CN111867245A - MiniLED substrate, module and module manufacturing method - Google Patents
MiniLED substrate, module and module manufacturing method Download PDFInfo
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- CN111867245A CN111867245A CN202010507860.XA CN202010507860A CN111867245A CN 111867245 A CN111867245 A CN 111867245A CN 202010507860 A CN202010507860 A CN 202010507860A CN 111867245 A CN111867245 A CN 111867245A
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- white resin
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
The invention relates to a MiniLed substrate, a module and a module manufacturing method, wherein the MiniLed substrate comprises substrates, a plurality of bonding pads are arranged on each substrate, a white resin film surrounding the bonding pads is attached to the outer sides of the corresponding bonding pads of the substrates, the surface tension of the white resin film is not less than the viscosity of the white resin film, and a release protective film in the same shape as the white resin film is attached to one side of the white resin film, which is far away from the substrates. The invention has the effects of improving the welding offset condition of MiniLed in reflow soldering, ensuring uniform luminous brightness under the condition that MiniLed is not damaged and fundamentally improving the repair condition.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to a MiniLed substrate, a MiniLed module and a module manufacturing method.
Background
The MiniLed chip is an LED chip with a chip size of about 100 μm × 100 μm, has the advantages of high color saturation, local dimming, high brightness, energy saving, and the like, can be applied to a backlight display, and has become a recent research hotspot. To improve the color rendering of a backlight display.
The existing MiniLed module usually mounts a MiniLed chip on a PCB to realize an ultra-small light mixing distance. At present, in the manufacturing of the MiniLed module, the MiniLed is generally placed on the PCB first, and then the MiniLed is directly soldered on the PCB by reflow soldering.
However, when the MiniLed module is manufactured, the MiniLed is very likely to generate soldering offset in reflow soldering, thereby reducing the mounting yield of the MiniLed module. The MiniLed backlight module has the problems of uneven brightness, difficult repair and the like.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a MiniLed substrate which can improve the welding offset condition of the MiniLed in reflow soldering; the second purpose of the present invention is to provide a MiniLed module, which can improve the welding offset condition of MiniLed in reflow soldering; the third purpose of the invention is to provide a manufacturing method of a MiniLed module, which improves the welding offset condition of the MiniLed in reflow soldering, thereby ensuring the uniform brightness of the light and fundamentally improving the repair condition under the condition that the MiniLed is not damaged.
One of the above-mentioned objects of the present invention is achieved by the following technical solutions:
A MiniLed substrate comprises substrates, wherein a plurality of bonding pads are arranged on each substrate, a white resin film surrounding the bonding pads is attached to the outer side, corresponding to the bonding pads, of each substrate, each white resin film comprises a polycarbonate film, and a release protective film which is identical to the white resin film in shape is attached to one side, away from the substrates, of each white resin film.
By sampling the above technical scheme: when the LED packaging structure is used, the release protective film on the surface of the white resin film can be directly torn off, then all pins of the MiniLed are directly inserted into the corresponding bonding pads, the middle part of the MiniLed is attached to the white resin film, then reflow soldering is adopted, the MiniLed and the bonding pads are welded, the LED welding offset problem is solved, the white resin film is upwards wrapped by the LEDs under the influence of temperature and surface tension, the white resin film can also serve as reflected light, and the backlight brightness is improved.
The second object of the present invention is achieved by the following technical solutions:
a MiniLed module comprises a substrate, wherein a plurality of bonding pads are arranged on the substrate, a white resin film surrounding the bonding pads is attached to the outer side, corresponding to the bonding pads, of the substrate, the white resin film comprises a polycarbonate film, a MiniLed which is attached to the white resin film and is inserted into the bonding pads respectively is further arranged on the substrate, a soldering paste is arranged between the pins of the MiniLed and the bonding pads, and the upper side of part of the white resin film bends towards the direction of the side walls of the MiniLed and is attached to the side walls of the MiniLed.
Through sampling above-mentioned technical scheme, carry on spacingly to each MiniLed through the white resin film that adopts, can guarantee the location when MiniLed and base plate reflow soldering, prevent MiniLed skew, guarantee MiniLed's welding yield, secondly, white resin film also can be as the effect of reverberation, improves backlight brightness.
