CN103104868A - Light emitting diode (LED) backlight unit and electronic device - Google Patents
Light emitting diode (LED) backlight unit and electronic device Download PDFInfo
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- CN103104868A CN103104868A CN2013100020763A CN201310002076A CN103104868A CN 103104868 A CN103104868 A CN 103104868A CN 2013100020763 A CN2013100020763 A CN 2013100020763A CN 201310002076 A CN201310002076 A CN 201310002076A CN 103104868 A CN103104868 A CN 103104868A
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- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 12
- 239000003292 glue Substances 0.000 claims description 24
- 230000005855 radiation Effects 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 17
- 230000000694 effects Effects 0.000 description 19
- 239000000463 material Substances 0.000 description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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Abstract
The invention provides a light emitting diode (LED) backlight unit and an electronic device. The LED backlight unit is applied to a liquid crystal electronic device. The LED backlight unit comprises a light guiding board and a rubber frame, wherein the rubber frame is provided with a first lateral side, and the light guiding board is provided with an in-light surface. The LED backlight unit further comprises an LED light bar component which is arranged close to the first lateral side, a fixed part and a heat dissipation part, wherein the LED light bar component comprises a circuit board and at least two LED lights arranged on a first surface of the circuit board, a second surface of the circuit board is close to the first lateral side, the second surface and the first surface are two opposite surfaces of the circuit board, the heat dissipation part is fixed on the first surface of the circuit board through the fixed part to enable the LED light bar component to be located between the heat dissipation part and the first lateral side of the rubber frame, the heat dissipation part is located between the in-light surface and the first surface, and the heat dissipation part is used for heat dissipation of the LED light bar component.
Description
Technical field
The present invention relates to field of liquid crystal display, relate in particular to a kind of LED-backlit module and electronic equipment.
Background technology
Along with the development of lcd technology, the backlight of LCDs has also substituted the CCFL(cold-cathode tube by LED-backlit gradually) backlight, LED-backlit refers to use the LED(light emitting diode) be used as the backlight of LCDs.compare with the CCFL backlight, LED-backlit has advantages of low-power consumption, lower calorific value, brightness is high, the life-span is long, further, in view of energy-conserving and environment-protective, the advantage such as ultra-thin, the LED-backlit structure that versatility is the widest in the industry at present is side-light type, simultaneously, in the industry in order to obtain larger viewing area under same volume, the face frame of liquid crystal display or LCD TV, be outer rim do more and more narrow, be referred to as in the industry extremely narrow frame, please refer to Figure 1A, the width w of face frame is smaller, usually be for example 6mm, 7.9mm, 9.9mm, 10.9mm, 15mm, and the LED-backlit module generally all is arranged in the face frame, the below describes the structure of LED-backlit module take monolateral side light type LED back light module as example.
Please also refer to Figure 1A, Figure 1B and Fig. 2, this LED-backlit module comprises LED lamp bar assembly, and LED lamp bar assembly comprises circuit board and the LED lamp that is positioned on circuit board; Radiating piece (heat-dissipation aluminum sectional material), the first side of next-door neighbour's glue frame, wherein, the outside of glue frame (side relative with the first side) is near the face frame; LED lamp bar is fixed together by two-sided heat conduction subsides and heat-dissipation aluminum sectional material, can be found out by Figure 1A and Figure 1B, heat-dissipation aluminum sectional material between the first side of LED lamp assembly and glue frame, i.e. heat-dissipation aluminum sectional material the first side of the glue frame of close electronic equipment, and the LED lamp is near display panels.LGP(Light guide plate; LGP) be positioned at the exiting surface side of LED lamp, be used for irradiation with the LED lamp to the display panels that is positioned on LGP.In addition, also have reflector plate at the lower surface of LGP, be used for the light of reflection LED, also be provided with diaphragm at the LGP upper surface, be provided with panel on diaphragm.
