CN216871666U - Mold assembly for processing exposed copper foil conductive adhesive film - Google Patents
Mold assembly for processing exposed copper foil conductive adhesive film Download PDFInfo
- Publication number
- CN216871666U CN216871666U CN202220129684.5U CN202220129684U CN216871666U CN 216871666 U CN216871666 U CN 216871666U CN 202220129684 U CN202220129684 U CN 202220129684U CN 216871666 U CN216871666 U CN 216871666U
- Authority
- CN
- China
- Prior art keywords
- cutter
- cutting
- copper foil
- die
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model provides a die assembly for processing a conductive adhesive film with an exposed copper foil, which comprises a first etching die for primary punching, a second etching die for secondary punching and a rubber plate die for tertiary punching, wherein the first etching die comprises an annular cutter for processing a positioning hole and a first cutter for cutting the conductive adhesive; the second etching die comprises a first positioning pin matched with the positioning hole and a second cutter used for cutting the Mylar adhesive tape and the copper foil; the rubber plate die comprises a second positioning needle matched with the positioning hole and a third cutter for cutting the release paper, wherein the third cutter is a square closed-loop cutter with at least one side provided with a notch; through setting up three mould that is used for the difference to cut the electric glue membrane, cut the material in different levels, can produce the electric glue membrane that has the exposed type copper foil and lead for conductive adhesive layer and copper foil, copper foil and dumb rye draw to combine inseparabler between the gluey layer, are difficult to peel off, and processing makes things convenient for the location accurate, has stronger popularization meaning.
Description
Technical Field
The utility model relates to the technical field of die processing, in particular to a die assembly for processing a conductive adhesive film with an exposed copper foil.
Background
The conductive adhesive film provides mechanical and electrical connection between the device and the circuit board, and thus is gradually and widely used in various electronic fields such as microelectronic packaging, printed circuit boards, conductive circuit bonding, and the like.
At present, the conventional conductive adhesive film generally includes a conductive adhesive layer, wherein the conductive adhesive layer has conductive particles therein, and the conductive adhesive film is adhered between conductors, and by adhering one surface of the conductive adhesive film to one of the conductors and adhering the other surface of the conductive adhesive film to the other conductor, the conduction between the conductors is realized. However, in the process of implementing the utility model, the inventor finds that the prior art has at least the following problems: due to the influence of factors such as stress, climate and the like, the volume or the shape of the substrate of the conductive adhesive film is easy to change gradually or suddenly, so that the stacking state of the conductive particles in the conductive adhesive film is easy to change, the conductive path in the conductive adhesive film is easy to change, the conduction effect of the conductive adhesive film and the ground layer of the circuit board is not ideal, and the grounding stability of the conductive adhesive film is poor; and the adhesive layer may creep and deform in long-term use, resulting in inaccurate adhesion, so a new conductive adhesive film processing mold is needed to process a conductive adhesive film with better grounding property and less change of conductive performance.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the technology, the utility model provides the die assembly for processing the conductive adhesive film with the exposed copper foil.
In order to achieve the purpose, the utility model provides a die assembly for processing a conductive adhesive film with an exposed copper foil, which comprises a first etching die for primary punching, a second etching die for secondary punching and a rubber plate die for tertiary punching, wherein the first etching die comprises an annular cutter for processing a positioning hole and a first cutter for cutting the conductive adhesive; the second etching die comprises a first positioning pin matched with the positioning hole and a second cutter used for cutting the Mylar adhesive tape and the copper foil; the rubber plate die comprises a second positioning needle and a third cutter, the second positioning needle is used for being matched with the positioning hole, the third cutter is used for cutting release paper, and the third cutter is a square closed-loop cutter with a notch formed in at least one side.
Specifically, the method comprises the following steps: the first cutters are a plurality of transverse cutters arranged in parallel side by side, the number of the transverse cutters is at least four, the transverse cutters comprise two transverse cutters arranged in the middle and two transverse cutters arranged on two outer sides, and the annular cutters are respectively arranged on two outer sides of the transverse cutters.
Preferably, the method comprises the following steps: the positions corresponding to the two transverse cutters in the middle of the second cutter and the first etching film are provided with the same inner cutter, the positions corresponding to the two transverse cutters on the two outer sides are provided with outer cutters, and any one side edge of each outer cutter inclines towards the direction close to the inner cutter to form a chamfering cutter structure.