The third object of the present invention is achieved by the following technical solutions:
a manufacturing method of a MiniLed module comprises the following steps:
designing a substrate circuit, designing a corresponding circuit on a substrate according to requirements, and completing the forming of a bonding pad;
laminating a substrate, namely attaching a layer of white resin film with the surface tension not less than the viscosity of the white resin film to the position, corresponding to each bonding pad, of the substrate, wherein the white resin film is in a frame-shaped structure capable of surrounding the bonding pad, and a release protective film is attached to one side, away from the substrate, of the white resin film;
coating tin on the substrate, covering the substrate attached with the white resin film with a screen plate corresponding to the bonding pads, coating tin paste on each bonding pad, and ensuring that the height of the tin paste is not higher than the upper surface of the white resin film;
step four, sticking the MiniLed, tearing off the release protective film on the outer side of the white resin film, and moving the MiniLed to the position of each bonding pad on the substrate to bond the MiniLed and the white resin film;
And step five, welding the MiniLed and the bonding pad in a reflow soldering mode, and after the welding is finished, covering the MiniLed side wall upwards by the white resin film under the action of temperature and surface tension.
By adopting the technical scheme, after the circuit design on the substrate is finished, the processed white resin film is attached to the periphery of the bonding pad and used for bonding the MiniLED, the LED is fixed in the reflow soldering process, the LED soldering offset problem is further improved, the white resin film can also serve as reflected light, and the backlight brightness is improved.
The present invention in a preferred example may be further configured to: the forming method of the white resin whole film and the release protective film comprises the following steps:
(1) selecting a whole white resin film and a whole release protection film;
(2) attaching the release protective whole film to the surface of the white resin whole film;
(3) designing a cutting die according to the size of the bonding pad;
(4) and punching the white resin film attached with the whole release protection film by adopting a cutting die to form the white resin film and the release protection film meeting the requirements.
By adopting the technical scheme: firstly, with the whole membrane laminating of type protection in the whole membrane surface of white resin, can protect the whole membrane of white resin, and conveniently take, secondly, adopt the cross cutting technology directly to the laminating have the whole membrane of white resin from the whole membrane of type protection to carry out die-cut shaping, convenient operation, and can guarantee from the whole precision of type protection film and white resin membrane.
The present invention in a preferred example may be further configured to: when the cutter die punches the whole white resin film, the cutter die is kept inclined, so that the section of the inner groove punched by the white resin film is trapezoidal.
By adopting the technical scheme, when the cutting die with the inclination angle is used for punching the whole white resin film, the die cutting pressure is small, and the forming is simple.
The present invention in a preferred example may be further configured to: the cutting edge angle of the cutting die is 42 degrees.
The present invention in a preferred example may be further configured to: the width of each side of the white resin film is less than the MiniLed thickness.
By adopting the technical scheme, when each side of the white resin film is upwards wrapped by each side of the MiniLed under the influence of temperature and surface tension, the white resin film can be ensured to wrap a part of the side wall of the MiniLed and can be prevented from excessively extending out of the upper side of the MiniLed, and the influence on the use of the MiniLed is avoided.
The present invention in a preferred example may be further configured to: the white resin film includes polycarbonate.
In summary, the invention includes at least one of the following beneficial technical effects:
1. after the circuit design on the substrate is finished, a layer of processed white resin film is attached to the periphery of the bonding pad and used for bonding a MiniLED, and the LED is fixed in the reflow soldering process, so that the LED soldering offset problem is improved, and the white resin film can also serve as reflected light to improve the backlight brightness;
2. The method comprises the following steps of firstly, attaching a release type protection whole film to the surface of a white resin whole film, protecting the white resin whole film and facilitating taking, and secondly, directly punching and forming the white resin whole film attached with the release type protection whole film by adopting a die cutting process, so that the operation is convenient, and the integral precision of the release type protection film and the white resin film can be ensured;
3. when each side of the white resin film is upwards wrapped on each side of the MiniLed under the influence of temperature and surface tension, the white resin film can be ensured to wrap a part of the side wall of the MiniLed, the white resin film can be prevented from excessively extending out of the upper side of the MiniLed, and the influence on the use of the MiniLed is avoided.
Drawings
Fig. 1 is a schematic view of a solder substrate structure.
Fig. 2 is a schematic structural view of a substrate before being coated with tin.
Fig. 3 is a schematic structural diagram of the substrate after the MiniLed pin is soldered.
In the figure, 1, a substrate; 11. a welding zone; 12. a pad; 2. a white resin film; 3. a release protective film; 4. MiniLed; 41. a pin; 5. a solder paste.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The first embodiment is as follows: referring to fig. 1 and 2, a MiniLed substrate disclosed by the present invention includes a substrate 1, a plurality of bonding pads 11 are uniformly disposed on the substrate 1, each bonding pad 11 includes two bonding pads 12, a white resin film 2 is bonded to an outer side of the substrate 1 corresponding to the bonding pad 12, the white resin film 2 is in a frame structure surrounding the bonding pad 12, a notch shape of the white resin is the same as the shape of the bonding pad 12, the white resin film 2 is made of a material having a surface tension not less than a viscosity thereof, such as polycarbonate, a release protection film 3 is further bonded to a side of the white protection film away from the substrate 1, and a shape of the release protection film 3 is the same as the shape of the white resin film 2.
