CN108363240A - Lamp bar and backlight module, display device - Google Patents
Lamp bar and backlight module, display device Download PDFInfo
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- CN108363240A CN108363240A CN201810136487.4A CN201810136487A CN108363240A CN 108363240 A CN108363240 A CN 108363240A CN 201810136487 A CN201810136487 A CN 201810136487A CN 108363240 A CN108363240 A CN 108363240A
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- lamp bar
- substrate
- led chip
- connecting pin
- backlight module
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133608—Direct backlight including particular frames or supporting means
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133612—Electrical details
Abstract
The invention belongs to display technology fields, and in particular to a kind of lamp bar and backlight module, display device.The lamp bar includes substrate and the fluorescent film of the multiple LED chips for being set to the substrate homonymy, the multiple LED chips of cladding, multiple LED chips are arranged along orientation interval, wherein, the one side that the LED chip is not arranged for the substrate is also arranged at intervals with multiple connecting pins, and each connecting pin is connect by connecting cabling with one or more LED chips;And in orientation, the distance between the adjacent connecting pin is less than the distance between the adjacent LED chip.The lamp bar realizes the design of narrow frame backlight module by the improvement of connection cabling and light extraction mode.
Description
Technical field
The invention belongs to display technology fields, and in particular to a kind of lamp bar and backlight module, display device.
Background technology
LCD(Liquid Crystal Display:Liquid crystal display device) it is current common flat display apparatus.Liquid crystal
It itself does not shine, therefore backlight module is used to provide necessary light source for imaging.In recent years, the application of linear light source encapsulating structure
Rapid growth realizes specific optics point by the way that multiple light emitting diodes (LED) are encapsulated in the plane of a small area
Cloth, have many advantages, such as size it is small, it is at low cost, be conducive to that heat dissipation, light emission rate is high and easily realizes automated production.
For narrow frame display device due to showing area bigger, visual stimulus is stronger, therefore can more cater to consumer's
Demand.With being announced to the world splendidly for millet MIX, the mobile phone of surrounding Rimless is even more a wind vane as market.Each mobile phone
Manufacturer is laid out screen accounting bigger 18 one after another:9 mobile phone products.COB (Chip On Board) technology is to realize narrow frame
Backlight module frame, can be narrowed within 2.8mm by one new application of (Narrow Bezel) mobile phone.
Current COB lamp bar construction packages are usually that side is illuminated (side view).As shown in figures 1A-c, COB lamps
Item includes the LED chip 2 (chip) and fluorescent film 3 for being set to 1 side of substrate;As shown in Fig. 2, (the Y behind fluorescent film 3 of substrate 1
Direction), the width and fluorescent film 3 of substrate 1 are wide (Z-direction), and 1 width of substrate is too narrow and can not be designed into walking line.As Fig. 2,
It shown in Fig. 3, can only be drawn out on intermediary FPC41 by solder joint 40, in the enterprising walking line designs of intermediary FPC41.That is LED chip 2
Intermediary FPC41 (Flexible Printed Circuit, abbreviation FPC, flexible PCB) is connected by solder joint 40, and is passed through
The control circuit (being not shown in Figure 1A-Fig. 1 C, Fig. 2) of Jie FPC41 and backlight connects.LED chip 2 therein is removed and 1 knot of substrate
The equal light extraction of other faces outside the face of conjunction, the illuminated lamp bar in the side are reversely attached at the top of light guide plate 7, but due to border width side
It is encapsulated as 0.75mm or so to (i.e. Y-direction) lamp bar, forms relatively large package dimension so that backlight module frame can not be received
It is too narrow within 2.0mm.
The design of backlight module for how realizing more narrow frame, becomes a technical problem to be solved urgently.
Invention content
The technical problem to be solved by the present invention is to be directed to above-mentioned deficiency in the prior art, a kind of lamp bar and backlight mould are provided
Group, display device, the lamp bar realize narrow frame backlight module by the improvement of connection cabling and light extraction mode.
Technical solution is the lamp bar used by solving present invention problem, including substrate and is set to the substrate
Multiple LED chips of homonymy, the fluorescent film of the multiple LED chips of cladding, multiple LED chips are set along orientation interval
It sets, wherein the one side that the LED chip is not arranged for the substrate is also arranged at intervals with multiple connecting pins, each connecting pin
It is connect with one or more LED chips by connecting cabling;
And in orientation, the distance between the adjacent connecting pin is less than the distance between the adjacent LED chip.