Preferably, the method comprises the following steps: the notch of the third cutter is arranged on one side corresponding to the inner cutter.
Preferably, the method comprises the following steps: the thickness of the bottom plate of the first etching film and the second etching film is at least 0.5mm, and the thickness of the bottom plate of the rubber plate mold is at least 6 mm.
Specifically, the method comprises the following steps: the length of the first positioning needle and the length of the second positioning needle are both at least 15 mm.
Specifically, the method comprises the following steps: the length of the cutting edges of the first cutter and the second cutter is at least 1.5mm, the length of the cutting edge of the third cutter is at least 2mm, and the length of the cutting edge of the annular cutter is at least 1.6 mm.
Specifically, the method comprises the following steps: the cutting tool is characterized by further comprising a bottom plate for placing materials to be processed, wherein concave parts are inwards recessed towards the middle position at any two opposite sides of the bottom plate, and the recessed depth of the concave parts is equal to the distance between the annular cutters.
Preferably, the method comprises the following steps: the thickness of the base plate is at least 6 mm.
The utility model has the beneficial effects that: compared with the prior art, the die assembly for processing the conductive adhesive film with the exposed copper foil comprises a first etching die for primary punching, a second etching die for secondary punching and a rubber plate die for tertiary punching, wherein the first etching die comprises an annular cutter for processing a positioning hole and a first cutter for cutting the conductive adhesive; the second etching die comprises a first positioning needle matched with the positioning hole and a second cutter for cutting the Mylar adhesive tape and the copper foil; the rubber plate die comprises a second positioning needle matched with the positioning hole and a third cutter for cutting the release paper, wherein the third cutter is a square closed-loop cutter with at least one side provided with a notch; through setting up three mould that is used for the difference to cut the electric glue membrane, cut the material in different levels, can produce the electric glue membrane that has the exposed type copper foil and lead for conductive adhesive layer and copper foil, copper foil and dumb rye draw to combine inseparabler between the gluey layer, are difficult to peel off, and processing is convenient and fix a position accurately, has stronger popularization meaning.
Drawings
FIG. 1 is a schematic view of a first etching mold according to the present invention;
FIG. 2 is a schematic view of a second etching mold according to the present invention;
FIG. 3 is a schematic view of a slab rubber mold of the present invention;
FIG. 4 is a schematic view of a base plate of the present invention;
FIG. 5 is a schematic view of the exposed copper foil conductive adhesive film of the present invention.
The main element symbols are as follows:
1. a first etching mold; 11. a ring-shaped cutter; 12. a first cutter; 2. a second etching mold; 21. an inner cutter; 22. an outer cutter; 23. chamfering the cutter structure; 24. a first positioning pin; 3. a rubber plate mold; 31. a second positioning pin; 32. a third cutter; 33. a notch; 4. a cushion pan; 5. a recessed portion.
Detailed Description
In order to more clearly describe the present invention, the present invention will be further described with reference to the accompanying drawings.
In the following description, details of general examples are given to provide a more thorough understanding of the present invention. It should be apparent that the described embodiments are only some embodiments of the present invention, and not all embodiments. It should be understood that the specific embodiments are illustrative of the utility model and are not to be construed as limiting the utility model.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof.
In order to solve the defects and shortcomings in the prior art, the utility model specifically provides a die assembly for processing a conductive adhesive film with an exposed copper foil, which refers to fig. 1-5, and comprises a first etching die 1 for primary punching, a second etching die 2 for secondary punching and a rubber plate die 3 for tertiary punching, wherein the first etching die 1 comprises an annular cutter 11 for processing a positioning hole and a first cutter 12 for cutting the conductive adhesive; the second etching die 2 comprises a first positioning pin 24 matched with the positioning hole and a second cutter used for cutting the Mylar adhesive tape and the copper foil; the rubber plate die 3 comprises a second positioning needle 31 matched with the positioning hole and a third cutter 32 used for cutting release paper, wherein the third cutter 32 is a square closed-loop cutter with a notch 33 formed in at least one side; the first etching die 1 is used for first punching of raw materials, the raw materials of the first punching are white lattice release paper, conductive adhesive self-carrying paper and a transparent silica gel protective film which are sequentially arranged, wherein the annular cutter 11 completely cuts all layers, and the first cutter 12 only cuts the conductive adhesive self-carrying paper part.