Another kind of mode is to use screw that LED lamp bar assembly is fixed on heat-dissipation aluminum sectional material, but heat-dissipation aluminum sectional material is still between LED lamp bar assembly and the first side, and thus, distance between two LED lamps adjacent with screw will be far, so near will causing screw hole, optical density can be little a lot of than other positions, external manifestation is dark than other positions near screw, forms in " lamp shadow ".
Refer again to Fig. 2 and Fig. 3, A represents that LED lamp exiting surface is to display screen active area(effective display area territory) distance, P represents the centre distance of two adjacent LEDs lamp, and the ratios affect lamp shadow problem of A/P, under the confined space restriction of extremely narrow frame, the position of heat-dissipation aluminum sectional material and thickness effect LED exiting surface be to the distance of the incidence surface of LGP, and then affect distance A, further increased the weight of the lamp shadow problem.
Summary of the invention
The invention provides a kind of LED-backlit module and electronic equipment, cause increasing the weight of the technical problem of lamp shadow to the distance of the incidence surface of LGP in order to position and the thickness effect LED exiting surface that solves the radiating piece that exists in prior art.
one aspect of the present invention provides a kind of LED-backlit module, be applied in a liquid crystal electron equipment, described LED-backlit module comprises a LGP and glue frame, described glue frame has the first side, described LGP has an incidence surface, described LED-backlit module also comprises: LED lamp bar assembly, arrange near described the first side, described LED lamp bar assembly comprises circuit board and is arranged at least two LED lamps of the first surface of described circuit board, second of described circuit board near described the first side, wherein, described second is two relative faces of described circuit board with described first surface, one fixture, radiating piece, by described fixture, described radiating piece is fixed on the first surface of described circuit board, make described LED lamp bar assembly between described first side of described radiating piece and described glue frame, described radiating piece is between described incidence surface and described first surface, and described radiating piece is used for to described LED lamp bar assembly heat radiation.
The present invention provides a kind of electronic equipment on the other hand, comprising: above-mentioned backlight module; The liquid crystal display module is connected in described backlight module.
The one or more technical schemes that provide in the embodiment of the present invention have following technique effect or advantage at least:
One embodiment of the invention has adopted in glue frame limited space, reduced the thickness effect of radiating piece, LED lamp bar assembly is arranged between radiating piece and glue frame, being about to radiating piece moves between LED lamp bar assembly and LGP, LED lamp bar assembly is moved outward, technical scheme near the glue frame, the distance of LED lamp exiting surface to active area just increased, be that the A value has increased, so compared with prior art, in the situation that the P value is constant, increase by A, make the ratio of A/P become large, so can alleviate the lamp shadow problem, make display effect better.
Further, because can overcome the lamp shadow problem by increasing the A value, so under the prerequisite that keeps same display effect, the P value can value scope wider, can get than value larger in prior art, namely according to the design in the technical scheme of the present embodiment, the size of LED lamp can become greatly, and need not be confined to small size; Further, after the size of LED lamp became greatly, the quantity of LED lamp will reduce, so production efficiency will improve, cost also can reduce.
Further, because LED lamp bar assembly moves, reduced the impact of radiating piece thickness outward, so keeping A and the constant situation of P, in the situation that namely display effect is identical, it is narrower that the face frame can further be done, and makes electronic equipment toward narrower narrow frame development.
Description of drawings
Figure 1A-Figure 1B is the structure chart of LED-backlit module in prior art;
Fig. 2 is the schematic diagram of A in prior art, P value;
Fig. 3 is the side cutaway view of LED-backlit module in prior art;
Fig. 4 A is the structure chart of the LED-backlit module in one embodiment of the invention;
Fig. 4 B is the structure chart of the LED-backlit module in another embodiment of the present invention;
Fig. 4 C is the side view cutaway drawing of the LED-backlit module in one embodiment of the invention;
Fig. 5 is the A value schematic diagram in one embodiment of the invention;
Fig. 6 is the P value schematic diagram in one embodiment of the invention.
