Application publication date: 20200327