CN110012589A - The assemble method and flexible circuit template die group of flexible circuit template die group - Google Patents
The assemble method and flexible circuit template die group of flexible circuit template die group Download PDFInfo
- Publication number
- CN110012589A CN110012589A CN201811613529.5A CN201811613529A CN110012589A CN 110012589 A CN110012589 A CN 110012589A CN 201811613529 A CN201811613529 A CN 201811613529A CN 110012589 A CN110012589 A CN 110012589A
- Authority
- CN
- China
- Prior art keywords
- flexible circuit
- circuit board
- metallic conduction
- die group
- template die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The present invention provides the assemble methods of flexible circuit template die group and flexible circuit template die group, wherein the assemble method of the flexible circuit template die group includes: to fit in cover film on flexible circuit board ontology；The cover film is pressed on the flexible circuit board ontology；The position processing of metallic conduction piece on the flexible circuit board ontology is corresponded on the cover film for the opening exposed for the metallic conduction piece.The present invention corresponds to metallic conduction piece again and is open to cover film by first fitting in cover film on flexible circuit board ontology, improves the aligning accuracy of opening with metallic conduction piece, and overflow adhesive influences the area that metallic conduction piece exposes.
Description
[technical field]
The present invention relates to flexible circuit board field more particularly to the assemble methods and flexible circuit board of flexible circuit template die group
Mould group.
[background technique]
One layer of cover film protection copper wire or via hole are covered on flexible circuit board, cover film, which needs to be open, to be exposed for contact
Or the metallic conduction piece of welding, the general flow of the prior art are as follows: be first open, then cover film conformed to soft in advance in cover film
Property circuit board on, then cover film is pressed, however, during fitting, it is difficult to opening be aligned with metallic conduction piece accurately, and be bonded
With irregular excessive glue is had in bonding processes, influence product quality, and as flexible circuit board application is miniaturized, precise treatment, such as
Upper process is unable to satisfy required precision.
Therefore, it is necessary to provide a kind of assemble method of flexible circuit template die group to solve the above problems.
[summary of the invention]
Opening is set to align flexibility accurate and that excessive glue does not occur with metallic conduction piece the purpose of the present invention is to provide a kind of
The assemble method of circuit board module group.
Technical scheme is as follows: a kind of assemble method of flexible circuit template die group, comprising:
Laminating step fits in cover film on flexible circuit board ontology；
Step is pressed, the cover film is pressed on the flexible circuit board ontology；
Opening procedure, the position processing that metallic conduction piece on the flexible circuit board ontology is corresponded on the cover film are used
In the opening exposed for the metallic conduction piece.
Preferably, the opening is cut by laser mode and processes to be formed.
Preferably, orthographic projection and the metallic conduction piece of the opening on the flexible circuit board ontology are described soft
Property circuit board body on orthographic projection position deviation be less than or equal to 0.05mm.
Preferably, orthographic projection and the metallic conduction piece of the opening on the flexible circuit board ontology are described soft
Property circuit board body on orthographic projection position deviation be 0.03mm.
Preferably, the metallic conduction piece is circle.
Preferably, the diameter of the metallic conduction piece is 0.25mm ± 0.05mm.
The purpose of the present invention is to provide a kind of flexible circuit template die group, including flexible circuit board ontology, be set to it is described soft
Property circuit board body on metallic conduction piece and the front cover that is covered on the flexible circuit board ontology, the front is covered
It corresponds to the metallic conduction piece on epiphragma to offer for the opening for metallic conduction piece exposing, the front cover is adopted
It is bonded with the assemble method of flexible circuit template die group as described above.
Preferably, the flexible circuit board ontology is equipped at least two metallic conduction pieces, the front cover
It is equipped with the opening identical with the metallic conduction piece quantity, each opening respectively corresponds the metallic conduction
Piece setting.