The specific embodiment
The invention provides a kind of LED-backlit module and electronic equipment, cause increasing the weight of the technical problem of lamp shadow to the distance of the incidence surface of LGP in order to position and the thickness effect LED exiting surface that solves the radiating piece that exists in prior art.
Technical scheme in the embodiment of the present invention is for solving above-mentioned technical problem, and general thought is as follows:
In glue frame limited space, reduced the thickness effect of radiating piece, LED lamp bar assembly is arranged between radiating piece and glue frame, being about to radiating piece moves between LED lamp bar assembly and LGP, LED lamp bar assembly is moved outward, technical scheme near the glue frame, the distance of LED lamp exiting surface to active area just increased, be that the A value has increased, so compared with prior art, in the situation that the P value is constant, increase by A, make the ratio of A/P become large, so can alleviate the lamp shadow problem, make display effect better.
Further, because can overcome the lamp shadow problem by increasing the A value, so the scope that the P value can value is wider, can get than value larger in prior art, namely according to the design in the technical scheme of the present embodiment, the size of LED lamp can become greatly, and need not be confined to small size; Further, after the size of LED lamp became greatly, the quantity of LED lamp will reduce, so production efficiency will improve, cost also can reduce.
In order better to understand technique scheme, below in conjunction with Figure of description and concrete embodiment, technique scheme is described in detail.
In the present embodiment, the LED-backlit module is applied in a liquid crystal electron equipment, and liquid crystal electron equipment has a frame, and the width w of face frame for example please refer to shown in Figure 1A for 6mm, 7.9mm, 9.9mm, 10.9mm, 15mm(less than a predetermined value).The LED-backlit module comprises a LGP and glue frame, and the glue frame has the first side, and LGP has an incidence surface.
Next please refer to Fig. 4 A to Fig. 4 C, Fig. 4 A is the LED-backlit modular structure figure in one embodiment of the invention, and Fig. 4 C is the side sectional view of LED-backlit module.The LED-backlit module also comprises LED lamp bar assembly, and LED lamp bar assembly comprises circuit board and at least two LED lamps that are arranged on the first surface of circuit board, this LED lamp bar assembly arranges near the first side, second of circuit board near described the first side, wherein, described second is two relative faces of described circuit board with described first surface; One fixture (as the screw 10 in Fig. 4 C), radiating piece (for example heat-dissipation aluminum sectional material), by this fixture, radiating piece is fixed on the first surface of circuit board, make LED lamp bar assembly between the first side of radiating piece and glue frame, namely radiating piece is between the incidence surface of LED lamp bar assembly and LGP.This radiating piece is used for dispelling the heat to LED lamp bar assembly.Compared with prior art, under same face width of frame and space, the position of radiating piece and LED lamp bar assembly is changed, and need not therefore will increase the width w of face frame.In the present embodiment, radiating piece is take heat-dissipation aluminum sectional material as example, but in other embodiments, radiating piece can be also the radiating piece of other materials.Wherein circuit board can be pcb board, in other embodiments, and circuit board that also can other types.
By the technical scheme in the present embodiment, radiating piece is moved between LED lamp bar assembly and LGP, be that LED lamp bar assembly moves the first side near the glue frame outward, the distance of LED lamp exiting surface to active area increased, namely the A value has increased, so compared with prior art, in the situation that the P value is constant, by the increase of A, make the ratio of A/P become large, so can alleviate the lamp shadow problem, make display effect better.
Further, because can overcome the lamp shadow problem by increasing the A value, so under the prerequisite that keeps same display effect, the P value can value scope wider, can get than value larger in prior art, namely according to the design in the technical scheme of the present embodiment, the size of LED lamp can become greatly, and need not be confined to small size; Further, and after the size of LED lamp became greatly, the quantity of LED lamp will reduce, so production efficiency will improve, cost also can reduce.
Next, will take 46 cun single minor face side light type LED back light modules as example, provide detailed numerical computations.