Preferably, the substrate is double face copper, and the double face copper corresponds to the region of each LED chip
Via is offered, the connection cabling extends to the connecting pin from the via.
Preferably, all the connecting pin is located in a draw-out area, and the draw-out area is in the lamp bar length
The heart.
Preferably, the connecting pin includes an anode connection terminal and at least one cathode connecting pin, all LED
The anode parallel connection of chip is connect with the anode connection terminal, is connected to multiple LED chips of a cathode connecting pin
Cathode be connected in series with or be connected in parallel, the anode connection terminal and the cathode connecting pin with connect FPC connections.
Preferably, the fluorescent film coats the LED chip, and the fluorescent film is not flushed with the edge of the substrate and set
It sets.
Preferably, shading reflecting layer, the edge in the shading reflecting layer are additionally provided in the side surface of the fluorescent film
It is flushed with the edge of the substrate.
A kind of backlight module, including above-mentioned lamp bar.
Preferably, the backlight module includes paranotum and the light guide plate on the inside of the paranotum, the lamp bar
By adhesive layer, it is set to position corresponding with the light guide plate on the paranotum.
Preferably, including light guide plate, plane is vertical plane where the substrate of the lamp bar and light guide plate place sets
It sets, the light-emitting surface of the lamp bar is towards the lateral incidence surface of the light guide plate, and the relatively described LED chip of the substrate is further from institute
State light guide plate.
A kind of display device, including above-mentioned backlight module.
The beneficial effects of the invention are as follows:The cabling of the lamp bar is arranged at the back side of substrate, realizes ultra-narrow frame module design;
Light extraction mode is illuminated by the illuminated top that is converted in side in the prior art, can save glue frame, and lamp bar can be arranged
On paranotum, smaller border width is occupied.
Description of the drawings
Figure 1A-Fig. 1 C are respectively the front view of side-emitting item, upward view and side view in the prior art;
Fig. 2 is the structural schematic diagram of backlight module in the prior art;
Fig. 3 is the cabling schematic diagram of side-emitting item in the prior art;
Fig. 4 is the manufacturing process schematic diagram of side-emitting item in the prior art;
Fig. 5 is the structural schematic diagram that luminous lamp strip is pushed up in the embodiment of the present invention 1;
Fig. 6 A- Fig. 6 C are respectively front view, vertical view and the side view that luminous lamp strip is pushed up in the embodiment of the present invention 1;
Fig. 7 A are the cabling schematic diagram that luminous lamp strip is pushed up in the embodiment of the present invention 1;
Fig. 7 B are the schematic diagram of via and connection cabling in substrate in the embodiment of the present invention 1;
Fig. 8 is the manufacturing process schematic diagram that luminous lamp strip is pushed up in the embodiment of the present invention 1;
Fig. 9 is the structural schematic diagram of backlight module in the embodiment of the present invention 2;
In attached drawing mark:
1- substrates;2-LED chips;3- fluorescent films;40- solder joints;41- intermediaries FPC;42- connections FPC;43- vias;5- hides
Reflection layer;6- protective layers;
7- light guide plates;8- reflecting plates;9- optical film layers;10- adhesive layers;11- adhesive tape;12- backboards;13- glue frames.
Specific implementation mode
To make those skilled in the art more fully understand technical scheme of the present invention, below in conjunction with the accompanying drawings and specific embodiment party
Formula is described in further detail lamp bar of the present invention and backlight module, display device.
Embodiment 1:
The present embodiment provides a kind of lamp bars that top is illuminated, to realize backlight module ultra-narrow frame design.
A kind of lamp bar, including substrate and be set to multiple LED chips of substrate homonymy, the multiple LED chips of cladding it is glimmering
Light film, multiple LED chips are arranged along orientation interval, and the one side that LED chip is not arranged for substrate is also arranged at intervals with multiple companies
End is connect, each connecting pin is connect by connecting cabling with one or more LED chips;And in orientation, adjacent connecting ends
Between distance be less than adjacent LED chip chamber distance.
As shown in Fig. 5, Fig. 6 A- Fig. 6 C, which includes substrate 1, LED chip 2, fluorescent film 3, LED chip 2 and fluorescent film
3 are set to the homonymy of substrate 1, and LED chip 2, which is arranged in order, constitutes the lamp bar with certain length.Wherein, LED chip 2 and control
The connection cabling of circuit is set to the one side formation connecting pin that LED chip 2 is not arranged for substrate 1.In the lamp bar of the present embodiment, substrate
For double face copper, the region that double face copper corresponds to each LED chip offers via, and connection cabling extends to company from via
Connect end.Here connecting pin, that is, solder joint 40.