Preferably, the flexible circuit board ontology includes substrate with the first front and the first reverse side, is set to described the
Positive copper wire layer on one front, the reverse side copper wire layer on first reverse side, the front copper wire layer, which has, deviates from institute
The second front of substrate is stated, the metallic conduction piece is convexly equipped on second front, and the front cover is covered in described
On second front.
Preferably, the flexible circuit board ontology further includes reverse side cover film, the reverse side cover film be attached at it is described just
Face copper wire layer back on the surface of the substrate.
The beneficial effects of the present invention are: it is corresponded to again by being first bonded, being pressed on flexible circuit board ontology by cover film
Metallic conduction piece is open to cover film, improves the aligning accuracy of opening Yu metallic conduction piece, and overflow adhesive influences metal
The area that conductive sheet exposes.
[Detailed description of the invention]
Fig. 1 is the front schematic view of flexible circuit template die group provided in an embodiment of the present invention；
Fig. 2 is the side sectional view of flexible circuit board in Fig. 1；
Fig. 3 is the flow chart of the assemble method of flexible circuit template die group provided in an embodiment of the present invention.
100, flexible circuit template die group；10, flexible circuit board ontology；1, substrate；21, positive copper wire layer；22, reverse side copper wire
Layer；31, front cover；301, it is open；32, reverse side cover film；4, metallic conduction piece.
[specific embodiment]
The invention will be further described for 1-2 and embodiment with reference to the accompanying drawing.
Fig. 1 and Fig. 3 are please referred to, flexible circuit template die group 100 includes flexible circuit board ontology 10 and is attached at flexible circuit
For the metallic conduction piece 4 that contacts or weld on plate ontology 10, the front cover that is sticked also is needed on flexible circuit board ontology 10
31, it needs on front cover 31 to be open and exposes metallic conduction piece 4, flexible circuit template die group provided in an embodiment of the present invention
100 assemble method, comprising:
S11, front cover 31 is fitted on flexible circuit board ontology 10 by glue；
S12, front cover 31 is pressed on flexible circuit board ontology 10；
S13, it is processed on front cover 31 by laser for the opening 301 exposed for metallic conduction piece 4, it is specific to grasp
When making, by controlling the energy of laser, laser may make only to cut front cover 31.
In the present embodiment, the edge line of laser sintered opening 301 simultaneously goes formation opening 301 after material, using first fitting, presses
The technique of laser opening 301 after tight front cover 31, may make orthographic projection of the opening 301 on flexible circuit board ontology 10
It is less than or equal to 0.05mm with orthographic projection position deviation of the metallic conduction piece 4 on flexible circuit board ontology 10, even up to
0.03mm effectively increases the aligning accuracy of opening 301 with metallic conduction piece 4, and overflow adhesive influences metallic conduction piece 4 and exposes
Area.
Preferably, the shape of metallic conduction piece 4 is circle, and diameter is 0.25mm ± 0.05mm.It of courses, concrete application
In, the size and shape of metallic conduction piece 4 are without being limited thereto, such as the shape of metallic conduction piece 4 may be rectangle or irregular
Shape etc..
Other than laser, other cutting modes processing opening 301 also can be used, as cutter is cut.
Except through glue, front cover 31 and flexible circuit board ontology 10 can also pass through the modes gluing such as double-sided adhesive.
Referring to Fig. 2, flexible circuit board ontology 10 is covered including substrate 1, positive copper wire layer 21, reverse side copper wire layer 22, front
Epiphragma 31 and reverse side cover film 32, positive copper wire layer 21 and reverse side copper wire layer 22 are respectively arranged at two opposite sides of substrate 1
On, front cover 31 is covered in positive copper wire layer 21 on the side of substrate 1, and reverse side cover film 32 is covered in reverse side copper wire
Layer 22 is on the side of substrate 1, and metallic conduction piece 4 is set to positive copper wire layer 21 back on the surface of substrate 1, and front is covered
The assemble method of the flexible circuit template die group 100 provided through the embodiment of the present invention on epiphragma 31 is offered for for metallic conduction
The exposed opening 301 of piece 4.