Please refer to Fig. 3 and Fig. 5, expressed in Fig. 3 in structure of the prior art, LED lamp exiting surface to the distance A of display screen active area is for example 4.95mm, and in Fig. 5, in the structure that the present embodiment technical scheme provides, A increases to 7.35mm, wherein, because heat-dissipation aluminum sectional material is fixed on LED lamp side, so the distance that increases comprises the thickness 0.4mm that two-sided heat conduction is pasted, and the thickness 2.0mm of heat-dissipation aluminum sectional material.
According to structure of the prior art, in the industry cycle interior experience as can be known, will satisfy A/P usually more than or equal to 0.8, just can overcome the lamp shadow problem, because A is 4.95mm, P will be less than or equal to 6.1875mm so; And according to the structure that provides in the present embodiment, A is 7.35mm, satisfy A/P more than or equal to 0.8, and as long as P is just less than or equal to 9.1875mm so.
Refer again to Fig. 6, P is the centre distance of two adjacent LEDs lamp, i.e. P=L
LED+ Δ S, wherein, Δ S must more than or equal to 1mm, can calculate the size of the LED lamp that meets design requirement so accordingly.
The structure of prior art: L
LED≤ P-Δ S, i.e. L
LED≤ 6.1875-1=5.1875mm is so the LED lamp must select 4014 model lamps could satisfy the A/P value more than or equal to 0.8 requirement.
Structure in the present embodiment, L
LED≤ P-Δ S, i.e. L
LED≤ 9.1875-1=8.1875mm so the LED lamp can be selected 5630 model lamps or 7020 model lamps, can satisfy the A/P value more than or equal to 0.8 requirement, and reduce the quantity of required LED lamp, can improve lamp bar assembly production efficiency, reduces costs.
And in the situation that the P value remains unchanged, for example the P value is 6.1875mm, and A/P value 4.95mm/6.1875mm of the prior art is 0.8; And increase to 7.35mm by the method A value in the present embodiment, to be 7.35/6.1875 be 1.1879 to the A/P value so, is far longer than 0.8, so better overcome the lamp shadow problem, makes display effect better.
Further, because LED lamp bar assembly moves, reduced the impact of radiating piece thickness outward, so keeping A and the constant situation of P, in the situation that namely display effect is identical, it is narrower that the face frame can further be done, and makes electronic equipment toward narrower narrow frame development.
Please continue with reference to figure 4A and Fig. 4 C, be formed with the first hole 101 below at least two LED lamps on circuit board, be provided with the through hole 201 consistent with the quantity in the first hole 101 with 101 relevant positions, the first hole on radiating piece.Further, only show first hole 101 and a through hole 201 in Fig. 4 A, but when practical application, the quantity of the first hole 101 and through hole 201 can actual conditions be selected, as long as can radiating piece and LED lamp bar assembly is fixing.
Further, fixture is specially the screw consistent with the quantity of through hole 201 10, and screw 10 passes through hole 201, the first hole 101 successively, and radiating piece is fixed on first surface.
Wherein, in one embodiment, the first hole 101 can be blind hole, can be also through hole, and better is through hole, because in actual production process, through hole is better realized, better operation.
In a further embodiment, the length of screw 10 is greater than the length of through hole 201, and less than or equal to the length of through hole 201 and the length sum in the first hole 101, so the tip of screw 10 can not be exposed to circuit board, both fixedly radiating piece and circuit board, but applying between circuit board and shell do not affected again.
Because the first hole is arranged at the below of LED lamp, so can not affect the cabling in circuit board, can not affect the distance between the two adjacent LEDs lamp yet, so further overcome " lamp shadow " problem, and adopt screw to connect, and reliable, convenient, also reduced cost.
In a further embodiment, be provided with internal thread in the first hole 101, make screw 10 can screw in more easily in the first hole 101, so easy assembly and disassembly.
