CN112188745A - Die-cutting conductor circuit manufacturing process - Google Patents
Die-cutting conductor circuit manufacturing process Download PDFInfo
- Publication number
- CN112188745A CN112188745A CN202011056118.8A CN202011056118A CN112188745A CN 112188745 A CN112188745 A CN 112188745A CN 202011056118 A CN202011056118 A CN 202011056118A CN 112188745 A CN112188745 A CN 112188745A
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- China
- Prior art keywords
- die
- metal conductor
- foil
- conductor foil
- cutting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention provides a die-cutting conductor circuit manufacturing process, which comprises the following steps of S1: preparing a metal conductor foil for die cutting processing; cleaning the surface of the metal conductor foil; s2: attaching the metal conductor foil to a bearing film layer with cohesiveness; and gluing by using adhesive glue; s3: the conductor surface of the metal conductor foil attached on the bearing film layer is upward; the die-cutting conductor line processing technology is placed on laser cutting processing equipment or a die punching machine, the processing efficiency can be obviously improved, the processing accuracy is high, and the application effect is good.
Description
[ technical field ]
The invention relates to the technical field of conductor circuit manufacturing processes, in particular to a die-cutting conductor circuit manufacturing process with a prominent application effect.
[ background art ]
The traditional circuit board lead is usually made by etching a circuit on a copper-clad plate, or is made by cutting and removing unnecessary copper by adopting laser and a milling cutter. However, the former is costly and highly polluting, while the latter is inefficient and cannot be mass produced.
How to effectively improve the production and processing efficiency and reduce pollution is a problem which is often considered by technicians in the field, and a great deal of research and development and experiments are also carried out, so that better results are obtained.
[ summary of the invention ]
In order to overcome the problems in the prior art, the invention provides a manufacturing process of a die-cut conductor circuit with a prominent application effect.
The technical scheme for solving the technical problem of the invention is to provide a manufacturing process of a die-cut conductor circuit, which comprises the following steps,
s1: preparing a metal conductor foil for die cutting processing; cleaning the surface of the metal conductor foil;
s2: attaching the metal conductor foil to a bearing film layer with cohesiveness; and gluing by using adhesive glue;
s3: the conductor surface of the metal conductor foil attached on the bearing film layer is upward; placing on laser cutting processing equipment or a die punching machine; performing stamping processing by adopting a pre-prepared die, and cutting the metal conductor foil by laser or die cutting stamping processing, wherein the bearing film layer at the bottom is not completely cut;
s4: after laser cutting or die cutting and stamping are finished, removing the unnecessary patterns; specifically, the method comprises the steps of carrying out waste material removal treatment by using adhesive tape bonding, UV local irradiation, local heating, manual mechanical removal or vacuum adsorption; reserving a required graph on the bearing film layer;
s5: attaching an insulating layer to the metal conductor surface of the metal conductor foil with the waste removed, and then performing high-temperature lamination treatment by using a laminating machine; so that the metal conductor foil and the insulating layer are bonded into a whole;
s6: removing the bearing film layer; printing insulating ink on the exposed metal conductor foil or laminating and bonding the metal conductor foil to cover an insulating layer;
s7: and carrying out circuit board surface electroplating treatment on the Pad after the bonding treatment is finished to form the single-sided circuit board.
Preferably, the insulating layer PI, PET, PPS, PET, ceramic, PTFE, epoxy resin, FR4 or glass in the step S5 is self-adhesive: acrylic, epoxy or TPI colloids.
Preferably, in step S7, the method further includes attaching an additional laser-finished semi-finished metal conductor foil to the back of the manufactured single-sided circuit board to form a second conductor circuit layer of the double-sided circuit board.
Preferably, the metal conductor foil used in step S1 is a copper foil, an aluminum foil, graphene, graphite, a carbon film, or a foil with a conductive substance.
Preferably, the supporting film layer in step S1 is made of PET, PI, PEN, PPS, PTFE, PVC or PO; the adhesive glue is acrylic acid series, epoxy series or silica gel series glue.
Preferably, the laminating temperature in the step S5 ranges from 80 degrees celsius to 450 degrees celsius; and the lamination time is controlled between 2 seconds and 5 hours.
Compared with the prior art, the die-cutting conductor circuit processing technology of the die-cutting conductor circuit manufacturing technology can obviously improve the processing efficiency, and has high processing accuracy and good application effect.
[ description of the drawings ]
FIG. 1 is a schematic flow chart of a die-cut conductor line manufacturing process of the present invention.