Flexible circuit board ontology 10 is equipped with two rows of metallic conduction pieces 4, and every row is equipped with 3 metallic conduction pieces 4, front covering
Each metallic conduction piece 4 is corresponded on film 31 and is provided with opening 301, in this way, being conducive to improve the processing efficiency of opening 301, at it
In his embodiment, the quantity and arrangement mode of metallic conduction piece 4 are not limited to foregoing description.
Reverse side copper wire layer 22 is equipped with the strengthening course 5 being disposed opposite to each other with metallic conduction piece 4, reinforcement away from the side of substrate 1
The corresponding metallic conduction piece 4 of layer 5 is arranged, in this way, strengthening course 5 is set between reverse side copper wire layer 22 and reverse side cover film 32, for increasing
Add the intensity in corresponding 4 region of metallic conduction piece of flexible circuit board ontology 10., reverse side cover film 32 and reverse side copper wire layer 22 and mend
Strong layer 5 is bonded the fixed function due to reverse side cover film 32, and strengthening course 5 is not easy to remove in copper wire layer 22 from the negative.
Front cover 31 is first bonded when assembling front cover 31 and is pressed in flexible electrical by the embodiment of the present invention
It on road plate ontology 10, then is open by laser to front cover 31 and exposes metallic conduction piece 4, so that opening 301 is led with metal
Electric piece 4 aligns precisely, and dimensional accuracy is high, and overflow adhesive influences the area that metallic conduction piece 4 exposes.
Flexible circuit template die group 100 provided by the invention is preferred on loudspeaker.
Above-described is only embodiments of the present invention, it should be noted here that for those of ordinary skill in the art
For, without departing from the concept of the premise of the invention, improvement can also be made, but these belong to protection model of the invention
It encloses.
Claims (10)
1. a kind of assemble method of flexible circuit template die group characterized by comprising
Laminating step fits in cover film on flexible circuit board ontology；
Step is pressed, the cover film is pressed on the flexible circuit board ontology；
Opening procedure, the position that metallic conduction piece on the flexible circuit board ontology is corresponded on the cover film are processed for supplying
The exposed opening of the metallic conduction piece.
2. the assemble method of flexible circuit template die group according to claim 1, it is characterised in that: the opening passes through laser
Cutting mode is processed to be formed.
3. the assemble method of flexible circuit template die group according to claim 1, it is characterised in that: the opening is described soft
The orthographic projection position deviation of orthographic projection and the metallic conduction piece on the flexible circuit board ontology in property circuit board body
Less than or equal to 0.05mm.
4. the assemble method of flexible circuit template die group according to claim 3, it is characterised in that: the opening is described soft
The orthographic projection position deviation of orthographic projection and the metallic conduction piece on the flexible circuit board ontology in property circuit board body
For 0.03mm.
5. the assemble method of flexible circuit template die group according to claim 1, it is characterised in that: the metallic conduction piece is
It is round.
6. the assemble method of flexible circuit template die group according to claim 5, it is characterised in that: the metallic conduction piece
Diameter is 0.25mm ± 0.05mm.
7. a kind of flexible circuit template die group is led including flexible circuit board ontology, the metal on the flexible circuit board ontology
Electric piece and the front cover being covered on the flexible circuit board ontology correspond to the metallic conduction on the front cover
Piece offers the opening for exposing for the metallic conduction piece, which is characterized in that the front cover is used as right is wanted
The assemble method of flexible circuit template die group described in any one of 1-6 is asked to be bonded.
8. flexible circuit template die group according to claim 7, it is characterised in that: the flexible circuit board ontology is equipped with extremely
Few two metallic conduction pieces, the front cover are equipped with the opening identical with the metallic conduction piece quantity,
Each opening respectively corresponds the metallic conduction piece setting.
