JP2004014894A - Circuit board for semiconductor component, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board for semiconductor components wherein the assembling error of the components can be reduced by making only one positioning operation by using positioning holes. <P>SOLUTION: In the circuit board 10 for semiconductor components, a mounting portion 11 having a mounted semiconductor light receiving element 20 and a connecting portion 12 extended from the mounting portion 11 are formed by using a flexible board 13, and a reinforcing plate is attached to the rear surface of the mounting portion 11. Further, in this circuit board 10, the shape of the reinforcing plate is made consistent with the external shape of the mounting portion 11, and positioning holes 24 are provided integrally penetrating the mounting portion 11 and the reinforcing plate with an identical shape and for assembling the semiconductor components. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a circuit board for a semiconductor component in which a semiconductor element is mounted on a flexible substrate, and more particularly, to a circuit board for a semiconductor component using a small-sized semiconductor element, a semiconductor product using the same, and a method of manufacturing the same.
[0002]
[Prior art]
A semiconductor product (optical module) having a semiconductor light receiving element such as a CCD or a CMOS sensor is mounted on a substrate having the semiconductor light receiving element mounted on an opening at the bottom of the housing and an optical lens mounted on a top of the housing. is there. The substrate on which the semiconductor light receiving element is mounted is positioned and mounted on the housing by fitting a positioning hole provided on the substrate into a positioning projection provided on the housing.
When a flexible substrate is used as a substrate on which a semiconductor light receiving element is mounted, the reinforcing plate is attached to the back surface of the substrate because the substrate strength is low and the substrate cannot be kept flat. As the reinforcing plate, an aluminum plate is often used, and conventionally, a plate formed by cutting into individual pieces according to the shape of the substrate is used. When mounting the reinforcing plate on the flexible substrate, the positioning holes provided on the flexible substrate in accordance with the positions of the positioning projections provided on the housing, and the positioning holes of the reinforcing plate formed when the individual pieces are cut Are aligned and bonded using a pin gauge.
[0003]
Then, after mounting the semiconductor light receiving element on the flexible substrate, the positioning holes formed in the flexible substrate are aligned with the positioning projections provided on the housing in which the optical lens is incorporated, and the flexible plate with the reinforcing plate is aligned. The semiconductor product is assembled by attaching the substrate to the housing.
Thus, even when a flexible substrate having low rigidity is used as the substrate on which the semiconductor light receiving element is mounted, the substrate is securely supported by the housing by attaching the reinforcing plate, and the assembly error is reduced. It is possible to manufacture semiconductor products with high accuracy.
[0004]
[Problems to be solved by the invention]
Here, the positioning holes formed in the reinforcing plate are formed slightly larger than the positioning holes provided in the flexible substrate in consideration of an attachment error with the flexible substrate. On the other hand, assembling of a semiconductor product requires extremely high precision, and in order to increase the assembling accuracy, it is necessary to make the positioning hole of the reinforcing plate as large as the positioning hole provided in the flexible substrate.
In conventional semiconductor products, a flexible board on which a semiconductor light-receiving element is mounted and a housing with a lens are formed in separate processes, and when the flexible board and housing are combined, they are mounted on a circuit board. In some cases, the center of the semiconductor light receiving element may deviate from the center of the lens incorporated in the housing, resulting in a problem that the reliability as a semiconductor product is lacking and the yield is reduced. The above-described error in attaching the reinforcing plate to the flexible substrate also contributes to a decrease in the yield of semiconductor products.
[0005]
In addition, as a method of combining the flexible board and the reinforcing board, a method of attaching the reinforcing board and the flexible board to each other by adjusting the outer shape is also performed, but the edge of the reinforcing board is positioned inside the edge of the flexible board. In the case of products that do, the protruding part of the flexible board is in a state of being cantilevered by the reinforcing plate, so the wiring pattern formed on the flexible board of the part protruding from the reinforcing board may be bent and damaged. There is also a problem that a wiring pattern cannot be formed at the end of the flexible substrate, which is an obstacle to miniaturization of the circuit board.
