JPH0818267A - Electronic circuit module - Google Patents

Abstract

PURPOSE:To provide an electronic circuit module wherein a case can be well mounted on a circuit board. CONSTITUTION:An electronic circuit module 1 is composed of a circuit board 2 having a board 20 on which specified electronic circuit is formed and signal input/output part 21 of this circuit on one end face 20a and a case 3 mounted on the board 2 such that it surrounds two side end faces 20b and other end face 20c of the board 20. At one end face 20a of the board 20, at least, protrusions 22 are formed at a high working precision than that of the side end face 20b and positioning parts 31 are formed which contact with the protrusions 22 when the case 3 is mounted on the board 2 whereby the case 3 is positioned to the board 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit module in which a circuit board having a predetermined electronic circuit is surrounded by a case.

[0002]

2. Description of the Related Art Electronic circuit modules having predetermined electronic functions, such as electronic tuners, digital processing circuits, and amplifiers,
The modules are mounted on a mother board or the like in module units to form the entire electronic function of an electric device. Figure 4 (a)
As shown in the perspective view of FIG.
Has a predetermined electronic circuit formed on the substrate 20 and has one end face 20a.
A circuit component board 2 having a signal input / output section 21 composed of leads 21a and the like;
One side end surface 20b and the other end surface 20c are surrounded by a metal case 3 mounted on the circuit component board 2.

The width of both end faces 20b of the circuit board 2 on the circuit board 2 serves as a mounting positioning reference L'of the case 3, and is provided on the inner surface of the case 3 with the circuit board 2 fitted in the case 3. The case 3 and the circuit board 2 are combined so that the edge of the substrate 20 is hooked on the claw (not shown). When the signal input / output unit 21 is composed of the lead 21a, the lead 21a is inserted into a mother board (not shown) for electrical connection. In this case, the electronic circuit module 1 is mechanically attached via the kink portion 32 provided in the case 3.

A plurality of electronic circuit modules 1 having various electronic functions are attached to a mother board (not shown) via kink portions 32, and constitute electronic functions in a predetermined electric device. The signal input / output unit 21 other than the lead 21a may be a connector connection. In the case of connector connection, for example, the lead 21a
Instead of, the contact is provided as the signal input / output unit 21,
Electrical connection is made by inserting this contact into a connector connected to the mother board (not shown).

[0005]

The circuit board 2 used in the electronic circuit module 1 as shown in FIG.
Usually, it is manufactured using a collective substrate in which a plurality of constituent substrates are continuous. That is, it is manufactured by forming a predetermined electronic circuit on each constituent substrate of the collective substrate by a similar process, and cutting and dividing the electronic circuit. At this time, the one end face 20a side of the substrate 20 in the circuit component plate 2 has the lead 21a
Since it is necessary to provide the signal input / output section 21 such as the above, it is formed by punching with precision using a press die or the like before forming a circuit. However, the side end surface 20 of the substrate 20
b is integrated with the adjacent substrate 20 until a predetermined circuit is formed, and is cut and formed by forming a V groove or perforation after forming the circuit and bending the groove.

For this reason, burrs are generated on the side end surface 20b of the substrate 20, and when the case 3 is mounted on the circuit board 2, the burrs have an adverse effect on the mounting of the case 3 or the inner surface of the case 3. A gap is formed between the side end surface 20b of the substrate 20. FIG. 4B is a diagram showing a gap between the kink portion 32 and the lead 21a when the case 3 is mounted. That is, when the side end surface 20b of the substrate 20 has no flash, the case 3 is at the position shown by the solid line in the figure, and the distance between the kink portion 32 and the lead 21a is d as designed. However, when burrs are generated on the side end surface 20b of the substrate 20, the case 3 is at the position shown by the broken line in the figure, and the distance between the kink portion 32 and the lead 21a becomes d '.

Since the size of the flash is usually about 0.5 mm, d'is larger than d by the size of the flash. Therefore, when the lead 21a is attached to the mother board (not shown) with the kink portion 32 as a reference, the lead 21a is misaligned with respect to the mother board, which causes a problem that the lead 21a is not properly inserted.