Lamp bar generally includes multiple LED chips 2, and each LED chip 2 includes an anode and a cathode.Connecting pin
Including an anode connection terminal and at least one cathode connecting pin, the anode parallel connection of all LED chips is connect with anode connection terminal,
The cathode for being connected to multiple LED chips of a cathode connecting pin is connected in series with or is connected in parallel, and anode connection terminal and cathode connect
It connects end and connect FPC connections.Whole connecting pins are located in a draw-out area, and draw-out area is close to lamp bar lengthwise centers, such lamp bar
The cabling of the LED chip 2 at both ends to connecting pin summarizes from both ends to by paracentral position respectively on length direction, each
The width that end cabling occupies all will not be too wide, smaller in the size of Z-direction when ensureing that lamp bar is used.
Wherein, the distance between adjacent LED chip 2 is more than the distance between adjacent connecting ends, is connected in series with or parallel connection connects
Each cabling of the LED chip 2 connect, in the back side (one side that LED chip is not arranged) parallel arranged of substrate 1, and between cabling
Spacing it is preferably equal.
The lamp bar of the present embodiment determines parallel connection LED chip according to luminance parameter (spec), power consumption or technique regularity
2 quantity, Fig. 7 A and Fig. 7 B using after six 2 each adjacent two of LED chip are connected two-by-two, be connected in parallel draw connecting pin as
Example.In Fig. 7 A six LED chips 2 using three and cabling design (since the anode of all LED chips 2 links together,
Here for three and cabling is mainly for cathode), it is provided with the positive copper clad layers of LED chip 2 not cabling (preventing from cutting off),
The lead of LED chip 2 is drawn out to the copper clad layers at the back side by punching form, in the position of the anode and cathode of corresponding LED chip
It sets punching respectively and forms via 43;A (anode) is arranged in the copper clad layers that the reverse side of LED chip 2 is not arranged, (three negative by K1, K2, K3
Pole) four cablings, wherein the anode of six LED chips 2 connects a cabling to positive A, the moon of each adjacent two LED chip 2
Pole connects a cabling to cathode K, and so that above-mentioned four are walked the congruence to the same draw-out area is arrived, finally with the control of backlight
Circuit connects.Under normal conditions, 30-40 LED chip 2 can be set to a cathode connecting pin, and draw-out area is arranged
At 1/3 extension position of 2 orientation of LED chip.Fully consider that circuit designs, one end (such as paper of lamp bar in Fig. 7 B
Right end) there are two cathode cablings, one end (such as paper left end) to have a cathode cabling, anode cabling opposing cathode cabling
Closer to via 43, the overall width of such cabling is the width of two cablings and the distance of the two spacing, therefore can be with
Being sized in z-direction of substrate 1 is extremely narrow.
On substrate 1 due to the setting of connection cabling, FPC42 connections are connect connecting pin and, the cabling pattern in connection FPC42
Only play connection extension, therefore the integral thickness of lamp bar will not be increased.FPC42 is connected by connecting pin and backlight control electricity
The IC chip on road connects, and the cabling connected at this time on FPC42 need to only occupy very narrow width.
And in the lamp bar of the prior art, LED chip 2 and the cabling of control circuit are set on intermediary FPC41, i.e. intermediary
Setting connection cabling is needed on FPC41, to be matched with solder joint and control circuit.As shown in figure 3, the substrate 1 of the lamp bar of the prior art
Although being also double face copper, since substrate width only has, 0.35mm is even narrower, can not be carried out in copper clad layers complete
Portion's cabling (can only single LED chip 2 connect cabling) is provided with the positive copper clad layers of LED chip 2 not cabling, but logical
It crosses punching and the lead of LED chip 2 is directly drawn out to the copper clad layers of back side corresponding position, and corresponding solder joint 40 is set, it is adjacent
Mutually from farther out between solder joint 40, it is drawn out on intermediary FPC41 finally by solder joint 40, passes through the connection cabling on intermediary FPC41
It is connect with the main FPC of control circuit.