In another embodiment, fixture is specially heat conduction and pastes (not shown), can double faced adhesive, and namely paste by heat conduction circuit board and radiating piece are pasted and fixed on together.
Next, please continue the 4C with reference to figure, radiating piece comprises first end 20 and the second end 30, and first end 20 and the second end 30 link together at angle, and first end 20 is fixed on first surface.Better, radiating piece becomes L-type, and first end 20 and the second end 30 are respectively the two ends of L-type, and namely this angle is 90 degree, is convenient to the housing design of follow-up electronic equipment.
Further, first end 20 and the second end 30 structure that is formed in one, thus easily make, and can more firmly the LED-backlit module be fixed on shell, can also support the LED-backlit module.
Refer again to Fig. 4 A, have a breach 301 on the second end 30, and the position of breach 301 is corresponding to the position of through hole 201, so can mount and dismount screw 10 easily by breach 301.
Further, refer again to Fig. 4 B, the LGP of LED-backlit module is positioned at the inboard of the second end 30, makes LGP and at least two LED lamps be positioned at the same side of the second end 30.Display panels can be positioned on LGP, and by LGP, the light that the LED lamp can be sent shines on display panels uniformly.
Further, the outside of the second end 30 is fixedly connected with the backboard (shown in Figure 1A) of a shell.
Further, fit in second the first side with this glue frame of circuit board, and second is two relative faces of circuit board with first surface.
Refer again to Fig. 4 A and Fig. 4 C, also be provided with a terminal 40 on LED lamp bar assembly, be used for connecting a power supply, power to circuit board.
In order conveniently to be connected in the power line cabling of terminal 40, radiating piece the second end 30 is curved near the turning of terminal 40, thus, can prevent that just square or other sharp-pointed dihedrals from cutting off power line.
Above each embodiment use of can interosculating, those skilled in the art can select the combination between embodiment according to actual needs.
Another embodiment of the present invention also provides a kind of electronic equipment, this electronic equipment comprises LED-backlit module in the various embodiments described above, and liquid crystal display module, be connected in this LED-backlit module, this electronic equipment can be LCD TV, liquid crystal display, notebook computer, and other use the electronic equipment of liquid crystal display.
The one or more technical schemes that provide in the embodiment of the present invention have following technique effect or advantage at least:
One embodiment of the invention has adopted in glue frame limited space, reduced the thickness effect of radiating piece, LED lamp bar assembly is arranged between radiating piece and glue frame, being about to radiating piece moves between LED lamp bar assembly and LGP, LED lamp bar assembly is moved outward, technical scheme near the glue frame, the distance of LED lamp exiting surface to active area just increased, be that the A value has increased, so compared with prior art, in the situation that the P value is constant, increase by A, make the ratio of A/P become large, so can alleviate the lamp shadow problem, make display effect better.
Further, because can overcome the lamp shadow problem by increasing the A value, so under the prerequisite that keeps same display effect, the P value can value scope wider, can get than value larger in prior art, namely according to the design in the technical scheme of the present embodiment, the size of LED lamp can become greatly, and need not be confined to small size; Further, after the size of LED lamp became greatly, the quantity of LED lamp will reduce, so production efficiency will improve, cost also can reduce.
Further, because LED lamp bar assembly moves, reduced the impact of radiating piece thickness outward, so keeping A and the constant situation of P, in the situation that namely display effect is identical, it is narrower that the face frame can further be done, and makes electronic equipment toward narrower narrow frame development.
Further, also form the first hole in one embodiment of the invention below the upper LED lamp of circuit board, be provided with the through hole consistent with the quantity in the first hole with the first relevant position, hole on radiating piece, and fixture is specially screw, its quantity is consistent with through hole, then screw passes through hole, the first hole, radiating piece is fixed on the first surface of circuit board.Because the first hole is arranged at the below of LED lamp, so can not affect the cabling in circuit board, can not affect the distance between the two adjacent LEDs lamp yet, so further overcome " lamp shadow " problem, and adopt screw to connect, and reliable, convenient, also reduced cost.