Further, as shown in FIG. 4 (c), the case 3
When connecting the substrate 20 and the substrate 20 with the solder 4 to obtain conduction, the workability of the soldering is reduced, the adhesion strength is insufficient, and cracks are generated due to the effect of the gap generated between the substrate 20 and the case 3 by the flash. May cause defective soldering.

[0009]

SUMMARY OF THE INVENTION The present invention is an electronic circuit module made to solve such problems. That is, according to the present invention, a circuit component plate in which a predetermined electronic circuit is formed on a substrate having a substantially rectangular shape and a signal input / output portion of the electronic circuit is provided on one end face of the substrate, and two circuit plates substantially perpendicular to the one end face of the substrate An electronic circuit module comprising a side end face and a case mounted on a circuit component board in a state of enclosing the other end face substantially parallel to the one end face, wherein at least one side face of the circuit component plate has a processing accuracy on one end face of the substrate. The convex portion is formed with higher processing accuracy than that of the case, and the case is provided with a positioning portion that contacts the convex portion when the circuit component board is mounted and positions the circuit component board and the case.

Further, it is also an electronic circuit module in which the signal input / output portion is arranged with reference to the position of the convex portion, or soldering is performed at the contact portion between the convex portion and the positioning portion.
Furthermore, when connecting to the motherboard via the kink portion provided on the case, the tips of the protrusions contact the motherboard when the kink portion is inserted into the motherboard, and the case and the circuit component board are connected to the motherboard. It is also an electronic circuit module that determines the mounting position.

[0011]

In the present invention, the circuit board is provided with a convex portion formed on one end surface of the circuit board at a processing accuracy higher than the processing accuracy of at least the side end surface of the board, which serves as a reference for mounting the case. That is, when the case is mounted, the positioning portion provided on the case and the convex portion come into contact with each other, and even if there is variation in the processing accuracy of the side end surface, the convex portion serves as a reference to accurately measure the case. It will be possible to attach it to the position.

Further, the positional relationship between the case and the signal input / output section is accurately determined by using the convex portion, which is the reference for mounting the case, as the reference for the arrangement of the signal input / output section. The mounting position of the part becomes accurate. Further, according to the present invention, the convex portion and the positioning portion are in a state of reliably contacting each other without a gap without being affected by the flash. Therefore, by conducting soldering at the contact portion between the convex portion and the positioning portion, it is possible to reliably obtain conduction between the circuit component board and the case.

Further, in the case of an electronic circuit module which is connected to a motherboard through a kink portion provided in the case, the tip of the convex portion may come into contact with the motherboard when the kink portion is inserted into the motherboard. Become.
That is, the mounting positions of the case and the circuit component board with respect to the mother board can be accurately determined according to the height of the convex portion.

[0014]

Embodiments of the electronic circuit module of the present invention will be described below with reference to the drawings. 1A and 1B are views for explaining an electronic circuit module according to this embodiment, FIG. 1A is a perspective view, and FIG. 1B is a partially enlarged view of a main part. As shown in FIG. 1A, the electronic circuit module 1 includes a substrate 2 having a substantially square shape.
0 has a predetermined electronic circuit and one end surface 20a of the substrate 20.
The circuit component plate 2 is provided with a signal input / output section 21 including leads 21a and the like, and a case 3 mounted on the circuit component plate 2 so as to surround the two side end faces 20b and the other end face 20c of the substrate 20. A protrusion 22 is provided on one end surface 20 a of the substrate 20, and a positioning portion 31 that abuts the protrusion 22 is provided on the case 3. Further, when the electronic circuit module 1 is mounted on a mother board or the like, a kink portion 32 for positioning is provided in the case 3.

The convex portion 22 provided on the one end surface 20a of the substrate 20 is formed with a processing accuracy higher than that of the side end surface 20b of the substrate 20. That is, the convex portion 22 is formed at the same time when the one end surface 20a of the substrate 20 is cut and formed. For example, when the side end surface 20b of the substrate 20 is formed by V-groove cutting or perforation cutting, the one end surface 20a of the substrate 20 is formed by punching using a press die having higher processing accuracy than this. . Thereby, the convex portion 22 is processed with a molding accuracy higher than that of the side end surface 20b.