[ detailed description of the invention ]
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, a manufacturing process 1 of die-cut conductor circuit according to the present invention includes the following steps,
s1: preparing a metal conductor foil for die cutting processing; cleaning the surface of the metal conductor foil;
s2: attaching the metal conductor foil to a bearing film layer with cohesiveness; and gluing by using adhesive glue;
s3: the conductor surface of the metal conductor foil attached on the bearing film layer is upward; placing on laser cutting processing equipment or a die punching machine; performing stamping processing by adopting a pre-prepared die, and cutting the metal conductor foil by laser or die cutting stamping processing, wherein the bearing film layer at the bottom is not completely cut;
s4: after laser cutting or die cutting and stamping are finished, removing the unnecessary patterns; specifically, the method comprises the steps of carrying out waste material removal treatment by using adhesive tape bonding, UV local irradiation, local heating, manual mechanical removal or vacuum adsorption; reserving a required graph on the bearing film layer;
s5: attaching an insulating layer to the metal conductor surface of the metal conductor foil with the waste removed, and then performing high-temperature lamination treatment by using a laminating machine; so that the metal conductor foil and the insulating layer are bonded into a whole;
s6: removing the bearing film layer; printing insulating ink on the exposed metal conductor foil or laminating and bonding the metal conductor foil to cover an insulating layer;
s7: and carrying out circuit board surface electroplating treatment on the Pad after the bonding treatment is finished to form the single-sided circuit board.
The die-cutting conductor line processing technology can obviously improve the processing efficiency, and is high in processing accuracy and good in application effect.
The circuit conductor layer can also be attached on the conductor face with the tie coat (the material can be for making the common PP prepreg of PCB, the bonding of acrylic acid glue, the bonding of epoxy resin series glue, and TPI glue) as required, then apply the another side subsides of conductor on the carrier film.
Preferably, the insulating layer PI, PET, PPS, PET, ceramic, PTFE, epoxy resin, FR4 or glass in the step S5 is self-adhesive: acrylic, epoxy or TPI colloids.
Preferably, in step S7, the method further includes attaching an additional laser-finished semi-finished metal conductor foil to the back of the manufactured single-sided circuit board to form a second conductor circuit layer of the double-sided circuit board.
Preferably, the metal conductor foil used in step S1 is a copper foil, an aluminum foil, graphene, graphite, a carbon film, or a foil with a conductive substance.
Preferably, the supporting film layer in step S1 is made of PET, PI, PEN, PPS, PTFE, PVC or PO; the adhesive glue is acrylic acid series, epoxy series or silica gel series glue.
Preferably, the laminating temperature in the step S5 ranges from 80 degrees celsius to 450 degrees celsius; and the lamination time is controlled between 2 seconds and 5 hours.
The circuit board of the invention comprises a single-sided flexible circuit board, a double-sided flexible circuit board, a single-sided PCB hard board, a double-sided PCB hard board (comprising FR4 material, PTFE material, ceramic material and other metal base material)
The circuit board of the invention comprises a circuit conductor layer, a protective insulating bonding substrate and a bonding layer which is added sometimes.
Compared with the prior art, the die-cutting conductor circuit processing technology of the die-cutting conductor circuit manufacturing technology 1 can remarkably improve the processing efficiency, and is high in processing accuracy and good in application effect.
The above-described embodiments of the present invention do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (6)
1. A manufacturing process of a die-cut conductor circuit is characterized by comprising the following steps: comprises the following steps of (a) carrying out,
s1: preparing a metal conductor foil for die cutting processing; cleaning the surface of the metal conductor foil;
s2: attaching the metal conductor foil to a bearing film layer with cohesiveness; and gluing by using adhesive glue;
s3: the conductor surface of the metal conductor foil attached on the bearing film layer is upward; placing on laser cutting processing equipment or a die punching machine; performing stamping processing by adopting a pre-prepared die, and cutting the metal conductor foil by laser or die cutting stamping processing, wherein the bearing film layer at the bottom is not completely cut;
s4: after laser cutting or die cutting and stamping are finished, removing the unnecessary patterns; specifically, the method comprises the steps of carrying out waste material removal treatment by using adhesive tape bonding, UV local irradiation, local heating, manual mechanical removal or vacuum adsorption; reserving a required graph on the bearing film layer;
s5: attaching an insulating layer to the metal conductor surface of the metal conductor foil with the waste removed, and then performing high-temperature lamination treatment by using a laminating machine; so that the metal conductor foil and the insulating layer are bonded into a whole;
s6: removing the bearing film layer; printing insulating ink on the exposed metal conductor foil or laminating and bonding the metal conductor foil to cover an insulating layer;
s7: and carrying out circuit board surface electroplating treatment on the Pad after the bonding treatment is finished to form the single-sided circuit board.
2. The process of claim 1, wherein the die-cut conductor line comprises: the insulating layer PI, PET, PPS, PET, ceramic, PTFE, epoxy, FR4, or glass in the step S5 is self-contained colloid: acrylic, epoxy or TPI colloids.
3. The process of claim 1, wherein the die-cut conductor line comprises: in step S7, the method further includes attaching an additional laser-finished semi-finished metal conductor foil to the back of the manufactured single-sided circuit board to form a second conductor circuit layer of the double-sided circuit board.
4. The process of claim 1, wherein the die-cut conductor line comprises: the metal conductor foil used in step S1 is a copper foil, an aluminum foil, graphene, graphite, a carbon film, or a foil with a conductive substance.
