CN213718310U - Circuit board, lamp panel, backlight module and display device - Google Patents
Circuit board, lamp panel, backlight module and display device Download PDFInfo
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- CN213718310U CN213718310U CN202022497512.7U CN202022497512U CN213718310U CN 213718310 U CN213718310 U CN 213718310U CN 202022497512 U CN202022497512 U CN 202022497512U CN 213718310 U CN213718310 U CN 213718310U
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Abstract
The utility model provides a circuit board, lamp plate, backlight unit and display device, this circuit board includes: a plurality of bonding pads for bonding chips, wherein an insulating part is arranged around the bonding pads; the circuit board is also provided with a solder-open-proof window, and the solder-open-proof window exposes part of the bonding pad and extends to the exposed part of the insulating part; the solder mask layer is arranged on the surface of the circuit board except the solder mask windowing; the utility model provides a circuit board sets up the windowing scope including pad and insulating part through setting up insulating part around the pad, has enlarged the windowing scope to on the basis that does not influence pad welding effect, make the windowing scope more accurate, improve chip welding yield.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a circuit board, lamp plate, backlight unit and display device.
Background
At present, micro light emitting diode display is more and more favored by the market, and is different from the traditional liquid crystal display adopting a backlight scheme of light guide plate side-entering, and the micro light emitting diode display has the advantages of ultra-thinness, HDR technology, high resolution, high contrast, high brightness, high color gamut and the like. Resulting in still higher costs, which hinders its access to the mass market. Therefore, how to improve the bonding yield of the chip is a problem to be solved.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a circuit board, lamp plate, backlight unit and display device, the main technical problem who solves is: the problem of poor welding of a chip is caused by inaccurate windowing range of a welding disc of the existing circuit board.
In order to solve the above technical problem, the utility model provides a circuit board includes:
a plurality of bonding pads for bonding chips, wherein an insulating part is arranged around the bonding pads;
the circuit board is also provided with a solder-open-proof window, and the solder-open-proof window exposes part of the bonding pad and extends to the exposed part of the insulating part;
and the solder mask layer is arranged on the surface of the circuit board except the solder mask windowing.
Optionally, the shape of the anti-welding opening window is rectangular.
Optionally, the pad includes an anode pad and a cathode pad, and a line connected to the anode pad and a line connected to the cathode pad in the circuit board are asymmetric lines.
Optionally, a separation region for insulating and separating the positive electrode pad and the negative electrode pad is arranged between the positive electrode pad and the negative electrode pad, and the separation region is provided with at least one bending portion.
Optionally, the solder mask window includes the separation region, the insulating portion and a pad therebetween, and a pad width between the separation region and the insulating portion is greater than 1/2 of a chip width.
Optionally, the insulating part is made of resin.
Optionally, the solder mask layer is formed by digital ink jet printing.
Optionally, the circuit board further includes a protective layer covering the surface of the solder mask layer on the side away from the circuit board.
The utility model also provides a lamp plate, the lamp plate include the chip and as above arbitrary the circuit board, the chip weld in on the pad.
The utility model also provides a backlight module, backlight module includes light guide plate and above-mentioned lamp plate, the lamp plate set up in the light guide plate side.
The utility model also provides a display device, display device includes display panel and above-mentioned backlight unit.
The utility model has the advantages that:
the utility model provides a circuit board includes: a plurality of bonding pads for bonding chips, wherein an insulating part is arranged around the bonding pads; the circuit board is also provided with a solder-open-proof window, and the solder-open-proof window exposes part of the bonding pad and extends to the exposed part of the insulating part; the solder mask layer is arranged on the surface of the circuit board except the solder mask windowing; the utility model provides a circuit board sets up the windowing scope including pad and insulating part through setting up insulating part around the pad, has enlarged the windowing scope to on the basis that does not influence pad welding effect, make the windowing scope more accurate, improve chip welding yield.
Drawings
Fig. 1 is a schematic cross-sectional structure diagram of a circuit board according to an embodiment of the present invention;
fig. 2 is a top view of a circuit board according to a first embodiment of the present invention;
fig. 3 is a schematic cross-sectional view of another circuit board according to an embodiment of the present invention;
fig. 4 is a flowchart illustrating a manufacturing process of a flexible circuit board according to an embodiment of the present invention.