9. flexible circuit template die group according to claim 8, it is characterised in that: the flexible circuit board ontology includes having
First front and the substrate of the first reverse side, the positive copper wire layer on first front, on first reverse side
Reverse side copper wire layer, the front copper wire layer have away from the second front of the substrate, and the metallic conduction piece is convexly equipped in described
On second front, the front cover is covered on second front.
10. flexible circuit template die group according to claim 9, it is characterised in that: the flexible circuit board ontology further includes
Reverse side cover film, the reverse side cover film be attached at the reverse side copper wire layer back on the surface of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811613529.5A CN110012589B (en) | 2018-12-27 | 2018-12-27 | Assembling method of flexible circuit board module and flexible circuit board module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811613529.5A CN110012589B (en) | 2018-12-27 | 2018-12-27 | Assembling method of flexible circuit board module and flexible circuit board module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110012589A true CN110012589A (en) | 2019-07-12 |
| CN110012589B CN110012589B (en) | 2021-04-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811613529.5A Expired - Fee Related CN110012589B (en) | 2018-12-27 | 2018-12-27 | Assembling method of flexible circuit board module and flexible circuit board module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110012589B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110139496A (en) * | 2019-05-07 | 2019-08-16 | 深圳市新宇腾跃电子有限公司 | A kind of cover film windowing process |
| CN114474699A (en) * | 2021-12-23 | 2022-05-13 | 深圳市鑫达辉软性电路科技有限公司 | Process for adding PT film to flexible circuit board cover film |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102307433A (en) * | 2011-04-03 | 2012-01-04 | 广东生益科技股份有限公司 | Method for manufacturing flexible printed circuit board |
| CN104797082A (en) * | 2015-05-14 | 2015-07-22 | 昆山意力电路世界有限公司 | Intensive-bonding-pad high-density board and windowing method thereof |
| CN105142337A (en) * | 2015-09-10 | 2015-12-09 | 深圳华麟电路技术有限公司 | Inner layer bonding pad later-windowed rigid-flexible printed circuit board and manufacturing method thereof |
| CN107231755A (en) * | 2017-07-21 | 2017-10-03 | 维沃移动通信有限公司 | A kind of flexible PCB and preparation method thereof, mobile terminal |
| CN206743663U (en) * | 2017-04-21 | 2017-12-12 | 华显光电技术（惠州）有限公司 | FPC golden finger structures and FPC welding structures |
-
2018
- 2018-12-27 CN CN201811613529.5A patent/CN110012589B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102307433A (en) * | 2011-04-03 | 2012-01-04 | 广东生益科技股份有限公司 | Method for manufacturing flexible printed circuit board |
| CN104797082A (en) * | 2015-05-14 | 2015-07-22 | 昆山意力电路世界有限公司 | Intensive-bonding-pad high-density board and windowing method thereof |
| CN105142337A (en) * | 2015-09-10 | 2015-12-09 | 深圳华麟电路技术有限公司 | Inner layer bonding pad later-windowed rigid-flexible printed circuit board and manufacturing method thereof |
| CN206743663U (en) * | 2017-04-21 | 2017-12-12 | 华显光电技术（惠州）有限公司 | FPC golden finger structures and FPC welding structures |
| CN107231755A (en) * | 2017-07-21 | 2017-10-03 | 维沃移动通信有限公司 | A kind of flexible PCB and preparation method thereof, mobile terminal |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110139496A (en) * | 2019-05-07 | 2019-08-16 | 深圳市新宇腾跃电子有限公司 | A kind of cover film windowing process |
| CN114474699A (en) * | 2021-12-23 | 2022-05-13 | 深圳市鑫达辉软性电路科技有限公司 | Process for adding PT film to flexible circuit board cover film |
| CN114474699B (en) * | 2021-12-23 | 2024-02-02 | 深圳市鑫达辉软性电路科技有限公司 | Technology for increasing PT film on flexible circuit board cover film |
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| Publication number | Publication date |
|---|---|
| CN110012589B (en) | 2021-04-27 |
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