When the case 3 is mounted on the circuit board 2, the board 20 is fitted in the case 3, and the edge of the board 2 is hooked on a claw (not shown) provided on the inner surface of the case 3. To combine. At this time, the two positioning portions 31 provided on the case 3 are attached to the one end surface 2 of the substrate 20.
0a is in contact with the outer surface of each of the two protrusions 22.

That is, the distance between the outer surfaces of the two convex portions 22 serves as the mounting positioning reference L for mounting the case 3. As described above, the convex portion 22 is formed with a processing accuracy higher than that of the side end surface 20b, so that the mounting positioning reference L can be set to an accurate value. Therefore, by bringing the positioning portion 31 into contact with the outer side surface of the convex portion 22, it becomes possible to accurately determine the attachment position of the circuit component plate 2 and the case 3.

In order to bring the positioning portion 31 of the case 3 into contact with the convex portion 22 of the substrate 20 to perform accurate positioning, as shown in FIG. Case 3 is designed. That is, the size of the flash based on the processing accuracy of the side end surface 20b is, for example, 0.
When the thickness is about 5 mm, a gap (0.5 m) between the side end surface 20b of the substrate 20 and the case 3 does not contact the flash.
It is designed so that the positioning portion 31 contacts the convex portion 22 in this state. As a result, when mounting the case 3,
The positioning portion 31 of the case 3 comes into contact with the convex portion 22 without being affected by the flash, and accurate case mounting based on the mounting positioning reference L shown in FIG. 1A can be performed.

The positioning portion 31 is brought into contact with the convex portion 22 so that the kink portion 32 and the convex portion 22 provided on the case 3 are provided.
The positions of and will be accurately determined. Therefore, the convex portion 2
By providing the lead 21a with 2 as the reference, the distance D between the kink portion 32 and the lead 21a can be accurately set.

Next, a case where the electronic circuit module 1 is mounted on a mother board by using the kink portion 32 will be described. FIG. 2 is a perspective view illustrating a state where the electronic circuit module 1 according to the present embodiment is mounted on the motherboard 10. The motherboard 10 has an electronic circuit module 1
A kink insertion hole 11 for inserting the kink portion 32 provided in the case 3 and a lead insertion hole 12 for inserting the lead 21a of the circuit component board 2 are provided.

The electronic circuit module 1 is attached to the mother board 10
For mounting, the kink portion 32 provided on the case 3 is inserted into the kink insertion hole 11 of the motherboard 10 and the lead 21a is inserted into the lead insertion hole 12. As described above, the lead 2 is based on the position of the convex portion 22.
By arranging 1a, the distance D (see FIG. 1B) between the kink portion 32 and the lead 21a can be accurately determined. As a result, the electronic circuit module 1
When the is mounted on the mother board 10, by inserting the kink portion 32 into the kink insertion hole 11, the lead 21a can be accurately inserted into the lead insertion hole 12.

When the electronic circuit module 1 is mounted on the mother board 10, the convex portion 22 provided on the one end face 20a of the substrate 20 comes into contact with the surface of the mother board 10. Since the convex portion 22 is formed in an accurate size, the mounting position of the circuit component board 2 and the case 3 with respect to the mother board 10 at the time of mounting can be accurately set by using this as a reference.

That is, if the electronic circuit module 1 is mounted on the mother board 10 by using the convex portion 22 as a stopper, the insertion depth of the case 3 and the circuit board 2 and the mother board 1 can be improved.
The interval with 0 can be kept constant. In this way, by providing a predetermined space between the circuit board 2 and the mother board 10, it is possible to mount other components in this space on the mother board 10 and the one end portion 20a of the substrate 20 is It is possible to prevent a short circuit in an unnecessary portion because the motherboard 10 is not contacted.

Further, since the convex portion 22 serves as a stopper when the kink portion 32 is inserted, it is not necessary to provide a special stopper (step or the like) on the kink portion 32, and the case 3
It will be possible to simplify the manufacturing.

Next, the case of soldering the board 20 and the case 3 will be described with reference to the perspective view of FIG. That is, when the land (not shown) provided on the substrate 20 and the metal case 3 are connected to each other by the solder 4, it is desirable to work at a contact portion without a gap. Therefore,
In the electronic circuit module 1 of this embodiment, the case 3
Utilizing the fact that the positioning portion 31 and the convex portion 22 of the substrate 20 reliably contact each other, soldering is performed at this contact portion.