[0006]
[Means for Solving the Problems]
The inventor of the present invention has studied various methods for reducing an error in assembling a semiconductor component on which such a semiconductor light receiving element is mounted. As a result, the reference position used when forming a positioning hole used for assembling another component is determined. It is set so that it does not vary depending on the semiconductor components, and the positioning operation using the positioning holes is performed only once, so that assembly errors are reduced, and the outer shape of the mounting portion of the flexible board is made to match the outer shape of the reinforcing plate. Accordingly, the present inventors have conceived that a wiring pattern can be formed on the entire mounting portion of the flexible substrate, and have completed the present invention.
That is, the present invention provides a circuit for a semiconductor component in which a mounting portion for mounting a semiconductor light receiving element and a connection portion extending from the mounting portion are formed by a flexible substrate, and a reinforcing plate is attached to a back surface of the mounting portion. In the substrate, the reinforcing plate is formed in a shape that matches the outer shape of the mounting portion, and a positioning hole for assembling a semiconductor product that integrally penetrates the mounting portion and the reinforcing plate in the same shape is provided. It is a circuit board for semiconductor parts characterized by the above-mentioned.
As a result, the positioning operation using the positioning holes can be performed only once, so that assembly errors can be reduced.
[0007]
Further, it is preferable that the reinforcing plate is made of the same material as the flexible substrate.
As a result, the clearance of the punching die can be easily set, and burrs do not occur after the punching, so that shaping after the punching operation becomes unnecessary, so that the manufacturing efficiency of the circuit board can be improved.
[0008]
Further, as an invention of a method of manufacturing a circuit board for semiconductor components according to the present invention, a mounting portion for mounting a semiconductor light receiving element, and a connection portion extending from the mounting portion are formed by a flexible substrate, In the method for manufacturing a circuit board for a semiconductor component having a reinforcing plate attached to the back surface, after forming a wiring pattern on the flexible substrate, the reinforcing plate is attached to a surface opposite to a surface on which the mounting portion of the flexible substrate is formed. Punching the flexible substrate and the reinforcing plate based on the shape of the wiring pattern using a press die, and penetrating the mounting portion and the reinforcing plate to punch out a positioning hole for assembling a semiconductor product. And
[0009]
Furthermore, after a reinforcing plate is attached to the surface opposite to the surface serving as the mounting portion of the flexible substrate, a wiring pattern is formed on the flexible substrate, and a pressing die is used to form a wiring pattern based on the shape of the wiring pattern. The method is characterized in that a flexible substrate and the reinforcing plate are punched, and a positioning hole for assembling a semiconductor product is punched through the mounting portion and the reinforcing plate.
With these manufacturing methods, it is possible to reduce the variation in the arrangement positions of the positioning holes in each semiconductor component circuit board.
[0010]
Further, the reinforcing plate may be made of the same material as the flexible substrate.
According to this, the clearance of the punching die can be easily set, and burrs do not occur after the punching, so that shaping after the punching operation becomes unnecessary, so that the production efficiency of the circuit board can be improved.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a preferred embodiment of a circuit board for semiconductor parts of the present invention will be described with reference to the drawings.
First, a circuit board for a semiconductor component will be described. 1 and 2 are a plan view and a bottom view showing a state where a semiconductor light receiving element 20 is mounted on a circuit board 10 for semiconductor components.
In the circuit board 10 of the present embodiment, a mounting portion 11 on which the semiconductor light receiving element 20 is mounted is formed at one end, and a connection portion 12 having a width narrower than the mounting portion 11 extends from the edge of the mounting portion 11 to the other end. It is provided. The mounting portion 11 and the connection portion 12 are integrally formed by a flexible substrate 13, and a required wiring pattern is provided on a surface of the flexible substrate 13.
[0012]
The semiconductor light receiving element 20 and the wiring pattern are electrically connected by wire bonding the connection pad 14 provided on the wiring pattern and the semiconductor light receiving element 20. Reference numeral 15 denotes a bonding wire. Reference numeral 16 denotes a circuit component mounted on the mounting unit 11. Circuit components are also mounted electrically connected to the wiring pattern. Thus, a semiconductor component is formed.
[0013]
As shown in FIG. 2, a rectangular reinforcing plate 32 formed in a shape matching the outer shape of the mounting portion 11 is attached to the back surface of the mounting portion 11 of the circuit board 10 by bonding to the flexible substrate 13. .