In lamp bar as shown in Figure 5, fluorescent film 3 coats LED chip 2, and fluorescent film 3 does not flush setting with the edge of substrate 1,
I.e. the edge of fluorescent film 3 and substrate 1 is mutually from setting.Preferably, and the side surface of fluorescent film 3 be additionally provided with shading reflecting layer
5, the edge in shading reflecting layer 5 is flushed with the edge of substrate 1.The setting in shading reflecting layer 5, on the one hand so that the lamp bar is formed as
Push up it is illuminated, on the other hand so that LED chip 2 light side carry out multiple reflections, with improve ejection light efficiency.
Preferably, it to prevent the fluorescent powder in fluorescent film 3 in high temperature and humidity or other adverse circumstances mesometamorphisms, needs
In the overall peripheral protective mulch 6 of lamp bar.Here it will be understood that other figures of the present embodiment in addition to Fig. 5, Fig. 8, are
The position relationship that each structure of lamp bar can preferably be illustrated, eliminates the signal of protective layer 6.
In the present embodiment, since lamp bar is to push up illuminated, substrate 1 (Y-direction) behind fluorescent film 3, the width of substrate 1
Than 3 wide 0.20mm of fluorescent film or so, therefore solder joint 40 can directly (connection FPC42 be not necessarily to routing of layout figure with FPC42 is connect
Case) connection, and then connect with the main FPC of control circuit.
According to design requirement, substrate 1 is completed to prepare lamp bar after punching penetrates through, cabling designs, in the present embodiment
The production method of lamp bar is as shown in figure 8, include step:
1) die bond:LED chip 2 is existed by surface mounting technology (Surface Mount Technology, abbreviation SMT)
On substrate 1;
2) press mold:Then fluorescent film 3 is covered in LED chip 2;
3) it toasts:Realize that fluorescent film 3 is fixed with substrate 1 by baking technology;
4) it cuts for the first time:Fluorescent film 3 is first cut, setting width is formed between adjacent LED chip 2 (is, for example,
Gap 0.35mm);
5) shading reflecting layer is set:In the periphery injection molding high reflectance silica gel material of LED chip 2, shading reflecting layer 5 is formed;
6) it cuts for second:Cutting downwards is more than the gap of the substrate 1 (being, for example, 0.55mm) of setting width, to cut
Go out the package dimension of requirement up to specification, the layer surface in shading reflecting layer is flushed with the edge of substrate 1 at this time;
7) it welds:Solder joint 40 is welded with FPC42 is connect.In view of the plank of substrate 1 is harder, poor in flexibility, in lamp
After item is cut into package dimension, the transition by connecting FPC42 connects, and is then welded on again with the main FPC for going out light control circuit
Together, connection FPC42 at this time need to only be arranged very narrow width and carry out connection welding 40;
8) armor coated:To prevent the fluorescent powder in fluorescent film 3 in high temperature and humidity or other adverse circumstances mesometamorphisms,
Need the overall peripheral protective mulch 6 in lamp bar.
So far, the complete manufacture craft process of lamp bar is realized.
And the production method of lamp bar is as shown in figure 4, include step in the prior art:
1) die bond:LED chip 2 is formed on substrate 1 by SMT technologies;
2) press mold:Then fluorescent film 3 is covered in LED chip 2;
3) it toasts:Realize that fluorescent film 3 is fixed with substrate 1 by baking technology;
4) it cuts:Fluorescent film 3 and substrate 1 are cut simultaneously, is cut into the package dimension of requirement up to specification entirely;
5) it welds:According to the LED chip 2 of lamp bar quantity in parallel, corresponding solder joint 40 is drawn, cabling will be finally provided with
Intermediary FPC41 is connected with solder joint 40, and intermediary FPC41 is connect with the main FPC of control circuit again;
6) armor coated:To prevent the fluorescent powder in fluorescent film 3 in high temperature and humidity or other adverse circumstances mesometamorphisms,
Need the overall peripheral protective mulch 6 in lamp bar.
Lamp bar in compared with the prior art, the lamp bar in the present embodiment are to push up illuminated (top-view), and multiple LED
The connecting pin of the cabling of chip concentrates on a draw-out area, therefore can save the patterning between LED chip and control circuit
Cabling connection, simplify structure, substrate width be thinned, also effectively shorten the package dimension of lamp bar, the lamp bar envelope effectively reduced
Width is filled in 0.30mm or more, and then the frame of backlight module can be narrowed within 2.0mm, ultra-narrow frame module is easy to implement
Design.
Embodiment 2:
The present embodiment provides a kind of backlight module, which includes the lamp bar in embodiment 1.