The implementation principle of the embodiment is as follows: when the LED soldering offset protection film is used, the release protection film 3 on the surface of the white resin film 2 can be directly torn off, then the pins 41 of the MiniLed4 are directly inserted into the corresponding soldering pads 12, the middle part of the MiniLed4 is attached to the white resin film 2, then the MiniLed4 and the soldering pads 12 are soldered by adopting reflow soldering, the LED soldering offset problem is improved, the white resin film 2 is enabled to wrap the LED upwards under the influence of temperature and surface tension, the white resin film 2 can also serve as the function of reflecting light, and the backlight brightness is improved.
Example two: referring to fig. 2 and 3, in the MiniLed module disclosed in the present invention, a plurality of lands 11 are uniformly disposed on a substrate 1, each land 11 includes two pads 12, a white resin film 2 is bonded to an outer side of the substrate 1 corresponding to the pad 12, the white resin film 2 has a frame structure surrounding the pad 12, a notch shape of the white resin film 2 is the same as a shape of the pad 12, and the white resin film 2 is made of a material having a surface tension not less than a viscosity thereof, such as polycarbonate. MiniLed4 attached to the upper side of the white resin film 2 is further provided in each land 11 of the substrate 1, two pins 41 are provided below the MiniLed4, the two pins 41 are respectively inserted into the two pads 12 of the land 11, solder paste 5 is provided between the pin 41 of the MiniLed4 and the pad 12, and the pad 12 and the MiniLed4 pin 41 are fixed by the solder paste 5. The upper side of the white resin film 2 is also partially bent toward the side wall of the MiniLed4 and is adhered to the side wall of the MiniLed 4.
The implementation principle of the embodiment is as follows: the adopted white resin film 2 limits each MiniLed4, so that the positioning of MiniLed4 and the substrate 1 during reflow soldering can be ensured, the MiniLed4 is prevented from deviating, the soldering yield of MiniLed4 is ensured, and the white resin film 2 can also act as reflected light to improve the backlight brightness.
Example three: the invention discloses a method for manufacturing a MiniLed module, which comprises the following steps:
referring to fig. 1, step one, designing a circuit of a substrate 1, designing a corresponding circuit on the substrate 1 as required, and completing the molding of a bonding pad 12;
referring to fig. 2, step two, laminating the substrate 1, attaching a layer of white resin film 2 with surface tension not less than viscosity to the position corresponding to each pad 12 on the substrate 1, wherein polycarbonate can be used as the white resin film 2, the white resin film 2 is in a frame-shaped structure capable of surrounding the pad 12, the width of each side of the white resin film 2 is less than the thickness of MiniLed4, and simultaneously attaching a release protection film 3 with the same shape as the white resin film 2 to the side of the white resin film 2 away from the substrate 1;
the forming method of the white resin film 2 and the release protective film 3 comprises the following steps:
(1) selecting a whole white resin film and a whole release protection film;
(2) Attaching the release protective whole film to the surface of the white resin whole film;
(3) designing a cutting die according to the size of the bonding pad 12;
(4) the white resin film 2 attached with the whole release protection film is punched by a cutting die to form the white resin film 2 and the release protection film 3 meeting the requirements, and when the white resin film is punched by the cutting die, the cutting die is kept to be arranged obliquely, so that the cutting edge angle of the cutting die is ensured to be 42 degrees, and the section of an inner groove punched by the white resin film 2 is trapezoidal;
step three, coating tin on the substrate 1, covering a screen plate corresponding to the bonding pads 12 on the substrate 1 attached with the white resin film 2, and coating tin paste on each bonding pad 12 to ensure that the height of the tin paste is not higher than the upper surface of the white resin film 2;
step four, sticking MiniLed4, tearing off the release protective film 3 on the outer side of the white resin film 2, and moving MiniLed4 to the position of each bonding pad 12 on the substrate 1 to enable MiniLed4 to be bonded with the white resin film 2;
referring to fig. 3, in step five, the MiniLed4 and the pad 12 are soldered by reflow soldering, and after the soldering is completed, the white resin film 2 will wrap up the side wall of the MiniLed4 under the temperature and surface tension.
The implementation principle of the embodiment is as follows: after the circuit design on the substrate 1 is finished, a processed white resin film 2 is attached to the periphery of the bonding pad 12 and used for bonding a miniLED, and the LED is fixed in the reflow soldering process, so that the LED soldering offset problem is improved, and the white resin film 2 can also serve as reflected light to improve the backlight brightness. In addition, when making the whole membrane of white resin and from type protection film 3, laminate the whole membrane of type protection in the whole membrane surface of white resin, can protect the whole membrane of white resin, and conveniently take, secondly, adopt the cross cutting technology directly to carry out die-cut shaping to the whole membrane of white resin that the laminating has the whole membrane of type protection, convenient operation, and can guarantee from the whole precision of type protection film 3 and white resin membrane 2.
The embodiments of the present invention are preferred embodiments of the present invention, and the scope of the present invention is not limited by these embodiments, so: all equivalent changes made according to the structure, shape and principle of the invention are covered by the protection scope of the invention.
Claims (8)
1. A MiniLed substrate, comprising: the adhesive tape comprises a substrate (1), wherein a plurality of bonding pads (12) are arranged on the substrate (1), a white resin film (2) surrounding the bonding pads (12) is attached to the outer side of the substrate (1) corresponding to the bonding pads (12), the surface tension of the white resin film (2) is not less than the viscosity of the white resin film, and a release protective film (3) which is the same as the shape of the white resin film (2) is attached to one side, away from the substrate (1), of the white resin film (2).
2. A MiniLed module, its characterized in that: the packaging structure comprises a substrate (1), wherein a plurality of bonding pads (12) are arranged on the substrate (1), a white resin film (2) surrounding the bonding pads (12) is attached to the outer side of the substrate (1) corresponding to the bonding pads (12), the surface tension of the white resin film (2) is not less than the viscosity of the white resin film, MiniLed (4) attached to the white resin film (2) and inserted into the bonding pads (12) respectively is arranged on the substrate (1), a soldering paste (5) is arranged between the pins (41) of the MiniLed (4) and the bonding pads (12), and part of the upper side of the white resin film (2) bends towards the side wall direction of the MiniLed (4) and is attached to the side wall of the MiniLed (4).
3. A manufacturing method of a MiniLed module comprises the following steps:
step one, designing a circuit of a substrate (1), designing a corresponding circuit on the substrate (1) according to requirements, and finishing the forming of a bonding pad (12);
step two, laminating the substrate (1), namely attaching a layer of white resin film (2) with the surface tension not less than the viscosity of the white resin film at the position, corresponding to each bonding pad (12), on the substrate (1), wherein the white resin film (2) is in a frame-shaped structure capable of surrounding the bonding pad (12), and a release protective film (3) is attached to one side, away from the substrate (1), of the white resin film (2);
coating tin on the substrate (1), covering the substrate (1) attached with the white resin film (2) with a screen plate corresponding to the bonding pads (12), coating tin paste on each bonding pad (12), and ensuring that the height of the tin paste is not higher than the upper surface of the white resin film (2);
step four, sticking a MiniLed (4), tearing off the release protective film (3) on the outer side of the white resin film (2), and moving the MiniLed (4) to the position of each bonding pad (12) on the substrate (1) to adhere the MiniLed (4) and the white resin film (2);
and step five, welding the MiniLed (4) and the bonding pad (12) in a reflow soldering mode, and after the welding is finished, the white resin film (2) is heated and subjected to surface tension to upwards wrap the side wall of the MiniLed (4).
4. The method of claim 3, wherein the MiniLed module comprises: the forming method of the white resin whole film and the release type protective film (3) comprises the following steps:
(1) selecting a whole white resin film and a whole release protection film;
(2) attaching the release protective whole film to the surface of the white resin whole film;
(3) designing a cutting die according to the size of the bonding pad (12);
(4) and punching the white resin film (2) adhered with the whole release protection film by adopting a cutting die to form the white resin film (2) and the release protection film (3) meeting the requirements.
5. The method of claim 4, wherein the MiniLed module comprises: when the cutter die punches the whole white resin film, the cutter die is kept inclined, so that the section of the inner groove of the white resin film (2) punched is trapezoidal.
6. The method of claim 5, wherein the MiniLed module comprises: the cutting edge angle of the cutting die is 42 degrees.
7. The method of claim 3, wherein the MiniLed module comprises: the width of each side of the white resin film (2) is smaller than the thickness of MiniLed (4).
8. The method of claim 3, wherein the MiniLed module comprises: the white resin film (2) comprises polycarbonate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010507860.XA CN111867245A (en) | 2020-06-05 | 2020-06-05 | MiniLED substrate, module and module manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010507860.XA CN111867245A (en) | 2020-06-05 | 2020-06-05 | MiniLED substrate, module and module manufacturing method |
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| CN111867245A true CN111867245A (en) | 2020-10-30 |
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| US20040108135A1 (en) * | 2002-10-11 | 2004-06-10 | Takeshi Ashida | Circuit board, mounting structure of ball grid array, electro-optic device and electronic device |
| US20040169275A1 (en) * | 2003-02-27 | 2004-09-02 | Motorola, Inc. | Area-array device assembly with pre-applied underfill layers on printed wiring board |
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Application publication date: 20201030 |