Therefore, when the case 3 and the substrate 20 are soldered, the tip of the positioning portion 31 is slightly bent in advance in a direction parallel to the side surface of the convex portion 22 to form the convex portion 22. Try to increase the contact surface. Then, by connecting the contact portion between the bent positioning portion 31 and the convex portion 22 with the solder 4, it is possible to perform good soldering without cracks or insufficient adhesion strength.

In the present embodiment, the signal input / output unit 2
1 (see FIG. 1) has been described as an example in which the lead 21a is provided, but the present invention is not limited to this, and the same applies to the case where the signal input / output unit 21 including a connector connection is provided. In this case, a contact is provided in place of the lead 21a, and the connector connected to the mother board 10 is connected to this contact. In addition, even when the connector is connected, when mounting on the motherboard 10, the kink portion 32 is provided in advance in the case 3, and the kink portion 32 is inserted into the kink insertion hole 11 of the motherboard 10. The electronic circuit module 1 may be mounted.

[0028]

As described above, the electronic circuit module of the present invention has the following effects. That is,
In the electronic circuit module of the present invention, a convex portion is formed on one end surface of the substrate with a higher processing accuracy than the processing accuracy of the side end surface, and the positioning portion of the case is brought into contact with the convex portion to mount the case. Therefore, the case can be properly attached to the circuit board without being affected by the flash generated on the side end surface of the substrate.

Further, by providing the signal input / output section with the convex portion as a reference, it becomes possible to accurately connect the signal input / output section and the motherboard when the electronic circuit module is mounted on the motherboard or the like. Moreover, by soldering the contact portion between the convex portion of the substrate and the positioning portion of the case, solder joining is performed in a portion without a gap, and an electronic circuit module having high electrical reliability can be provided.

Further, when the electronic circuit module is mounted on the mother board through the kink portion provided on the case, the insertion of the kink portion is stopped at the position where the tip of the convex portion contacts the mother board, and the case and the circuit. The mounting position of the component board with respect to the motherboard can be set accurately. As a result, a special stopper is not required to be formed on the kink portion, the case can be easily manufactured, and the productivity of the electronic circuit module can be improved and the cost can be reduced.

[Brief description of drawings]

FIG. 1 is a diagram illustrating an electronic circuit module of the present invention,
(A) is a perspective view and (b) is a partially enlarged view of a main part.

FIG. 2 is a perspective view illustrating a mounting state on a motherboard.

FIG. 3 is a perspective view illustrating a soldering state.

FIG. 4 is a diagram illustrating a conventional example, (a) is a perspective view,
(B) shows the distance between the kink and the lead, and (c) shows the soldered state.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Electronic circuit module 2 Circuit component plate 3 Case 4 Solder 10 Motherboard 11 Kink insertion hole 12 Lead insertion hole 20 Board 20a One end face 20b Side end face 20c Other end face 21 Signal input / output part 21a Lead 22 Convex part 31 Positioning part 32 Kink part

Claims (4)

[Claims] 1. A circuit component plate in which a predetermined electronic circuit is formed on a substrate having a substantially rectangular shape, and a signal input / output section of the electronic circuit is provided on one end face of the substrate, and a substrate substantially perpendicular to the one end face of the substrate. An electronic circuit module comprising two side end faces and a case mounted on the circuit component board so as to surround the other end face substantially parallel to the one end face, wherein the circuit component plate is provided on at least one end face of the substrate. The board is provided with a convex portion formed with a processing accuracy higher than that of the side end surface of the substrate, and the case contacts the convex portion when mounted on the circuit component board, and the circuit component plate and the case. An electronic circuit module comprising a positioning portion for performing positioning with the electronic circuit module. 2. The electronic circuit module according to claim 1, wherein the signal input / output unit is arranged with reference to the position of the convex portion. 3. The electronic circuit module according to claim 1, wherein soldering is performed at a contact portion between the convex portion and the positioning portion. 4. An electronic circuit module for connecting to a mother board via a kink portion provided in the case, wherein a tip of the convex portion is connected to the mother board when the kink portion is inserted into the mother board. The electronic circuit module according to any one of claims 1 to 3, wherein the electronic circuit module is in contact with each other and defines a mounting position of the case and the circuit component plate with respect to the motherboard.