5. The process of claim 1, wherein the die-cut conductor line comprises: the bearing film layer in the step S1 is made of PET, PI, PEN, PPS, PTFE, PVC or PO; the adhesive glue is acrylic acid series, epoxy series or silica gel series glue.
6. The process of claim 1, wherein the die-cut conductor line comprises: the laminating temperature range in the step S5 is 80 to 450 ℃; and the lamination time is controlled between 2 seconds and 5 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011056118.8A CN112188745A (en) | 2020-09-30 | 2020-09-30 | Die-cutting conductor circuit manufacturing process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011056118.8A CN112188745A (en) | 2020-09-30 | 2020-09-30 | Die-cutting conductor circuit manufacturing process |
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| CN112188745A true CN112188745A (en) | 2021-01-05 |
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| CN202011056118.8A Pending CN112188745A (en) | 2020-09-30 | 2020-09-30 | Die-cutting conductor circuit manufacturing process |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112930039A (en) * | 2021-01-27 | 2021-06-08 | 中国科学院重庆绿色智能技术研究院 | Method for manufacturing flexible circuit by laser etching |
| CN113079647A (en) * | 2021-03-25 | 2021-07-06 | 惠州市鼎丰泰科技有限公司 | Method for manufacturing flexible die-cut conductor circuit |
| CN114449774A (en) * | 2022-02-28 | 2022-05-06 | 厦门市匠研新材料技术有限公司 | Manufacturing process of conducting circuit |
| CN116489892A (en) * | 2023-05-18 | 2023-07-25 | 淮安麦禾田新材料科技有限公司 | Preparation system and preparation process for producing flexible circuit board by laser cutting |
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| CN104853519A (en) * | 2015-05-26 | 2015-08-19 | 江苏悦达新材料科技有限公司 | Flexible conducting circuit and manufacturing method thereof |
| CN105813392A (en) * | 2014-12-31 | 2016-07-27 | 佛山市顺德区莱尔电子材料有限公司 | Flexible LED substrate preparation method |
| CN107911949A (en) * | 2017-11-06 | 2018-04-13 | 王国清 | A kind of wiring thin film board manufacturing method |
| CN108323026A (en) * | 2018-04-03 | 2018-07-24 | 王玉昌 | A kind of process for manufacturing circuit board |
-
2020
- 2020-09-30 CN CN202011056118.8A patent/CN112188745A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105813392A (en) * | 2014-12-31 | 2016-07-27 | 佛山市顺德区莱尔电子材料有限公司 | Flexible LED substrate preparation method |
| CN104853519A (en) * | 2015-05-26 | 2015-08-19 | 江苏悦达新材料科技有限公司 | Flexible conducting circuit and manufacturing method thereof |
| CN107911949A (en) * | 2017-11-06 | 2018-04-13 | 王国清 | A kind of wiring thin film board manufacturing method |
| CN108323026A (en) * | 2018-04-03 | 2018-07-24 | 王玉昌 | A kind of process for manufacturing circuit board |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112930039A (en) * | 2021-01-27 | 2021-06-08 | 中国科学院重庆绿色智能技术研究院 | Method for manufacturing flexible circuit by laser etching |
| CN112930039B (en) * | 2021-01-27 | 2022-06-17 | 中国科学院重庆绿色智能技术研究院 | Method for manufacturing flexible circuit by laser etching |
| CN113079647A (en) * | 2021-03-25 | 2021-07-06 | 惠州市鼎丰泰科技有限公司 | Method for manufacturing flexible die-cut conductor circuit |
| CN114449774A (en) * | 2022-02-28 | 2022-05-06 | 厦门市匠研新材料技术有限公司 | Manufacturing process of conducting circuit |
| CN114449774B (en) * | 2022-02-28 | 2024-07-30 | 厦门市匠焊新材料技术有限公司 | Manufacturing process of conductive circuit |
| CN116489892A (en) * | 2023-05-18 | 2023-07-25 | 淮安麦禾田新材料科技有限公司 | Preparation system and preparation process for producing flexible circuit board by laser cutting |
| CN116489892B (en) * | 2023-05-18 | 2024-06-25 | 淮安麦禾田新材料科技有限公司 | Preparation system and preparation process for producing flexible circuit board by laser cutting |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20221202 Address after: Room 7, No. 228, Kuntai Road, Zhoushi Town, Suzhou City, Jiangsu Province, 215000 Applicant after: Kunshan Meixing Microelectronics Co.,Ltd. Address before: 518000 1st floor, Tsinghua Ziguang science and Technology Park, No.13, Langshan Road, north high tech Zone, Nanshan District, Shenzhen City, Guangdong Province Applicant before: SHENZHEN GUANGYUNDA LASER APPLICATION TECHNOLOGY Co.,Ltd. Applicant before: Wu Ziming Applicant before: Cao Hanyi |
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Application publication date: 20210105 |
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