Reference numeral 24 denotes a positioning hole provided through the flexible board 13 and the reinforcing plate 32. In the present embodiment, one positioning hole 24 is provided at each corner of the front edge of the mounting portion 11. In the circuit board 10 for semiconductor components of the present embodiment, the positioning holes 24 for use in assembling the semiconductor products, which are aligned with the positioning projections of the substrate provided on the housing on which the optical lens is mounted, are provided with the flexible substrate 13. It is characteristic that the reinforcing plate 32 and the reinforcing plate 32 are completely penetrated with the same diameter.
[0014]
FIG. 3 is an explanatory view showing a state in which a circuit board for a semiconductor component is manufactured. A method for manufacturing the circuit board 10 of the above embodiment will be described with reference to FIG.
In the present embodiment, a single-sided copper-clad film 30 in which a copper foil is provided on one side of a film having electrical insulation such as a polyimide film is provided on the inside of the carrier 26 formed in a frame shape using an aluminum plate or the like, After the copper foil of the single-sided copper-clad film 30 is etched to form a wiring pattern corresponding to each flexible substrate 13, the reinforcing plate 32 is bonded to the back surface of the single-sided copper-clad film 30, and a pressing die is used. Then, the reinforcing plate 32 is removed together with the single-sided copper-clad film 30 to form the individual circuit board 10. In the same drawing, a broken line for pulling out the single-sided copper-clad film 30 and the reinforcing plate 32 is indicated by a broken line.
[0015]
The reinforcing plate 32 is formed in a band shape in advance according to the size of the mounting portion 11 of the circuit board 10. As shown in FIG. 3, the reinforcing plate 32 is formed to have the same width dimension (A) as the length of the side of the mounting portion 11, and is aligned with the mounting portion 11 formed on the single-sided copper-clad film 30. Adhere to the back side of the one-sided copper-clad film 30.
[0016]
In the present manufacturing method, since the reinforcing plate 32 is punched at a time together with the single-sided copper-clad film 30 into the circuit board 10, the reinforcing plate 32 can be easily cut together with the single-sided copper-clad film 30 and is made of a material that does not cause punching or the like. It is better to use something. From the viewpoint of the clearance setting of the die for pressing, etc., the same material as the base material of the single-sided copper-clad film 30 is used as the reinforcing plate 32, rather than using a different material from the base material of the single-sided copper-clad film 30. Good to do. For example, when the single-sided copper-clad film 30 is made of a polyimide film as a base material, it is preferable to use a reinforcing plate formed of the same polyimide as the polyimide film because the punching accuracy becomes good. In the present embodiment, a 180 μm thick polyimide material is used as the reinforcing plate 32.
[0017]
After the reinforcing plate 32 is bonded to the single-sided copper-clad film 30, the positioning holes 24 are pulled out so as to penetrate the single-sided copper-clad film 30 and the reinforcing plate 32 when the reinforcing plate 32 is dropped onto the individual circuit board 10. The press die performs press punching based on the shape of the wiring pattern formed on the circuit board 10 when dropping the circuit board 10 and the positioning holes 24. According to the press punching using such a press die, the outer shape of the mounting portion 11 of the circuit board 10 and the positioning hole 24 can be simultaneously processed, and the positional relationship between the wiring pattern of the mounting portion 11 and the positioning hole 24 is extremely high. It can be processed with high precision. Also, the positioning hole 24 can be formed in an optimal shape according to the shape of the positioning projection provided on the housing for assembling the semiconductor product.
[0018]
As described above, since the circuit board obtained by the manufacturing method of the present embodiment has a good positional accuracy between the wiring pattern of the mounting portion 11 and the positioning hole 24, the circuit board 10 can be accurately mounted on a housing for assembling semiconductor components. Can be attached, thereby making it possible to obtain a semiconductor component having high reliability and a high production yield.
[0019]
FIG. 4 shows a manufacturing process from forming a wiring pattern on the single-sided copper-clad film 30, forming the positioning holes 24, and forming a semiconductor component. FIG. 4 shows a portion of the semiconductor component which is to be the mounting portion 11 of the circuit board 10 for the sake of explanation.
FIG. 4A shows a single-sided copper-clad film 30 used in manufacturing the circuit board 10 in a semiconductor component. 30a is a base film serving as a base material of the single-sided copper-clad film 30, and 34 is a copper foil adhered to one side of the base film 30a.