Further again, also designed the length of the described through hole of length of screw in one embodiment of the invention, and less than or equal to the length of described through hole and the length sum in described the first hole, so the tip of screw can not be exposed to circuit board, both fixedly radiating piece and circuit board, but applying between circuit board and shell do not affected again.
Obviously, those skilled in the art can carry out various changes and modification and not break away from the spirit and scope of the present invention the present invention.Like this, if within of the present invention these are revised and modification belongs to the scope of claim of the present invention and equivalent technologies thereof, the present invention also is intended to comprise these changes and modification interior.
Claims (10)
1. a LED-backlit module, be applied in a liquid crystal electron equipment, and described LED-backlit module comprises a LGP and glue frame, and described glue frame has the first side, and described LGP has an incidence surface, it is characterized in that, described LED-backlit module also comprises:
LED lamp bar assembly, arrange near described the first side, described LED lamp bar assembly comprises circuit board and is arranged at least two LED lamps of the first surface of described circuit board, second of described circuit board near described the first side, wherein, described second is two relative faces of described circuit board with described first surface;
One fixture;
Radiating piece, by described fixture, described radiating piece is fixed on the first surface of described circuit board, make described LED lamp bar assembly between described first side of described radiating piece and described glue frame, described radiating piece is between described incidence surface and described first surface, and described radiating piece is used for to described LED lamp bar assembly heat radiation.
2. backlight module as claimed in claim 1, is characterized in that, is formed with the first hole below the above at least two LED lamp of described circuit board; Be provided with the through hole consistent with the quantity in described the first hole with described the first relevant position, hole on described radiating piece, described fixture is specially the screw consistent with the quantity of described through hole, described screw passes described through hole, described the first hole successively, and described radiating piece is fixed on described first surface.
3. backlight module as claimed in claim 2, is characterized in that, is provided with internal thread in described the first hole.
4. backlight module as claimed in claim 2, is characterized in that, the length of described screw is greater than the length of described through hole, and less than or equal to the length of described through hole and the length sum in described the first hole.
5. backlight module as claimed in claim 1, is characterized in that, described fixture is specially heat conduction and pastes.
6. backlight module as claimed in claim 1, is characterized in that, described radiating piece comprises first end and the second end, and described first end and described the second end link together at angle, and described first end is fixed on described first surface.
7. backlight module as claimed in claim 6, is characterized in that, described LGP is positioned at the inboard of described the second end, and wherein, described LGP and described at least two LED lamps are positioned at the same side of described the second end.
8. backlight module as claimed in claim 7, is characterized in that, the outside of described the second end is fixedly connected with the backboard of a shell.
9. backlight module as claimed in claim 8, is characterized in that, fits with described the first side for second of described circuit board.
10. an electronic equipment, is characterized in that, comprising:
Backlight module as described in any one in right 1-9;
The liquid crystal display module is positioned on described backlight module.
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| CN201310002076.3A CN103104868B (en) | 2012-08-15 | 2013-01-04 | A kind of LED-backlit module and electronic equipment |
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| CN201210290437.4 | 2012-08-15 | ||
| CN201210290437 | 2012-08-15 | ||
| CN2012102904374 | 2012-08-15 | ||
| CN201310002076.3A CN103104868B (en) | 2012-08-15 | 2013-01-04 | A kind of LED-backlit module and electronic equipment |
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| CN103104868A true CN103104868A (en) | 2013-05-15 |
| CN103104868B CN103104868B (en) | 2015-09-09 |
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| CN103557507A (en) * | 2013-10-31 | 2014-02-05 | 深圳市华星光电技术有限公司 | Heat conduction device, backlight module and liquid crystal display |
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| WO2015109637A1 (en) * | 2014-01-27 | 2015-07-30 | 深圳市华星光电技术有限公司 | Backlight module and liquid crystal display comprising same |
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