As shown in figure 9, the backlight module includes paranotum 12 and the light guide plate 7 positioned at 12 inside of paranotum, the base of lamp bar
1 place plane of plate is vertically arranged with 7 place plane of light guide plate, the lateral incidence surface of the light-emitting surface of lamp bar towards light guide plate 7.Its
In, substrate 1 is with respect to LED chip 2 further from light guide plate 7.Lamp bar is set on paranotum 12 and light guide plate 7 by adhesive layer 10
Corresponding position.
It is reflected it is easily understood that the backlight module is provided with reflecting plate 8 in the lower section of light guide plate 7, to improve light
Source utilization rate;The top of light guide plate 7 is provided with optical film layer 9, to improve source mass.Pass through adhesive layer 10 between each component
It is bonded together, also setting up adhesive tape 11 in frame region carries out shading.
The backlight module of the prior art shown in Fig. 2 is compared, the lamp bar light extraction mode in the present embodiment is by the prior art
Side it is illuminated be converted to top it is illuminated, glue frame 13 can be saved, can further save space.
The cabling of lamp bar in the present embodiment is arranged at the back side of substrate, and pushing up the illuminated glue frame that can save can directly set
It sets on paranotum, occupies smaller border width.
Embodiment 3:
The present embodiment provides a kind of display device, which includes the backlight module in embodiment 2.
The display device can be:Desktop computer, tablet computer, laptop, mobile phone, PDA, GPS, car-mounted display,
Projection Display, video camera, digital camera, electronic watch, calculator, electronic instrument and meter, Electronic Paper, television set, display,
It is more to can be applied to public display and illusory display etc. for any product or component with display function such as Digital Frame, navigator
A field.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, in the essence for not departing from the present invention
In the case of refreshing and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of lamp bar, including substrate and it is set to multiple LED chips of the substrate homonymy, the multiple LED cores of cladding
The fluorescent film of piece, multiple LED chips are arranged along orientation interval, which is characterized in that the LED is not arranged for the substrate
The one side of chip is also arranged at intervals with multiple connecting pins, and each connecting pin is by connecting described in cabling and one or more
LED chip connects;
And in orientation, the distance between the adjacent connecting pin is less than the distance between the adjacent LED chip.
2. lamp bar according to claim 1, which is characterized in that the substrate is double face copper, the double face copper
The region of corresponding each LED chip offers via, and the connection cabling extends to the connecting pin from the via.
3. lamp bar according to claim 1, which is characterized in that all the connecting pin is located in a draw-out area, described
Draw-out area is close to the lamp bar lengthwise centers.
4. lamp bar according to claim 1, which is characterized in that the connecting pin includes an anode connection terminal and at least one
The anode parallel connection of a cathode connecting pin, all LED chips is connect with the anode connection terminal, is connected to a cathode
The cathode of multiple LED chips of connecting pin is connected in series with or is connected in parallel, and the anode connection terminal is connected with the cathode
It holds and connect FPC connections.
5. lamp bar according to claim 1, which is characterized in that the fluorescent film coats the LED chip, the fluorescent film
Setting is not flushed with the edge of the substrate.
6. lamp bar according to claim 5, which is characterized in that be additionally provided with shading reflection in the side surface of the fluorescent film
Layer, the edge in the shading reflecting layer is flushed with the edge of the substrate.
7. a kind of backlight module, which is characterized in that including claim 1-6 any one of them lamp bars.
8. backlight module according to claim 7, which is characterized in that the backlight module includes paranotum and is located at described
Light guide plate on the inside of paranotum, the lamp bar are set to position corresponding with the light guide plate on the paranotum by adhesive layer
It sets.
9. backlight module according to claim 8, which is characterized in that flat where the substrate of the lamp bar including light guide plate
Plane where face and the light guide plate is vertically arranged, and the light-emitting surface of the lamp bar is towards the lateral incidence surface of the light guide plate, institute
The relatively described LED chip of substrate is stated further from the light guide plate.
10. a kind of display device, which is characterized in that including claim 7-9 any one of them backlight modules.
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CN201810136487.4A CN108363240A (en) | 2018-02-09 | 2018-02-09 | Lamp bar and backlight module, display device |
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CN201810136487.4A CN108363240A (en) | 2018-02-09 | 2018-02-09 | Lamp bar and backlight module, display device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN116772131A (en) * | 2023-06-26 | 2023-09-19 | 惠科股份有限公司 | Lamp panel, manufacturing method of lamp panel and display device |
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