FIG. 4B shows a state where the surface of the copper foil 34 is covered with a photosensitive resist 36 in order to form the copper foil 34 into a predetermined wiring pattern, and FIG. 4C shows exposure and development of the photosensitive resist 36. In this state, a resist pattern 36a is formed. The resist pattern 36a is provided so as to cover a portion left as the wiring pattern 38.
[0020]
FIG. 4D shows a state where the copper foil 34 is etched using the resist pattern 36a as a mask to form a wiring pattern 38. Reference numeral 38a denotes a connection electrode on which circuit components are mounted. The wiring pattern 38 includes, in addition to the connection electrode 38a, a connection pad connected to the semiconductor light receiving element 20 by wire bonding, and a wiring for routing.
After forming the wiring pattern 38, the surface on which the wiring pattern 38 is formed is covered with a solder resist 40, and only the connection electrode 38a and the connection pad are exposed to the outside.
[0021]
FIG. 4E shows a state in which after the surface on which the wiring pattern 38 is formed is covered with the solder resist 40, a reinforcing plate 32 for reinforcing the mounting portion 11 of the circuit board 10 is adhered to the back surface of the base film 30a. .
4F, the base film 30a and the reinforcing plate 32 are punched out using a press die to form the mounting portion 11 of the circuit board 10 and penetrate the base film 30a and the reinforcing plate 32. The state where the positioning hole 24 is formed is shown. When the base film 30a and the reinforcing plate 32 are punched, the wiring pattern or the alignment pattern provided on the flexible substrate is optically detected, and the workpiece is accurately aligned with the press-cutting die and press-cut. By performing the processing, high-precision punching can be performed.
[0022]
In the above-described method of manufacturing a circuit board for a semiconductor component, a method of forming a wiring pattern on a flexible substrate by a so-called subtraction method has been described. However, a method of forming a wiring pattern on a flexible substrate is limited to the method shown in FIG. However, it is of course possible to use other methods.
[0023]
As described above, the circuit board 10 of the semiconductor component obtained by the manufacturing method of the present embodiment has the positioning of the positioning holes 24 provided on the circuit board 10 formed with extremely high precision, so that the assembly of the semiconductor product is performed. A semiconductor product can be assembled with high precision by being attached to a housing used for a semiconductor device. Since the circuit board 10 can be assembled to the housing with high accuracy, the optical axis position of the optical lens can be adjusted by assembling the housing incorporating the optical lens in advance and the semiconductor component of the present embodiment. It is possible to obtain a semiconductor product having high light receiving accuracy without being displaced from the center position of the semiconductor device.
[0024]
Further, according to the manufacturing method of the present embodiment, a plurality of semiconductor components can be manufactured at once by subjecting one carrier 26 to exposure, development, etching, or the like. There is an advantage that the semiconductor device can be manufactured efficiently and mass-produced semiconductor components easily.
[0025]
In the semiconductor component manufactured by the method described above, since the arrangement position of the semiconductor light receiving element 20 is always in a predetermined positional relationship with the position of the positioning hole 24, the semiconductor light receiving element 20 is mounted on the circuit board 10 with the center of the lens. The center of the semiconductor light receiving element 20 is aligned, and a semiconductor product with high light receiving accuracy can be manufactured.
Also, instead of forming the positioning holes 24 for each component as in the related art and assembling the components by the positioning holes 24, a method of forming the positioning holes 24 in the state of the semiconductor component or the circuit board 10 is used. According to the method, the manufacturing process can be simplified, so that the manufacturing cost of the semiconductor component can be reduced.
[0026]
Furthermore, since the reinforcing plate 32 is formed of the same kind of polyimide as the material of the flexible substrate 13, the positioning holes 24 can be easily punched out, and burrs do not occur due to the punching. Can be further improved.
[0027]
Further, in the present embodiment, the semiconductor element used is a semiconductor light receiving element such as a CMOS sensor, but may be a normal semiconductor element. According to the structure of the circuit board for a semiconductor component according to the present invention, since the position of the positioning hole for assembly is determined with respect to the wiring pattern formed on the substrate, positioning with a predetermined positional relationship with respect to the wiring pattern is always performed. Holes can be formed.
[0028]
【The invention's effect】
According to the semiconductor component and the circuit board for the semiconductor component according to the present invention, the following effects can be obtained.