In the present embodiment, mention is made of: the first cutters 12 are a plurality of transverse cutters arranged in parallel side by side, the number of the transverse cutters is at least four, the transverse cutters comprise two transverse cutters arranged in the middle and two transverse cutters arranged on two outer sides, and the annular cutters 11 are respectively arranged on two outer sides of the transverse cutters.
In a preferred embodiment, mention is made of: the positions corresponding to the two transverse cutters at the middle positions on the second cutter and the first etching film are provided with the same inner cutter 21, the positions corresponding to the two transverse cutters at the two outer sides are provided with outer cutters 22, and any one side edge of the outer cutter 22 inclines towards the direction close to the inner cutter 21 to form a chamfer cutter structure 23; the second etching die 2 is used for secondary punching of raw materials, the raw materials for secondary punching are 0.03 matt black mylar adhesive tape, 0.05 copper foil, conductive adhesive self-carrying paper and a transparent silica gel protective film which are sequentially arranged, the 0.03 matt black mylar adhesive tape and 0.05 copper foil are attached to the surface after primary processing, at the moment, the inner cutter 21 only cuts to the position of the matt rye mylar adhesive tape, the outer cutter 22 cuts to the position of the conductive adhesive, and the first positioning needle 24 is used for positioning before cutting and then cutting.
The rubber plate die 3 is used for punching the raw materials for the third time, the punched raw materials for the third time are a 0.05 transparent PE protective film, a 0.03 matte black Mylar adhesive tape, a 0.05 copper foil, conductive adhesive, self-contained paper of the conductive adhesive and a transparent silica gel protective film which are sequentially arranged, the third cutter 32 cuts the part of the conductive adhesive, which is self-contained paper, and the whole formed conductive adhesive film is completely cut.
In a preferred embodiment, mention is made of: the notch 33 of the third cutter 32 is located at the corresponding side of the inner cutter 21.
In a preferred embodiment are mentioned: the thickness of the bottom plate of the first etching film and the second etching film 2 is at least 0.5mm, and the thickness of the bottom plate of the rubber plate film 3 is at least 6 mm.
In the present embodiment, mention is made of: the length of each of the first and second positioning pins 24, 31 is at least 15 mm.
In the present embodiment, mention is made of: the lengths of the cutting edges of the first cutter 12 and the second cutter are at least 1.5mm, the length of the cutting edge of the third cutter 32 is at least 2mm, and the length of the cutting edge of the annular cutter 11 is at least 1.6 mm.
Example 1: briefly, the following steps are carried out:
coating materials (ensuring the cleanness of the machine), forming by a die cutting machine, positioning and pasting by a pasting machine to form a second punching material layer, forming, removing a middle release film and a Mylar adhesive tape by the pasting machine, removing handle waste materials and rim charge by the pasting machine, punching a third line, pasting the product by DA75T12, separating the surface by paper, cutting, checking, packaging and delivering.
In the present embodiment, mention is made of: still including the backing plate 4 that is used for placing the material of treating processing, backing plate 4 arbitrary relative both sides inwards cave in towards the intermediate position has depressed part 5, and the sunken degree of depth of depressed part 5 equals with the distance between the annular cutter 11.
In a preferred embodiment, mention is made of: the thickness of the mat base 4 is at least 6 mm.
The utility model has the advantages that:
through setting up three mould that is used for the difference to cut the electric glue membrane, cut the material in different levels, can produce the electric glue membrane that has the exposed type copper foil and lead for conductive adhesive layer and copper foil, copper foil and dumb rye draw to combine inseparabler between the gluey layer, are difficult to peel off, and processing is convenient and fix a position accurately, has stronger popularization meaning.
The above disclosure is only for a few specific embodiments of the present invention, but the present invention is not limited thereto, and any variations that can be made by those skilled in the art are intended to fall within the scope of the present invention.
Claims (9)
1. A die assembly for processing a conductive adhesive film with an exposed copper foil is characterized by comprising a first etching die for primary punching, a second etching die for secondary punching and a rubber plate die for tertiary punching, wherein the first etching die comprises an annular cutter for processing a positioning hole and a first cutter for cutting the conductive adhesive; the second etching die comprises a first positioning pin matched with the positioning hole and a second cutter used for cutting the Mylar adhesive tape and the copper foil; the rubber plate die comprises a second positioning needle and a third cutter, the second positioning needle is used for being matched with the positioning hole, the third cutter is used for cutting release paper, and the third cutter is a square closed-loop cutter with a notch formed in at least one side.