In fig. 1, 11 is a circuit board, 12 is a solder mask layer, 121 is a solder mask window, 13 is a chip, 14 is an insulating part, and 15 is a bonding pad; in fig. 3, 16 is a protective layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the embodiments of the present invention are described in further detail below with reference to the accompanying drawings by way of specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The first embodiment is as follows:
in order to solve the problem of poor chip soldering caused by inaccurate windowing range of a pad of an existing circuit board, the present embodiment provides a circuit board, specifically referring to fig. 1, where fig. 1 is a schematic cross-sectional structure diagram of the circuit board, the circuit board includes:
a plurality of bonding pads 15 for bonding chips, wherein an insulating part 14 is arranged around the bonding pads 15; the circuit board is further provided with a solder-resisting window 121, and the solder-resisting window 121 exposes a part of the pad 15 and extends to expose a part of the insulating part 14; and the solder mask layer 12 is arranged on the surface of the circuit board except the solder mask window 121, and the solder mask layer 12 is arranged on the surface of the circuit board except the solder mask window 121.
It should be noted that, among other things, the circuit board 11 has a carrying and supporting function for providing electrical power. In the embodiment of the present invention, the circuit board 11 is used for providing the driving electrical signal for the chip 13. In this embodiment, the chip may be a micro light emitting diode chip, which is only illustrated and not limited herein. The micro light-emitting diode 13 and the circuit board 11 are separately manufactured, the surface of the circuit board 11 comprises a plurality of bonding pads 15 for welding the micro light-emitting diode, after the micro light-emitting diode 12 is manufactured, the micro light-emitting diode 13 is transferred to the upper portion of the bonding pad 15 of the circuit board 11, the micro light-emitting diode 13 is welded on the circuit board 11 through processes such as reflow soldering and the like, and therefore the micro light-emitting diode 13 can be driven to emit light through input signals of the control circuit board 11.
In a specific implementation, the Circuit Board 11 may be a Printed Circuit Board (PCB), where the PCB includes an electronic Circuit and an insulating layer, and the insulating layer exposes a pad of the electronic Circuit, which is soldered to the micro light emitting diode 13, and covers the rest of the electronic Circuit.
Alternatively, the circuit board 11 may be an array substrate formed by fabricating a thin film transistor driving circuit on a substrate, the surface of the array substrate may have a connection electrode (i.e., a pad in the window) connected to the thin film transistor driving circuit, and the electrodes of the micro light emitting diodes 13 may be soldered to the connection electrodes in a one-to-one correspondence manner. The substrate or the substrate base plate of the above circuit board 11 may be made of a flexible material to form a flexible display device.
In the embodiment of the present invention, the circuit board 11 is plate-shaped, preferably, and is rectangular or square as a whole. The length of the circuit board 11 is 200mm-800mm, and the width is 100mm-500 mm. According to the size of the display device, the backlight module may include a plurality of circuit boards 11, and the circuit boards 11 are connected to each other in a splicing manner to provide backlight. In order to avoid the optical problem caused by the splicing of the circuit boards 11, the splicing seams between the adjacent circuit boards 11 are as small as possible, and even seamless splicing is realized.
The solder mask 12 covers the circuit board 11. The solder mask layer 12 may be a passivation layer located above the circuit board 11, and when the material with reflective property is coated on the surface of the circuit board 11, the passivation layer has a reflective function at the same time, so as to reflect the light incident to one side of the circuit board 11, thereby improving the utilization efficiency of the light. In the embodiment of the present invention, the welding-proof layer 12 can be made of white oil or other materials. A window is made in the solder mask layer 12 to further expose the pads on the circuit board 11. Wherein the pad includes: the areas of the corresponding windowing regions on the positive bonding pad and the negative bonding pad are equal, so that the micro light-emitting diode 13 can be accurately and effectively welded on the bonding pads.
Specifically, the circuit board 11 is taken as a flexible circuit substrate for explanation, and the preparation method comprises the following steps:
step S41, providing a flexible substrate with a front copper wire and a back copper wire on the surface, wherein the flexible substrate comprises a positive electrode pad and a negative electrode pad which are arranged at intervals, and positioning a middle area between the positive electrode pad and the negative electrode pad.
Step S42, preparing a white oil layer on the flexible substrate, and thinning the white oil layer in the middle area to form a height difference between the white oil layer in the middle area and the white oil layers in the other areas; wherein, thinning the white oil layer of the middle area comprises the following steps: and stamping the white oil layer at the middle area position by adopting a corresponding stamping die, or etching by adopting an etching mode.
Step S43, etching the white oil layer, forming a windowing region exposing at least the positive electrode pad and the negative electrode pad outside the middle region, and then curing the white oil layer; wherein etching the white oil layer comprises the following steps: and grabbing the center of the middle area, and etching from the boundary of the middle area to two sides or the periphery by taking the center of the middle area as a reference to expose the positive electrode bonding pad and the negative electrode bonding pad.
Preferably, in the embodiment of the present invention, a plurality of solder windows may be directly formed or may be directly formed in a digital inkjet printing manner.
And step S44, electrically connecting the miniature secondary light-emitting tube with the anode pad and the cathode pad respectively through the window-opening area. Specifically, before soldering, the micro-leds 13 may be moved above their corresponding pads by mechanical transfer. The mechanical arm for transferring the micro light-emitting diode 13 transfers the micro light-emitting diode 13 to the corresponding position above the circuit board 11 according to the nominal value of the windowing on the circuit board 11, and because the size of the micro light-emitting diode 13 is in the micron order, the requirement on the accuracy of the windowing of the circuit board 11 is very high, and if the bonding pads in the windowing cannot be aligned, the welding of the micro light-emitting diode 13 is poor.
Therefore, if only the positive electrode bonding pad and the negative electrode bonding pad are exposed, the windowing inaccuracy is easily caused, so that the bonding pad windowing copper-exposed positive electrode bonding pad and negative electrode bonding pad forming the bonding pad cannot meet the welding requirement of the micro light-emitting diode 13, and the welding of the micro light-emitting diode 13 is poor.
In order to solve the above problem, as shown in fig. 2, fig. 2 is a top view of a circuit board according to a first embodiment of the present invention. It can be seen that the solder mask window exposes the positive electrode pad and the negative electrode pad, and extends to expose a part of the insulation part around, wherein the width of the exposed insulation part may be 30-60 μm.
On the basis of not influencing the welding effect of the bonding pad, the windowing range is expanded, even if the windowing area is inaccurate to a certain degree, the windowing range of the bonding pad can be met, and the anode bonding pad and the cathode bonding pad of the bonding pad are completely exposed, so that the micro light-emitting diode 13 can be successfully welded on the anode bonding pad and the cathode bonding pad of the bonding pad, and the welding yield of the micro light-emitting diode 13 is improved.
In order to facilitate the identification of the polarity of the patch, an asymmetric line fool-proofing design is added, the pad comprises an anode pad and a cathode pad, and a line connected with the anode pad and a line connected with the cathode pad in the circuit board are asymmetric lines. The identification of the polarity of the patch is facilitated by designing an asymmetric line.
And a separation region for insulating and separating the positive electrode bonding pad and the negative electrode bonding pad is arranged between the positive electrode bonding pad and the negative electrode bonding pad, and at least one bending part is arranged in the separation region. The anti-warping capability of the PCB can be improved, the flatness in the printing process can be improved, the printing yield can be improved, and the service life of the steel mesh can be prolonged.
The solder mask window comprises the separation region, the insulating part and a pad between the separation region and the insulating part, and the width of the pad between the separation region and the insulating part is greater than 1/2 of the width of the chip.
Fig. 3 is a schematic cross-sectional view of another circuit board according to an embodiment of the present invention, as shown in fig. 3, the circuit board according to an embodiment of the present invention further includes a protection layer 16 covering on a surface of the solder mask layer 12 deviating from one side of the circuit board 11. The protective layer 16 serves to encapsulate the micro light emitting diode 13, thereby effectively preventing the micro light emitting diode from falling off and moisture. The material used for the protective layer 16 includes silicon gel, epoxy resin or other colloid material with higher transmittance. In practical applications, the micro light emitting diodes 13 may be formed on the surface by spraying or spot coating. Specifically, the protective layer 16 can be manufactured by a full-surface spraying method, and the production efficiency of the full-surface spraying manufacturing method is higher. In practical application, a mode of dispensing a colloid material above the micro light emitting diode 13 and packaging the micro light emitting diode 13 can be adopted, the colloid material can be saved by the dispensing packaging mode, the glue coating amount can be flexibly controlled, and the applicability is stronger.
The utility model provides a circuit board includes: a plurality of bonding pads for bonding chips, wherein an insulating part is arranged around the bonding pads; the circuit board is also provided with a solder-open-proof window, and the solder-open-proof window exposes part of the bonding pad and extends to the exposed part of the insulating part; the solder mask layer is arranged on the surface of the circuit board except the solder mask windowing; the utility model provides a circuit board sets up the windowing scope including pad and insulating part through setting up insulating part around the pad, has enlarged the windowing scope, because the windowing scope that increases is insulating part, even consequently enlarge the windowing scope, nevertheless still does not influence the size that the pad exposes to on the basis that does not influence pad welding effect, make the windowing scope more accurate, improve chip welding yield.
Example two
An embodiment of the utility model provides a still provide a lamp plate, the lamp plate includes the chip and as above embodiment one the circuit board, the chip weld in on the pad.
The embodiment of the utility model provides a still provide a backlight unit, backlight unit includes light guide plate and foretell lamp plate, the lamp plate set up in the light guide plate side.
The embodiment of the utility model provides a still provide a display device, display device includes display panel and foretell backlight unit.
It should be noted that the light emitting chip referred to in the embodiments of the present application includes at least one of a Light Emitting Diode (LED), a mini LED (or a small-pitch LED), a micro LED, and a nano-scale LED.
It should be understood that the circuit board provided in this embodiment may be applied to various light emitting fields, and besides the application to the backlight module and further to the display backlight field (which may be a backlight module of a terminal such as a television, a display, a mobile phone, etc.) shown in the foregoing, the circuit board may also be applied to the key backlight field, the photographing field, the household lighting field, the medical lighting field, the decoration field, the automobile field, the traffic field, etc. When the LED backlight source is applied to the key backlight field, the LED backlight source can be used as a key backlight light source of mobile phones, calculators, keyboards and other devices with keys; when the camera is applied to the field of shooting, a flash lamp of a camera can be manufactured; when the lamp is applied to the field of household illumination, the lamp can be made into a floor lamp, a table lamp, an illuminating lamp, a ceiling lamp, a down lamp, a projection lamp and the like; when the lamp is applied to the field of medical illumination, the lamp can be made into an operating lamp, a low-electromagnetic illuminating lamp and the like; when the decorative material is applied to the decorative field, the decorative material can be made into various decorative lamps, such as various colored lamps, landscape illuminating lamps and advertising lamps; when the material is applied to the field of automobiles, the material can be made into automobile lamps, automobile indicating lamps and the like; when the lamp is applied to the traffic field, various traffic lights and various street lamps can be manufactured. The applications described above are only a few applications exemplified by the present embodiment, and it should be understood that the application of the circuit board is not limited to the fields of the examples described above.
The foregoing is a more detailed description of embodiments of the present invention, and the specific embodiments are not to be considered in a limiting sense. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.
Claims (12)
1. A circuit board, comprising:
a plurality of bonding pads for bonding chips, wherein an insulating part is arranged around the bonding pads;
the circuit board is also provided with a solder-open-proof window, and the solder-open-proof window exposes part of the bonding pad and extends to the exposed part of the insulating part;
and the solder mask layer is arranged on the surface of the circuit board except the solder mask windowing.
2. The circuit board according to claim 1, wherein the width of the exposed insulating portion is 30 to 60 μm.
3. The circuit board of claim 1, wherein the solder opening prevention window is rectangular in shape.
4. The circuit board of claim 1, wherein the pads comprise a positive pad and a negative pad, and wherein the line connecting the positive pad and the line connecting the negative pad in the circuit board are asymmetric lines.
5. The circuit board of claim 4, wherein a separation region is disposed between the positive electrode pad and the negative electrode pad to insulate and separate the positive electrode pad and the negative electrode pad, and the separation region has at least one bent portion.
6. The circuit board of claim 5, wherein the solder mask window comprises the separation region, the insulating portion and a pad therebetween, and a pad width between the separation region and the insulating portion is greater than 1/2 of a chip width.
7. The circuit board according to claim 1, wherein a material of the insulating portion is resin.
8. The circuit board of claim 1, wherein the solder mask layer is formed by digital ink jet printing.
9. The circuit board of claim 1, further comprising a passivation layer covering a surface of the solder mask layer facing away from the circuit board.
10. A lamp panel, wherein the lamp panel comprises a chip and the circuit board of any one of claims 1-9, and the chip is soldered to the pad.
11. A backlight module is characterized in that the backlight module comprises a light guide plate and the lamp panel according to claim 10, wherein the lamp panel is arranged on the side face of the light guide plate.
12. A display device comprising a display panel and the backlight module according to claim 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022497512.7U CN213718310U (en) | 2020-10-30 | 2020-10-30 | Circuit board, lamp panel, backlight module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022497512.7U CN213718310U (en) | 2020-10-30 | 2020-10-30 | Circuit board, lamp panel, backlight module and display device |
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| Publication Number | Publication Date |
|---|---|
| CN213718310U true CN213718310U (en) | 2021-07-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022497512.7U Active CN213718310U (en) | 2020-10-30 | 2020-10-30 | Circuit board, lamp panel, backlight module and display device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023019628A1 (en) * | 2021-08-18 | 2023-02-23 | Tcl华星光电技术有限公司 | Backlight module and manufacturing method therefor, and display panel |
| US11852917B2 (en) | 2021-08-18 | 2023-12-26 | Tcl China Star Optoelectronics Technology Co., Ltd. | Backlight module and preparation method therefor, and display panel |
-
2020
- 2020-10-30 CN CN202022497512.7U patent/CN213718310U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023019628A1 (en) * | 2021-08-18 | 2023-02-23 | Tcl华星光电技术有限公司 | Backlight module and manufacturing method therefor, and display panel |
| US11852917B2 (en) | 2021-08-18 | 2023-12-26 | Tcl China Star Optoelectronics Technology Co., Ltd. | Backlight module and preparation method therefor, and display panel |
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