That is, in a semiconductor component circuit board including a semiconductor element, a flexible board on which the semiconductor element is mounted, and a reinforcing board to be attached to the flexible board on which a wiring pattern is formed, after attaching the reinforcing board to the flexible board, The flexible board on which the element is mounted and the reinforcing plate are penetrated in the vertical direction of the circuit board by the same positioning hole, so that the positioning holes are provided in each of the components constituting the circuit board for the semiconductor component. Based on the positioning holes, it is possible to eliminate the occurrence of assembly errors that are accumulated by assembling the components, and to provide a circuit board for semiconductor components having accurate assembly accuracy.
[0029]
The location of the positioning hole is a circuit board structure that recognizes the wiring pattern formed on the flexible substrate and determines the location based on the shape of the wiring pattern. Since the relative positional relationship can be a constant circuit board, the eccentricity between the center of the lens and the center of the semiconductor light receiving element can be reduced when incorporated in a housing in which the lens is fitted. A highly reliable semiconductor product can be provided, and the wiring pattern can be made finer, so that the semiconductor product can be downsized.
[0030]
Furthermore, since the reinforcing plate has a circuit board structure for semiconductor components formed of the same material as the flexible substrate, punching of the positioning holes becomes easy, and burrs do not occur after punching. Since the shaping can be made unnecessary, it is possible to reduce the manufacturing cost of the circuit board of the semiconductor component.
[Brief description of the drawings]
FIG. 1 is a plan view showing a state where a semiconductor light receiving element is mounted on a circuit board for semiconductor components.
FIG. 2 is a bottom view showing a state where a semiconductor light receiving element is mounted on a circuit board for semiconductor components.
FIG. 3 is an explanatory view showing a state in which a circuit board for a semiconductor component is manufactured.
FIG. 4 is an explanatory diagram showing a manufacturing process from forming a wiring pattern on a single-sided copper-clad film, forming a positioning hole, and forming a semiconductor component.
[Explanation of symbols]
REFERENCE SIGNS LIST 10 circuit board 11 mounting part 12 connection part 13 flexible board 14 connection pad 16 circuit component 20 semiconductor light receiving element 24 positioning hole 26 carrier 30 substrate 30 a film 30 b base film 32 reinforcing plate 34 copper foil 36 photosensitive resist 36 a resist pattern 38 a connection electrode 40 Solder resist

Claims (5)

In a semiconductor component circuit board, a mounting portion for mounting a semiconductor light receiving element and a connection portion extending from the mounting portion are formed by a flexible substrate, and a reinforcing plate is attached to a back surface of the mounting portion.
The reinforcing plate is formed in a shape that matches the outer shape of the mounting portion,
A circuit board for a semiconductor component, comprising: a positioning hole for assembling the semiconductor component, which is integrally formed through the mounting portion and the reinforcing plate and has the same shape. 2. The circuit board according to claim 1, wherein the reinforcing plate is made of a material having the same quality as the flexible substrate. A mounting method for mounting a semiconductor light receiving element, and a connecting part extending from the mounting part are formed by a flexible substrate, and a method for manufacturing a circuit board for semiconductor components, comprising a reinforcing plate attached to the back surface of the mounting part,
After forming a wiring pattern on the flexible substrate,
Attaching a reinforcing plate to the surface opposite to the surface on which the mounting portion of the flexible substrate is formed, punching out the flexible substrate and the reinforcing plate based on the shape of the wiring pattern using a press die, and A method for manufacturing a circuit board for a semiconductor component, wherein a positioning hole for assembling the semiconductor component is punched out through a reinforcing plate. A mounting method for mounting a semiconductor light receiving element, and a connecting part extending from the mounting part are formed by a flexible substrate, and a method for manufacturing a circuit board for semiconductor components, comprising a reinforcing plate attached to the back surface of the mounting part,
After attaching a reinforcing plate to the surface opposite to the surface serving as the mounting portion of the flexible substrate,
Forming a wiring pattern on the flexible substrate, punching out the flexible substrate and the reinforcing plate based on the shape of the wiring pattern using a press die, and penetrating the mounting portion and the reinforcing plate to assemble a semiconductor component. A method for manufacturing a circuit board for a semiconductor component, comprising punching out a positioning hole for a semiconductor component. 5. The method according to claim 3, wherein a material of the same quality as the flexible substrate is used for the reinforcing plate.

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