2. The mold assembly of claim 1, wherein the first cutting blade is a plurality of parallel side-by-side transverse cutting blades, the number of the transverse cutting blades is at least four, the transverse cutting blades include two transverse cutting blades disposed at a middle position and two transverse cutting blades disposed at two outer sides, and the annular cutting blade is disposed at two outer sides of the plurality of transverse cutting blades.
3. The mold assembly of claim 2, wherein the second cutting blade has an inner cutting blade at a position corresponding to the two transverse cutting blades at the middle position on the first etched film, and an outer cutting blade at a position corresponding to the two transverse cutting blades at the two outer sides, and any one side of the outer cutting blade is inclined toward the inner cutting blade to form a chamfer cutting blade structure.
4. The mold assembly of claim 3, wherein the notch of the third cutter is located on a side of the inner cutter opposite to the notch of the third cutter.
5. The mold assembly of claim 1, wherein the first etching film and the second etching film have a base plate thickness of at least 0.5mm, and the base plate thickness of the adhesive film is at least 6 mm.
6. The mold assembly of claim 1, wherein the first positioning pin and the second positioning pin are at least 15mm long.
7. The mold assembly of claim 1, wherein the first and second cutters have a cutting edge length of at least 1.5mm, the third cutter has a cutting edge length of at least 2mm, and the annular cutter has a cutting edge length of at least 1.6 mm.
8. The mold assembly of claim 1, further comprising a backing plate for placing a material to be processed, wherein two opposite sides of the backing plate are recessed inward toward the middle of the backing plate, and the depth of the recess is equal to the distance between the annular cutters.
9. The mold assembly of claim 8, wherein the backing plate has a thickness of at least 6 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220129684.5U CN216871666U (en) | 2022-01-18 | 2022-01-18 | Mold assembly for processing exposed copper foil conductive adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220129684.5U CN216871666U (en) | 2022-01-18 | 2022-01-18 | Mold assembly for processing exposed copper foil conductive adhesive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216871666U true CN216871666U (en) | 2022-07-01 |
Family
ID=82152276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220129684.5U Active CN216871666U (en) | 2022-01-18 | 2022-01-18 | Mold assembly for processing exposed copper foil conductive adhesive film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216871666U (en) |
-
2022
- 2022-01-18 CN CN202220129684.5U patent/CN216871666U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10651320B2 (en) | Method of manufacturing a circuit board by punching | |
| CN105086858B (en) | A kind of gum and processing mold group and its processing technology | |
| CN109401663B (en) | Manufacturing process of double-sided adhesive tape of silica gel pad | |
| CN113070939A (en) | Production process and production equipment of multilayer special-shaped conductive adhesive tape and conductive copper foil composite assembly | |
| CN112188745A (en) | Die-cutting conductor circuit manufacturing process | |
| CN216871666U (en) | Mold assembly for processing exposed copper foil conductive adhesive film | |
| CN112589976B (en) | Production method of ceramic wafer for ceramic packaging base | |
| CN106376227A (en) | Manufacturing process for insulation shielding case | |
| CN107263956B (en) | Electromagnetic interference EMI composite material and preparation method thereof | |
| CN110012589B (en) | Assembling method of flexible circuit board module and flexible circuit board module | |
| CN108207078A (en) | Improve the manufacture craft that rigid-flex combined board takes off lid leak | |
| CN214644314U (en) | Production equipment for multilayer special-shaped conductive adhesive tape and conductive copper foil composite assembly | |
| CN115527895A (en) | Wafer film pasting equipment and wafer film pasting method | |
| CN100447053C (en) | Sheet type flexible board strip packaging method | |
| CN113308199A (en) | Adhesive tape lapping process | |
| CN114670284B (en) | Production system of double faced adhesive tape cross cutting piece | |
| CN112105155B (en) | Chip FPC and manufacturing method thereof | |
| CN212425934U (en) | Process membrane | |
| CN105787552B (en) | Processing method of intelligent card with keys | |
| CN215549291U (en) | Easy-to-peel die-cut product structure | |
| CN211831311U (en) | Automatic laminating structure of covering film | |
| CN115431344A (en) | Die cutting process for side-edge-wrapped graphite | |
| KR20190094794A (en) | Method of processing thermo-sensitive adhesive film using pinnacle mold | |
| CN213546291U (en) | Isolation device | |
| CN114103189B (en) | Multilayer structure turnover type protective film and production process thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |